Vertical light-emitting diode package structure and manufacturing method thereof

Abstract

To provide a vertical light-emitting diode package structure and a manufacturing method thereof.SOLUTION: A vertical light-emitting diode package structure includes a first structural layer including a first substrate and a first light-emitting element, a second structural layer including a second substrate and a second light-emitting element and connected to the first structural layer, and a third structural layer including a third substrate and a third light-emitting element. The third structural layer is connected to the second structural layer to make the second structural layer be arranged between the first structural layer and the third structural layer. The first light-emitting element, the second light-emitting element and the third light-emitting element are respectively disposed on upper surfaces of the first substrate, the second substrate and the third substrate. Thus, a structure size after packaging is effectively reduced, a die bonding process is simplified, and difficulties in tests and repairs can be reduced.SELECTED DRAWING: Figure 1A

Description

[Technical Field]

[0001] The present invention relates to a light emitting diode package structure, and more particularly to a vertical light emitting diode package structure and a method for manufacturing the same, which can improve manufacturing convenience and reduce size. [Background technology]

[0002] In a known LED packaging structure, the LED and a dummy plug are fixed to a substrate, and the LED and the dummy plug are electrically connected before colloidal packaging. However, in the known packaging structure, the LEDs are arranged horizontally, i.e., LEDs of different colors must be arranged separately in the horizontal direction, which makes the volume of the packaging structure too large and makes it difficult to achieve micro-sizing. Summary of the Invention [Means for solving the problem]

[0003] According to one aspect of the present invention, a first structural layer includes: a first substrate having an upper surface and a lower surface opposite the upper surface; four first conductive members each penetrating from the upper surface to the lower surface of the first substrate; a first light-emitting element provided on and electrically connected to an end surface located on the upper surface of one of the first conductive members; and a first dummy plug provided on and electrically connected to an end surface located on the upper surface of the other of the first conductive members; a second substrate having an upper surface and a lower surface opposite the upper surface; three second conductive members each penetrating from the upper surface to the lower surface of the second substrate and each electrically connected to three of the first conductive members that are not provided with a first light-emitting element; a second light-emitting element provided on and electrically connected to an end surface located on the upper surface of one of the second conductive members; and a first dummy plug provided on and electrically connected to an end surface located on the upper surface of the other of the second conductive members. a third structural layer including: a third substrate having an upper surface and a lower surface opposite to the upper surface; two third conductive members each penetrating from the upper surface to the lower surface of the third substrate and electrically connected to two of the second conductive members on which no second light-emitting element is provided; a third light-emitting element provided on and electrically connected to an end surface located on the upper surface of one of the third conductive members; and a third dummy plug provided on and electrically connected to an end surface located on the upper surface of the other of the third conductive members, wherein the third structural layer is connected to the second structural layer such that the second structural layer is located between the first structural layer and the third structural layer.

[0004] According to the vertical light emitting diode package structure, the second conductive members may be respectively aligned with three of the first conductive members that do not have a first light emitting element, and the third conductive members may be respectively aligned with two of the second conductive members that do not have a second light emitting element.

[0005] According to the vertical light-emitting diode package structure, the second conductive members may be aligned with three of the first conductive members, respectively, the third conductive members may be aligned with two of the second conductive members, and the first light-emitting element, the second light-emitting element, and the third light-emitting element may be aligned.

[0006] According to the vertical light emitting diode package structure, the first conductive members may be arranged in a 2x2 matrix.

[0007] According to the vertical type LED packaging structure, the first light emitting element may be a red light emitting element, the second light emitting element may be a green light emitting element, and the third light emitting element may be a blue light emitting element.

[0008] According to another aspect of the present invention, there are provided a first conductive member installation step of passing four first conductive members through the first substrate from the upper surface to the lower surface thereof, a first arrangement step of providing a first light-emitting element and a first dummy plug on end surfaces of two of the first conductive members located on the upper surface of the first substrate, respectively, and forming electrical connections with the two first conductive members, thereby obtaining a first structural layer, a second conductive member installation step of passing three second conductive members through the second substrate from the upper surface to the lower surface thereof, a second arrangement step of providing a second light-emitting element and a second dummy plug on end surfaces of two of the second conductive members located on the upper surface of the second substrate, respectively, and forming electrical connections with the two second conductive members, thereby obtaining a second structural layer, and a third arrangement step of providing two third conductive members. The present invention provides a method for manufacturing a vertical light emitting diode package structure, the method including: a third conductive member installation step of respectively penetrating the third substrate from the upper surface to the lower surface; a third arrangement step of respectively providing a third light emitting element and a third dummy plug on an end surface of the third conductive member located on the upper surface of the third substrate and forming an electrical connection with the third conductive member, thereby obtaining a third structural layer; and an assembly step of sequentially stacking and connecting the first structural layer, the second structural layer, and the third structural layer, electrically connecting the second conductive members to three of the first conductive members that are not provided with first light emitting elements, and electrically connecting the third conductive members to two of the second conductive members that are not provided with second light emitting elements, thereby forming a vertical light emitting diode package structure.

[0009] According to the manufacturing method of the vertical light emitting diode package structure, the second conductive members may be respectively aligned with three of the first conductive members that do not have a first light emitting element, and the third conductive members may be respectively aligned with two of the second conductive members that do not have a second light emitting element.

[0010] According to the manufacturing method of the vertical light emitting diode package structure, the second conductive members may be aligned with three of the first conductive members, respectively, the third conductive members may be aligned with two of the second conductive members, and the first light emitting element, the second light emitting element, and the third light emitting element may be aligned with each other.

[0011] According to the method for manufacturing the vertical light emitting diode package structure, the first conductive members may be arranged in a 2x2 matrix.

[0012] According to the manufacturing method of the vertical light emitting diode package structure, the first light emitting element may be a red light emitting element, the second light emitting element may be a green light emitting element, and the third light emitting element may be a blue light emitting element. [Brief explanation of the drawings]

[0013] [Figure 1A] 1 is a schematic perspective view of a vertical light-emitting diode package structure according to an embodiment of the present invention; [Figure 1B] 1B is an exploded schematic view of the vertical light-emitting diode package structure of FIG. 1A. [Figure 2A] 2A is a schematic cross-sectional view of the vertical light-emitting diode package structure of FIG. 1A taken along line 2A-2A. [Figure 2B] 2B is a schematic cross-sectional view of the vertical light-emitting diode package structure of FIG. 1A taken along line 2B-2B. [Figure 3] FIG. 10 is a schematic perspective view of a vertical light-emitting diode package structure according to another embodiment of the present invention; [Figure 4A] 4 is a schematic diagram of the bottom surface of the first substrate of FIG. 3. [Figure 4B] 4 is a schematic diagram of the bottom surface of the second substrate of FIG. 3. [Figure 4C] 4 is a schematic diagram of the bottom surface of the third substrate of FIG. 3. FIG. [Figure 5] 2 is a process flow chart of a method for manufacturing a vertical light emitting diode package structure according to an embodiment of the present invention. [Figure 6A] 3A to 3C are cross-sectional schematic diagrams of various flow stages of a manufacturing method for a vertical light emitting diode package structure. [Figure 6B] 3A to 3C are cross-sectional schematic diagrams of various flow stages of a manufacturing method for a vertical light emitting diode package structure. [Figure 6C] 3A to 3C are cross-sectional schematic diagrams of various flow stages of a manufacturing method for a vertical light emitting diode package structure. [Figure 6D] 3A to 3C are cross-sectional schematic diagrams of various flow stages of a manufacturing method for a vertical light emitting diode package structure. [Figure 6E] 3A to 3C are cross-sectional schematic diagrams of various flow stages of a manufacturing method for a vertical light emitting diode package structure. [Figure 6F] 3A to 3C are cross-sectional schematic diagrams of various flow stages of a manufacturing method for a vertical light emitting diode package structure. [Figure 6G] 3A to 3C are cross-sectional schematic diagrams of various flow stages of a manufacturing method for a vertical light emitting diode package structure. [Figure 6H] 3A to 3C are cross-sectional schematic diagrams of various flow stages of a manufacturing method for a vertical light emitting diode package structure. [Figure 7A] 3A-3C are schematic cross-sectional views of the various flow stages of the manufacturing method of the vertical light emitting diode package structure. [Figure 7B] 3A-3C are schematic cross-sectional views of the various flow stages of the manufacturing method of the vertical light emitting diode package structure. [Figure 7C] 3A-3C are schematic cross-sectional views of the various flow stages of the manufacturing method of the vertical light emitting diode package structure. [Figure 7D] 3A-3C are schematic cross-sectional views of the various flow stages of the manufacturing method of the vertical light emitting diode package structure. DETAILED DESCRIPTION OF THE INVENTION

[0014] Each embodiment of the present invention will be discussed in more detail below. However, the embodiments are applications of various inventive concepts and may be specifically implemented within a variety of different specific scopes. The specific embodiments are for illustrative purposes only and are not intended to limit the scope of the disclosure.

[0015] Please refer to Figures 1A and 1B. Figure 1A is a perspective schematic view of a vertical light-emitting diode package structure 100 of one embodiment of the present invention, and Figure 1B is an exploded schematic view of the vertical light-emitting diode package structure 100 of Figure 1A. The vertical light-emitting diode package structure 100 includes a first structural layer 110, a second structural layer 120, and a third structural layer 130, where the second structural layer 120 is connected to the first structural layer 110, and the third structural layer 130 is connected to the second structural layer 120 such that the second structural layer 120 is located between the first structural layer 110 and the third structural layer 130.

[0016] Please refer to Figures 2A and 2B together. Figure 2A is a schematic cross-sectional view of the vertical LED package structure 100 of Figure 1A taken along line 2A-2A, and Figure 2B is a schematic cross-sectional view of the vertical LED package structure 100 of Figure 1A taken along line 2B-2B. The first structural layer 110 includes a first substrate 111, four first conductive members 112, a first light-emitting element 113, and a first dummy plug 114. The first substrate 111 has an upper surface and a lower surface opposite to the upper surface. The first conductive members 112 each penetrate from the upper surface to the lower surface of the first substrate 111, thereby electrically connecting the elements located on both sides of the first substrate 111.

[0017] The first light emitting element 113 is provided on and electrically connected to an end surface located on the top surface of one of the first conductive members 112. The first dummy plug 114 is provided on and electrically connected to an end surface located on the top surface of the other of the first conductive members 112. The first light emitting element 113 and the first dummy plug 114 may be fixed to the first conductive member 112 via a conductive adhesive to achieve both structural and electrical connection and further reduce the overall size of the first structural layer 110.

[0018] The second structural layer 120 includes a second substrate 121, three second conductive members 122, a second light emitting element 123, and a second dummy plug 124. The second substrate 121 has an upper surface and a lower surface opposite the upper surface, and can have good light transmittance. The second conductive members 122 each penetrate the second substrate 121 from the upper surface to the lower surface. The second light emitting element 123 is disposed on and electrically connected to an end surface located on the upper surface of one of the second conductive members 122. The second dummy plug 124 is disposed on and electrically connected to an end surface located on the upper surface of the other of the second conductive members 122. The element structure and installation method of the second structural layer 120 are the same as or similar to those of the first structural layer 110, and therefore will not be described here.

[0019] The second conductive members 122 are each electrically connected to three of the first conductive members 112 that are not provided with a first light emitting element 113. In particular, the second conductive members 122 may be electrically connected to the first conductive members 112 via end faces located on the lower surface of the second substrate 121, or may be in direct contact with end faces of the first conductive members 112 located on the upper surface of the first substrate 111 or with the first dummy plugs 114 via a conductive adhesive to achieve both structural and electrical connection.

[0020] The third structural layer 130 includes a third substrate 131, two third conductive members 132, a third light emitting element 133, and a third dummy plug 134. The third substrate 131 has an upper surface and a lower surface opposite the upper surface, and can have good light transmittance. The third conductive members 132 each penetrate the third substrate 131 from the upper surface to the lower surface and are electrically connected to two of the second conductive members 122 that do not have second light emitting elements 123. The third light emitting element 133 is disposed on and electrically connected to an end surface located on the upper surface of one of the third conductive members 132. The third dummy plug 134 is disposed on and electrically connected to an end surface located on the upper surface of the other of the third conductive members 132. The element structure and installation method of the third structural layer 130 are the same as or similar to those of the first structural layer 110 and the second structural layer 120, and therefore will not be described here.

[0021] It should be particularly noted that the second conductive members 122 may be provided to align with three of the first conductive members 112 that do not have a first light emitting element 113, and the third conductive members 132 may be provided to align with two of the second conductive members 122 that do not have a second light emitting element 123, and the first conductive members 112 may be arranged in a 2 × 2 matrix. This contributes to reducing the difficulty of structural arrangement, shortens the distance between elements, and allows the first light emitting element 113, the second light emitting element 123, and the third light emitting element 133 to emit light without interfering with each other.

[0022] In addition, the first light emitting element 113 may be a red light emitting element, the second light emitting element 123 may be a green light emitting element, and the third light emitting element 133 may be a blue light emitting element, or the area of ​​the first light emitting element 113 may be larger than that of the second light emitting element 123, and the area of ​​the second light emitting element 123 may be larger than that of the third light emitting element 133. This can increase the light output of the first light emitting element 113 and the second light emitting element 123, contributing to color light mixing of the vertical light emitting diode package structure 100.

[0023] The vertical light emitting diode package structure 100 may further include two adhesive layers 115, 125 which may be located between the first structural layer 110 and the second structural layer 120, and between the second structural layer 120 and the third structural layer 130, respectively, and the adhesive layers 115, 125 may provide a protective effect to extend the life of the vertical light emitting diode package structure 100. The vertical light emitting diode package structure 100 may further include an adhesive layer 135 which may be provided on the upper surface of the third substrate 131 to cover the third light emitting element 133 and the third dummy plug 134.

[0024] The vertical LED package structure 100 may include two conductive layers 116, 126 that may be positioned between the first structural layer 110 and the second structural layer 120, and between the second structural layer 120 and the third structural layer 130, respectively, and electrical conduction between the first structural layer 110, the second structural layer 120, and the third structural layer 130 may be achieved through the conductive layers 116, 126, eliminating the need to manufacture circuits by wire bonding, further reducing size and improving process efficiency and yield. The vertical LED package structure 100 may further include a conductive layer 136 that may be provided on an upper surface of the adhesive layer 135 to electrically connect the vertical LED package structure 100 to the outside.

[0025] Please refer to FIG. 3 , which is a perspective schematic diagram of a vertical light-emitting diode package structure 200 according to another embodiment of the present invention. The vertical light-emitting diode package structure 200 is substantially the same as the vertical light-emitting diode package structure 100, except that the second conductive members 222 may be aligned with three of the first conductive members 212, the third conductive members 232 may be aligned with two of the second conductive members 222, the first light-emitting element 213, the second light-emitting element 223, and the third light-emitting element 233 may be aligned with each other, and the first conductive members 212 may be arranged in a 2×2 matrix. The aligned alignment of the first light-emitting element 213, the second light-emitting element 223, and the third light-emitting element 233 achieves a spatial color light mixing effect, thereby broadening the application range of the vertical light-emitting diode package structure 200.

[0026] Please refer to Figures 4A, 4B, and 4C. Figure 4A is a schematic bottom view of the first substrate 211 of Figure 3, Figure 4B is a schematic bottom view of the second substrate 221 of Figure 3, and Figure 4C is a schematic bottom view of the third substrate 231 of Figure 3. Because the first light-emitting element 213, the second light-emitting element 223, and the third light-emitting element 233 are aligned, the second conductive member 222 and the third conductive member 232 must be arranged on the bottom surfaces of the second substrate 221 and the third substrate 231, respectively, to ensure accurate circuit continuity. As can be seen from Figures 3 and 4B, the second conductive member 222 in the upper right corner is blocked by the first light-emitting element 213, so an electrical connection must be formed via the conductive extension member E1 and the first conductive member 212. Similarly, as can be seen from Figures 3 and 4C, the third conductive member 232 in the upper right corner is blocked by the second light-emitting element 223, so an electrical connection needs to be formed via the conductive extension member E2 and the second conductive member 222.

[0027] Please refer to Figures 5, 6A, 6B, 6C, 6D, 6E, 6F, 6G and 6H. Figure 5 is a process flowchart of a manufacturing method 300 of a vertical light-emitting diode package structure according to one embodiment of the present invention, and Figures 6A to 6H are cross-sectional schematic views of each flow stage of the manufacturing method 300 of a vertical light-emitting diode package structure. The manufacturing method 300 of a vertical light-emitting diode package structure includes step 310, step 320, step 330, step 340, step 350, step 360 and step 370.

[0028] Step 310 is a first conductive member installation step in which four first conductive members 112 are respectively inserted through the first substrate 111 from the top to the bottom. See FIG. 6A. Here, the first substrate 111 is taken as an example. The first substrate 111 may be a through-glass via (TGV) substrate, which can have good light transmittance and through-holes H for mounting other elements. The number and location of the through-holes H can be adjusted as needed and are not limited by the present invention. See FIG. 6B. The first conductive members 112 may be copper pillars, which eliminate the need for etching and reduce manufacturing costs. The first conductive members 112 may have heads whose width is greater than the diameter of the through-holes H. To secure the first conductive members 112, colloid may be filled between the first conductive members 112 and the through-holes H and between the heads and the top surface of the first substrate 111.

[0029] See Figure 6C. Step 320 is a first placement step in which the first light-emitting element 113 and the first dummy plug 114 are respectively provided on the end surfaces of two of the first conductive members 112 located on the upper surface of the first substrate 111, and electrical connections are formed with the two first conductive members 112, respectively, to obtain the first structural layer 110. See Figures 6D and 6E. After providing the first light-emitting element 113 and the first dummy plug 114, an adhesive layer 115 may be provided to cover the upper surface of the first substrate 111, the first light-emitting element 113, and the first dummy plug 114, and then holes may be drilled using a laser and a conductive layer 116 may be provided.

[0030] Step 330 is a second conductive member installation step in which three second conductive members 122 are respectively passed through the second substrate 121 from the upper surface to the lower surface. Step 340 is a second arrangement step in which a second light emitting element 123 and a second dummy plug 124 are respectively provided on end surfaces of two of the second conductive members 122 located on the upper surface of the second substrate 121, and electrical connections are formed with the two second conductive members 122, respectively, to obtain a second structural layer 120. The details of steps 330 and 340 are the same as or similar to steps 310 and 320, respectively, and therefore will not be described here.

[0031] Step 350 is a third conductive member installation step in which two third conductive members 132 are each penetrated from the upper surface to the lower surface of the third substrate 131. Step 360 is a third arrangement step in which a third light emitting element 133 and a third dummy plug 134 are respectively provided on end surfaces of the third conductive members 132 located on the upper surface of the third substrate 131, and electrical connections are formed with the third conductive members 132, thereby obtaining the third structural layer 130. The details of steps 350 and 360 are the same as or similar to steps 310 and 320, respectively, and therefore will not be described here.

[0032] Step 370 is an assembly process in which the first structural layer 110, the second structural layer 120, and the third structural layer 130 are stacked and connected in order, the second conductive members 122 are electrically connected to three of the first conductive members 112 that do not have the first light-emitting element 113, and the third conductive members 132 are electrically connected to two of the second conductive members 122 that do not have the second light-emitting element 123, to form the vertical light-emitting diode package structure 100. For details, see FIGS. 6F to 6H . The first structural layer 110, the second structural layer 120, and the third structural layer 130 may be electrically connected by applying conductive adhesive to the positions where they are to be electrically connected, and then aligned, stacked, pressed, and finally cut to obtain multiple vertical light-emitting diode package structures 100.

[0033] Please refer to Figures 7A, 7B, 7C, and 7D. Figures 7A to 7D are schematic cross-sectional views illustrating different flow stages of the manufacturing method 300 for a vertical LED package structure. In Figures 7A to 7D, the first conductive member 212, the second conductive member 222, and the third conductive member 232 are manufactured by chemical plating. For example, a seed layer C is sputtered into the through-hole H of the first substrate 211, and then the through-hole H is filled with chemical plating to form the first conductive member 212, the second conductive member 222, and the third conductive member 232. As can be seen from Figure 7D, the use of chemical plating can reduce the thickness, further reducing the size after packaging. Furthermore, the elimination of the need for colloidal filling and fixation reduces process complexity.

[0034] As described above, the vertical LED package structure of the present invention vertically stacks the first, second, and third light emitting elements, thereby effectively reducing the size of the packaged structure. Furthermore, the adoption of independent packaging and modular design simplifies the die bonding process and reduces the difficulty of testing and repair.

[0035] Although the present invention has been disclosed as described above in the examples, the above examples are not used to limit the present invention, and any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be determined based on what is defined by the claims attached below. [Explanation of symbols]

[0036] 100, 200: Vertical LED package structure 110: 1st structural layer 111, 211: First board 112, 212: First conductive member 113, 213: first light-emitting element 114: First dummy plug 115, 125, 135: Adhesive layer 116, 126, 136: Conductive layer 120:Second structural layer 121, 221: Second board 122, 222: second conductive member 123, 223: second light-emitting element 124: Second dummy plug 130:Third structural layer 131, 231: Third board 132, 232: third conductive member 133, 233: third light-emitting element 134: Third dummy plug 300: Manufacturing method of vertical light emitting diode package structure 310, 320, 330, 340, 350, 360, 370: Engineering E1, E2: Conductive extension in the material H: Penetrating point C: シード layer

Claims

1. a first structural layer including: a first substrate having an upper surface and a lower surface opposite to the upper surface; four first conductive members each penetrating from the upper surface to the lower surface of the first substrate; a first light-emitting element provided on and electrically connected to an end surface located on the upper surface of one of the four first conductive members; and a first dummy plug provided on and electrically connected to an end surface located on the upper surface of the other of the four first conductive members; a second substrate having an upper surface and a lower surface opposite to the upper surface; three second conductive members each penetrating from the upper surface to the lower surface of the second substrate and electrically connected to three of the four first conductive members on which the first light emitting element is not provided; a second light emitting element provided on and electrically connected to an end surface located on the upper surface of one of the three second conductive members; and a second dummy plug provided on and electrically connected to an end surface located on the upper surface of the other of the three second conductive members; and a second structural layer connected to the first structural layer; a third structural layer including: a third substrate having an upper surface and a lower surface opposite to the upper surface; two third conductive members each penetrating from the upper surface to the lower surface of the third substrate and electrically connected to two of the three second conductive members on which the second light emitting element is not provided; a third light emitting element provided on and electrically connected to an end surface located on the upper surface of one of the two third conductive members; and a third dummy plug provided on and electrically connected to an end surface located on the upper surface of the other of the two third conductive members; Equipped with The third structural layer is connected to the second structural layer such that the second structural layer is located between the first structural layer and the third structural layer.

2. 2. The vertical light-emitting diode package structure according to claim 1, wherein the three second conductive members are respectively aligned with the three of the four first conductive members that are not provided with the first light-emitting element, and the two third conductive members are respectively aligned with the two of the three second conductive members that are not provided with the second light-emitting element.

3. 2. The vertical light-emitting diode package structure according to claim 1, wherein the three second conductive members are aligned with three of the four first conductive members, the two third conductive members are aligned with two of the three second conductive members, and the first light-emitting element, the second light-emitting element, and the third light-emitting element are aligned.

4. 4. The vertical light emitting diode package structure as claimed in claim 2 or 3, wherein the four first conductive members are arranged in a 2x2 matrix.

5. 2. The vertical light emitting diode package structure as claimed in claim 1, wherein the first light emitting element is a red light emitting element, the second light emitting element is a green light emitting element, and the third light emitting element is a blue light emitting element.

6. a first conductive member installation step of passing four first conductive members through the first substrate from the top surface to the bottom surface; a first arrangement step of providing a first light-emitting element and a first dummy plug on end surfaces of two of the four first conductive members located on the upper surface of the first substrate, and forming electrical connections with the two first conductive members, respectively, to obtain a first structural layer; a second conductive member installation step of passing three second conductive members through the second substrate from the upper surface to the lower surface thereof; a second arrangement step of providing a second light-emitting element and a second dummy plug on end surfaces of two of the three second conductive members located on the upper surface of the second substrate, and forming electrical connections with the two second conductive members, respectively, to obtain a second structure layer; a third conductive member installation step of passing two third conductive members through the third substrate from the upper surface to the lower surface thereof; a third arrangement step of providing a third light-emitting element and a third dummy plug on end surfaces of the two third conductive members located on the upper surface of the third substrate, respectively, and forming electrical connections with the two third conductive members, respectively, to obtain a third structure layer; an assembly process of stacking and connecting the first structural layer, the second structural layer, and the third structural layer in order, electrically connecting the three second conductive members to three of the four first conductive members that are not provided with the first light emitting element, and electrically connecting the two third conductive members to two of the three second conductive members that are not provided with the second light emitting element, to form a vertical light emitting diode package structure; 10. A method for manufacturing a vertical light emitting diode package structure, comprising:

7. 7. The method for manufacturing a vertical light emitting diode package structure according to claim 6, wherein the three second conductive members are respectively aligned with the three of the four first conductive members that are not provided with the first light emitting element, and the two third conductive members are respectively aligned with the two of the three second conductive members that are not provided with the second light emitting element.

8. 7. The method for manufacturing a vertical light-emitting diode package structure according to claim 6, wherein the three second conductive members are aligned with three of the four first conductive members, the two third conductive members are aligned with two of the three second conductive members, and the first light-emitting element, the second light-emitting element, and the third light-emitting element are aligned with each other.

9. 9. The method for manufacturing a vertical light emitting diode package structure as claimed in claim 7 or 8, wherein the four first conductive members are arranged in a 2x2 matrix.

10. 7. The method for manufacturing a vertical light emitting diode package structure as claimed in claim 6, wherein the first light emitting element is a red light emitting element, the second light emitting element is a green light emitting element, and the third light emitting element is a blue light emitting element.

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