Resin composition, molding material, and resin molding

A resin composition combining (meth)acrylic copolymers and plate-like inorganic fillers addresses the challenges of dimensional stability, heat resistance, and impact resistance in acrylic resins, facilitating applications in diverse molded products with improved performance and recyclability.

JP2025135982APending Publication Date: 2025-09-19MITSUBISHI CHEM CORP
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Patent Information

Application Number
JP2024034100
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-03-06
Publication Date
2025-09-19

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Abstract

To provide a resin composition that exhibits superior dimensional stability, heat resistance, and impact resistance.SOLUTION: A resin composition comprises a (meth)acrylic copolymer (B) and an inorganic filler (C), wherein the (meth)acrylic copolymer (B) includes a polymer (B1) containing 50 mass% or more of repeating units derived from methyl methacrylate and a polymer (B2) having a glass transition temperature of less than 0°C, the (meth)acrylic copolymer (B) containing at least one selected from the group consisting of block copolymers, graft copolymers, and core-shell rubber particles, and the inorganic filler (C) being plate-like particles having an average particle diameter of 10 μm or more and 17,000 μm or less.SELECTED DRAWING: None
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