Resin molding equipment

Abstract

To provide a resin molding apparatus capable of optimally drying resin materials.SOLUTION: The resin molding apparatus 10 comprises a heating cylinder 21 heated by a heater 23, a hopper 26 that supplies resin material R into the interior of the heating cylinder 21, an extrusion device 20 that plasticizes and extrudes the resin material R inside the heating cylinder 21, a container 41 for holding and drying resin material R before it is supplied from the hopper 26 into the heated cylinder 21, and a heat exchange mechanism 50 for heating the container 41 by performing heat exchange between the heated cylinder 21 and the container 41.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a resin molding apparatus. [Background technology]

[0002] Conventionally, injection molding machines include a cylinder that injects resin material into a mold cavity and a hopper that supplies the resin material to the cylinder. When resin material containing a large amount of moisture from the atmosphere is used in an injection molding machine, hydrolysis can cause a decrease in the strength of the molded product and the occurrence of silver streaks on the surface of the molded product, which can result in poor appearance. For this reason, the resin material is typically dried before being supplied to the cylinder.

[0003] Patent Document 1 discloses an injection molding machine that dries the resin material inside the hopper by exchanging heat between the mold and the hopper. A heat medium flow path through which a heat medium (water) flows is formed inside the mold. The heat medium flow path is connected to a heat medium supply pipe that supplies the heat medium and a heat medium return pipe that discharges the heat medium. A heat exchanger is provided midway through the heat medium return pipe. The heat exchanger has a heat radiation pipe connected to the heat medium return pipe and a heat receiving pipe connected to the hot air supply pipe. The hot air supply pipe supplies the heat medium (air) to a preheating pipe wrapped around the outer or inner periphery of the hopper. The heat exchanger exchanges heat between the heat medium flowing through the heat medium return pipe and the heat medium flowing through the hot air supply pipe. As a result, the heat medium flowing through the hot air supply pipe is heated by the high-temperature heat medium flowing through the heat medium return pipe. This heated heat medium is supplied to the preheating pipe, heating and drying the resin material inside the hopper. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2011-5640 Summary of the Invention [Problem to be solved by the invention]

[0005] In the injection molding machine described in Patent Document 1, the temperature of the heat medium flowing through the heat medium return pipe becomes lower than the temperature of the mold due to heat loss. The temperature of the heat medium flowing through the hot air supply pipe becomes lower than the temperature of the heat medium flowing through the heat medium return pipe. Therefore, the heating temperature of the hopper due to heat exchange between the mold and the hopper, i.e., the heating temperature when drying the resin material, becomes lower than the temperature of the mold. In this case, there is a risk that the heating required to dry the resin material will be insufficient, leaving room for improvement.

[0006] This problem is not limited to injection molding machines, but also occurs in extrusion molding machines in which the resin material inside the cylinder is extruded through a die. [Means for solving the problem]

[0007] Various aspects of a resin molding device for solving the above problems will be described below. [Mode 1] A resin molding device having a heating cylinder heated by a heater, and a hopper that supplies resin material to the inside of the heating cylinder, an extrusion device that plasticizes and extrudes the resin material inside the heating cylinder, a container that contains and dries the resin material before it is supplied from the hopper to the inside of the heating cylinder, and a heat exchange mechanism that heats the container by exchanging heat between the heating cylinder and the container.

[0008] According to the above configuration, the heating cylinder is heated by a heater. Meanwhile, a portion connected to an extrusion device, such as a mold through which the resin material is extruded, is heated by the heat of the resin material extruded from the heating cylinder. Therefore, the temperature of the portion connected to the extrusion device is lower than the temperature of the heating cylinder. According to the above configuration, the heat exchange mechanism performs heat exchange between the heating cylinder and the container, thereby heating the container. Therefore, the heating temperature of the container, i.e., the heating temperature of the resin material, can be increased compared to when heat exchange is performed between the portion connected to the extrusion device and the container. Therefore, the resin material can be dried appropriately.

[0009] [Aspect 2] The extrusion device is provided with a metallic heat transfer member in contact with the heating cylinder, and the heat exchange mechanism performs heat exchange between the heating cylinder and the container via the heat transfer member. This is a resin molding device described in [Aspect 1].

[0010] When the heating cylinder and the container are connected by a heat exchange mechanism, there is a risk that the manner of connection, including the connection position and connection structure of the heat exchange mechanism to the heating cylinder, may be limited. In this regard, according to the above configuration, the heat exchange mechanism exchanges heat between the heating cylinder and the container via the heat transfer member, and therefore, by changing the shape of the heat transfer member, the degree of freedom in the manner in which the heat exchange mechanism is connected to the heating cylinder can be increased.

[0011] [Aspect 3] The extrusion device is a resin molding apparatus described in [Aspect 2], which has a communication passage connecting the inside of the hopper and the inside of the heating cylinder and includes a support block that supports the heating cylinder and the hopper, and the heat transfer member is in contact with the support block.

[0012] According to the above configuration, the resin material in the hopper is supplied to the inside of the heating cylinder through the communication passage in the support block. If the resin material partially melts and connects inside the communication passage due to the heat of the heating cylinder, the connected resin material may clog the communication passage. To avoid this problem, it is conceivable to cool the support block using a cooling device such as a chiller. In contrast, according to the above configuration, the heat from the heating cylinder is transferred to the container via a heat transfer member in contact with the support block. This makes it difficult for the heat from the heating cylinder to transfer to the support block via the heat transfer member, thereby preventing the temperature of the support block from rising. This eliminates the need for a separate cooling device to cool the support block. This prevents the configuration of the resin molding apparatus from becoming too complicated.

[0013] [Aspect 4] A resin molding apparatus according to [Aspect 2] or [Aspect 3], wherein the heating cylinder and the heat transfer member are formed from the same type of metal material. According to the above configuration, it is possible to suppress an increase in heat loss between the heating cylinder and the heat transfer member, and therefore it is possible to efficiently exchange heat between the heating cylinder and the container.

[0014] [Aspect 5] A resin molding apparatus described in any one of [Aspect 1] to [Aspect 4], wherein the heat exchange mechanism includes an evaporator that vaporizes the working fluid by receiving heat from the heating cylinder, a condenser that condenses the working fluid by dissipating heat to the container, a vapor pipe that circulates the working fluid vaporized in the evaporator to the condenser, and a liquid pipe that circulates the working fluid condensed in the condenser to the evaporator.

[0015] According to the above configuration, the evaporator receives heat from the extrusion device, causing the working fluid to vaporize in the evaporator. The vaporized working fluid moves toward the condenser through the vapor pipe. The condenser then releases heat to the container, causing the working fluid to condense in the condenser. The condensed working fluid moves toward the evaporator through the liquid pipe. In this way, heat exchange occurs between the extrusion device and the container while the working fluid undergoes a phase change, allowing the container to be efficiently heated. Therefore, the resin material can be efficiently dried.

[0016] [Aspect 6] A resin molding apparatus described in [Aspect 5], wherein the extrusion device is provided with a metal heat transfer member in contact with the heating cylinder, and the evaporator is constructed from the heat transfer member. According to the above configuration, the evaporator is configured by a heat transfer member separate from the heating cylinder, which makes it easier to configure the evaporator than, for example, when the evaporator is configured by a heating cylinder.

[0017] [Aspect 7] A resin molding apparatus described in [Aspect 5] or [Aspect 6], wherein the condenser is composed of piping that connects the steam pipe and the liquid pipe and is wrapped around the outer surface of the container.

[0018] According to the above configuration, the piping constituting the condenser is wrapped around the outer circumferential surface of the container, which increases the contact area between the condenser and the container, thereby enabling efficient heat exchange between the condenser and the container, and therefore allowing the resin material to be dried efficiently. [Effects of the Invention]

[0019] According to the present invention, the resin material can be suitably dried. [Brief explanation of the drawings]

[0020] [Figure 1] FIG. 1 is a schematic diagram showing the configuration of a resin molding apparatus according to one embodiment. [Figure 2]FIG. 2 is a schematic diagram showing the heat exchange mechanism of FIG. DETAILED DESCRIPTION OF THE INVENTION

[0021] Hereinafter, one embodiment of a resin molding apparatus will be described with reference to FIGS. (Schematic configuration of resin molding device) The resin molding device 10 is applied to, for example, an injection molding machine, which is a device that injects a molten resin material R into a cavity 101 of a mold 100 to manufacture a resin molded product.

[0022] The resin molding apparatus 10 includes an extrusion device 20, a drying device 40, and a heat exchange mechanism 50. The extrusion device 20 plasticizes the pellet-shaped resin material R supplied to the extrusion device 20 and extrudes it into the cavity 101 of the mold 100. The drying device 40 dries the resin material R before it is supplied to the extrusion device 20. The heat exchange mechanism 50 heats the drying device 40 by exchanging heat between the extrusion device 20 and the drying device 40. In the resin molding apparatus 10, the resin material R, whose temperature and humidity have been controlled in the drying device 40, is extruded into the cavity 101 by the extrusion device 20.

[0023] (Configuration of extrusion device 20) The extrusion device 20 includes a heating cylinder 21, a heater 23, a screw 24, a drive mechanism 25, a hopper 26, a support block 27, and a heat transfer member 30. The heating cylinder 21, the hopper 26, the support block 27, and the heat transfer member 30 are made of the same type of metal material, such as stainless steel.

[0024] The heating cylinder 21 is shaped like a cylinder having an internal space into which the resin material R is supplied. The heating cylinder 21 has a nozzle 22 at the tip end in the axial direction from which the resin material R is extruded. The nozzle 22 is connected to a communication passage of the mold 100 which communicates with the cavity 101.

[0025] A plurality of heaters 23 for heating the heating cylinder 21 are attached to the outer circumferential surface of the heating cylinder 21. The heaters 23 are attached at intervals from one another in the axial direction of the heating cylinder 21 in a portion of the outer circumferential surface of the heating cylinder 21 closer to the tip of the heating cylinder 21 than a heat transfer member 30 (described later) is. Each heater 23 is, for example, a band heater. The temperature of the heaters 23 is individually controlled according to the position of the heating cylinder 21 in the axial direction.

[0026] The screw 24 is housed inside the heating cylinder 21. The screw 24 is provided inside the heating cylinder 21 so as to be rotatable around the axis of the heating cylinder 21 and so as to be able to move forward and backward in the axial direction. The resin material R inside the heating cylinder 21 is plasticized by heating by the heater 23 and frictional heat generated by the rotation of the screw 24. When the screw 24 is driven, the resin material R is melted and kneaded, and is transported inside the heating cylinder 21 from the base end side to the tip end side. As a result, the resin material R is extruded from the nozzle 22.

[0027] The drive mechanism 25 drives the screw 24. The drive mechanism 25 is connected to one end of the screw 24. The drive mechanism 25 includes a motor that controls the operation of the screw 24. The hopper 26 stores the resin material R and supplies the resin material R to the inside of the heating cylinder 21. The resin material R dried by the drying device 40 is poured into the hopper 26. The shape of the hopper 26 is, for example, a funnel shape. A supply port 26a through which the resin material R falls is provided at the bottom of the hopper 26.

[0028] The support block 27 supports the heating cylinder 21 and the hopper 26. The support block 27 is, for example, shaped like a rectangular parallelepiped. The support block 27 has a support hole 28 with a circular cross section that supports the heating cylinder 21. The support hole 28 penetrates the support block 27 in the axial direction of the heating cylinder 21. The base end of the heating cylinder 21 is inserted into the support hole 28.

[0029] The support block 27 has a communication passage 29 that opens to both the outer circumferential surface of the support block 27 and the inner circumferential surface of the support hole 28 and that communicates with the internal space of the heating cylinder 21. The communication passage 29 is connected to an input port 21a that opens to the outer circumferential surface of the heating cylinder 21. The supply port 26a of the hopper 26 is inserted into the communication passage 29. Therefore, the communication passage 29 communicates between the inside of the hopper 26 and the inside of the heating cylinder 21.

[0030] The heat transfer member 30 has a shape of, for example, a rectangular parallelepiped. The heat transfer member 30 has an insertion hole 31 with a circular cross section, into which the heating cylinder 21 is inserted. The insertion hole 31 penetrates the heat transfer member 30 in the axial direction of the heating cylinder 21. The heat transfer member 30 is disposed between the heater 23 and the support block 27. The inner circumferential surface of the insertion hole 31 contacts the entire outer circumferential surface of the heating cylinder 21 between the heater 23 and the support block 27. As described above, the heat transfer member 30 is thermally connected to the heating cylinder 21.

[0031] The heat transfer member 30 and the support block 27 are adjacent to each other in the axial direction of the heating cylinder 21. More specifically, the entire outer surface of the heat transfer member 30 perpendicular to the axial direction of the heating cylinder 21 is in surface contact with the outer surface of the support block 27. As described above, the heat transfer member 30 is thermally connected to the support block 27.

[0032] (Configuration of drying device 40) The drying device 40 includes a container 41 , a heating device 42 , and an agitator 43 . The container 41 contains the resin material R before it is supplied to the hopper 26. The container 41 has a bottom wall 41a and a peripheral wall 41b that stands up from the periphery of the bottom wall 41a. The peripheral wall 41b has a circular shape when viewed from the axial direction of the container 41. An opening through which the resin material R is poured is provided at the end of the peripheral wall 41b opposite to the bottom wall 41a.

[0033] The heating device 42 heats the container 41. The resin material R contained in the container 41 is heated and dried by both the heating device 42 and the heat exchange mechanism 50, which will be described later. The agitator 43 is disposed inside the container 41. The agitator 43 has a rotating shaft 44 and a plurality of blade members 45 provided on the outer periphery of the rotating shaft 44. The rotating shaft 44 extends in the axial direction of the container 41. The plurality of blade members 45 are provided at intervals from one another in the axial direction of the rotating shaft 44. The rotating shaft 44 is rotated by a motor (not shown). The resin material R contained in the container 41 is agitated by the agitator 43, which makes it easier for the resin material R to be heated uniformly.

[0034] The resin material R dried by the drying device 40 is conveyed to the hopper 26 automatically or manually. (Configuration of heat exchange mechanism 50) As shown in Fig. 2, the heat exchange mechanism 50 has a closed-loop flow path 51 through which a working fluid circulates. The heat exchange mechanism 50 is a loop heat pipe that transports heat by causing a phase change in the working fluid sealed inside the flow path 51. The working fluid flows in one direction through the flow path 51. The working fluid is, for example, water.

[0035] The heat exchange mechanism 50 has an evaporator 52, a condenser 53, a steam pipe 55, and a liquid pipe 56. The evaporator 52 vaporizes the working fluid by receiving heat from the heating cylinder 21. The condenser 53 condenses the working fluid by radiating heat to the housing 41 of the drying device 40. The steam pipe 55 circulates the working fluid vaporized in the evaporator 52 to the condenser 53. The liquid pipe 56 circulates the working fluid condensed in the condenser 53 to the evaporator 52. The internal space of the steam pipe 55 and the internal space of the liquid pipe 56 form part of the flow path 51.

[0036] The evaporator 52 is composed of a heat transfer member 30 in contact with the heating cylinder 21. The evaporator 52 has an evaporation flow path 52a therein that vaporizes the working fluid. That is, the evaporation flow path 52a is formed inside the heat transfer member 30. The evaporator 52 vaporizes the working fluid inside the evaporation flow path 52a by receiving heat from the heating cylinder 21. That is, the heat of the heating cylinder 21 is used to vaporize the working fluid inside the evaporation flow path 52a. The evaporation flow path 52a forms a part of the flow path 51.

[0037] The evaporation flow path 52a extends, for example, in a U-shape so as to surround the insertion hole 31. Both ends of the evaporation flow path 52a in the longitudinal direction are open to the same outer surface of the heat transfer member 30. The evaporation flow path 52a connects the internal space of the liquid pipe 56 and the internal space of the vapor pipe 55.

[0038] The evaporator 52 includes a porous body 57 arranged in the evaporation flow path 52a. The porous body 57 is arranged at the end of the evaporation flow path 52a on the liquid pipe 56 side. The porous body 57 is inserted into the evaporation flow path 52a. In this embodiment, the entire porous body 57 is inserted into the evaporation flow path 52a. The porous body 57 has a function of moving the liquid-phase working fluid from the liquid pipe 56 toward the vapor pipe 55 inside the evaporation flow path 52a by capillary force. This capillary force serves as a driving source for circulating the working fluid inside the flow path 51. The porous body 57 is formed of a metal material such as an aluminum alloy.

[0039] The condenser 53 is formed by a pipe 54 that contacts the outer peripheral surface of the housing 41. The pipe 54 connects a steam pipe 55 and a liquid pipe 56. The pipe 54 is wound around the outer peripheral surface of the peripheral wall 41b of the housing 41 one or more times. For example, the pipe 54 extends in a spiral shape along the outer peripheral surface of the peripheral wall 41b while contacting the outer peripheral surface of the peripheral wall 41b. A condensation flow path 54a that condenses the working fluid is formed inside the pipe 54. The condensation flow path 54a constitutes a part of the flow path 51. The condensation flow path 54a connects the internal space of the steam pipe 55 and the internal space of the liquid pipe 56.

[0040] A reservoir 58 that temporarily stores the liquid-phase working fluid is provided in the liquid pipe 56. The reservoir 58 is a portion where the cross-sectional area of ​​the passage of the liquid pipe 56 is partially expanded. The flow rate of the working fluid in the flow path 51 varies depending on the amount of heat received by the evaporator 52. By storing the liquid-phase working fluid in the reservoir 58, it is possible to absorb fluctuations in the flow rate of the working fluid.

[0041] (Heat exchange by heat exchange mechanism 50) When the heating cylinder 21 is heated by the heater 23 to plasticize the resin material R, the heat transfer member 30 in contact with the heating cylinder 21, i.e., the evaporator 52, is heated. As a result, the working fluid vaporizes inside the evaporation channels 52a formed in the heat transfer member 30. The vaporized working fluid moves toward the condenser 53 through the vapor pipe 55. Because the piping 54 of the condenser 53 is in contact with the outer peripheral surface of the peripheral wall 41b of the container 41, the condenser 53 dissipates heat to the container 41, causing the working fluid to condense inside the condensation channels 54a. When the working fluid condenses in the condenser 53, the container 41 receives heat from the condenser 53, and the resin material R contained in the container 41 is heated. The container 41 is heated by both the heating device 42 and the heat exchange mechanism 50. The condensed working fluid moves toward the evaporator 52 through the liquid pipe 56. The working fluid that reaches the porous body 57 permeates the porous body 57 by capillary force, and then vaporizes again inside the evaporation flow path 52a.

[0042] As described above, the heat exchange mechanism 50 circulates the working fluid inside the flow path 51 , thereby exchanging heat between the heating cylinder 21 and the accommodation body 41 via the heat transfer member 30 . <Operation of this embodiment> In the resin molding apparatus 10 of this embodiment, the heating cylinder 21 is heated by the heater 23. Meanwhile, the mold 100, into which the resin material R is extruded, is heated by the heat of the resin material R extruded from the heating cylinder 21. Therefore, the temperature of the mold 100 is lower than the temperature of the heating cylinder 21. According to the resin molding apparatus 10 of this embodiment, heat exchange is performed between the heating cylinder 21 and the containing body 41 by the heat exchange mechanism 50, thereby heating the containing body 41. Therefore, compared to the case where heat exchange is performed between the mold 100 and the containing body 41, the heating temperature of the containing body 41, i.e., the heating temperature of the resin material R, can be increased.

[0043] <Effects of this embodiment> (1) The resin molding apparatus 10 includes an extrusion device 20, a container 41, and a heat exchange mechanism 50. The extrusion device 20 has a heating cylinder 21 heated by a heater 23, and a hopper 26 that supplies the resin material R to the inside of the heating cylinder 21. The container 41 stores and dries the resin material R before it is supplied from the hopper 26 to the inside of the heating cylinder 21. The heat exchange mechanism 50 heats the container 41 by exchanging heat between the heating cylinder 21 and the container 41.

[0044] According to the above configuration, the above-mentioned effects are achieved, and therefore the resin material R can be dried suitably. (2) The heat exchange mechanism 50 exchanges heat between the heating cylinder 21 and the container 41 via the heat transfer member 30 .

[0045] When the heating cylinder 21 and the containing body 41 are connected by the heat exchange mechanism 50, the manner of connection, including the connection position and connection structure of the heat exchange mechanism 50 relative to the heating cylinder 21, may be limited.

[0046] In this regard, according to the above configuration, the heat exchange mechanism 50 exchanges heat between the heating cylinder 21 and the accommodation body 41 via the heat transfer member 30. Therefore, by changing the shape of the heat transfer member 30, it is possible to increase the degree of freedom in the manner in which the heat exchange mechanism 50 is connected to the heating cylinder 21. It is also possible to increase the degree of freedom in the shape of the evaporation flow path 52a.

[0047] (3) The support block 27 has a communication passage 29 that connects the inside of the hopper 26 with the inside of the heating cylinder 21. The heat transfer member 30 is in contact with the support block 27. According to the above configuration, the resin material R in the hopper 26 is supplied to the heating cylinder 21 through the communication passage 29 of the support block 27. If the resin material R partially melts and connects within the communication passage 29 due to the heat of the heating cylinder 21, the connected resin material R may clog the communication passage 29. To avoid this problem, it is possible to cool the support block 27 using a cooling device such as a chiller. In contrast, according to the above configuration, the heat of the heating cylinder 21 is transferred to the housing 41 via the heat transfer member 30 in contact with the support block 27. This makes it difficult for the heat of the heating cylinder 21 to transfer to the support block 27 via the heat transfer member 30, thereby preventing the temperature of the support block 27 from rising. This eliminates the need for a cooling device to cool the support block 27. This prevents the configuration of the resin molding apparatus 10 from becoming complicated.

[0048] (4) The heating cylinder 21 and the heat transfer member 30 are made of the same type of metal material. According to the above configuration, it is possible to suppress an increase in heat loss between the heating cylinder 21 and the heat transfer member 30. Therefore, heat exchange between the heating cylinder 21 and the containing body 41 can be efficiently performed.

[0049] (5) The heat exchange mechanism 50 has an evaporator 52, a condenser 53, a vapor pipe 55, and a liquid pipe 56. The evaporator 52 vaporizes the working fluid by receiving heat from the extrusion device 20. The condenser 53 condenses the working fluid by dissipating heat to the container 41.

[0050] According to the above configuration, the evaporator 52 receives heat from the extrusion device 20, causing the working fluid to vaporize in the evaporator 52. The vaporized working fluid moves toward the condenser 53 through the vapor pipe 55. The condenser 53 then radiates heat to the housing 41, causing the working fluid to condense in the condenser 53. The condensed working fluid moves toward the evaporator 52 through the liquid pipe 56. In this way, heat exchange occurs between the extrusion device 20 and the housing 41 while the working fluid undergoes a phase change, thereby allowing the housing 41 to be efficiently heated. Therefore, the resin material R can be efficiently dried.

[0051] (6) The evaporator 52 is composed of a heat transfer member 30 . According to the above configuration, the evaporator 52 is configured by the heat transfer member 30 which is separate from the heating cylinder 21. Therefore, compared to the case where the evaporator 52 is configured by the heating cylinder 21, for example, the evaporator 52 can be configured more easily.

[0052] Furthermore, since the heat of the heating cylinder 21 is used to vaporize the working fluid inside the evaporation flow path 52a of the heat transfer member 30, the temperature of the support block 27 is less likely to rise. (7) The condenser 53 is configured by a pipe 54 that connects a steam pipe 55 and a liquid pipe 56 and is wound around the outer circumferential surface of the container 41 .

[0053] According to the above configuration, the piping 54 constituting the condenser 53 is wound around the outer peripheral surface of the housing 41, which increases the contact area between the condenser 53 and the housing 41. This allows efficient heat exchange between the condenser 53 and the housing 41. Therefore, the resin material R can be dried efficiently.

[0054] (8) The container 41 is heated by both the heating device 42 and the heat exchange mechanism 50 . According to the above configuration, the heating temperature of the housing 41 by the heating device 42 can be lowered compared to when the housing 41 is heated only by the heating device 42. This allows the power consumption of the heating device 42 to be reduced.

[0055] <Example of change> This embodiment can be modified as follows: This embodiment and the following modifications can be combined and implemented within the scope of technical compatibility.

[0056] The porous body 57 does not have to be made of metal. The porous body 57 may be made of, for example, resin or ceramic. Condenser 53 does not have to be configured by piping 54. Condenser 53 may be configured by, for example, housing 41 having peripheral wall 41b with condensation flow path 54a formed therein.

[0057] The evaporator 52 does not have to be made of the heat transfer member 30. The evaporator 52 may be made of, for example, a heating cylinder 21 having a peripheral wall in which an evaporation flow path 52a is formed.

[0058] The heat exchange mechanism 50 does not have to be a loop heat pipe, as long as it exchanges heat between the heating cylinder 21 and the housing 41. The heat exchange mechanism 50 may be configured to exchange heat using a working fluid that transports heat between the heating cylinder 21 and the housing 41, using a driving source such as a pump, for example.

[0059] The heating cylinder 21 and the heat transfer member 30 may be made of different types of metal materials. The heat transfer member 30 does not have to be in contact with the support block 27. In this case, a cooling flow path through which a cooling liquid flows may be formed inside the support block 27.

[0060] In the above embodiment, an example has been described in which the resin molding apparatus 10 is applied to an injection molding machine. However, the resin molding apparatus 10 is not limited to this, and may be applied to various devices, such as an extrusion molding machine, as long as the device plasticizes the resin material R and extrudes it from the extrusion device 20 to manufacture a resin molded product. [Explanation of symbols]

[0061] R…Resin material 10…Resin molding equipment 20...Extrusion device 21...Heating cylinder 21a...Inlet 22...Nozzle 23...Heater 24...Screw 25...Drive mechanism 26...Hopper 26a…Supply port 27...Support block 28…Support hole 29…Communication path 30...Heat transfer member 31...insertion hole 40...Drying device 41...Containment Unit 41a…Bottom wall 41b...peripheral wall 42...Heating device 43...Agitator 44...Rotation axis 45...wing member 50...Heat exchange mechanism 51...Flow path 52...Evaporator 52a...evaporation channel 53...Condenser 54...Plumbing 54a...Condensation channel 55...Steam pipe 56...liquid pipe 57...Porous material 58...Reservoir 100...Mold 101...cavity

Claims

1. an extrusion device including a heating cylinder heated by a heater and a hopper for supplying a resin material into the heating cylinder, the extrusion device plasticizing the resin material in the heating cylinder and extruding the resin material; a container that contains and dries the resin material before it is supplied from the hopper to the inside of the heating cylinder; a heat exchange mechanism that heats the container by exchanging heat between the heating cylinder and the container, Resin molding equipment.

2. the extrusion device includes a metal heat transfer member in contact with the heating cylinder; the heat exchange mechanism performs heat exchange between the heating cylinder and the container via the heat transfer member. The resin molding device according to claim 1 .

3. the extrusion device includes a support block having a communication passage that communicates the inside of the hopper with the inside of the heating cylinder and that supports the heating cylinder and the hopper; The heat transfer member is in contact with the support block. The resin molding device according to claim 2 .

4. The heating cylinder and the heat transfer member are formed of the same type of metal material. The resin molding device according to claim 2 .

5. The heat exchange mechanism includes: an evaporator that vaporizes the working fluid by receiving heat from the heating cylinder; a condenser that condenses the working fluid by dissipating heat into the container; a vapor pipe through which the working fluid vaporized in the evaporator flows to the condenser; a liquid pipe for circulating the working fluid condensed in the condenser to the evaporator. The resin molding device according to any one of claims 1 to 4.

6. the extrusion device includes a metal heat transfer member in contact with the heating cylinder, The evaporator is constituted by the heat transfer member. The resin molding apparatus according to claim 5 .

7. The condenser is configured by a pipe that connects the vapor pipe and the liquid pipe and is wound around the outer circumferential surface of the container. The resin molding apparatus according to claim 5 .

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