Component mounting system, and component mounting method

Abstract

To provide a component mounting system capable of properly suppressing the occurrence of voids in solder, and a component mounting method.SOLUTION: The component mounting system includes; a printing unit that prints solder P on a circuit board B that has electrodes E; a component mounting unit that attaches a component D to the circuit board B with the solder P printed thereon; and a calculation means that calculates a printing correction amount R(ΔX, ΔY) for shifting the position of solder P to be printed on the circuit board B from the position of electrode E on the circuit board B. The printing unit prints the solder P onto the circuit board B based on the print correction amount R(ΔX, ΔY) calculated by the calculation means.SELECTED DRAWING: Figure 8

Description

[Technical Field]

[0001] The present disclosure relates to a component mounting system and a component mounting method that include a printing device that prints solder on a board and a component mounting device that mounts components on the board. [Background technology]

[0002] In a component mounting system, a printing device prints solder onto a board through a mask with openings formed to match the positions of the board's electrodes. A component mounting device then mounts components onto the board with the printed solder. A reflow device then heats the board to melt the solder and solder the component terminals to the board's electrodes. Patent Document 1 discloses a method in which a camera captures an image of the board with printed solder to identify any misalignment of the solder, and the component mounting device then mounts the component at a corrected mounting position based on the misalignment. Even if the printed solder is misaligned with the electrodes, the surface tension of the melted solder during reflow attracts the component to the electrodes, mitigating the effects of misaligned solder printing and misaligned component mounting. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2019-186410 Summary of the Invention [Problem to be solved by the invention]

[0004] It is known that when molten solder solidifies during reflow, air is left behind in the solder, causing voids. However, while conventional technologies including Patent Document 1 mount components to electrodes with high precision, they do not disclose any method for suppressing the generation of voids, and there is room for further improvement in suppressing the generation of voids and improving mounting quality.

[0005] Therefore, an object of the present disclosure is to provide a component mounting system and a component mounting method that can appropriately suppress the occurrence of voids in solder. [Means for solving the problem]

[0006] The component mounting system of the present disclosure includes a printing device that prints solder on a substrate having electrodes and a component mounting device that attaches components to the substrate on which the solder has been printed, and is equipped with a calculation means that calculates a printing correction amount to shift the position of the solder to be printed on the substrate from the position of the electrodes on the substrate, and the printing device prints the solder on the substrate based on the printing correction amount calculated by the calculation means.

[0007] The component mounting method disclosed herein is a component mounting method that prints solder on a substrate having electrodes and attaches components to the substrate on which the solder has been printed, and calculates a printing correction amount for shifting the position of the solder to be printed on the substrate from the position of the electrodes on the substrate, and prints the solder on the substrate and attaches the components to the substrate based on the calculated printing correction amount. [Effects of the Invention]

[0008] According to the present disclosure, the occurrence of voids in solder can be appropriately suppressed. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a diagram illustrating a configuration of a component mounting system according to an embodiment of the present disclosure. [Figure 2] FIG. 1 is a side view showing a structure of a main part of a printing device included in a component mounting system according to an embodiment of the present disclosure. [Figure 3] FIG. 1 is a side view showing a structure of a main part of a component mounting device included in a component mounting system according to an embodiment of the present disclosure. [Figure 4] FIG. 1 is a block diagram illustrating a configuration of a component mounting system according to an embodiment of the present disclosure. [Figure 5](a) (b) (c) An explanatory diagram of a process of aligning a substrate with a mask having openings formed in accordance with the positions of electrodes in a printing apparatus according to an embodiment of the present disclosure. [Figure 6] 1A and 1B are explanatory diagrams illustrating a process of aligning a substrate with a mask having openings formed at positions shifted by a printing correction amount from the positions of electrodes in a printing apparatus according to an embodiment of the present disclosure. [Figure 7] FIG. 10 is an explanatory diagram illustrating printing solder at a position shifted by a printing correction amount from the position of the electrode in a printing device according to another embodiment of the present disclosure. [Figure 8] (a) A plan view showing a board on which solder has been printed in the correct position and components have been mounted in the correct position, using a component mounting system according to an embodiment of the present disclosure; (b) A plan view showing a board on which solder has been printed in a position shifted by the amount of printing correction and components have been mounted in accordance with the solder position; (c) A plan view showing a board on which solder has been printed in a position shifted by the amount of printing correction and components have been mounted in accordance with the position of the electrode. [Figure 9] 1A is a side view showing a state before reflow of a board on which solder has been printed in a regular position by a component mounting system according to an embodiment of the present disclosure and components have been mounted in a regular position; FIG. 1B is a side view showing a state during reflow; and FIG. 1C is a side view showing a state after reflow. [Figure 10] 1A and 1B are side views showing a state before reflow of a board on which solder has been printed at a position shifted by a print correction amount using a component mounting system according to an embodiment of the present disclosure, and components have been mounted in accordance with the solder positions; FIG. 1C is a side view showing a state after reflow of the board; [Figure 11] 1 is a flow diagram of a component mounting method according to an embodiment of the present disclosure; DETAILED DESCRIPTION OF THE INVENTION

[0010] An embodiment of the present disclosure will be described in detail below with reference to the drawings. The configurations, shapes, etc. described below are examples for explanation purposes and can be modified as appropriate depending on the specifications of the component mounting system, management computer, printing device, print inspection device, component mounting device, etc. In the following, corresponding elements in all drawings will be given the same reference numerals, and duplicated explanations will be omitted. In FIG. 2 and some of the following descriptions, the X-axis in the board transport direction (the direction perpendicular to the paper surface in FIG. 2) and the Y-axis orthogonal to the board transport direction (the left-right direction in FIG. 2) are shown as two axes that are orthogonal to each other in a horizontal plane. In FIG. 2 and some of the following descriptions, the Z-axis (the up-down direction in FIG. 2) is shown as the height direction that is orthogonal to the horizontal plane.

[0011] First, the configuration of component mounting system 1 will be described with reference to FIG. 1. FIG. 1 is an explanatory diagram of the configuration of a component mounting system according to an embodiment of the present disclosure. Component mounting system 1 is configured by connecting production devices, such as a printing device M1, a print inspection device M2, component mounting devices M3-M4, and a reflow device M5, in series from upstream (left side of the page) to downstream (right side of the page) in the board transport direction. Each production device is connected to a management computer 3 via a communication network 2. Component mounting system 1 has the function of processing a board B carried into printing device M1 in order while transporting it, and mounting components D on board B to produce a mounted board. Note that component mounting system 1 is a group of production devices connected via communication network 2, and the production devices do not necessarily have to be physically connected to each other.

[0012] In Fig. 1, printing device M1 performs a solder printing operation in which solder P (Fig. 5), such as solder paste, is printed through a mask having multiple openings formed at the positions of electrodes E (lands) on board B carried in from upstream by a solder printing operation unit. Printing inspection device M2 detects the state of the solder P printed on board B by printing device M1 and the position of the printed solder P based on inspection information including information on the positions of the multiple openings formed in the mask used by printing device M1. The detected state of solder P and the position of solder P are transmitted to component mounting devices M3 to M4 or management computer 3 via communication network 2.

[0013] The component mounting devices M3 to M4 perform component mounting work by attaching components D to a board B on which solder P has been printed by a component mounting work unit. Note that the production line L1 is not limited to a configuration with two component mounting devices M3 to M4, and may have one component mounting device M3 to M4 or three or more component mounting devices M3 to M4.

[0014] In Figure 1, reflow equipment M5 heats board B carried into the equipment using a board heating unit to melt solder P, performing a board heating operation (reflow) in which the solder P bonds the terminals and bumps of component D to electrodes E on board B. When solder P is melted in reflow equipment M5, the surface tension of the liquefied solder P pulls component D, which was misaligned when mounted, toward electrodes E on board B, resulting in a self-alignment effect in which misalignment with electrodes E is reduced after reflow. Note that the magnitude of the self-alignment effect depends on the shape and weight of component D, and the presence or extent of the effect varies for each component D.

[0015] Next, the structure of the printing device M1 will be described with reference to FIG. 2. FIG. 2 is a side view showing the structure of the main part of a printing device provided in a component mounting system according to an embodiment of the present disclosure. The printing device M1 has a function of printing solder P, such as a solder paste containing solder particles, onto a substrate B, such as a printed circuit board having electrodes E, through openings formed in a mask. The printing device M1 is equipped with a pair of transport conveyors 11 extending along the X-axis on a base 10. The transport conveyors 11 are controlled by a print control unit 61 (see FIG. 4), and transport the substrate B received from upstream of the printing device M1 along the X-axis and carry it out downstream of the printing device M1.

[0016] 2, an XY table 12, a θ table 13, and a substrate lifting mechanism 14 are provided in this order from bottom to top on a base 10 below a transfer conveyor 11. The XY table 12 moves the θ table 13 in a horizontal plane (X-axis direction, Y-axis direction). The θ table 13 rotates the substrate lifting mechanism 14 by θ around the Z axis. The substrate lifting mechanism 14 supports the substrate holder 16 from below and raises and lowers it.

[0017] The substrate holding unit 16 is provided near the center of the transport conveyor 11 in the X-axis direction. The substrate holding unit 16 receives the substrate B transported by the transport conveyor 11 and holds it at a predetermined clamp position. The XY table 12, the θ table 13, and the substrate lifting mechanism 14 constitute a substrate positioning mechanism 15 that moves the substrate holding unit 16 to align the substrate B held by the substrate holding unit 16 with the underside of the mask. The substrate positioning mechanism 15 is controlled by the print control unit 61.

[0018] 2, a mask 17 having a plurality of openings 17a for printing solder P on a substrate B and a pair of mask-side marks 17m formed therein is installed above the substrate holding part 16. The mask 17 has a rectangular plate shape extending across the XY plane, and its outer periphery is supported by a frame member 17w.

[0019] A camera unit 18 incorporating a camera for substrate recognition and a camera for mask recognition is disposed below the mask 17. The camera unit 18 moves along the Y axis in a horizontal plane (arrow a) by a camera movement mechanism 19 (see FIG. 4) controlled by the print control unit 61.

[0020] 2, an alignment process for aligning the position of the substrate B held by the substrate holding unit 16 with the mask 17 will be described. First, the camera unit 18 moves between the substrate B and the mask 17 and captures images of the substrate-side marks Bm for alignment formed on the substrate B and the mask-side marks 17m for alignment formed on the mask 17. The print control unit 61 recognizes the positions of the mask-side marks 17m and the substrate-side marks Bm based on the images captured by the camera unit 18.

[0021] Next, based on the recognition result, the print control unit 61 controls the substrate positioning mechanism 15 (XY table 12, θ table 13, substrate lifting mechanism 14) to align the position and orientation of substrate B so that the position of mask-side mark 17m formed on mask 17 matches the position of substrate-side mark Bm on substrate B held by substrate holding unit 16. Next, the print control unit 61 raises the substrate holding unit 16 to bring substrate B into contact with the underside of mask 17 from below.

[0022] In FIG. 2, a print head 21 is disposed above the mask 17 and is moved along the Y-axis by a print head moving mechanism 20 (see FIG. 4). The print head 21 is equipped with a moving base 22 that is moved within a horizontal plane by the print head moving mechanism 20. Two squeegee holders 23 are disposed on the moving base 22, side by side along the Y-axis. Each squeegee holder 23 holds a squeegee 24 at its lower end, which extends along the X-axis, and is raised and lowered by an elevating mechanism 25 provided on the moving base 22. The print head moving mechanism 20 and print head 21 are controlled by a print control unit 61. As the squeegee 24 slides along the Y-axis while in contact with the mask 17, solder P supplied onto the mask 17 from a solder supply unit (not shown) is transferred (printed) onto the substrate B through the openings 17a in the mask 17.

[0023] Next, with reference to FIG. 3, the configuration of component mounting devices M3 to M4 will be described in detail. FIG. 3 is a side view showing the structure of a main part of a component mounting device included in a component mounting system according to an embodiment of the present disclosure. FIG. 3 schematically shows component mounting devices M3 to M4. Component mounting devices M3 to M4 have the function of mounting components D onto a board B on which solder P has been printed. A board transport mechanism 31 is disposed in the center of base 30 along the X-axis, which is the board transport direction. Board transport mechanism 31 transports board B transported from upstream to the mounting position, positions it, and holds it. In addition, board transport mechanism 31 transports board B downstream after component mounting work has been completed. A board support mechanism 32 is disposed between base 30 and board transport mechanism 31 on the upper surface of base 30, supporting board B from below after it has been transported to the mounting position.

[0024] A carriage 34 having a plurality of tape feeders 33 arranged along the X-axis on its upper surface is attached to one side of the board transport mechanism 31. The tape feeder 33 supplies components D to a suction position where the mounting head 36 picks up the components D by pitch-feeding a carrier tape that stores components D in a direction from the outside toward the board transport mechanism 31. A tray feeder 35 is attached to one side of the board transport mechanism 31 and supplies components D, which are arranged on a tray, to the suction position of the mounting head 36.

[0025] 3, a head moving mechanism 37 is disposed on a frame (not shown) supported by a base 30 along the Y axis, which is perpendicular to the board transport direction. A mounting head 36 is attached to the head moving mechanism 37 via a moving member 38. A nozzle 39 that sucks and holds a component D is attached to the bottom of the mounting head 36. By driving the head moving mechanism 37, the mounting head 36 moves in the X axis direction and the Y axis direction. As a result, the mounting head 36 moves between the board B, which is positioned and held at the mounting work position, and the tape feeder 33 and tray feeder 35, and mounts the component D, which is picked up from the tape feeder 33 or tray feeder 35, onto the board B using the nozzle 39 provided at the bottom.

[0026] 3, a component recognition camera 40 is disposed between the board transport mechanism 31 and the tape feeder 33 and tray feeder 35. The component recognition camera 40 captures an image of a component D from below that has been picked up from the tape feeder 33 or tray feeder 35 by the mounting head 36 and moved above the component recognition camera 40. This captures an image of the component D held by the nozzle 39 of the mounting head 36, and the position of the component D held by the nozzle 39, etc., is detected.

[0027] A board recognition camera 41 is disposed on the movable member 38 with its imaging direction facing downward. The board recognition camera 41 moves above the board B together with the mounting head 36 and captures an image of the board B held at the mounting work position. This allows the positions of the board-side marks Bm and electrodes E formed on the board B to be detected. When the mounting head 36 mounts the component D on the board B, the mounting position is corrected taking into account the recognition result of the board B by the board recognition camera 41 and the recognition result of the component D by the component recognition camera 40.

[0028] Next, the configuration of component mounting system 1 will be described with reference to Fig. 4. Fig. 4 is a block diagram showing the configuration of a component mounting system according to an embodiment of the present disclosure. Here, the configuration relating to the function of printing solder P offset from the position of electrodes E on substrate B in component mounting system 1 will be mainly described.

[0029] The management computer 3 includes a management storage unit 50, a calculation means 51, and a management communication unit 52. The management communication unit 52 is a communication interface that exchanges signals and data with the printing apparatus M1, the print inspection apparatus M2, the component mounting apparatuses M3 to M4, and the reflow apparatus M5 via the communication network 2. The management storage unit 50 is a storage device that stores board information 50a, print correction amount information 50b, and the like. The board information 50a includes, for each type of mounting board produced by the component mounting system 1, the type of component D to be mounted on the board B, the mounting position, the position of the electrode E formed on the board B, and the like.

[0030] 4, calculation means 51 is an arithmetic device that calculates, based on board information 50a, a print correction amount R (FIG. 5(b)) for shifting the position of solder P to be printed on board B from the position of electrode E on board B. The calculated print correction amount R is stored in management storage unit 50 as print correction amount information 50b, and is also transmitted to printing device M1. The print correction amount R is used by printing device M1 to print solder P at an appropriate offset from the position of electrode E on board B.

[0031] By printing the solder P offset from the position of the electrode E and then mounting the component D, it is possible to reduce the amount (size, number) of voids V remaining in the solder P after reflow (see FIG. 10). The optimal value of the printing correction amount R differs for each type of component D and is determined by experimentation or the like. The calculation means 51 calculates one appropriate printing correction amount R for each type of mounting board based on the types of components D mounted on the board B, their ratio, the quality targets required for the mounting board, etc. The calculation means 51 also calculates an appropriate printing correction amount R for each type of component D.

[0032] In Figure 4, the printing device M1 includes a print memory unit 60, a print control unit 61, a transport conveyor 11, a substrate positioning mechanism 15, a substrate holder 16, a camera unit 18, a camera movement mechanism 19, a print head movement mechanism 20, a print head 21, and a print communication unit 62. The print communication unit 62 is a communication interface that exchanges signals and data with the management computer 3 and the print inspection device M2 via the communication network 2. The print memory unit 60 is a storage device that stores print information 60a, print correction amount information 60b, and the like. The print information 60a includes information about the mask 17, printing conditions, and the like for each type of mounting board. The print correction amount information 60b stores the print correction amount R sent from the management computer 3.

[0033] The printing control unit 61 controls each unit based on the printing correction amount R included in the printing information 60a and the printing correction amount information 60b to print the solder P on the board B. That is, the printing device M1 prints the solder P based on the printing correction amount R calculated by the calculation means 51.

[0034] Referring now to FIG. 5, a method for printing solder P on a substrate B using a mask 17A having openings 17a formed to correspond to the positions of electrodes E by a printing device M1 will be described. FIGS. 5(a), 5(b), and 5(c) are explanatory diagrams of a process for aligning a substrate with a mask having openings formed to correspond to the positions of electrodes in a printing device according to an embodiment of the present disclosure. The mask 17A is formed so that when the center Bc of the substrate mark Bm is aligned with the center 17c of the mask mark 17m, the electrodes E formed on the substrate B coincide with the positions of the openings 17a formed in the mask 17A (see FIG. 5(a)). Hereinafter, the position of the center of gravity of the electrodes E to be bonded to the terminals of one component D will be referred to as the electrode center Ec, the position of the center of gravity of the solder P printed on the substrate B to be bonded to the terminals of one component D will be referred to as the solder center Pc, and the center of the component D in a planar view will be referred to as the component center Dc (see FIG. 8).

[0035] In Figure 5(a), first, the printing control unit 61 causes the camera unit 18 to capture images of the mask side mark 17m and the substrate side mark Bm of the substrate B held by the substrate holding unit 16, and recognizes the positions of the center 17c of the mask side mark 17m and the center Bc of the substrate side mark Bm, respectively.

[0036] 5(b), the printing control unit 61 then controls the substrate positioning mechanism 15 based on the printing correction amount R(ΔX, ΔY) included in the printing correction amount information 60b to move the substrate B held by the substrate holding unit 16 so that the center Bc of the substrate-side mark Bm on the substrate B is shifted by ΔX in the X-axis direction and ΔY in the Y-axis direction from the center 17c of the mask-side mark 17m (arrow b1). As a result, the position of the center of gravity of the multiple openings 17a into which the solder P is printed (solder center Pc) is shifted by the printing correction amount R(ΔX, ΔY) from the electrode center Ec of the electrode E.

[0037] 5(c), the print control unit 61 then controls the substrate positioning mechanism 15 to raise the substrate B and bring it into contact with the underside of the mask 17A (arrow b2). The print control unit 61 then controls the print head moving mechanism 20 and the print head 21 to fill the openings 17a in the mask 17A with solder P. The print control unit 61 then controls the substrate positioning mechanism 15 to lower the substrate B and separate it from the mask 17A. This causes the solder P to be printed (transferred) onto the substrate B.

[0038] In this way, the printing device M1 uses a mask 17A having openings 17a formed to match the positions of the electrodes E, aligns the substrate B to a position shifted by the printing correction amount R (ΔX, ΔY) from the correct position (the position where the position of the center Bc of the substrate-side mark Bm coincides with the position of the center 17c of the mask-side mark 17m), brings the substrate B into contact with the mask 17A, and prints the solder P on the substrate B. As a result, the solder P is printed at a position shifted by the printing correction amount R (ΔX, ΔY) from the electrodes E on the substrate B (FIGS. 8(b), 8(c), and 10(a)).

[0039] Next, referring to FIG. 6, a method for printing solder P on a substrate B using a mask 17B having openings 17a formed at positions offset by a printing correction amount R (ΔX, ΔY) from the positions of the electrodes E by the printing device M1 will be described. FIGS. 6(a) and 6(b) are explanatory diagrams of a process for aligning a substrate with a mask having openings formed at positions offset by a printing correction amount from the positions of the electrodes E in a printing device according to an embodiment of the present disclosure. The mask 17B has the openings 17a formed such that, when the center Bc of the substrate-side mark Bm is aligned with the center 17c of the mask-side mark 17m, the center of gravity of the openings 17a (solder center Pc) is offset by the printing correction amount R (ΔX, ΔY) from the electrode center Ec of the electrode E (see FIG. 6(a)). That is, the positions of the openings 17a in the mask 17B are formed based on the printing correction amount R calculated by the calculation means 51. The positions of the openings 17a in the mask 17B can be set for each type of component D based on the printing correction amount R calculated for each type of component D.

[0040] 6(a), first, the printing control unit 61 causes the camera unit 18 to capture images of the mask-side mark 17m and the board-side mark Bm of the board B held by the board holding unit 16, and recognizes the positions of the center 17c of the mask-side mark 17m and the center Bc of the board-side mark Bm. Next, the printing control unit 61 controls the board positioning mechanism 15 to align the position of the board B so that the position of the center Bc of the board-side mark Bm of the board B held by the board holding unit 16 coincides with the center 17c of the mask-side mark 17m. As a result, the position of the center of gravity of the multiple openings 17a in which the solder P is printed (solder center Pc) is shifted from the electrode center Ec of the electrode E by the printing correction amount R (ΔX, ΔY).

[0041] 6(b), the print control unit 61 then controls the substrate positioning mechanism 15 to raise the substrate B and bring it into contact with the underside of the mask 17B (arrow c). The print control unit 61 then controls the print head moving mechanism 20 and the print head 21 to fill the openings 17a in the mask 17A with solder P. The print control unit 61 then controls the substrate positioning mechanism 15 to lower the substrate B and separate it from the mask 17B. This causes the solder P to be printed (transferred) onto the substrate B.

[0042] In this way, the printing device M1 uses a mask 17B having openings 17a formed at positions shifted by the printing correction amount R (ΔX, ΔY) from the positions of the electrodes E, aligns the substrate B to the correct position (a position where the position of the center Bc of the substrate-side mark Bm coincides with the position of the center 17c of the mask-side mark 17m), abuts the substrate B against the mask 17B, and prints the solder P on the substrate B. As a result, the solder P is printed at a position shifted by the printing correction amount R (ΔX, ΔY) from the electrodes E on the substrate B (FIGS. 8(b), 8(c), and 10(a)).

[0043] Next, a method for printing solder P on a substrate B based on a print correction amount R (ΔX, ΔY) by a printing device M1A according to another embodiment will be described with reference to FIG. 7. FIG. 7 is an explanatory diagram showing how solder is printed at a position shifted by the print correction amount from the position of the electrode in a printing device according to another embodiment of the present disclosure. The printing device M1A differs from the printing device M1 in that it does not use a mask 17, is provided with a discharge unit 26 that discharges solder P from discharge ports 26a instead of the print head 21, and is provided with a discharge unit movement mechanism that moves the discharge unit 26 in the X-axis and Y-axis directions instead of the print head movement mechanism 20.

[0044] In Figure 7, the printing control unit of the printing device M1A controls the discharge unit moving mechanism and the discharge unit 26 based on the printing correction amount R (ΔX, ΔY) included in the printing information 60a and the printing correction amount information 60b, and prints the solder P on the substrate B by adjusting the position of the discharge port 26a that discharges the solder P to a position shifted by the printing correction amount R (ΔX, ΔY) from the position of the electrode E.

[0045] In this way, the printing device M1A prints the solder P on the substrate B by aligning the position of the outlet 26a that discharges the solder P to a position shifted by the printing correction amount R (ΔX, ΔY) from the position of the electrode E. As a result, the solder P is printed at a position shifted by the printing correction amount R (ΔX, ΔY) from the electrode E on the substrate B (FIGS. 8(b), 8(c), and 10(a)). In other words, the solder P printed on the substrate B is printed at a position where the solder center Pc is shifted by the printing correction amount R (ΔX, ΔY) from the electrode center Ec.

[0046] 4, the print inspection device M2 includes an inspection memory unit 70, an inspection control unit 71, an inspection transport mechanism 72, an inspection camera 73, an inspection camera movement mechanism 74, a recognition processing unit 75, and an inspection communication unit 76. The inspection communication unit 76 is a communication interface that exchanges signals and data with the management computer 3, the printing device M1, and the component mounting devices M3 to M4 via the communication network 2. The inspection memory unit 70 is a storage device that stores inspection information 70a and the like. The inspection information 70a includes, for each type of mounting board, the positions of multiple openings 17a formed in masks 17, 17A, and 17B.

[0047] The inspection control unit 71 controls the inspection transport mechanism 72 to transport the board B carried out from the printing device M1 to the inspection position, and then carries out the inspected board B to the component mounting device M3. The inspection control unit 71 also controls the inspection camera 73 and the inspection camera moving mechanism 74 to have the inspection camera 73 capture an image of the top surface of the board B on which the solder P is printed. The recognition processing unit 75 is an information processing device that performs image recognition processing on the image captured by the inspection camera 73 to detect the state and position of the solder P printed on the board B. The detected state and position of the solder P (inspection results) are transmitted to the component mounting devices M3 to M4 or the management computer 3 via the communication network 2.

[0048] In FIG. 4, component mounting devices M3-M4 each include a mounting memory unit 80, a mounting control unit 81, a board transport mechanism 31, a board support mechanism 32, a tape feeder 33, a tray feeder 35, a mounting head 36, a head movement mechanism 37, a component recognition camera 40, a board recognition camera 41, and a mounting communication unit 82. The mounting communication unit 82 is a communication interface that exchanges signals and data with the management computer 3, the print inspection device M2, and the reflow device M5 via the communication network 2. The mounting memory unit 80 is a storage device that stores mounting information 80a, inspection result information 80b, and the like. The mounting information 80a includes, for each type of mounting board, the type of component D, the mounting position, the mounting conditions, and the like. The inspection result information 80b stores the inspection results sent from the print inspection device M2.

[0049] Based on the inspection results included in the mounting information 80a and the inspection result information 80b, the mounting control unit 81 controls each unit to mount the component D on the board B in accordance with the position of the printed solder P or the position of the electrode E. In this way, the component mounting devices M3 to M4 mount the component D on the board B in accordance with the position of the solder P printed by the printing devices M1, M1A (FIG. 8(b)). Alternatively, the component mounting devices M3 to M4 mount the component D on the board B in accordance with the position of the electrode E (FIG. 8(c)).

[0050] Next, with reference to Figures 8 to 10, we will explain the effect of the printing position of the solder P on voids V remaining in the solder P after reflow. Figure 8 shows (a) a plan view of a board on which solder has been printed in the correct position and components have been mounted in the correct position by a component mounting system according to an embodiment of the present disclosure; (b) a plan view of a board on which solder has been printed in a position shifted by a printing correction amount and components have been mounted to match the solder position; and (c) a plan view of a board on which solder has been printed in a position shifted by a printing correction amount and components have been mounted to match the electrode position. Figure 9 shows (a) a side view of a board on which solder has been printed in the correct position by a component mounting system according to an embodiment of the present disclosure and components have been mounted in the correct position before reflow, (b) a side view of a board during reflow, and (c) a side view of a board after reflow. 10A and 10B are side views of a substrate on which solder has been printed at a position shifted by a printing correction amount by a component mounting system according to an embodiment of the present disclosure, the side views showing (a) the state before reflow, (b) the state during reflow, and (c) the state after reflow, of the substrate on which a component has been mounted in accordance with the solder position. Figures 8A and 9A show a state in which solder P has been printed on substrate B so that the position of solder P (solder center Pc) coincides with the position of electrode E (electrode center Ec), and a component D has been mounted in accordance with the position of electrode E.

[0051] When this board B is heated inside the reflow equipment M5, the granular solder P melts and becomes liquid (Fig. 9(b)). At this time, the air remaining between the granular solder P moves within the liquid solder P and grows into large voids V. When the board B is removed from the reflow equipment M5 and the solder P solidifies, voids V remain within the solidified solder P (Fig. 9(c)). If voids V remain within the solder P, there is a risk that the long-term reliability of the solder joint will be reduced.

[0052] 8(b) and 10(a) show a state in which solder P is printed on board B so that the position of solder P (solder center Pc) is shifted from the position of electrode E (electrode center Ec) by a printing correction amount R (ΔX, ΔY), and component D is mounted in accordance with the position of the printed solder P. In other words, component D is mounted so that the component center Dc of component D is shifted from the electrode center Ec of electrode E by a printing correction amount R (ΔX, ΔY).

[0053] When this board B is heated inside the reflow device M5, the granular solder P melts and becomes liquid (Figure 10(b)). At this time, the liquid solder P is pulled toward the electrode E. During this process, the air remaining between the granular solder P is expelled from the flowing solder P, and voids V disappear from the liquid solder P. The position of component D (component center Dc) also moves toward electrode E due to the so-called self-alignment effect. When board B is removed from the reflow device M5 and the solder P solidifies, there are no (or very few) voids V in the solidified solder P, and a high-quality solder joint is formed (Figure 10(c)). The self-alignment effect also causes the position of component D (component center Dc) to move toward the position of electrode E (electrode center Ec).

[0054] FIG. 8(c) shows a state in which solder P is printed on board B so that the position of solder P (solder center Pc) is shifted from the position of electrode E (electrode center Ec) by a printing correction amount R (ΔX, ΔY), and component D is attached to match the position of electrode E. In other words, component D is attached so that the component center Dc of component D is aligned with the electrode center Ec of electrode E. In this case, as with the example described in FIG. 10, any air remaining in the solder P that becomes liquid and flows during the reflow process is expelled to the outside, resulting in no (or very few) voids V in the solidified solder P, resulting in the formation of a high-quality solder joint.

[0055] Next, a component mounting method in which the component mounting system 1 prints solder P on a board B having electrodes E and then mounts a component D on the board B on which the solder P has been printed will be described with reference to the flow chart in FIG. 11. FIG. 11 is a flow chart of the component mounting method according to an embodiment of the present disclosure. First, the calculation means 51 calculates a print correction amount R (ΔX, ΔY) for shifting the position of the solder P to be printed on the board B from the position of the electrode E on the board B based on the board information 50a (ST1: print correction amount calculation step). Next, the printing devices M1 and M1A print the solder P on the board B based on the calculated print correction amount R (ΔX, ΔY) (ST2: printing step). Next, the component mounting devices M3 and M4 mount the component D on the board B in alignment with the position of the printed solder P or with the position of the electrode E (ST3: component mounting step). This allows the occurrence of voids V in the solder P to be appropriately suppressed.

[0056] As described above, the component mounting system 1 of this embodiment includes printing devices M1, M1A that print solder P on a board B having electrodes E, and component mounting devices M3-M4 that attach components D to the board B on which the solder P has been printed, and is equipped with calculation means 51 that calculates a printing correction amount R (ΔX, ΔY) for shifting the position of the solder P to be printed on the board B from the position of the electrodes E on the board B, and the printing devices M1, M1A print the solder P on the board B based on the printing correction amount R (ΔX, ΔY) calculated by the calculation means 51. This makes it possible to appropriately suppress the occurrence of voids V in the solder P.

[0057] Although the embodiments have been described above with reference to the accompanying drawings, the present disclosure is not limited to such examples. It is clear that a person skilled in the art can conceive of various modifications, alterations, substitutions, additions, deletions, and equivalents within the scope of the claims, and it is understood that these also fall within the technical scope of the present disclosure. Furthermore, the components in the above-described embodiments may be combined in any manner without departing from the spirit of the invention. [Industrial Applicability]

[0058] The component mounting system and component mounting method of the present disclosure have the effect of being able to appropriately suppress the occurrence of voids in solder, and are useful in the field of mounting components on substrates. [Explanation of symbols]

[0059] 1. Component mounting system 17, 17A, 17B Mask 17a aperture 26a Discharge port B board E-electrode M1,M1A Printing device M3~M4 component mounting equipment P solder R Printing correction amount

Claims

1. A component mounting system including a printing device that prints solder on a substrate having electrodes, and a component mounting device that mounts components on the substrate on which the solder has been printed, a calculation means for calculating a printing correction amount for shifting the position of the solder printed on the board from the position of the electrode on the board; The printing device prints the solder on the board based on the print correction amount calculated by the calculation means.

2. 2. The component mounting system according to claim 1, wherein the printing device uses a mask having openings formed to match the positions of the electrodes, aligns the substrate to a position shifted by the printing correction amount from a normal position, and prints the solder on the substrate.

3. 2. The component mounting system according to claim 1, wherein the printing device uses a mask having openings formed at positions shifted by the printing correction amount from the positions of the electrodes, aligns the substrate to a correct position, and prints the solder on the substrate.

4. 2. The component mounting system according to claim 1, wherein the printing device prints the solder on the board by aligning the position of the discharge port that discharges the solder with a position that is shifted from the position of the electrode by the print correction amount.

5. The component mounting system according to claim 1 , wherein the component mounting device mounts the component in accordance with the position of the solder printed by the printing device.

6. The component mounting system according to claim 1 , wherein the component mounting device mounts the component in accordance with the position of the electrode.

7. A component mounting method for printing solder on a substrate having electrodes and mounting components on the substrate on which the solder is printed, comprising: calculating a printing correction amount for shifting the position of the solder to be printed on the board from the position of the electrode on the board; printing the solder on the board based on the calculated printing correction amount; A component mounting method for mounting components on the substrate.

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