Holding device

Abstract

To provide a holding device capable of improving a heat removal property on a holding surface.SOLUTION: An electrostatic chuck 1 comprises: a ceramic plate 10 having a holding surface 11 and a lower surface 12 provided on the opposite side, in the thickness direction, to the holding surface 11; a coolant passage 13, for flowing a coolant, which is formed inside the ceramic plate 10; and a gas passage 41, for supplying inert gas onto the holding surface 11, which is formed inside the ceramic plate 10. The electrostatic chuck holds a semiconductor wafer W on the holding surface 11. The coolant passage 13 has a coolant tunnel 14 which is formed in an XY-plane direction. The gas passage 41 has a gas tunnel 42 which is formed in the XY-plane direction. The coolant tunnel 14 is disposed further on the holding surface 11 side than the gas tunnel 42.SELECTED DRAWING: Figure 2

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