Display panel, method for manufacturing display panel and electronic equipment

Abstract

SOLUTION: A display panel includes an array substrate, a partition structure, light emitting elements, a first packaging layer, and a second packaging layer, the partition structure is located on one side of the array substrate, forms an enclosed, isolated opening, with at least a portion of the light emitting elements positioned within the partition opening, the first packaging layer is located on the side away from the array substrate of the light emitting element, and includes a packaging unit, a gap exists between the packaging unit located on the side away from the array substrate of the partition structure and the side away from the array substrate of the partition structure, and the second packaging layer is located on the side away from the array substrate of the first packaging layer, with at least a portion of the second packaging layer extending into the gap.EFFECT: It improves the stability of a packaging unit located on the side away from an array substrate of a partition structure, makes the packaging unit more resistant to breakage and enhances the stability of a display panel.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] This application claims priority from a Chinese patent application bearing application number 202410337713.0, filed on March 21, 2024, for "Display panel, method for manufacturing a display panel, and electronic device," the entire contents of which are incorporated herein by reference.

[0002] The present application relates to the technical field of displays, and more particularly to a display panel, a method for manufacturing a display panel, and an electronic device. [Background technology]

[0003] Flat panel displays based on technologies such as organic light emitting diodes (OLEDs) and light emitting diodes (LEDs) have advantages such as high image quality, power saving, thinness, and a wide range of applications, and are therefore widely used in various consumer electronic products such as mobile phones, televisions, laptops, and desktop computers, becoming the mainstream display panel.

[0004] However, there are still problems to be solved in the display panel. Summary of the Invention

[0005] In order to solve the technical problems described in the background art above, the embodiments of the present application include: an array substrate; a partition structure located on one side of the array substrate and surrounded by the partition structure to form an isolation opening; a light emitting element at least partially located within the partition opening; a first packaging layer located on a side of the light-emitting element away from the array substrate, the first packaging layer including a packaging unit, the packaging unit extending from a side of the partition structure to the side of the partition structure away from the array substrate, the side of the partition structure facing the partition opening of the partition structure, and a gap between the packaging unit located on the side of the partition structure away from the array substrate and the side of the partition structure away from the array substrate; a second packaging layer located on a side of the first packaging layer away from the array substrate, the second packaging layer having at least a portion extending into the gap.

[0006] In some possible embodiments, the present application further comprises: an array substrate; a partition structure located on one side of the array substrate and surrounded by the partition structure to form an isolation opening; a light-emitting element at least a portion of which is located within the partition opening; a first packaging layer located on a side of the light-emitting element away from the array substrate, the first packaging layer including a packaging unit extending from a side of the partition structure to the side of the partition structure away from the array substrate, the side of the partition structure facing the partition opening, a gap between the packaging unit located on the side of the partition structure away from the array substrate and the side of the partition structure away from the array substrate, and heights of the gaps corresponding to the light-emitting elements of different colors are not equal; a second packaging layer located on a side of the first packaging layer away from the array substrate, the second packaging layer having at least a portion extending into the gap.

[0007] In some possible embodiments, the present application further comprises: providing an array substrate; forming a partition structure on one side of the array substrate, the partition structure being surrounded to form an isolation opening; forming at least a portion of a light emitting element within the partition opening; forming a first packaging layer on a side of the light-emitting element away from the array substrate, the first packaging layer including a packaging unit, the packaging unit extending from a side of the partition structure to the side of the partition structure away from the array substrate, the side of the partition structure facing the partition opening, and a gap between a part of the packaging unit located on the side of the partition structure away from the array substrate and the side of the partition structure away from the array substrate; and forming a second packaging layer on a side of the first packaging layer away from the array substrate, wherein at least a portion of the second packaging layer extends into the gap.

[0008] In some possible embodiments, the present application further provides an electronic device including a display panel described herein or a display panel manufactured by the method for manufacturing a display panel described herein. [Effects of the Invention]

[0009] Compared to existing technologies, the present application has the following beneficial effects:

[0010] In the display panel, the manufacturing method of the display panel, and the electronic device according to the present application, at least a portion of the second packaging layer is extended into the gap, so that the second packaging layer can support the suspended packaging unit, improving the stability of the packaging unit located on the side of the partition structure away from the array substrate, making the packaging unit less likely to break, and thereby improving the stability of the display panel. [Brief explanation of the drawings]

[0011] [Figure 1] 1 is a cross-sectional view of a display panel according to a related art provided by an embodiment of the present application; [Figure 2] 1 is a cross-sectional view of a display panel according to an embodiment of the present application; [Figure 3] 1 is a cross-sectional view of a display panel provided according to an embodiment of the present application, the display panel including a third packaging layer. [Figure 4] FIG. 2 is a cross-sectional schematic diagram of a partition structure provided by an embodiment of the present application that includes a three-layer structure. [Figure 5] 1 is a flow diagram of a method for manufacturing a display panel according to an embodiment of the present application; [Figure 6] FIG. 2 is a cross-sectional view of a first electrode layer formed on one side of an array substrate provided by an embodiment of the present application. [Figure 7] 3 is a cross-sectional view of a pixel-defining material layer formed on a side of a first electrode layer away from an array substrate according to an embodiment of the present application; FIG. [Figure 8] 1 is a schematic cross-sectional view of a pixel-defining material layer provided in accordance with an embodiment of the present application, on the side of the pixel-defining material layer away from the array substrate, forming a partition structure material layer; [Figure 9] 1 is a cross-sectional view illustrating a partition structure material layer provided in an embodiment of the present invention after dry etching. [Figure 10] 1 is a schematic cross-sectional view of a partition structure material layer provided in an embodiment of the present application when a patterning process is performed thereon. [Figure 11] 2 is a cross-sectional view of a pixel-defining material layer according to an embodiment of the present invention after a patterning process is performed; FIG. [Figure 12] 1 is a cross-sectional view showing a partition structure according to an embodiment of the present invention, in which a light-emitting functional layer of a first color light-emitting element is formed on the side away from the array substrate. [Figure 13] 3 is a cross-sectional view showing a first color light-emitting element provided by an embodiment of the present application, in which a second electrode layer is formed on the side of the light-emitting functional layer away from the array substrate. FIG. [Figure 14] FIG. 10 is a first cross-sectional schematic view of forming a first packaging layer on the side of the second electrode layer away from the array substrate provided by an embodiment of the present application. [Figure 15]3 is a cross-sectional view illustrating a process of forming a first etching protection layer in a partition opening corresponding to a first color light-emitting element according to an embodiment of the present application; FIG. [Figure 16] 1 is a schematic cross-sectional view illustrating a process of removing the first packaging layer, the light-emitting functional layer, and the second electrode layer that are not covered by the first etching protection layer provided in an embodiment of the present application, and removing the first etching protection layer. [Figure 17] 10 is a cross-sectional view showing a partition structure according to an embodiment of the present invention, in which a light-emitting functional layer of a second color light-emitting element is formed on the side away from the array substrate. FIG. [Figure 18] 3 is a cross-sectional view showing a second electrode layer formed on the side of the light-emitting functional layer of a second color light-emitting element provided by an embodiment of the present application that is farther away from the array substrate. FIG. [Figure 19] FIG. 10 is a second cross-sectional schematic view of forming a first packaging layer on the side of the second electrode layer away from the array substrate provided by an embodiment of the present application. [Figure 20] 10 is a cross-sectional view illustrating the formation of a second etching protection layer in a partition opening corresponding to a second color light-emitting element according to an embodiment of the present application. FIG. [Figure 21] This is a schematic cross-sectional view showing the sequential removal of the first packaging layer, light-emitting functional layer, and second electrode layer of a second-color light-emitting element not covered by the second etching protection layer provided by an embodiment of the present application, and the removal of the second etching protection layer. DETAILED DESCRIPTION OF THE INVENTION

[0012] As shown in Figure 1, a display panel in the related art includes an array substrate 1, a partition structure 7 located on one side of the array substrate 1, a light-emitting element 10 located within a partition opening 9 formed at least in part by the partition structure 7, and a first packaging layer 6 located on the side of the partition structure 7 away from the array substrate 1, where the first packaging layer 6 includes a packaging unit 61 that extends from the side of the partition structure 7 to the side of the partition structure 7 away from the array substrate 1.

[0013] When manufacturing a display panel in the related art, the vapor deposition material above the partition structure 7 is removed during the wet etching process, resulting in a gap 8 between the part of the packaging unit 61 located on the side of the partition structure 7 away from the array substrate 1 and the side of the partition structure 7 away from the array substrate 1. Therefore, the packaging unit 61 located on the side of the partition structure 7 away from the array substrate 1 is in a suspended state, and the suspended packaging unit 61 is likely to break during the subsequent manufacturing process, thereby reducing the stability of the display panel and ultimately affecting the display quality of the display panel.

[0014] In view of this, this embodiment provides a technical form that can improve the stability of the display panel, and the technical form according to this embodiment will be described in detail below.

[0015] As shown in FIG. 2, this embodiment provides a display panel, which includes an array substrate 1 , a partition structure 7 , a light emitting element 10 , a first packaging layer 6 and a second packaging layer 11 .

[0016] The array substrate 1 may include a substrate and a plurality of driving units located on one side of the substrate, each of which may include one or more semiconductor switching elements. The semiconductor switching elements may be formed by the cooperation of multiple film layers of the array substrate 1, for example, thin film transistors formed by the cooperation of multiple film layers.

[0017] The partition structure 7 is located on one side of the array substrate 1, the partition structure 7 defines a partition opening 9, and at least a portion of the light-emitting element 10 is located within the partition opening 9.

[0018] The light-emitting elements 10 include red, blue, and green light-emitting elements.

[0019] The configuration, manufacture, etc. of the partition structure 7 are further described in patents PCT / CN2023 / 134518, 202310759370.2, 202310740412.8, 202310707209.0, 202311346196.5, and 202310692671.8 for reference.

[0020] The first packaging layer 6 is located on the side of the light-emitting element 10 away from the array substrate 1, and includes a packaging unit 61 that extends from the side of the partition structure 7 to the side of the partition structure 7 away from the array substrate 1, the side of the partition structure 7 facing the partition opening 9 of the partition structure 7, and there is a gap 8 between the packaging unit 61 located on the side of the partition structure 7 away from the array substrate 1 and the side of the partition structure 7 away from the array substrate 1. The second packaging layer 11 is located on the side of the first packaging layer 6 away from the array substrate 1, and at least a portion of the second packaging layer 11 extends into the gap 8.

[0021] During the patterning process of the light-emitting element, the first packaging layer 6 forms a packaging unit 61, and finally forms a plurality of packaging units 61 spaced apart from one another, which can independently package the light-emitting elements 10, thereby improving the display characteristics of the display panel.

[0022] Two adjacent packaging units 61 are spaced apart on the side of the partition structure 7 that faces away from the array substrate 1, and the orthogonal projection of the packaging units 61 on the array substrate 1 covers the orthogonal projection of the partition opening 9 on the array substrate 1 and also covers the orthogonal projection of part of the partition structure 7 on the array substrate 1. When forming the second packaging layer 11, the material of the second packaging layer 11 flows into and fills the gap 8, and the second packaging layer 11 located in the gap 8 can support the packaging unit 61 located on the side of the partition structure 7 that faces away from the array substrate 1. This makes the packaging unit 61 less likely to break during subsequent manufacturing processes, thereby improving the stability and yield of the display panel.

[0023] Due to the above design, in this embodiment, at least a portion of the second packaging layer 11 extends into the gap 8, so that the second packaging layer 11 can support the suspended packaging unit 61, thereby improving the stability of the packaging unit 61 located on the side of the partition structure 7 away from the array substrate 1, making the packaging unit 61 less likely to break, and improving the stability of the display panel.

[0024] 2 , in some possible embodiments, the light-emitting element 10 includes a first electrode layer, a light-emitting functional layer, and a second electrode layer that are stacked in this order along a direction away from the array substrate 1, and a first packaging layer 6 is located on the side of the second electrode layer that faces away from the array substrate 1. The first electrode layer includes a first electrode 2, the light-emitting functional layer includes a light-emitting portion 4, and the second electrode layer includes a second electrode 5, and the orthogonal projection of the partition opening 9 on the array substrate 1 and the orthogonal projection of the first electrode 2 on the array substrate 1 at least partially overlap, the light-emitting portion 4 is located within the partition opening 9, and the second electrode 5 is electrically connected to the partition structure 7.

[0025] The display panel further includes a pixel definition layer 3 located on a side of the first electrode layer facing away from the array substrate 1, and a partition structure 7 located on a side of the pixel definition layer 3 facing away from the array substrate 1. The pixel definition layer 3 includes pixel openings 31 that expose at least a portion of the first electrode 2, and the orthogonal projections of the partition structure 7 on the array substrate 1 are located between the orthogonal projections of two adjacent pixel openings 31 on the array substrate 1. The orthogonal projections of the pixel openings 31 on the array substrate 1 are located within the orthogonal projections of the partition openings 9 on the array substrate 1.

[0026] When forming the light-emitting functional layer, the light-emitting functional layer is partitioned by a partition structure 7 to form a plurality of light-emitting sections 4 spaced apart, and when forming the second electrode layer, the second electrode layer is partitioned by the partition structure 7 to form a plurality of second electrodes 5 spaced apart, the partition structure 7 containing a conductive material, and the second electrodes 5 are electrically connected to the partition structure 7, so that one first electrode 2, one light-emitting section 4, and one second electrode 5 form one light-emitting element 10. The first electrode 2 is an anode, and the second electrode 5 is a cathode.

[0027] In some possible embodiments, along the direction perpendicular to the array substrate 1, the height h of the gap is greater than the thickness of the light-emitting functional layer, and along the direction perpendicular to the array substrate 1, the height h of the gap is less than the distance from the side of the second electrode 5 away from the array substrate 1 to the side of the first electrode 2 closer to the array substrate 1, and the heights h of the gaps corresponding to the light-emitting elements 10 of different colors are not equal.

[0028] Preferably, as shown again in Figure 2, along the direction perpendicular to the array substrate 1, the height h of the gap 8 is equal to the distance H from the side of the first electrode 2 of the light-emitting element away from the array substrate 1 to the side of the packaging unit 61 close to the array substrate 1.

[0029] During the manufacturing process of the display panel, a light-emitting functional layer and a second electrode layer are present between a portion of the partition structure 7 of the packaging unit 61 located on the side away from the array substrate 1 and the partition structure 7 on the side away from the array substrate 1, and after the manufacturing of the display panel is completed, the light-emitting functional layer and the second electrode layer between the portion of the partition structure 7 of the packaging unit 61 located on the side away from the array substrate 1 and the partition structure 7 on the side away from the array substrate 1 are removed, so that the height h of the gap 8 along the direction perpendicular to the array substrate 1 is equal to the sum of the thicknesses of the light-emitting functional layer and the second electrode layer of the light-emitting element. In this way, when the second packaging layer 11 is formed, the material of the second packaging layer 11 can easily fill the gap 8, thereby further improving the stability of the display panel.

[0030] TIFF2025146764000002.tif30170

[0031] 2 , in some possible embodiments, the minimum distance D between the orthogonal projection of the edge of the packaging unit 61 on the array substrate 1 and the orthogonal projection of the edge of the partition structure 7 on the array substrate 1 is 1 μm to 2 μm, for example, the minimum distance D may be 1 μm, 1.2 μm, 1.5 μm, 1.8 μm, 2 μm, etc. The minimum distance D is the horizontal length of the hanging portion of the packaging unit 61 located on the side of the partition structure 7 away from the array substrate 1. By rationally optimizing the minimum distance D, the second packaging layer 11 can more easily fill the gap 8, thereby further improving the stability of the display panel.

[0032] 3, the display panel further includes a third packaging layer 12 located on a side of the second packaging layer 11 away from the array substrate 1, and the side of the second packaging layer 11 away from the array substrate 1 is arranged flat. The materials of the first packaging layer 6 and the third packaging layer 12 both include inorganic materials, and the material of the second packaging layer 11 includes organic materials.

[0033] The third packaging layer 12 can further improve the packaging effect for the display panel. The side of the second packaging layer 11 away from the array substrate 1 is set flat, which can further improve the display quality of the display panel.

[0034] In some possible embodiments, as shown again in Figure 3, the partition structure 7 includes a first partition section 71 and a second partition section 72 that are stacked in order along a direction away from the array substrate 1, and the orthogonal projection of the first partition section 71 on the array substrate 1 on the side away from the array substrate is located within the orthogonal projection of the second partition section 72 on the array substrate 1.

[0035] The second partition portion 72 is located on the side of the first partition portion 71 that faces away from the array substrate 1, and the width of the second partition portion 72 is greater than the width of the first partition portion 71 on the side that faces away from the array substrate 1, so the second partition portion 72 separates the light-emitting function layer and the second electrode layer at the partition structure 7. In this way, the partition structure 7 formed by the first partition portion 71 and the second partition portion 72 makes it easy to package each light-emitting element 10 independently.

[0036] In some possible embodiments, as shown in FIG. 3 again, the second electrode 5 of the light-emitting element 10 is electrically connected to the first partition portion 71. As shown in FIG. 4, and / or the partition structure 7 further includes a third partition portion 73 located on the side of the first partition portion 71 facing the array substrate 1, and the second electrode 5 of the light-emitting element 10 is electrically connected to the third partition portion 73. The material of the third partition portion 73 includes molybdenum metal. And / or the material of the first partition portion 71 includes aluminum metal. And / or the material of the second partition portion 72 includes titanium metal. In this way, when the partition structure 7 separates the second electrode layer as the second electrode 5, the second electrode 5 is more likely to be electrically connected to the first partition portion 71 and / or the third partition portion 73.

[0037] As described above, in the present application, at least a portion of the second packaging layer 11 is extended into the gap 8, so that the second packaging layer 11 can support the suspended packaging unit 61, thereby improving the stability of the packaging unit 61 located on the side of the partition structure 7 away from the array substrate 1, making the packaging unit 61 less likely to break and improving the stability of the display panel.

[0038] In some possible embodiments, the present application further provides a method for manufacturing a display panel, as shown in Figure 5. The method includes the following steps:

[0039] S10: Provide an array substrate 1.

[0040] The array substrate 1 may include a substrate and a plurality of driving units located on one side of the substrate, each of which may include one or more semiconductor switching elements. The semiconductor switching elements may be formed by the cooperation of multiple film layers of the array substrate 1, for example, thin film transistors formed by the cooperation of multiple film layers.

[0041] S11: Form a partition structure 7 on one side of the array substrate 1, the partition structure 7 defining a partition opening 9.

[0042] As shown in FIG. 6, a first electrode layer is formed on one side of the array substrate 1, and the first electrode layer includes a plurality of first electrodes 2 spaced apart from one another.

[0043] As shown in FIG. 7, a pixel defining material layer 13 is formed on the side of the first electrode layer away from the array substrate 1 .

[0044] As shown in FIG. 8, a partition structure material layer 14 is formed on the side of the pixel defining material layer 13 that faces away from the array substrate 1 .

[0045] As shown in FIG. 9, the partition structure material layer 14 is subjected to dry etching.

[0046] As shown in FIG. 10, the partition structure material layer 14 is subjected to a patterning process to form the partition structures 7.

[0047] As shown in FIG. 11 , the pixel defining material layer 13 is patterned to form a pixel defining layer 3, which includes a pixel opening 31 that exposes at least a portion of the first electrode 2, and the orthogonal projection of the pixel opening 31 on the array substrate 1 is located within the orthogonal projection of the partition opening 9 on the array substrate 1.

[0048] S12: At least a part of the light emitting element 10 is formed inside the partition opening 9.

[0049] As shown in FIG. 12, a light-emitting functional layer for a first color light-emitting element is formed on the side of the partition structure 7 that is farther away from the array substrate 1.

[0050] The light-emitting functional layer is broken at the partition structure 7, so that at least a portion of the light-emitting functional layer is located within the partition opening 9 to form the light-emitting section 4, and by controlling the deposition angle, contact between the light-emitting section 4 and the partition structure 7 can be prevented.

[0051] As shown in FIG. 13, a second electrode layer is formed on the side of the light-emitting functional layer of the first color light-emitting element that is farther away from the array substrate 1.

[0052] The second electrode layer is broken at the partition structures 7, so that at least a portion of the second electrode layer is located within the partition openings 9 to form the second electrodes 5. By controlling the deposition angle, the second electrodes 5 can be extended from within the partition openings 9 until they are in electrical contact with the partition structures 7, thereby connecting adjacent second electrodes 5 or connecting the second electrodes 5 to other circuits. In this way, the difficulty of manufacturing the display panel can be reduced.

[0053] S13: A first packaging layer 6 is formed on the side of the light-emitting element 10 away from the array substrate 1, the first packaging layer 6 includes a packaging unit 61, the packaging unit 61 extends from the side of the partition structure 7 to the side of the partition structure 7 away from the array substrate 1, the side of the partition structure 7 is the surface facing the partition opening 9 of the partition structure 7, and there is a gap 8 between the packaging unit 61 located on the side of the partition structure 7 away from the array substrate 1 and the side of the partition structure 7 away from the array substrate 1.

[0054] As shown in Figure 14, a first packaging layer 6 is formed on the side of the second electrode layer away from the array substrate 1, and the first packaging layer 6 covers both the second electrode layer located on the side of the partition structure 7 away from the array substrate 1 and the second electrode layer located within the partition opening 9.

[0055] As shown in FIG. 15, a first etching protection layer 15 is formed in the partition opening 9 corresponding to the first color light emitting element.

[0056] The light-emitting element 10 may include a first color light-emitting element, a second color light-emitting element, and a third color light-emitting element, where the first color light-emitting element may be a red light-emitting element, the second color light-emitting element may be a green light-emitting element, and the third color light-emitting element may be a blue light-emitting element. The first etching protection layer 15 can protect the corresponding light-emitting functional layer of the first color light-emitting element, the second electrode layer, and the first packaging layer 6.

[0057] 16, the first packaging layer 6, the light-emitting functional layer, and the second electrode layer that are not covered by the first etching protective layer 15 are removed, and the first etching protective layer 15 is also removed, thereby forming the light-emitting portion 4, the second electrode 5, and the packaging unit 61 in the pixel opening 31 corresponding to the first color light-emitting element. Along the direction perpendicular to the array substrate 1, the height h1 of the gap 8 is equal to the distance H1 from the side of the first electrode 2 corresponding to the first color light-emitting element that is away from the array substrate 1 to the side of the packaging unit 61 that is close to the array substrate 1.

[0058] When the first packaging layer 6, the light-emitting functional layer, and the second electrode layer that are not covered by the first etching protection layer 15 are removed, the light-emitting functional layer and the second electrode layer between the packaging unit 61 located on the side of the partition structure 7 away from the array substrate 1 and the partition structure 7 are also removed, so that the height h1 of the gap 8 along the direction perpendicular to the array substrate 1 is equal to the sum of the thicknesses of the light-emitting section 4 corresponding to the first color light-emitting element and the second electrode 5. In this way, the light-emitting functional layer and the second electrode layer are completely covered by the packaging unit 61, and the light-emitting functional layer and the second electrode layer between the part of the packaging unit 61 located on the side of the partition structure 7 away from the array substrate 1 and the side of the partition structure 7 away from the array substrate 1 are removed, reducing the risk of the deposition material being exposed to air entering the deposition apparatus and causing contamination of the apparatus or rupture of the film layer.

[0059] In this way, no precise photomask is required, and the light-emitting portion 4, the second electrode 5 and the packaging unit 61 can be formed only in the pixel opening 31 corresponding to the first color light-emitting element, and the second electrode 5 can be electrically connected to the partition structure 7, thereby making it possible to form the first color light-emitting element in the pixel opening 31 corresponding to the first color light-emitting element at a lower cost.

[0060] As shown in Figure 17, an emitting functional layer for the second color light-emitting element is formed on the side of the partition structure 7 away from the array substrate 1, and the emitting functional layer for the second color light-emitting element covers the side of the packaging unit 61 corresponding to the first color light-emitting element away from the array substrate 1.

[0061] After forming the first color light-emitting element, the light-emitting functional layer of the second color light-emitting element is subsequently formed, and the light-emitting functional layer of the second color light-emitting element covers the packaging unit 61 corresponding to the first color light-emitting element and forms the light-emitting portion 4 of the second color light-emitting element within the pixel opening 31 corresponding to the second color light-emitting element.

[0062] As shown in Figure 18, a second electrode layer is formed on the side of the light-emitting functional layer of the second color light-emitting element away from the array substrate 1, and a second electrode 5 of the second color light-emitting element is formed within the pixel opening 31 corresponding to the second color light-emitting element, and the second electrode 5 of the second color light-emitting element is connected to the electrode of the partition structure 7.

[0063] As shown in FIG. 19, a first packaging layer 6 is formed on the side of the second electrode layer that is farther away from the array substrate 1.

[0064] 20, a second etching protection layer 16 is formed in the partition opening 9 corresponding to the second color light-emitting element. The second etching protection layer 16 can protect the light-emitting functional layer, the second electrode layer, and the first packaging layer 6 corresponding to the second color light-emitting element.

[0065] 21 , the first packaging layer 6, the light-emitting functional layer, and the second electrode layer of the second color light-emitting element that are not covered by the second etching protective layer 16 are removed, and the second etching protective layer 16 is also removed, thereby forming the light-emitting portion 4, the second electrode 5, and the packaging unit 61 in the pixel opening 31 corresponding to the second color light-emitting element. Along the direction perpendicular to the array substrate 1, the height h2 of the gap 8 is equal to the distance H2 from the side of the first electrode 2 corresponding to the second color light-emitting element that is away from the array substrate 1 to the side of the packaging unit 61 that is close to the array substrate 1.

[0066] When the first packaging layer 6, the light-emitting functional layer, and the second electrode layer that are not covered by the second etching protection layer 16 are removed, the light-emitting functional layer and the second electrode layer between the part of the packaging unit 61 that is located on the side away from the array substrate 1 of the partition structure 7 and the partition structure 7 are also removed together, and therefore, along the direction perpendicular to the array substrate 1, the height h2 of the gap 8 is equal to the sum of the thicknesses of the light-emitting section 4 and the second electrode 5 corresponding to the second color light-emitting element.

[0067] In this way, no precise photomask is required, and the light-emitting portion 4, the second electrode 5, and the packaging unit 61 can be formed only in the pixel opening 31 corresponding to the second color light-emitting element, and the second electrode 5 can be electrically connected to the partition structure 7. In this way, the second color light-emitting element can be formed in the pixel opening 31 corresponding to the second color light-emitting element at a lower cost.

[0068] In this way, by adopting the above steps, the light emitting portion 4, the second electrode 5 and the packaging unit 61 can be formed in the pixel opening 31 corresponding to the light emitting element 10 of a third color or more other colors. The plurality of light emitting elements 10 formed through the above steps can be individually packaged, so that the light emitting elements 10 are independent from each other and the optical properties of the display panel can be optimized.

[0069] S14: The second packaging layer 11 is formed on the side of the first packaging layer 6 that is away from the array substrate 1, and at least a part of the second packaging layer 11 extends into the gap 8.

[0070] As shown in FIG. 2 again, after forming the light-emitting elements 10 of various colors by the above method, a second packaging layer 11 is formed on the side of the first packaging layer 6 away from the array substrate 1. The material of the second packaging layer 11 flows into the gap 8 and fills it. The second packaging layer 11 located in the gap 8 can support the packaging unit 61 located on the side of the partition structure 7 away from the array substrate 1, making the packaging unit 61 less likely to break during the subsequent manufacturing process, thereby improving the stability and yield of the display panel.

[0071] In some possible embodiments, the present application further provides an electronic device that includes a display panel according to the present application or a display panel manufactured by the method for manufacturing a display panel according to the present application. The electronic device may include a device with an image processing function, such as a server, a personal computer, or a laptop. The electronic device has better stability and yield because it includes the display panel according to the present application. [Explanation of symbols]

[0072] 1 Array board 2 1st electrode 3 Pixel Definition Layer 31 pixel aperture 4 Light-emitting part 5 Second electrode 6 First Packaging Layer 61 Packaging Unit 7 Partition structure 71 First partition 72 Second partition 73 Third partition 8. Gap 9 Partition opening 10 Light-emitting element 11 Second Packaging Layer 12 Third Packaging Layer 13 Pixel Definition Material Layers 14 Partition structural material layer 15 First etching protection layer 16 Second etching protection layer

Claims

1. A display panel, an array substrate; a partition structure located on one side of the array substrate and surrounded by the partition structure to form an isolation opening; a light emitting element at least partially located within the partition opening; a first packaging layer located on a side of the light-emitting element away from the array substrate, the first packaging layer including a packaging unit, the packaging unit extending from a side of the partition structure to the side of the partition structure away from the array substrate, the side of the partition structure facing the partition opening of the partition structure, and a gap between the packaging unit located on the side of the partition structure away from the array substrate and the side of the partition structure away from the array substrate; a second packaging layer located on a side of the first packaging layer away from the array substrate, at least a portion of which extends into the gap; A display panel characterized by:

2. the light emitting device includes a first electrode layer, a light emitting function layer, and a second electrode layer that are sequentially stacked along a direction away from the array substrate, and the first packaging layer is located on a side of the second electrode layer that is away from the array substrate; the first electrode layer includes a first electrode, the light-emitting function layer includes a light-emitting portion, the second electrode layer includes a second electrode, an orthogonal projection of the partition opening on the array substrate and an orthogonal projection of the first electrode on the array substrate at least partially overlap each other, the light-emitting portion is located within the partition opening, and the second electrode is electrically connected to the partition structure; 2. The display panel according to claim 1, wherein the first and second electrodes are arranged parallel to each other.

3.

4. a minimum distance between an orthogonal projection of an edge of the packaging unit on the array substrate and an orthogonal projection of an edge of the partition structure on the array substrate is 1 μm to 2 μm; two adjacent packaging units are spaced apart from each other on a side of the partition structure that is away from the array substrate; an orthogonal projection of the packaging unit on the array substrate covers an orthogonal projection of the partition opening on the array substrate and also covers an orthogonal projection of a part of the partition structure on the array substrate; 2. The display panel according to claim 1, wherein the first and second electrodes are arranged parallel to each other.

5. the second packaging layer completely fills the gap; a side of the second packaging layer away from the array substrate is flat; the display panel further includes a third packaging layer located on a side of the second packaging layer away from the array substrate, the first packaging layer and the third packaging layer both contain inorganic materials; the material of the second packaging layer comprises an organic material; 2. The display panel according to claim 1, wherein the first and second electrodes are arranged parallel to each other.

6. the display panel further includes a pixel definition layer located on a side of the first electrode layer away from the array substrate, the partition structure being located on the side of the pixel definition layer away from the array substrate, the pixel definition layer including pixel openings exposing at least a portion of the first electrode, and an orthogonal projection of the partition structure on the array substrate being located between orthogonal projections of two adjacent pixel openings on the array substrate; an orthogonal projection of the pixel aperture on the array substrate is located within an orthogonal projection of the partition aperture on the array substrate; 3. The display panel according to claim 2.

7. the partition structure includes a first partition section and a second partition section that are stacked in order along a direction away from the array substrate, and an orthogonal projection of the first partition section on the array substrate on a side away from the array substrate is located within an orthogonal projection of the second partition section on the array substrate; 2. The display panel according to claim 1, wherein the first and second electrodes are arranged parallel to each other.

8. a second electrode of the light-emitting element is electrically connected to the first partition portion, the partition structure further includes a third partition portion located on a side of the first partition portion facing the array substrate, and the second electrode of the light-emitting element is electrically connected to the third partition portion; The material of the third partition portion includes molybdenum metal, the material of the first partition portion includes aluminum metal, and the material of the second partition portion includes titanium metal.

8. The display panel according to claim 7,

9. A display panel, an array substrate; a partition structure located on one side of the array substrate and surrounded by the partition structure to form an isolation opening; a light emitting element at least partially located within the partition opening; a first packaging layer including a packaging unit located on a side of the light-emitting element away from the array substrate, the packaging unit extending from a side of the partition structure to the side of the partition structure away from the array substrate, the side of the partition structure being a surface facing the partition opening of the partition structure, a gap being present between the packaging unit located on the side of the partition structure away from the array substrate and the side of the partition structure away from the array substrate, and heights of the gaps corresponding to the light-emitting elements of different colors being unequal; A display panel characterized by:

10. the light emitting device includes a first electrode layer, a light emitting function layer, and a second electrode layer that are stacked in this order along a direction away from the array substrate, and the first packaging layer is located on a side of the second electrode layer that is away from the array substrate; 10. The display panel according to claim 9.

11. the first electrode layer includes a first electrode, the light-emitting function layer includes a light-emitting portion, the second electrode layer includes a second electrode, an orthogonal projection of the partition opening on the array substrate and an orthogonal projection of the first electrode on the array substrate at least partially overlap each other, the light-emitting portion is located within the partition opening, and the second electrode is electrically connected to the partition structure; 11. The display panel according to claim 10.

12. a height of the gap along a direction perpendicular to the array substrate is greater than a thickness of the corresponding light-emitting functional layer; 11. The display panel according to claim 10.

13. Along a direction perpendicular to the array substrate, the height of the gap is smaller than the distance from the side of the corresponding second electrode away from the array substrate to the side of the corresponding first electrode close to the array substrate.

12. The display panel according to claim 11.

14.

15. A method for manufacturing a display panel, comprising: providing an array substrate; forming a partition structure on one side of the array substrate, the partition structure being surrounded to form an isolation opening; forming at least a portion of a light emitting device within the partitioned opening; forming a first packaging layer on a side of the light-emitting element away from the array substrate, the first packaging layer including a packaging unit, the packaging unit extending from a side of the partition structure to the side of the partition structure away from the array substrate, the side of the partition structure facing the partition opening of the partition structure, and a gap between the packaging unit located on the side of the partition structure away from the array substrate and the side of the partition structure away from the array substrate; forming a second packaging layer on a side of the first packaging layer away from the array substrate, wherein at least a portion of the second packaging layer extends into the gap; 10. A display panel manufacturing method comprising:

16. The step of forming a partition structure on one side of the array substrate includes: forming a first electrode layer on one side of the array substrate, the first electrode layer including a plurality of spaced-apart first electrodes; forming a pixel-defining material layer on a side of the first electrode layer away from the array substrate; forming a partition structure material layer on a side of the pixel defining material layer away from the array substrate; performing a patterning process on the partition structure material layer to form a partition structure; performing a patterning process on the pixel-defining material layer to form a pixel-defining layer, the pixel-defining layer including pixel openings exposing at least a portion of the first electrodes, and an orthogonal projection of the pixel openings on the array substrate being located within an orthogonal projection of the partition openings on the array substrate; 16. The method for manufacturing a display panel according to claim 15.

17. The step of forming at least a portion of a light emitting element within the partition opening includes: forming a light-emitting functional layer of a first color light-emitting element on a side of the partition structure away from the array substrate; forming a second electrode layer on a side of the light-emitting functional layer of the first color light-emitting element that is away from the array substrate; 17. The method for manufacturing a display panel according to claim 16.

18. forming a first packaging layer on a side of the light emitting device away from the array substrate; forming a first packaging layer on a side of the second electrode layer away from the array substrate; forming a first etching protection layer in the partition opening corresponding to the first color light-emitting element; removing the first packaging layer, the light-emitting functional layer, and the second electrode layer that are not covered by the first etching protection layer, and removing the first etching protection layer, thereby forming a light-emitting portion, a second electrode, and a packaging unit in a pixel opening corresponding to the first color light-emitting element, wherein a height of the gap is equal to a distance from a side of the first electrode corresponding to the first color light-emitting element that is away from the array substrate to a side of the packaging unit that is close to the array substrate along a direction perpendicular to the array substrate; 18. The method for manufacturing a display panel according to claim 17.

19. After the step of removing the first packaging layer, the light-emitting function layer, and the second electrode layer that are not covered by the first etching protection layer, and removing the first etching protection layer, further: forming a light-emitting functional layer of a second color light-emitting element on a side of the partition structure away from the array substrate, the light-emitting functional layer covering a side of the packaging unit corresponding to the first color light-emitting element away from the array substrate; forming a second electrode layer on a side of the light-emitting functional layer of the second color light-emitting element that is away from the array substrate; forming a first packaging layer on a side of the second electrode layer away from the array substrate; forming a second etching protection layer in the partition opening corresponding to the second color light emitting element; removing the first packaging layer, the light-emitting functional layer, and the second electrode layer of the second color light-emitting element that are not covered by the second etching protection layer, and removing the second etching protection layer, thereby forming a light-emitting portion, a second electrode, and a packaging unit in a pixel opening corresponding to the second color light-emitting element, wherein a height of the gap is equal to a distance from a side of the first electrode corresponding to the second color light-emitting element that is away from the array substrate to a side of the packaging unit that is close to the array substrate along a direction perpendicular to the array substrate.

19. The method for manufacturing a display panel according to claim 18.

20. An electronic device, A display panel comprising the display panel of claim 1. An electronic device characterized by:

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