Resin material for molding, molded article, and masterbatch

Abstract

To provide a resin material for molding that enables production of a resin molded article having bleed-out resistance and sustained good sliding performance.SOLUTION: This resin material for molding comprises a thermoplastic resin (A), a compound (B) having a functional group X and different from the thermoplastic resin (A), and a silicone compound (C) having a functional group Y capable of reacting with the functional group X to form a bond. When the content of the compound (B) is MB and the content of the silicone compound (C) is MC in the resin material for molding, the value of MB / MC is 0.5 or more in mass ratio.SELECTED DRAWING: None

Description

[Technical Field]

[0001] The present invention relates to a molding resin material, a molded article, and a masterbatch. [Background technology]

[0002] 2. Description of the Related Art Due to the industrial importance of molding resin materials containing thermoplastic resins, various developments have been carried out to date.

[0003] Patent Document 1 discloses an antifouling polypropylene resin composition containing a polypropylene resin, a silicone oil having a polar group, and a compatibilizer that improves the compatibility between the silicone oil having a polar group and the polypropylene resin. One of the features of this composition is that the silicone oil having a polar group is dispersed in the polypropylene resin.

[0004] Patent Document 2 discloses a thermoplastic resin composition [X] containing 20 to 65 parts by mass of a rubber-reinforced vinyl resin [A] and 35 to 80 parts by mass of a polycarbonate resin [B] (where the total of [A] and [B] is 100 parts by mass). In this composition, the rubber-reinforced vinyl resin [A] is a rubber-reinforced vinyl resin [A1] obtained by polymerizing a vinyl monomer [c1] in the presence of an ethylene-α-olefin rubbery polymer [a1] having a Tm (melting point) of 0°C or higher. The content of the ethylene-α-olefin rubbery polymer [a1] is 5 to 30% by mass, with the thermoplastic resin composition [X] being 100% by mass.

[0005] In addition to Patent Documents 1 and 2, Patent Documents 3 to 7 are also cited as prior art techniques relating to molding resin materials containing thermoplastic resins. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] International Publication No. 2009 / 072299 [Patent Document 2] Japanese Patent Application Laid-Open No. 2014-237855 [Patent Document 3] Japanese Patent Application Publication No. 2018-141077 [Patent Document 4] Japanese Patent Application Laid-Open No. 2007-106841 [Patent Document 5] International Publication No. 2018 / 173435 [Patent Document 6] International Publication No. 2022 / 004550 [Patent Document 7] Japanese Patent Application Laid-Open No. 2016-204599 Summary of the Invention [Problem to be solved by the invention]

[0007] Resin molded products are often required to have good sliding properties. Conventionally, in order to improve the sliding properties of resin molded products, some kind of additive component has been added to the molding resin material. However, the use of additive components often causes the problem of bleed-out, that is, the problem of the additive components rising to the surface of the resin molded article over time. Furthermore, the effects of the added components, such as improved sliding properties, were sometimes difficult to sustain.

[0008] The present invention has been made in view of the above circumstances, and one of the objects of the present invention is to provide a molding resin material that is less likely to bleed out and that can be used to produce a resin molded product that maintains good sliding properties. [Means for solving the problem]

[0009] The present inventors have completed the invention provided below and solved the above problems.

[0010] 1. a thermoplastic resin (A); a compound (B) having a functional group X and different from the thermoplastic resin (A); a silicone compound (C) having a functional group Y capable of reacting with the functional group X to form a bond; A molding resin material comprising: The content of the compound (B) in the molding resin material is M B The content of the silicone compound (C) is M C , then M B / M C The molding resin material has a mass ratio of 0.5 or more. 2. a thermoplastic resin (A); a compound (B) having a functional group X and different from the thermoplastic resin (A); a silicone compound (C) having a functional group Y capable of reacting with the functional group X to form a bond; A molding resin material comprising: The amount of the silicone compound (C) in the molding resin material is 0.01 to 1 part by mass per 100 parts by mass of the thermoplastic resin (A). 3. The molding resin material according to 1. or 2., The compound (B) is a molding resin material containing a resin. 4. The molding resin material according to any one of 1. to 3., The molding resin material, wherein the silicone compound (C) contains silicone oil. 5. The molding resin material according to any one of 1. to 4., the functional group X is at least one group selected from the group consisting of a group containing a cyclic acid anhydride skeleton, an isocyanate group, and a blocked isocyanate group, The molding resin material, wherein the functional group Y is an amino group. 6. The molding resin material according to any one of 1. to 5., The compound (B) is a molding resin material containing a polyolefin having a cyclic acid anhydride skeleton. 7. The molding resin material according to any one of 1. to 6., The molding resin material further comprises a wax (D). 8. The molding resin material according to any one of 1. to 7., The thermoplastic resin (A) is a molding resin material containing at least one selected from the group consisting of polyolefin resin, polycarbonate resin, ABS resin, and (meth)acrylic resin. 9. 1. The molding resin material according to claim 1, The molding resin material contains the silicone compound (C) in an amount of 0.01 to 1 part by mass relative to 100 parts by mass of the thermoplastic resin (A). 10. The molding resin material according to any one of 1. to 9., A molding resin material in the form of pellets obtained by kneading at least the thermoplastic resin (A), the compound (B), and the silicone compound (C). 11. A molded product obtained by molding the molding resin material according to any one of 1. to 9. 12. a compound (B) having a functional group X; a silicone compound (C) having a functional group Y capable of reacting with the functional group X to form a bond; A masterbatch used to produce a molded article by mixing with a thermoplastic resin (A) different from the compound (B), The content of the compound (B) in the master batch is M B The content of the silicone compound (C) is M C , then M B / M C The masterbatch has a value of 0.5 or more. [Effects of the Invention]

[0011] According to the present invention, there is provided a molding resin material that is less likely to bleed out and that can be used to produce a resin molded product that maintains good sliding properties. DETAILED DESCRIPTION OF THE INVENTION

[0012] Hereinafter, embodiments of the present invention will be described in detail.

[0013] In this specification, unless otherwise specified, the expression "X to Y" in the description of a numerical range means at least X and at most Y. For example, "1 to 5% by mass" means "at least 1% by mass and at most 5% by mass."

[0014] In this specification, the term "(meth)acrylic" represents a concept that encompasses both acrylic and methacrylic. The same applies to similar terms such as "(meth)acrylate."

[0015] <Resin material for molding> The molding resin material of this embodiment is a thermoplastic resin (A); a compound (B) having a functional group X and different from the thermoplastic resin (A); a silicone compound (C) having a functional group Y capable of reacting with the functional group X to form a bond; Includes.

[0016] The molding resin material of this embodiment satisfies one or both of the following (1) and (2). (1) The content of compound (B) is M B , the content of the silicone compound (C) is M C , then M B / M C The value of is 0.5 or more. (2) In the molding resin material, the amount of the silicone compound (C) is 0.01 to 1 part by mass per 100 parts by mass of the thermoplastic resin (A).

[0017] The silicone compound (C) is considered to be a component that improves the sliding properties. In this embodiment, the functional group Y of the silicone compound (C) can react with the functional group X of the compound (B) to form a bond. For example, when the molding resin material of this embodiment is heated and melted to produce a molded product, it is thought that the silicone compound (C) will bond with the compound (B). When the silicone compound (C) is bonded to the compound (B), the silicone compound (C) becomes less mobile, probably due to an increase in molecular weight, and therefore, it is believed that the bleed-out of the silicone compound (C) is suppressed in this embodiment compared to when a conventional silicone compound with a relatively low molecular weight is simply used. However, if the amount of silicone compound (C) is too large, most of the silicone compound (C) will not be able to react with compound (B), which may result in bleed-out. Therefore, in this embodiment, as described in (1) above, the content M of silicone compound (C) is C The content of compound (B) M B is 0.5 or more in mass ratio, or, as in (2) above, the silicone compound (C) is used in a relatively small amount.

[0018] Another way of looking at it is that the molding resin material of this embodiment is "a molding resin material that can easily achieve high slidability without using a large amount of silicone compound (C)." Not needing to use a large amount of silicone compound (C) is also preferable from the viewpoint of suppressing screw slippage, which is one of the problems that can occur when producing molded products.

[0019] The molding resin material of this embodiment will be further described.

[0020] (Thermoplastic resin (A)) As the thermoplastic resin (A), known or commercially available resins can be used without any particular limitation. The thermoplastic resin (A) preferably contains at least one selected from the group consisting of polyolefin resins, polycarbonate resins, ABS resins, and (meth)acrylic resins. The thermoplastic resin (A) is usually different from the compound (B). The thermoplastic resin (A) usually does not substantially have the functional group X. In other words, the thermoplastic resin (A) may have a small amount of the functional group X due to an unintended side reaction during its production, but the functional group X is not intentionally introduced. The thermoplastic resin (A) usually does not react with the silicone compound (C) to form a bond.

[0021] Examples of polyolefin resins include polyethylene and polypropylene, with polypropylene being particularly preferred. Examples of polyolefin resins also include cyclic olefin resins such as polynorbornene.

[0022] A (meth)acrylic resin is a resin having (meth)acrylic acid ester units and / or (meth)acrylic acid units as structural units. The (meth)acrylic acid ester units are structural units derived from monomers such as methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, n-butyl (meth)acrylate, t-butyl (meth)acrylate, n-hexyl (meth)acrylate, cyclohexyl (meth)acrylate, benzyl (meth)acrylate, chloromethyl (meth)acrylate, 2-chloroethyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, 2,3,4,5,6-pentahydroxyhexyl (meth)acrylate, 2,3,4,5-tetrahydroxypentyl (meth)acrylate, methyl 2-(hydroxymethyl)acrylate, and methyl 2-(hydroxyethyl)acrylate. The (meth)acrylic resin may be a homopolymer or a copolymer. The (meth)acrylic resin preferably has a structural unit derived from methyl (meth)acrylate, and is more preferably polymethyl methacrylate (PMMA).

[0023] Other examples of the thermoplastic resin (A) include polyamide resin, polyester resin, polyphenylene sulfide resin, polyphenylene oxide resin, polycarbonate resin, polylactic acid resin, polysulfone resin, polyacetal resin, tetrafluoroethylene resin, polyetherimide resin, polyamideimide resin, polyimide resin, polyethersulfone resin, polyetherketone resin, polythioetherketone resin, polyetheretherketone resin, polystyrene resin, polyalkylene oxide resin, and vinyl chloride resin.

[0024] The molding resin material of this embodiment may contain only one thermoplastic resin (A), or may contain two or more thermoplastic resins (A). The proportion of the thermoplastic resin (A) in the molding resin material of this embodiment is usually 90 to 99.5 mass %, preferably 92 to 99 mass %, and more preferably 95 to 99 mass %.

[0025] (Compound (B)) The compound (B) has a functional group X, that is, a group capable of reacting with the functional group Y of the silicone compound (C) to form a bond, and is a compound different from the thermoplastic resin (A). Compound (B) may be a resin (polymer) or a low molecular weight compound. Considering the presumed mechanism that "when silicone compound (C) bonds with compound (B), the silicone compound (C) becomes less mobile, possibly due to an increase in molecular weight," when compound (B) is a low molecular weight compound, the molecular weight is preferably 100 or more, more preferably 200 or more. There is no particular upper limit to the molecular weight of the low molecular weight compound, but the upper limit is, for example, 1,000.

[0026] The compound (B) preferably contains a polyolefin having a cyclic acid anhydride skeleton, and the functional group X is preferably a group containing a cyclic acid anhydride skeleton. The "cyclic acid anhydride skeleton" is typically a maleic anhydride skeleton. The "olefin" in the polyolefin having a cyclic acid anhydride backbone can be ethylene, propylene, or the like. The polyolefin having a cyclic acid anhydride skeleton may be a commercially available product. Polyolefins having a cyclic acid anhydride skeleton are often introduced on the market under names such as "modified polyolefin resin" and "acid-modified polyolefin resin."

[0027] Polyolefins having a cyclic acid anhydride skeleton are considered preferable from the viewpoints of availability / ease of synthesis and compatibility with the thermoplastic resin (A), ie, miscibility. Furthermore, it is considered preferable that the functional group X is a group containing a cyclic acid anhydride skeleton, since the functional group X and Y react appropriately at a normal heating temperature (melting temperature) during the production of a molded article.

[0028] In another embodiment, the compound (B) is preferably at least one selected from the group consisting of a compound having an isocyanate group and a compound having a blocked isocyanate group, i.e., the functional group X is preferably an isocyanate group or a blocked isocyanate group. These compounds are also considered to be preferable from the viewpoints of availability / ease of synthesis, compatibility with the thermoplastic resin (A), i.e., miscibility, etc. In addition, it is considered preferable that the functional group X is an isocyanate group or a blocked isocyanate group, in that the functional groups X and Y react appropriately at the normal heating temperature (melting temperature) during the production of molded articles.

[0029] Examples of compounds having an isocyanate group and compounds having a blocked isocyanate group are shown below.

[0030] Aliphatic diisocyanate compounds: hexamethylene diisocyanate, trimethylene diisocyanate, 1,4-tetramethylene diisocyanate, pentamethylene diisocyanate, lysine diisocyanate, 1,3-butylene diisocyanate, etc. Alicyclic diisocyanate compounds: isophorone diisocyanate, 4,4'-methylenebis(cyclohexyl isocyanate), methylcyclohexane-2,4- (or -2,6-) diisocyanate, 1,3- (or 1,4-) di(isocyanatomethyl) cyclohexane, 1,4-cyclohexane diisocyanate, 1,3-cyclopentane diisocyanate, 1,2-cyclohexane diisocyanate, and the like. Aromatic diisocyanate compounds: xylylene diisocyanate, metaxylylene diisocyanate, tetramethylxylylene diisocyanate, tolylene diisocyanate, 4,4'-diphenylmethane diisocyanate, (m- or p-)phenylene diisocyanate, and the like. Other polyisocyanates: polyisocyanate compounds having three or more isocyanate groups, such as triphenylmethane-4,4',4''-triisocyanate; adducts obtained by reacting a polyisocyanate compound in an amount such that the amount of isocyanate groups is in excess relative to the hydroxyl groups of a polyol, such as ethylene glycol, propylene glycol, 1,4-butylene glycol, polyalkylene glycol, trimethylolpropane, or hexanetriol; biuret-type adducts and isocyanuric ring-type adducts of hexamethylene diisocyanate, isophorone diisocyanate, tolylene diisocyanate, xylylene diisocyanate, 4,4'-diphenylmethane diisocyanate, and 4,4'-methylenebis(cyclohexyl isocyanate).

[0031] Also included are blocked isocyanate compounds in which part or all of the isocyanate groups of the above isocyanate compounds are blocked with a blocking agent. More specifically, blocked isocyanate compounds in which the isocyanate groups are blocked with a blocking agent such as alcohol, phenol, lactam, or oxime can also be used as compound (B). The blocking agent is preferably a phenol-based blocking agent, a lactam-based blocking agent or an oxime-based blocking agent. Examples of phenol-based blocking agents include phenol, cresol, xylenol, nitrophenol, chlorophenol, ethylphenol, hydroxydiphenyl, t-butylphenol, and methyl hydroxybenzoate. Examples of lactam blocking agents include ε-caprolactam, δ-valerolactam, γ-butyrolactam, and β-propiolactam. Examples of oxime-based blocking agents include acetaldoxime, acetoxime, methyl ethyl ketoxime, diacetyl monooxime, benzophenone oxime, and cyclohexane oxime. Uretdione-based compounds in which the isocyanate groups of the above-mentioned isocyanate compounds are blocked by bonding them together can also be used as the compound (B) having a blocked isocyanate group. Examples of such compounds include uretdiones composed of diisocyanates bonded to aliphatic, cycloaliphatic, or aromatic groups. Examples of commercially available products of the compound (B) having an isocyanate or blocked isocyanate group include the DESMODUR (registered trademark) series from Covestro, the Burnock (registered trademark) series from DIC Corporation, Duranate (registered trademark) from Asahi Kasei Corporation, and the VESTAGON (registered trademark) series from Evonik.

[0032] The molding resin material of this embodiment may contain only one compound (B), or may contain two or more compounds (B). The amount of compound (B) used is preferably optimized from the viewpoints of fully obtaining the effects of compound (B), having a sufficient amount of thermoplastic resin (A) present in the molding resin material, compatibility between thermoplastic resin (A) and compound (B), etc. Specifically, the amount is preferably 0.01 to 1 part by mass, more preferably 0.02 to 0.5 parts by mass, and even more preferably 0.04 to 0.3 parts by mass per 100 parts by mass of thermoplastic resin (A).

[0033] (Silicone Compound (C)) The silicone compound (C) has a siloxane skeleton and a functional group Y that can react with the functional group X to form a bond. The functional group Y is not particularly limited as long as it reacts with the functional group X of the compound (B) to form a bond. In terms of appropriate reactivity, however, a hydroxy group, an isocyanate group, an epoxy group, or an amino group is preferred, an amino group is more preferred, and an -NH group is particularly preferred.

[0034] The silicone compound (C) preferably contains a silicone oil, which is a compound that contains a siloxane bond and is liquid at room temperature (for example, 25°C). Silicone oils having functional groups are available from, for example, Shin-Etsu Chemical Co., Ltd. The molding resin material of this embodiment may contain only one silicone compound (C), or may contain two or more silicone compounds (C).

[0035] As described above, the molding resin material of this embodiment satisfies one or both of the following (1) and (2). (1) The content of compound (B) is M B , the content of the silicone compound (C) is M C , then M B / M C The value of is 0.5 or more in mass ratio. (2) In the molding resin material, the amount of the silicone compound (C) relative to 100 parts by mass of the thermoplastic resin (A) is 0.01 to 1 part by mass.

[0036] In view of (1) above, M B / M C The value of is preferably 0.5 to 15, more preferably 0.5 to 12, and even more preferably 0.7 to 10, in mass ratio. From the viewpoint of (2) above, the amount of the silicone compound (C) relative to 100 parts by mass of the thermoplastic resin (A) is preferably 0.01 to 0.5 parts by mass, more preferably 0.01 to 0.4 parts by mass, and even more preferably 0.01 to 0.3 parts by mass.

[0037] (Wax (D)) The molding resin material of this embodiment preferably contains a wax (D). When the molding resin material contains the wax (D), it tends to be easier to obtain an improved sliding property effect with a smaller amount of the silicone compound (C). This is presumably because when the molding resin material contains the wax (D), the fluidity of the molten molding resin material during molding is improved, making it easier for the silicone compound (C) to migrate to the surface vicinity of the molded article.

[0038] The wax (D) is not particularly limited as long as it is solid at room temperature but liquefied by heating when melting the molding resin material and does not substantially chemically react with other components. The melting point of the wax (D) is preferably 50 to 110°C. Using a wax (D) with an appropriate melting point can further improve the fluidity of the molten molding resin material during molding.

[0039] Specific examples of wax (D) include fatty acids such as palmitic acid, stearic acid, arachidic acid, and behenic acid. The number of carbon atoms in the fatty acid is preferably 16 to 22. The fatty acid is preferably linear. The fatty acid is preferably saturated. Further examples include metal salts of fatty acids, such as lithium salts, magnesium salts, calcium salts, barium salts, and zinc salts of the above fatty acids. Compounds commercially available as metal soaps can also be used as appropriate. Furthermore, fatty acid amides can also be used, and examples of fatty acid amides include stearic acid amide, oleic acid amide, erucic acid amide, methylene bisstearic acid amide, and ethylene bisstearic acid amide. Other examples include glycerin fatty acid esters, which are commercially available from Riken Vitamin Co., Ltd. under the name "Rikemal" (registered trademark).

[0040] When wax (D) is used, only one wax (D) may be used, or two or more waxes (D) may be used. When the wax (D) is used, the amount thereof is preferably 0.1 to 10 parts by mass, more preferably 0.02 to 10 parts by mass, and even more preferably 0.05 to 8.5 parts by mass, relative to 100 parts by mass of the thermoplastic resin (A).

[0041] (Other optional ingredients) The molding resin material of this embodiment may or may not contain components other than the above (A) to (D), such as various additives known in the field of molding resin materials.

[0042] (Properties of molding resin material) The properties of the molding resin material of this embodiment are not particularly limited as long as it can be put into various molding devices to produce molded products. The molding resin material of this embodiment usually contains at least Thermoplastic resin (A), a compound (B) having a functional group X and different from the thermoplastic resin (A); and a silicone compound (C) having a functional group Y capable of reacting with the functional group X to form a bond; It is in the form of pellets in which the above ingredients are kneaded.

[0043] <Molded products> A molded article can be produced using the molding resin material of this embodiment. For example, an injection molding machine and a mold can be used to produce the molded article. The molding resin material is melted at, for example, 130 to 350°C, preferably 180 to 300°C, depending on the melting point of the thermoplastic resin (A), and then injected (injected) into a mold and allowed to cool, thereby producing a molded article.

[0044] Molded articles produced using the molding resin material of this embodiment have good sliding properties. Furthermore, this good sliding property is likely to be maintained. Therefore, the molding resin material of this embodiment can be preferably used to produce components for products with moving parts, such as automobiles and electrical appliances, and components for products that are frequently touched by human hands.

[0045] <Masterbatch> The molding resin materials described above are basically intended to be melted and molded as they are without being mixed with other materials. Alternatively, it is possible to use compound (B) and silicone compound (C) in an appropriate ratio in a masterbatch, that is, a material to be mixed with a base thermoplastic resin (pellets, etc.).

[0046] Specifically, it is conceivable to manufacture a molded article by mixing the following masterbatch with a base thermoplastic resin (specifically, the above-mentioned thermoplastic resin (A)).

[0047] a compound (B) having a functional group X; a silicone compound (C) having a functional group Y capable of reacting with the functional group X to form a bond; A masterbatch used to produce a molded article by mixing with a thermoplastic resin (A) different from the compound (B), comprising at least The content of compound (B) in this master batch is M B , the content of the silicone compound (C) is M C , then M B / M C The masterbatch has a value of 0.5 or more.

[0048] In the masterbatch, the compound (B), the functional group X, the silicone compound (C), the functional group Y, the thermoplastic resin (A), M B / M C Specific aspects such as the value of can be as explained in the section <Molding Resin Material>. Other matters not specified here can also be as explained in the section <Molding Resin Material>.

[0049] Although the embodiments of the present invention have been described above, these are merely examples of the present invention, and various other configurations may be adopted. Furthermore, the present invention is not limited to the above-described embodiments, and modifications and improvements within the scope of achieving the object of the present invention are included in the present invention. [Example]

[0050] The embodiments of the present invention will be described in detail based on Examples and Comparative Examples. However, it should be noted that the present invention is not limited to the Examples.

[0051] <Production of molding resin materials> The materials shown in the table below were dry-blended in the amounts shown to produce molding resin materials.

[0052] <Molded product manufacturing> Using an injection molding machine (SE18S, manufactured by Sumitomo Heavy Industries, Ltd.) set to a cylinder temperature of 220°C, molten resin material was injected at a mold temperature of 40°C into a mold that had been textured on one side (texture pattern: Tanazawa Hakkosha TH-1008, texture depth 100 μm, draft angle 10°). In this way, a test piece with a textured surface measuring 50 mm long x 40 mm wide and 1.5 mm thick was prepared.

[0053] <Evaluation> (Moldability) The behavior of the screw in the injection molding machine into which the molding resin material was charged was visually observed and evaluated as follows. 3: The screw does not slip, does not stick to the mold, and can be used for injection molding. 2: The screw does not slip and there is some sticking to the mold, but injection molding is possible. 1: The screw slips, making injection molding difficult.

[0054] (bleed-out properties) The surface condition of the test piece immediately after molding was visually confirmed by touching the surface with a finger or by visually observing the surface, and was evaluated according to the following evaluation criteria. 5: No visible bleeding was observed, and nothing stuck to the finger when touched. 4: Bleed-out material can be seen on part of the surface of the plate, but nothing sticks to the surface when touched with a finger. 3: Bleed-out material can be seen on part of the surface of the plate, and some can be seen to adhere when touched with a finger. 2: Although there are some unevenness, the bleed-out material is visible across the entire surface of the plate, and when touched with a finger, a fairly large amount adheres. 1: Bleed-out material is clearly visible across the entire surface of the plate, and a large amount adheres to the surface when touched with a finger.

[0055] (Slidability: Dynamic friction coefficient) The test piece was set in a dynamic friction coefficient measuring device (TL201Tt, manufactured by Trinity Labs). Then, the contactor attached to the measuring device (contactor with hardness equivalent to that of a fingertip: contact area 1.5 cm 2 ) was brought into contact with the grained surface of the test piece, and the contact was moved 10 mm at a speed of 1.6 mm / s while applying a load of 200 g. In this way, the dynamic friction coefficient was measured, and the sliding properties were evaluated according to the following criteria.

[0056] Very good: Dynamic friction coefficient is 0.3 or less Good: Dynamic friction coefficient is over 0.3 and 0.35 or less Poor: Coefficient of dynamic friction exceeds 0.35

[0057] (sustained sliding properties) (1) Dynamic friction coefficient after rubbing with isopropanol (IPA) A 500 g load was applied to a cloth soaked in isopropanol, and the surface of each test piece was rubbed back and forth 50 times. Thereafter, the dynamic friction coefficient was measured in the same manner as described in (Slidability: Dynamic Friction Coefficient). (2) Dynamic friction coefficient after heat resistance test Each test piece was heated in an oven at 80°C for 72 hours. Then, a 500g load was applied to a cloth soaked in isopropanol and rubbed back and forth across the surface of each test sample 50 times. The dynamic friction coefficient was measured in the same manner as described in (Slidability: Dynamic Friction Coefficient).

[0058] For the above (1) and (2), the value of the dynamic friction coefficient was evaluated in the same manner as in the evaluation of (slidability: dynamic friction coefficient), using the following three-level scale. Very good: Coefficient of dynamic friction is 0.3 or less Good: Dynamic friction coefficient is over 0.3 and 0.35 or less Poor: Coefficient of dynamic friction exceeds 0.35

[0059] The composition and various ratios of the molding resin materials, as well as the evaluation results, are summarized in Tables 1 and 2.

[0060] [Table 1]

[0061] [Table 2]

[0062] [Table 3]

[0063] Details of the materials listed in Tables 1 to 3 are as follows. (thermoplastic resin) PP: Novatec MA3 (Japan Polypropylene Corporation, isotactic polypropylene resin, weight-average molecular weight 397,000) PC: Iupilon H-4000 (Mitsubishi Engineering Plastics Corporation, bisphenol A aromatic polycarbonate resin, glass transition temperature 148°C, weight average molecular weight 168,000) ABS: Dialac® M U400 (manufactured by Techno UGM Co., Ltd., transparent acrylonitrile-butadiene-styrene copolymer synthetic resin) PMMA: ACRYPET VH-001 (manufactured by Mitsubishi Chemical Corporation, an acrylic resin containing 95% or more by mass of structural units derived from methyl methacrylate, glass transition temperature 90°C, weight average molecular weight 168,000)

[0064] (Polyolefins having an acid anhydride skeleton and comparative polyolefins) Auroren 350S: Nippon Paper Industries Co., Ltd., maleic anhydride modified polyolefin Umex 1001: Maleic anhydride modified polyolefin manufactured by Sanyo Chemical Industries, Ltd. Unistall P-901: Hydroxyl-modified polyolefin manufactured by Mitsubishi Chemical Corporation (for comparison)

[0065] (Compounds containing an isocyanate group or a blocked isocyanate group) Duranate TMA-100: Asahi Kasei Corporation, isocyanurate Death Module N3400: HDI uretdione manufactured by Covestro

[0066] (Silicone compounds having an acid anhydride skeleton, a functional group that reacts with an isocyanate group or a blocked isocyanate group, and comparative silicone compounds) KF-868: Shin-Etsu Chemical Co., Ltd., side chain monoamino-modified silicone oil, kinematic viscosity 90 mm 2 / s KF-6001: Shin-Etsu Silicone Co., Ltd., both-end carbinol-modified silicone oil, kinematic viscosity 45 mm 2 / s X-22-163B: Shin-Etsu Silicone Co., Ltd., epoxy-modified silicone oil, kinematic viscosity 60 mm 2 / s SH-200: Dimethyl silicone oil (for comparison), manufactured by Toray Dow Corning Co., Ltd.

[0067] (wax) Stearic acid: Tokyo Chemical Industry Co., Ltd., melting point 68°C to 71°C Behenic acid: Tokyo Chemical Industry Co., Ltd., melting point 77-82°C Erucic acid amide: Melting point 79-81℃ Rikemal (registered trademark) S-100: manufactured by Riken Vitamin Co., Ltd., glycerin fatty acid ester, melting point 63-68°C

[0068] In Examples 1 to 22, the bleed-out property, sliding property, and durability of sliding property were good. One reason for this is thought to be that compound (B) and silicone compound (C) are bonded together by heating during molding, thereby suppressing the bleeding out of silicone compound (C). Also, M B / M CThe good results are also thought to be due to the fact that the value of (a) is 0.5 or more in mass ratio and / or the amount of silicone compound (C) is 0.01 to 1 part by mass per 100 parts by mass of thermoplastic resin (A), thereby achieving sufficient sliding properties while suppressing the generation of residual silicone compound (C) that cannot bond with compound (B).

[0069] In comparison with the Examples, Comparative Example 1, which used comparative silicone oil SH-200 (not having functional group Y), and Comparative Example 2, which used comparative polyolefin UNISTOL P-901 (not having functional group X that can react with functional group Y), had poor evaluations of bleed-out properties and dynamic friction coefficient after rubbing with isopropanol. These poor results are thought to be due to the fact that in Comparative Examples 1 and 2, no bond was formed between the silicone compound and compound (B). Also, M B / M C In Comparative Example 3, where the value was too small and the amount of silicone compound (C) was too large, the evaluation of bleed-out properties was poor. This poor result can be interpreted as meaning that the amount of silicone compound (C) was too large compared to the amount of compound (B), so that most of the silicone compound (C) was unable to bond with compound (B) and bled out.

[0070] A more detailed analysis of the examples reveals the following: Comparison of Example 8 with other Examples shows that the moldability can be further improved by adjusting the amount of polyolefin having an acid anhydride skeleton used. Comparison of Example 11 with other Examples shows that the amount of silicone compound used is appropriate and that M B / M C By setting the value of , it is possible to further improve various performances. Comparing Example 16 with other examples, it is clear that the use of wax can further improve various performances. Comparing Example 19 with Example 22, it can be seen that the evaluation result of the bleed-out property can be more favorable when the functional group Y is an amino group than when the functional group Y is a hydroxy group.

Claims

1. A thermoplastic resin (A), a compound (B) having a functional group X and different from the thermoplastic resin (A); a silicone compound (C) having a functional group Y capable of reacting with the functional group X to form a bond; A molding resin material comprising: The content of the compound (B) in the molding resin material is M Ｂ The content of the silicone compound (C) is M Ｃ , then M Ｂ / M Ｃ The molding resin material has a mass ratio of 0.5 or more.

2. A thermoplastic resin (A), a compound (B) having a functional group X and different from the thermoplastic resin (A); a silicone compound (C) having a functional group Y capable of reacting with the functional group X to form a bond; A molding resin material comprising: The amount of the silicone compound (C) in the molding resin material is 0.01 to 1 part by mass per 100 parts by mass of the thermoplastic resin (A).

3. The molding resin material according to claim 1 or 2, The compound (B) is a molding resin material containing a resin.

4. The molding resin material according to claim 1 or 2, The molding resin material, wherein the silicone compound (C) contains silicone oil.

5. The molding resin material according to claim 1 or 2, the functional group X is at least one group selected from the group consisting of a group containing a cyclic acid anhydride skeleton, an isocyanate group, and a blocked isocyanate group, The molding resin material, wherein the functional group Y is an amino group.

6. The molding resin material according to claim 1 or 2, The compound (B) is a molding resin material containing a polyolefin having a cyclic acid anhydride skeleton.

7. The molding resin material according to claim 1 or 2, The molding resin material further comprises a wax (D).

8. The molding resin material according to claim 1 or 2, The thermoplastic resin (A) is a molding resin material containing at least one selected from the group consisting of polyolefin resin, polycarbonate resin, ABS resin, and (meth)acrylic resin.

9. The molding resin material according to claim 1, The molding resin material contains the silicone compound (C) in an amount of 0.01 to 1 part by mass per 100 parts by mass of the thermoplastic resin (A).

10. The molding resin material according to claim 1 or 2, A molding resin material in the form of pellets obtained by kneading at least the thermoplastic resin (A), the compound (B), and the silicone compound (C).

11. A molded product obtained by molding the molding resin material according to claim 1 or 2.

12. a compound (B) having a functional group X; a silicone compound (C) having a functional group Y capable of reacting with the functional group X to form a bond; A masterbatch used to produce a molded article by mixing with a thermoplastic resin (A) different from the compound (B), The content of the compound (B) in the master batch is M Ｂ The content of the silicone compound (C) is M Ｃ , then M Ｂ / M Ｃ The masterbatch has a value of 0.5 or more.

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