Joint and holding device

Abstract

To provide technology to improve thermal conductivity in a composite member.SOLUTION: A composite member is made of a composite material. The composite material includes aluminium nitride and silicon carbide, with a greater content of aluminium nitride than silicon carbide.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a composite member, a joint, and a holding device. [Background technology]

[0002] Composite members made of multiple materials have been known for some time. For example, Patent Documents 1 and 2 disclose composite members having silicon carbide as a main constituent phase and containing titanium silicide, titanium silicon carbide, etc. Furthermore, Patent Document 3 discloses a composite member having titanium silicide as a main constituent phase and containing silicon carbide, titanium carbide, etc. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 6182082 [Patent Document 2] Patent No. 5666748 [Patent Document 3] Japanese Patent Publication No. 2021-116218 Summary of the Invention [Problem to be solved by the invention]

[0004] However, even with the prior art such as Patent Documents 1 to 3, there is still room for improvement in the technology for increasing the thermal expansion coefficient while improving the thermal conductivity of a composite member. For example, the composite members described in Patent Documents 1 and 2 contain silicon carbide particles, and the composite member described in Patent Document 3 contains titanium silicide particles. As a result, gaps that cause heat transfer resistance are likely to form between the particles inside the composite member, which could result in reduced thermal conductivity.

[0005] An object of the present invention is to provide a technique for increasing the thermal expansion coefficient of a composite member while improving the thermal conductivity. [Means for solving the problem]

[0006] The present invention has been made to solve at least part of the above-mentioned problems, and can be realized in the following aspects.

[0007] (1) According to one aspect of the present invention, there is provided a composite member made of a composite material, wherein the composite material contains aluminum nitride and silicon carbide, and the aluminum nitride content is greater than the silicon carbide content.

[0008] According to this configuration, the composite member has a higher aluminum nitride content than the silicon carbide content. This facilitates the formation of a solid solution of aluminum nitride between silicon carbide particles within the composite member, making it easier for heat to be transferred through the aluminum nitride solid solution than in composite members whose main constituent phase is silicon carbide. This increases the thermal conductivity of the composite member, thereby improving the thermal conductivity of the composite member. Furthermore, compared to composite members whose main constituent phase is silicon carbide, the composite member has a higher aluminum nitride content, which has a higher thermal expansion coefficient, thereby increasing the thermal expansion coefficient of the composite member.

[0009] (2) In the composite member of the above embodiment, the composite material may contain a titanium compound. According to this configuration, the composite member contains a titanium compound, which allows for control of the thermal expansion coefficient of the composite member formed from aluminum nitride and silicon carbide. For example, when the composite member is bonded to another component that becomes hot and the composite member is used as a heat dissipation component, this prevents the other component from peeling off from the composite member due to differences in thermal expansion. This allows the composite member to efficiently dissipate heat from the other component and maintain a bonded state with the other component.

[0010] (3) In the composite material of the above embodiment, the aluminum nitride content may be 10% by mass or more and 50% by mass or less. With this configuration, the composite material contains a certain amount of aluminum nitride, whose properties such as the thermal expansion coefficient are relatively easy to control. This makes it easy to control the thermal expansion coefficient of the composite material.

[0011] (4) In the composite member of the above embodiment, the silicon carbide content may be 1% by mass or more and 30% by mass or less. According to this configuration, the aluminum nitride content in the composite member is relatively higher than that of silicon carbide. This makes it easier to form a solid solution of aluminum nitride, further reducing the gaps between silicon carbide particles and making heat conduction easier. Therefore, the thermal conductivity of the composite member can be further improved.

[0012] (5) In the composite material of the above embodiment, the thermal conductivity may be 80 W / (m·K) or more. According to this configuration, a solid solution of aluminum nitride is formed between the silicon carbide particles inside the composite material, thereby making it possible to achieve a thermal conductivity of 80 W / (m·K) or more.

[0013] (6) According to another aspect of the present invention, there is provided a joined body. The joined body includes the composite member described above and a ceramic material joined to the composite member. According to this configuration, the joined body includes a composite member that easily conducts heat and a ceramic material joined to the composite member. This allows the heat of the ceramic material to be efficiently dissipated via the composite member, thereby suppressing damage to the joined body due to heat.

[0014] (7) In the bonded body of the above embodiment, the difference between the thermal expansion coefficient of the composite member and the thermal expansion coefficient of the ceramic material is 0.3 × 10 -6 / K. According to this configuration, the difference between the thermal expansion coefficient of the composite member and the thermal expansion coefficient of the ceramic material may be within 0.3×10 -6 / K, it is possible to prevent the ceramic material from peeling off from the composite member due to thermal expansion even when the bonded body is heated to high temperatures, thereby preventing damage to the bonded body due to heat.

[0015] (8) In the joined body of the above embodiment, the ceramic material may be made of alumina. According to this configuration, the ceramic material is made of alumina, which has a relatively low thermal conductivity, but is joined to a composite material that easily conducts heat. This allows heat from the ceramic material made of alumina to be efficiently released via the composite material, thereby suppressing damage to the joined body due to heat.

[0016] (9) In the joined body of the above embodiment, the composite member and the ceramic material may be joined by metal bonding. According to this configuration, the composite member and the ceramic material are joined by metal bonding, which is a metal bonding method that allows heat to be transmitted relatively easily. This allows heat from the ceramic material to be transmitted relatively easily to the composite member, so that the heat from the ceramic material can be more efficiently dissipated through the composite member. Therefore, damage to the joined body due to heat can be suppressed.

[0017] (10) According to yet another aspect of the present invention, a holding device is provided. This holding device includes the above-described joined body, wherein the ceramic material has a chuck electrode, and the composite member has a cooling function. With this configuration, the holding device can hold an object using the chuck electrode of the ceramic material. At this time, heat from the ceramic material is transferred to the composite member, which is a good conductor of heat, and can be dissipated to the outside of the joined body by the cooling function of the composite member. This makes it possible to suppress damage to the holding device due to heat.

[0018] The present invention can be realized in various forms, for example, in the form of a method for manufacturing a composite member and a joined body, an apparatus including a composite member and a joined body, a system including a holding device, and a method for controlling these devices and systems. [Brief explanation of the drawings]

[0019] [Figure 1] FIG. 2 is a perspective view of the holding device of the first embodiment. [Figure 2]1 is a cross-sectional view of a holding device according to a first embodiment. [Figure 3] FIG. 2 is a diagram illustrating a cross section of a composite member according to the first embodiment. [Figure 4] FIG. 2 is a diagram illustrating the blending ratio of raw materials in samples used in evaluation tests. [Figure 5] FIG. 10 is a diagram illustrating the results of an evaluation test. DETAILED DESCRIPTION OF THE INVENTION

[0020] First Embodiment FIG. 1 is a perspective view of a holding device 100 according to a first embodiment. FIG. 2 is a cross-sectional view of the holding device 100 according to the first embodiment. The holding device 100 according to the first embodiment is, for example, an electrostatic chuck that holds a wafer W by electrostatic attraction, and is provided in an etching device or the like. The holding device 100 includes a bonded body 1 having a ceramic material 10, a composite member 20, and a bonding portion 30. As shown in FIG. 1, the bonded body 1 is stacked in the order of the ceramic material 10, the bonding portion 30, and the composite member 20 from the positive side of the z-axis direction (stacking direction). In this embodiment, the bonded body 1 is a columnar body having a substantially circular cross-sectional shape perpendicular to the stacking direction. Note that each drawing schematically shows the arrangement of each part and does not accurately represent the dimensional ratio of each part.

[0021] The ceramic material 10 is a substantially circular flat plate member made of alumina (Al2O3). The ceramic material 10 has a pair of main surfaces 10a and 10b (see FIG. 2). One of the pair of main surfaces 10a and 10b, the main surface 10a, forms a mounting surface on which a wafer W is mounted. The wafer W mounted on the mounting surface is attracted and fixed to the mounting surface by electrostatic attraction generated by a chuck electrode 11 disposed inside the ceramic material 10. A heater electrode (not shown) for heating the wafer W attracted and fixed to the mounting surface may be built into the ceramic material 10. The ceramic material 10 may also be made of a material such as aluminum nitride (AlN), zirconia (ZrO2), silicon nitride (Si3N4), silicon carbide (SiC), or yttria (Y2O3).

[0022] The composite member 20 is a sintered member made of a composite material, and contains aluminum nitride (AlN), silicon carbide (SiC), and a titanium compound. In the composite member 20 of this embodiment, the aluminum nitride content is greater than the silicon carbide content. Specifically, the aluminum nitride content is 10% by mass or more and 50% by mass or less, while the silicon carbide content is 1% by mass or more and 30% by mass or less. This results in a thermal conductivity of the composite member 20 of 80 W / (m·K) or more. In this embodiment, the difference between the thermal expansion coefficient of the composite member 20 and the thermal expansion coefficient of the ceramic material 10 is 0.3×10 -6 / K or less. As shown in FIG. 2, the composite member 20 has a plurality of refrigerant flow paths 21 through which the refrigerant flows.

[0023] Fig. 3 is a diagram illustrating a cross section of the composite member 20 of the first embodiment. Fig. 3 is a diagram schematically illustrating a cross section of the composite member 20 imaged using a scanning electron microscope (SEM). The cross section shown in Fig. 3 shows silicon carbide (region R1 shown by dashed hatching), aluminum nitride (region R2 shown by dotted hatching), and a titanium compound (region R3 shown by dotted hatching). The silicon carbide, aluminum nitride, and titanium compound in the cross section of the composite member 20 are distinguished by comparing the cross section shown in Fig. 3 with the results of energy dispersive X-ray analysis of the same cross section.

[0024] 3, silicon carbide is contained in the form of particles, and aluminum nitride is contained as a solid solution. As a result, gaps between silicon carbide particles that cause heat transfer resistance are filled with the aluminum nitride solid solution inside composite member 20. Therefore, composite member 20 has a higher thermal conductivity than a composite member formed mainly from silicon carbide particles, and therefore can improve thermal conductivity.

[0025] As shown in the cross-sectional view of Figure 3, the titanium compound contained in the composite material 20 occupies a large portion of the cross section of the composite material 20. As a result, the ease of thermal expansion of the composite material 20 is determined by the ease of thermal expansion of the titanium compound. Therefore, by including a titanium compound, the degree of thermal expansion of the composite material 20 can be adjusted.

[0026] The joint 30 is disposed between the other of the pair of main surfaces 10a, 10b of the ceramic material 10 and the composite material 20. The joint 30 joins the ceramic material 10 and the composite material 20. In this embodiment, the joint 30 is a metal compound made of Al-Mg. This allows heat to be easily transferred between the ceramic material 10 and the composite material 20.

[0027] Next, we will explain the evaluation test of the composite material. In this evaluation test, we created multiple composite materials with different contents of the constituent phases by changing the raw material blend ratio and firing temperature when manufacturing the composite material, and evaluated and compared the thermal conductivity and thermal expansion coefficient of each.

[0028] FIG. 4 is a diagram explaining the blending ratio of raw materials in the composite material samples used in this evaluation test. First, the method for preparing the samples used in this evaluation test will be explained. In this evaluation test, eight types of samples were prepared as samples to be evaluated. Each of the eight types of samples was prepared by molding a mixture of at least three of the five types of raw materials shown in FIG. 4 and sintering it at the firing temperature shown in FIG. 4. For each of the five types of raw materials, particles having the particle sizes shown below were used. SiC: 15.5μm (average particle size) AlN: 15 μm (median) Si:10.12μm (average particle size) Ti:27μm (average particle size) TiSi2: 5~10μm (average particle size)

[0029] As shown in Figure 4, Samples 1 and 2 do not use aluminum nitride and titanium silicide (TiSi2) as raw materials. Samples 3 to 8 contain more aluminum nitride than silicon carbide as raw materials. Samples 6 and 8 differ from Samples 3 to 5 and 7 in that they use titanium silicide instead of silicon as raw materials. The firing temperature for Sample 2 was 1450°C, and for all samples other than Sample 2 it was 1400°C.

[0030] FIG. 5 is a diagram illustrating the results of this evaluation test. In FIG. 5, the content (unit: mass%) of each of the five constituent phases, the thermal conductivity (unit: W / (m·K)), and the thermal expansion coefficient (unit: × 10 -6 / K) and apparent density (g / cm 3 The content of each of the five constituent phases in the sample was determined using an X-ray diffractometer (measurement conditions: CuKα, 40 kV, 40 mA, 2θ = 5 to 70°) using a sample ground in a mortar. The thermal conductivity was measured using the laser flash method.

[0031] In this evaluation test, we assumed composite materials to be joined with ceramic materials made of alumina, and evaluated eight types of samples based on the thermal conductivity and thermal expansion coefficient required for joining with alumina. The thermal conductivity of alumina (Al2O3) is generally less than 30W / (m·K), and the thermal expansion coefficient is approximately 7.65×10 -6 / K. Therefore, if the sample is to be used as a composite material to be joined with a ceramic material made of alumina, the thermal conductivity of the sample should be 80W / (m·K) or more, which is more than twice the thermal conductivity of alumina. The thermal expansion coefficient of the sample should be ±0.3×10 relative to the thermal expansion coefficient of alumina. -6 / K, 7.35~7.95×10 -6 / K. Hereinafter, a thermal conductivity of 80 W / (m K) is referred to as the "reference thermal conductivity," and is within the range of 7.35 to 7.95 × 10 -6 The thermal expansion coefficient of 1 / K is called the "reference thermal expansion coefficient."

[0032] As mentioned above, Sample 1 and Sample 2 do not contain aluminum nitride as a raw material, and therefore do not contain aluminum nitride as a constituent phase. Although Sample 1 has a thermal expansion coefficient that is the standard thermal expansion coefficient, it was found that its thermal conductivity is lower than the standard thermal conductivity. On the other hand, Sample 2, which has the same raw materials and blending ratio as Sample 1 but is fired at a higher temperature than Sample 1, has a thermal conductivity higher than the standard thermal conductivity, but its thermal expansion coefficient is lower than the standard thermal expansion coefficient. For this reason, Sample 1 makes it difficult for heat to escape from the ceramic material, while Sample 2 has the risk of the bonded body being damaged due to the difference in thermal expansion.

[0033] On the other hand, Samples 3 to 8 have a higher content of aluminum nitride contained as a constituent phase than the content of silicon carbide. Specifically, in all of Samples 3 to 8, the content of aluminum nitride is 10% by mass or more and 50% by mass or less, and the content of silicon carbide is 1% by mass or more and 30% by mass or less. As a result, each of Samples 3 to 8 has a thermal conductivity equal to or greater than the reference thermal conductivity, and a thermal expansion coefficient that is equal to or greater than the reference thermal expansion coefficient. Therefore, it was revealed that the ceramic material can easily release heat (easily remove heat) while suppressing damage to the bonded body due to the difference in thermal expansion.

[0034] According to the composite member 20 of the present embodiment described above, the aluminum nitride content in the composite member 20 is greater than the silicon carbide content. This makes it easier for a solid solution of aluminum nitride to form between silicon carbide particles inside the composite member 20, and therefore heat is more easily conducted via the aluminum nitride solid solution than in a composite member having silicon carbide as the main constituent phase. This increases the thermal conductivity of the composite member 20, thereby improving the thermal conductivity of the composite member 20. Furthermore, compared to a composite member having silicon carbide as the main constituent phase, the composite member 20 has a higher aluminum nitride content, which has a higher thermal expansion coefficient, and therefore the thermal expansion coefficient of the composite member 20 can be increased.

[0035] Furthermore, in general, in a composite member containing a large amount of silicon carbide particles, the distribution of silicon carbide varies within the composite member. This results in non-uniform thermal conductivity within the composite member, and for example, when the composite member is used as a member for conducting heat, heat is not conducted uniformly. In the composite member 20 of this embodiment, a solid solution of aluminum nitride is easily formed among the silicon carbide particles, and therefore the thermal conductivity within the composite member 20 is likely to be uniform. In other words, the uniformity of the thermal conductivity within the composite member 20 can be improved, and therefore the thermal conductivity of the composite member 20 can be improved. As a result, when the composite member 20 is used as a member for conducting heat, heat can be conducted uniformly, allowing stable heat dissipation.

[0036] Furthermore, in composite member 20 of this embodiment, the content of silicon carbide is smaller than the content of aluminum nitride. This results in a relatively small content of silicon carbide, which is relatively difficult to process, in composite member 20, improving the processability of composite member 20. Furthermore, the surface roughness of composite member 20 is improved.

[0037] Furthermore, according to the composite member 20 of this embodiment, the composite member 20 contains a titanium compound, which makes it possible to control the thermal expansion coefficient of the composite member 20 formed from aluminum nitride and silicon carbide. As a result, in the joined body 1, by making the thermal expansion coefficient of the composite member 20 close to that of the ceramic material 10, it is possible to prevent the ceramic material 10 from peeling off from the composite member 20 due to the difference in thermal expansion. Therefore, the composite member 20 can efficiently release heat from the ceramic material 10, thereby improving the thermal conductivity of the composite member 20 and preventing damage to the joined body 1.

[0038] Furthermore, according to the composite material 20 of this embodiment, the aluminum nitride content is 10 mass % or more and 50 mass % or less. That is, since the composite material 20 contains a certain amount of aluminum nitride, whose properties such as the thermal expansion coefficient are relatively easy to control, the thermal expansion coefficient of the composite material 20 can be easily controlled.

[0039] Furthermore, according to the composite material 20 of this embodiment, the silicon carbide content is 1% by mass or more and 30% by mass or less. That is, the composite material 20 contains a relatively large amount of aluminum nitride compared to silicon carbide. This makes it easier for a solid solution of aluminum nitride to be formed among the silicon carbide particles, further reducing the gaps between the silicon carbide particles and making heat conduction easier. Therefore, the thermal conductivity of the composite material 20 can be further improved.

[0040] Furthermore, according to the composite material 20 of the present embodiment, aluminum nitride is formed as a solid solution between silicon carbide particles inside the composite material 20, and the thermal conductivity of the composite material 20 can be made 80 W / (m·K) or more.

[0041] Furthermore, the joined body 1 of this embodiment includes the ceramic material 10 joined to the composite member 20, which easily conducts heat. This allows the heat of the ceramic material 10 to be efficiently released through the composite member 20, thereby preventing damage to the joined body 1 due to heat.

[0042] Furthermore, according to the joined body 1 of this embodiment, the difference between the thermal expansion coefficient of the composite member 20 and the thermal expansion coefficient of the ceramic material 10 is 0.3×10 -6 / K. This makes it possible to prevent the ceramic material 10 from peeling off from the composite member 20 due to thermal expansion even when the bonded body 1 is heated to a high temperature. Therefore, damage to the bonded body 1 due to heat can be prevented.

[0043] Furthermore, according to the joined body 1 of this embodiment, the ceramic material 10 is made of alumina, which has a relatively low thermal conductivity, but is joined to the composite material 20, which easily conducts heat. This allows the heat of the ceramic material 10, which is made of alumina, to be efficiently released via the composite material 20, thereby preventing damage to the joined body 1 due to heat.

[0044] Furthermore, according to the joined body 1 of this embodiment, the composite member 20 and the ceramic material 10 are joined at the joint 30 by metal bonding, which is a relatively easy heat transfer material. This allows the heat of the ceramic material 10 to be transferred to the composite member 20 relatively easily, and the heat of the ceramic material 10 can be more efficiently released through the composite member 20. Therefore, damage to the joined body 1 due to heat can be suppressed.

[0045] The holding device 100 of this embodiment is an electrostatic chuck, and can hold the wafer W using the chuck electrode 11 of the ceramic material 10. At this time, heat from the ceramic material 10 is transferred to the composite member 20, which easily transfers heat, and can be released to the outside of the bonded body 1 by the coolant flowing through the coolant flow path 21 of the composite member 20. This can prevent damage to the holding device 100 due to heat.

[0046] <Modification of this embodiment> The present invention is not limited to the above-described embodiment, and can be embodied in various forms without departing from the spirit of the invention. For example, the following modifications are also possible.

[0047] [Variation 1] In the above-described embodiment, the composite material 20 contains a titanium compound. The composite material does not have to contain a titanium compound, but the thermal expansion coefficient of the composite material can be adjusted by adjusting the content of the titanium compound.

[0048] [Variation 2] In the above-described embodiment, the aluminum nitride content of the composite material 20 is set to 10% by mass or more and 50% by mass or less. The aluminum nitride content is not limited to this. It is desirable that the aluminum nitride content be greater than the silicon carbide content. When the aluminum nitride content is relatively large, the thermal expansion coefficient of the composite material can be easily controlled.

[0049] [Variation 3] In the above-described embodiment, the composite member 20 has a silicon carbide content of 1% by mass or more and 30% by mass or less. The silicon carbide content is preferably smaller than the aluminum nitride content. When the silicon carbide content is relatively small, a solid solution of aluminum nitride is more likely to be formed, which further reduces the gaps between silicon carbide particles and makes heat conduction easier. This can further improve the thermal conductivity of the composite member.

[0050] [Variation 4] In the above-described embodiment, in order to facilitate the dissipation of heat from the ceramic material 10 when the joined body is used as an electrostatic chuck, the thermal conductivity of the composite member is set to 80 W / (m K) or more. However, the thermal conductivity of the composite member is not limited to this value.

[0051] [Variation 5] In the above embodiment, the joined body 1 includes the ceramic material 10, the composite member 20, and the joining portion 30, but the configuration of the joined body 1 is not limited to this. The material forming the member joined to the composite member 20 is not limited to ceramic such as alumina, and the difference in thermal expansion coefficient between the composite member and the joined body 1 is not limited to 0.3×10 -6 The joining portion does not have to be a metal joining portion. It is sufficient if the high thermal conductivity of the composite material can be utilized.

[0052] [Variation 6] In the above embodiment, the joined body 1 is used in the holding device 100, but the application field of the joined body 1 is not limited to this. The joined body 1 can be applied to any field where the high thermal conductivity of the composite member can be utilized.

[0053] This aspect has been described above based on embodiments and modifications. However, the above-described embodiments are intended to facilitate understanding of this aspect and are not intended to limit this aspect. This aspect may be modified or improved without departing from the spirit and scope of the claims, and equivalents thereof are included in this aspect. Furthermore, if a technical feature is not described as essential in this specification, it may be deleted as appropriate.

[0054] (Application example 1) A composite member made of a composite material, the composite material includes aluminum nitride and silicon carbide; The aluminum nitride content is greater than the silicon carbide content. A composite member characterized by: (Application example 2) The composite member according to Application Example 1 further comprises: The composite material contains a titanium compound. A composite member characterized by: (Application example 3) The composite member according to Application Example 1 or Application Example 2, The content of aluminum nitride is 10% by mass or more and 50% by mass or less. A composite member characterized by: (Application example 4) The composite member according to Application Example 1 or Application Example 2, The silicon carbide content is 1% by mass or more and 30% by mass or less. A composite member characterized by: (Application example 5) The composite member according to any one of Application Examples 1 to 4, Thermal conductivity is 80W / (m·K) or more. A composite member characterized by: (Application Example 6) A conjugate comprising: The composite member according to any one of Application Examples 1 to 5, and a ceramic material bonded to the composite member. A conjugate characterized by: (Application Example 7) The bonded structure according to Application Example 6, The difference between the thermal expansion coefficient of the composite material and the thermal expansion coefficient of the ceramic material is 0.3 × 10 -6 / K or less, A conjugate characterized by: (Application Example 8) The bonded structure according to Application Example 6 or Application Example 7, The ceramic material is made of alumina. A conjugate characterized by: (Application Example 9) The bonded structure according to any one of Application Examples 6 to 8, The composite member and the ceramic material are joined by metal joining. A conjugate characterized by: (Application Example 10) A holding device, The bonded body according to any one of Application Examples 6 to 9 is provided, the ceramic material includes a chuck electrode; The composite member has a cooling function. A holding device characterized by: [Explanation of symbols]

[0055] 1...Holding device 10...Ceramic component 11...Chuck electrode 20...Composite material 21... Refrigerant flow path

Claims

1. A joint, Composite members and The composite member comprises a ceramic material to which the composite member is joined, The aforementioned composite member is made of a composite material, The aforementioned composite material is A compound containing titanium and silicon, aluminum nitride, and silicon carbide, The thermal conductivity is 80 W / (m·K) or higher. The difference between the thermal expansion coefficient of the composite member and the thermal expansion coefficient of the ceramic material is within 0.3 × 10⁻⁶ / K. The content of compounds containing titanium and silicon is greater than the content of aluminum nitride. The aluminum nitride content is greater than the silicon carbide content. A joint characterized by the following features.

2. The joint described in claim 1 further, The aforementioned composite material includes a titanium compound. A joint characterized by the following features.

3. A joint according to claim 1 or claim 2, The aluminum nitride content in the composite member is 10% by mass or more and 50% by mass or less. A joint characterized by the following features.

4. A joint according to claim 1 or claim 2, The silicon carbide content in the composite member is 1% by mass or more and 30% by mass or less. A joint characterized by the following features.

5. The joint according to claim 1 or claim 2, The aforementioned ceramic material is formed from alumina. A joint characterized by the following features.

6. The joint according to claim 1 or claim 2, The composite member and the ceramic material are joined by a metal bond. A joint characterized by the following features.

7. A holding device, The joint comprises the joint described in claim 1 or claim 2, The aforementioned ceramic material has a chuck electrode, The composite member has a cooling function. A holding device characterized by the following features.

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