Coil structure and component for coil structure

Abstract

To provide a coil structure capable of adjusting an inductance value, and a component for the coil structure.SOLUTION: In a coil structure 100, an inductance value can be easily adjusted. For example, a plurality of kinds of multilayer coil components 1 with different dimensions (line widths or the like) of U-shaped conductors 5A-5C are prepared and a kind of the multilayer coil component 1 is appropriately selected and mounted on a printed circuit board 3, thereby easily obtaining a desired inductance value. On the other hand, a plurality of kinds of printed circuit boards 3 with different dimensions (line widths or the like) of joint wires 9 are prepared and a kind of the printed circuit board 3 on which the multilayer coil component 1 is mounted is appropriately selected, thereby easily obtaining a desired inductance value. Namely, the inductance value can be freely and easily adjusted by a combination of the multilayer coil component 1 and the printed circuit board 3.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a coil structure and a component for a coil structure. [Background technology]

[0002] Patent Document 1 discloses a configuration in which a conductor pattern including lands is formed on a printed circuit board on which a coil component is mounted. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2008-186996 Summary of the Invention [Problem to be solved by the invention]

[0004] The inventors have conducted extensive research into inductance values ​​and have discovered a new technique for adjusting the inductance value.

[0005] An object of one aspect of the present invention is to provide a coil structure and a component for a coil structure that can adjust the inductance value. [Means for solving the problem]

[0006] A coil structure according to one aspect of the present invention comprises a printed circuit board and an electronic component mounted on the printed circuit board, wherein the electronic component includes a base body having a mounting surface facing the printed circuit board, and a plurality of U-shaped conductors provided within the base body and arranged around an axis parallel to the mounting surface, with both ends extending to the mounting surface, the printed circuit board including connecting wires connecting ends of different U-shaped conductors among the plurality of U-shaped conductors, and the plurality of U-shaped conductors of the electronic component and the connecting wires of the printed circuit board form a coil structure wound around the axis.

[0007] A coil structure component according to one aspect of the present invention comprises a base body having a mounting surface, and a plurality of U-shaped conductors provided within the base body, arranged around an axis parallel to the mounting surface, with both ends extending to the mounting surface, and the ends of different U-shaped conductors among the plurality of U-shaped conductors are connected to each other outside the base body to form a coil structure wound around the axis.

[0008] In the above-mentioned coil structure and coil structure component, the inductance value can be easily adjusted by connecting the ends of different U-shaped conductors among the multiple U-shaped conductors provided within the base body to form a coil structure outside the base body. [Effects of the Invention]

[0009] According to one aspect of the present invention, there are provided a coil structure and a component for a coil structure that are capable of adjusting an inductance value. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 1 is a perspective view of a coil structure according to an embodiment. [Figure 2] FIG. 2 is an exploded perspective view showing the configuration of each layer of the laminated coil component shown in FIG. [Figure 3] FIG. 2 is a side view of the coil structure shown in FIG. [Figure 4] 2 is a diagram showing the connection wires of the printed circuit board shown in FIG. 1. [Figure 5] 10A and 10B are perspective views of coil structures of different forms. [Figure 6] 6 is a diagram showing the connection wires of the printed circuit board shown in FIG. 5. [Figure 7] 10A and 10B are diagrams showing different aspects of printed circuit boards; DETAILED DESCRIPTION OF THE INVENTION

[0011] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same or corresponding elements are designated by the same reference numerals, and redundant description will be omitted.

[0012] A coil structure according to this embodiment will be described with reference to Fig. 1. Fig. 1 is a perspective view of a coil structure according to one embodiment. As shown in Fig. 1, a coil structure 100 includes a laminated coil component 1 (electronic component, coil structure component) and a printed circuit board 3 on which the laminated coil component 1 is surface-mounted.

[0013] The laminated coil component 1 is configured to include an element body 2 and an internal conductor 5 .

[0014] The element body 2 has a rectangular parallelepiped shape. The rectangular parallelepiped shape includes a rectangular parallelepiped shape with chamfered corners and ridges, and a rectangular parallelepiped shape with rounded corners and ridges. The element body 2 has, as its outer surfaces, a pair of end faces 2a and 2b, a pair of main faces 2c and 2d, and a pair of side faces 2e and 2f. The end faces 2a and 2b face each other. The main faces 2c and 2d face each other. The side faces 2e and 2f face each other. Hereinafter, the facing direction of the end faces 2a and 2b is referred to as a first direction D1, the facing direction of the side faces 2e and 2f is referred to as a second direction D2, and the facing direction of the main faces 2c and 2d is referred to as a third direction D3. The first direction D1, the third direction D3, and the second direction D2 are approximately perpendicular to each other.

[0015] The end faces 2a and 2b extend in the third direction D3 to connect the principal faces 2c and 2d. The end faces 2a and 2b also extend in the second direction D2 to connect the side faces 2e and 2f. The principal faces 2c and 2d extend in the first direction D1 to connect the end faces 2a and 2b. The principal faces 2c and 2d also extend in the second direction D2 to connect the side faces 2e and 2f. The side faces 2e and 2f extend in the first direction D1 to connect the end faces 2a and 2b. The side faces 2e and 2f also extend in the third direction D3 to connect the principal faces 2c and 2d.

[0016] The main surface 2d is a mounting surface, which faces the printed circuit board 3 when surface-mounted on the printed circuit board 3. The end surfaces 2a and 2b are surfaces that are continuous with the mounting surface (that is, the main surface 2d).

[0017] The length of the element body 2 in the first direction D1 is longer than the length of the element body 2 in the third direction D3 and the length of the element body 2 in the second direction D2. The length of the element body 2 in the third direction D3 is shorter than the length of the element body 2 in the second direction D2. That is, in this embodiment, the end faces 2a, 2b, main faces 2c, 2d, and side faces 2e, 2f have a rectangular shape. The length of the element body 2 in the third direction D3 may be equal to the length of the element body 2 in the second direction D2, or may be longer than the length of the element body 2 in the second direction D2.

[0018] In this embodiment, "equivalent" does not only mean equal, but also may mean values ​​that include slight differences or manufacturing errors within a preset range. For example, if multiple values ​​are within a range of ±5% of the average value of the multiple values, the multiple values ​​are defined as equivalent.

[0019] 2, the element body 2 has a configuration in which multiple element body layers are stacked in the third direction D3, and in this embodiment, the element body 2 is composed of seven element body layers 21 to 27. In other words, the stacking direction of the element body 2 coincides with the third direction D3. In an actual element body 2, the multiple element body layers 21 to 27 may be integrated to the extent that the boundaries between the layers are not visible, or may be integrated so that the boundaries between the layers are visible.

[0020] Each of the element layers 21 to 27 is mainly made of a resin material. The resin material includes at least one selected from the group consisting of liquid crystal polymer, polyimide resin, crystalline polystyrene, epoxy resin, acrylic resin, bismaleimide resin, and fluorine resin. The resin material may or may not contain a filler. The filler is, for example, an inorganic filler. An example of the inorganic filler is silica.

[0021] 2, of the element layers 21 to 27, the element layer 21 that constitutes the main surface 2c is made only of a resin material. Wiring portions 6, 8a to 8e of an internal conductor 5 that constitute part of a coil structure, which will be described later, are embedded in the element layers 22 to 27. More specifically, a plurality of parallel wirings 6 are embedded in the element layer 22, and wiring portions 8a to 8e that constitute vertical wirings 8, which will be described later, are embedded in the element layers 23 to 27, respectively.

[0022] Each of the element layers 21 to 27 may be made of a magnetic material. The magnetic material may include, for example, a Ni-Cu-Zn ferrite material, a Ni-Cu-Zn-Mg ferrite material, or a Ni-Cu ferrite material. The magnetic material may include, for example, an Fe alloy. Each of the element layers 21 to 27 may also include a non-magnetic material, which may be a glass ceramic material or a dielectric material.

[0023] The internal conductor 5 is disposed within the element body 2. The internal conductor 5 is composed of multiple U-shaped conductors, and in this embodiment, it is composed of three U-shaped conductors 5A to 5C. Each of the U-shaped conductors 5A to 5C is formed by electrically connecting a parallel wiring 6 and a pair of vertical wirings 8. Each of the U-shaped conductors 5A to 5C is arranged around an axis Z along a second direction D2 that is parallel to the main surface 2d. The three U-shaped conductors 5A to 5C are arranged at equal intervals along the second direction D2 in the order of U-shaped conductor 5A, U-shaped conductor 5B, and U-shaped conductor 5C from the side surface 2f. The parallel wirings 6 and vertical wirings 8 of each of the U-shaped conductors 5A to 5C are made of a conductive material (e.g., Cu).

[0024] The parallel wiring 6 of each of the U-shaped conductors 5A to 5C is disposed on the principal surface 2c side of the element body 2. That is, the parallel wiring 6 is disposed at a position away from the axis Z with respect to the principal surface 2d of the element body 2. Each of the parallel wiring 6 is disposed away from the end faces 2a, 2b, the principal surface 2c, and the side faces 2e, 2f of the element body 2. The parallel wiring 6 are parallel to each other and extend along the first direction D1. Two vertical wirings 8 are connected to each of the parallel wiring 6. Each of the parallel wiring 6 is bridged over the two vertical wirings 8. One end of each of the parallel wiring 6 in the extension direction (the end on the end face 2a side) is connected to one end of the vertical wiring 8 (the end on the principal surface 2c side). The other end of each of the parallel wiring 6 in the extension direction (the end on the end face 2b side) is connected to one end of the vertical wiring 8.

[0025] Each of the vertical wires 8 is disposed on the end face 2a side and the end face 2b side of the element body 2. Each of the vertical wires 8 extends along the third direction D3. The vertical wires 8 are disposed at a distance from the end faces 2a and 2b, the main surface 2c, and the side surfaces 2e and 2f. In this embodiment, the cross-sectional shape of the vertical wires 8 in a cross section perpendicular to the third direction D3 is substantially rectangular (specifically, substantially square). The cross-sectional shape of the vertical wires 8 may be, for example, circular, elliptical, or a polygonal shape other than a rectangle. The vertical wires 8 extend from the parallel wires 6 to the main surface 2d. One end of the vertical wire 8 is connected to one end and the other end of the parallel wire 6. The other end of the vertical wire 8 extends to the main surface 2d and is exposed from 2d.

[0026] Of the pair of vertical wires 8 constituting the U-shaped conductor 5A, the vertical wire 8 located on the end face 2a side has one end connected to one end of the parallel wire 6 and the other end forming end 5a. Of the pair of vertical wires 8 constituting the U-shaped conductor 5A, the vertical wire 8 located on the end face 2b side has one end connected to the other end of the parallel wire 6 and the other end forming end 5b. Of the pair of vertical wires 8 constituting the U-shaped conductor 5B, the vertical wire 8 located on the end face 2a side has one end connected to one end of the parallel wire 6 and the other end forming end 5c. Of the pair of vertical wires 8 constituting the U-shaped conductor 5B, the vertical wire 8 located on the end face 2b side has one end connected to the other end of the parallel wire 6 and the other end forming end 5d. Of the pair of vertical wires 8 constituting the U-shaped conductor 5C, the vertical wire 8 located on the end face 2a side has one end connected to one end of the parallel wire 6 and the other end forming end 5e. Of the pair of vertical wirings 8 constituting the U-shaped conductor 5C, the vertical wiring 8 located on the end face 2b side has one end connected to the other end of the parallel wiring 6 and the other end constituting the end 5f.

[0027] In this embodiment, pad electrodes 7a-7f are provided on the main surface 2d of the element body 2, connected to the ends 5a-5f of the three U-shaped conductors 5A-5C, respectively. The pad electrodes 7a-7f are provided in areas where the ends 5a-5f are exposed. In this embodiment, the pad electrodes 7a-7f are rectangular. Each of the pad electrodes 7a-7f can be formed of a plating layer.

[0028] The printed circuit board 3 has a surface 3a facing the mounting surface (principal surface 2d) of the element body 2 of the laminated coil component 1. In this embodiment, as shown in FIG. 3 , a connecting wire 9 is provided on the surface 3a of the printed circuit board 3. The connecting wire 9 includes a plurality of land electrodes 9a-9f provided at positions overlapping the pad electrodes 7a-7f, respectively, and a plurality of connection electrodes 9g and 9h. The connection electrode 9g extends from the land electrode 9b corresponding to the pad electrode 7b toward the land electrode 9c corresponding to the pad electrode 7c, and is oblique to the first direction D1. The pad electrode 7b is connected to the end 5b of the U-shaped conductor 5A, and the pad electrode 7c is connected to the end 5c of the U-shaped conductor 5B, so that the U-shaped conductors 5A and 5B are electrically connected via the connection electrode 9g. The connection electrode 9h extends from the land electrode 9d corresponding to the pad electrode 7d toward the land electrode 9e corresponding to the pad electrode 7e, and is oblique to the first direction D1. Pad electrode 7d is connected to end 5d of U-shaped conductor 5B, and pad electrode 7e is connected to end 5e of U-shaped conductor 5C, so that U-shaped conductor 5B and U-shaped conductor 5C are electrically connected via connection electrode 9h.

[0029] The number of connection electrodes 9g, 9h of the connecting wire 9 is one less than the number of parallel wirings 6. In other words, if there are n parallel wirings 6, the number of connection electrodes of the connecting wire 9 is n-1. In this embodiment, there are three parallel wirings 6 and the number of connection electrodes of the connecting wire 9 is two.

[0030] The laminated coil component 1 can be mounted on the printed circuit board 3, for example, by soldering the pad electrodes 7a to 7f and the land electrodes 9a to 9f that overlap each other.

[0031] In the above-described coil structure 100, a coil structure is formed by the laminated coil component 1 and the printed circuit board 3. This coil structure includes U-shaped conductors 5A to 5C provided in the element body 2 of the laminated coil component 1 and a connecting wire 9 provided on the front surface 3a of the printed circuit board 3, and is wound around the axis Z. For example, when a voltage is applied between the end 5a of the U-shaped conductor 5A and the end 5f of the U-shaped conductor 5C, a current flows from the end 5a to the end 5b in the U-shaped conductor 5A, passes from the end 5b through the pad electrode 7b and the land electrode 9b, flows into the connection electrode 9g, and flows to the land electrode 9c, flows from the land electrode 9c through the pad electrode 7c into the U-shaped conductor 5B, flows from the end 5c to the end 5d, flows from the end 5d through the pad electrode 7d and the land electrode 9d into the connection electrode 9h, and flows to the land electrode 9e, and flows from the land electrode 9e through the pad electrode 7e into the U-shaped conductor 5C, and flows from the end 5e to the end 5f. At this time, the current flows around the axis Z, and the coil structure as a whole functions as a helical coil.

[0032] In the coil structure 100 described above, the inductance value can be easily adjusted. For example, by preparing multiple types of laminated coil components 1 having different dimensions (wire width, etc.) of the U-shaped conductors 5A to 5C and appropriately selecting the type of laminated coil component 1 to mount on the printed circuit board 3, the desired inductance value can be easily obtained. On the other hand, by preparing multiple types of printed circuit boards 3 having different dimensions (wire width, etc.) of the connecting wires 9 and appropriately selecting the type of printed circuit board 3 on which the laminated coil component 1 is mounted, the desired inductance value can be easily obtained. In other words, the inductance value can be freely and easily adjusted by combining the laminated coil component 1 with the printed circuit board 3.

[0033] The parallel wiring 6 of the U-shaped conductor may extend parallel to the first direction D1 as in the above-described embodiment, or may extend in a direction intersecting the first direction D1. In the embodiment shown in FIG. 5, the element body 2 is provided with an internal conductor 5 including two U-shaped conductors 5A and 5B, each having parallel wiring 6 extending linearly in a direction intersecting the first direction D1. In the embodiment shown in FIG. 5, the axis Z of the coil structure intersects the second direction D2. In the case of the multilayer coil component 1 shown in FIG. 5, the connecting wire 9 of the printed circuit board 3 may have the configuration shown in FIG. 6. That is, the connecting wire 9 includes one connecting electrode 9g extending from the land electrode 9b connected to the end 5b of the U-shaped conductor 5A to the land electrode 9c connected to the end 5c of the U-shaped conductor 5B. The connecting electrode 9g extends parallel to the first direction D1. 5 and 6, when the connection electrodes 9g, 9h of the connecting wire 9 are embedded inside the printed circuit board 3, the inner diameter of the coil increases (more specifically, increases in the direction parallel to the mounting surface 2d) without changing the dimensions of the element, compared to when the parallel wiring 6 of the U-shaped conductor extends parallel to the first direction D1. This improves the inductance value of the coil structure of the coil structure 100.

[0034] The connecting wire 9 of the printed circuit board 3 does not necessarily need to be entirely provided on the front surface 3a, and may be partially embedded within the printed circuit board 3. In the embodiment shown in FIG. 7, the connection electrodes 9g, 9h of the connecting wire 9 are embedded within the printed circuit board 3. In this case, the connection electrodes 9g, 9h are connected to the land electrodes 9b to 9e by via conductors 9i, 9j extending from the front surface 3a of the printed circuit board 3 in the thickness direction. Even with the connecting wire 9 shown in FIG. 7, a coil structure is formed by the laminated coil component 1 and the printed circuit board 3. As shown in FIG. 7, when the connection electrodes 9g, 9h of the connecting wire 9 are embedded within the printed circuit board 3, the inner diameter of the coil is enlarged in the stacking direction (third direction D3) compared to when the connection electrodes 9g, 9h are provided on the front surface 3a of the printed circuit board 3. This improves the inductance value of the coil structure of the coil structure 100.

[0035] As can be understood from the above description, the present specification discloses the following. [Appendix 1] A printed circuit board and electronic components mounted on the printed circuit board, The electronic component is an element body having a mounting surface facing the printed circuit board; a plurality of U-shaped conductors provided within the element body, arranged around an axis parallel to the mounting surface, and having both ends extending to the mounting surface; Including, the printed circuit board includes connecting wires connecting ends of different U-shaped conductors among the plurality of U-shaped conductors, A coil structure in which a plurality of U-shaped conductors of the electronic component and connecting wires of the printed circuit board form a coil structure wound around the axis. [Appendix 2] the element body is formed of a plurality of laminated insulating layers, and has the mounting surface that intersects with a lamination direction, a pair of end faces that face each other in a first direction that is parallel to the mounting surface, and a pair of side faces that face each other in a second direction that is perpendicular to the lamination direction and the first direction, 2. The coil structure of claim 1, wherein the coil structure is wound around an axis along the second direction. [Appendix 3] 3. The coil structure of claim 2, wherein the U-shaped conductor includes parallel wiring that extends linearly along the first direction at a position away from the axis with respect to the mounting surface, and a pair of vertical wiring that extend linearly from both ends of the parallel wiring along the stacking direction to the mounting surface. [Appendix 4] 3. The coil structure of claim 2, wherein the U-shaped conductor includes parallel wiring that extends linearly along a direction perpendicular to the stacking direction and intersects with the first direction at a position away from the axis with respect to the mounting surface, and a pair of vertical wiring that extend linearly from both ends of the parallel wiring along the stacking direction to the mounting surface. [Appendix 5] 5. The coil structure according to claim 2, wherein the plurality of U-shaped conductors are arranged at equal intervals along the second direction when viewed from the stacking direction. [Appendix 6] 6. The coil structure according to any one of claims 1 to 5, wherein the connecting wire is provided on a surface of the printed circuit board on which the electronic component is mounted. [Appendix 7] 6. The coil structure according to claim 1, wherein a part of the connecting wire is embedded inside the printed circuit board. [Appendix 8] an element body having a mounting surface; a plurality of U-shaped conductors provided within the element body, arranged around an axis parallel to the mounting surface, and having both ends extending to the mounting surface; and A coil structure component in which ends of different U-shaped conductors among the plurality of U-shaped conductors are connected to each other outside the element body to form a coil structure wound around the axis. [Explanation of symbols]

[0036] 1... multilayer coil component, 2... element body, 3... printed circuit board, 5... internal conductor, 5a to 5f... end portion, 6... parallel wiring, 8... vertical wiring, 9... connecting wire, 100... coil structure, D1... first direction, D2... second direction, D3... third direction.

Claims

1. A printed circuit board and electronic components mounted on the printed circuit board, The electronic component is an element body having a mounting surface facing the printed circuit board; a plurality of U-shaped conductors provided within the element body, arranged around an axis parallel to the mounting surface, and having both ends extending to the mounting surface; Including, the printed circuit board includes connecting wires connecting ends of different U-shaped conductors among the plurality of U-shaped conductors, A coil structure in which the plurality of U-shaped conductors of the electronic component and the connecting wires of the printed circuit board form a coil structure wound around the axis.

2. the element body is formed of a plurality of laminated insulating layers, and has the mounting surface intersecting a lamination direction, a pair of end faces facing each other in a first direction parallel to the mounting surface, and a pair of side faces facing each other in a second direction perpendicular to the lamination direction and the first direction, The coil structure according to claim 1 , wherein the coil structure is wound around an axis along the second direction.

3. 3. The coil structure according to claim 2, wherein the U-shaped conductor includes parallel wiring that extends linearly along the first direction at a position away from the axis with respect to the mounting surface, and a pair of vertical wiring that extend linearly from both ends of the parallel wiring along the stacking direction to the mounting surface.

4. 3. The coil structure according to claim 2, wherein the U-shaped conductor includes parallel wiring that extends linearly along a direction perpendicular to the stacking direction and intersects with the first direction at a position away from the axis with respect to the mounting surface, and a pair of vertical wiring that extend linearly from both ends of the parallel wiring along the stacking direction to the mounting surface.

5. The coil structure according to claim 2 , wherein the plurality of U-shaped conductors are arranged at equal intervals along the second direction when viewed from the stacking direction.

6. The coil structure according to claim 1 , wherein the connecting wire is provided on a surface of the printed circuit board on which the electronic component is mounted.

7. The coil structure according to claim 1 , wherein a portion of the connecting wire is embedded inside the printed circuit board.

8. an element body having a mounting surface; a plurality of U-shaped conductors provided within the element body, arranged around an axis parallel to the mounting surface, and having both ends extending to the mounting surface; and A coil structure component in which ends of different U-shaped conductors among the plurality of U-shaped conductors are connected to each other outside the element body to form a coil structure wound around the axis.

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