Resin film, copper foil with resin, multilayer wiring substrate, coil structure, and magnetic device

Abstract

To provide a resin film which is excellent in voltage resistance, has a low dielectric constant, and enables thinning of an insulation layer.SOLUTION: A resin film 100 has a core layer 2 and adhesive resin layers 1 provided on both surfaces of the core layer 2, wherein the adhesive resin layer 1 is composed of an adhesive resin composition containing an epoxy resin, dielectric breakdown strength of a cured product of the adhesive resin composition is 300 kV / mm or more, the core layer 2 is composed of a polyimide film, and dielectric breakdown strength of the polyimide film is 300 kV / mm or more.SELECTED DRAWING: Figure 1

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