Power module

Abstract

To solve a problem in which electrical discharge may occur from the conductive layer formed on the surface of an insulating substrate.SOLUTION: A power module 1 includes an insulating substrate 11, a semiconductor element 16 mounted on the insulating substrate 11, a casing 70 that houses the insulating substrate 11 together with the semiconductor element 16, and a sealing material 60 that seals the semiconductor element 16 within the casing 70. A conductor pattern 12P including at least a conductive layer 12 on which the semiconductor element 16 is mounted is formed on the surface of the insulating substrate 11, and the surface of the insulating substrate 11, together with the periphery of the conductive layer 12, is covered with an insulating film 14 such that a mounting area 13 on the surface of the conductive layer 12 on which the semiconductor element 16 is mounted is exposed.SELECTED DRAWING: Figure 7

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