Wafer manufacturing method, wire saw, and coolant

Abstract

To provide a wafer manufacturing method that can easily perform removal of a wire after cutting a work-piece.SOLUTION: A wafer manufacturing method, which manufactures a wafer by cutting a work-piece by a wire wound around a plurality of rollers, includes: a holding process in which the work-piece is held by a work-piece holding part; a cutting process in which the work-piece is cut by the wire in the state that there are abrasive grains around the wire while supplying a coolant; and a removal process in which the wire is removed from the cut work-piece. The coolant includes a filler having a hardness smaller than a hardness of the abrasive grain, and the filler flows in a cut groove formed by the wire in the cutting process.SELECTED DRAWING: Figure 6

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