Powdered composition and molded article

Abstract

To enhance the long-term storage stability at ordinary temperature of a powdered composition used for resin molding.SOLUTION: The powdered composition of the present invention is a powdered composition used for resin molding, comprising a first powder and a second powder having a composition different from that of the first powder, wherein the first powder contains an epoxy resin, and the second powder contains a curing agent, and the first powder and the second powder are melt-kneaded and then subjected to resin molding.SELECTED DRAWING: None

Description

[Technical Field]

[0001] The present invention relates to a powdery composition and a molded article. More specifically, the present invention relates to a powdery composition, a molded article comprising a cured product of the powdery composition, and a method for producing the molded article. [Background technology]

[0002] Conventionally, epoxy resins have been cured with various curing agents to produce cured products with excellent mechanical properties, water resistance, chemical resistance, heat resistance, and electrical properties, and are used in a wide range of fields, including structures, adhesives, paints, laminates, and molding materials. Such an epoxy resin is heated, melted, and kneaded together with components such as a curing agent, a curing accelerator, and an inorganic filler in a kneader, and then cooled and pulverized to be molded into a tablet or powder-like epoxy resin composition.

[0003] However, in conventional epoxy resin compositions, the reaction proceeds depending on the composition and storage conditions, and therefore there is a demand for further improvement in storage stability. For example, Patent Document 1 (JP 2012-046632 A) discloses that in a powder encapsulating epoxy resin composition containing an epoxy resin, a curing agent, a curing catalyst, and an inorganic filler as essential components, the storage stability is improved by using a mixture containing a specific imidazole compound and a high molecular weight compound as the curing catalyst. It is also known that the progress of the reaction can be inhibited by storing the epoxy resin composition in a freezer or at a low temperature. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2012-046632 Summary of the Invention [Problem to be solved by the invention]

[0005] With the recent increase in interest in environmental issues, there is a demand for room temperature storage as a storage method that does not involve energy consumption. However, the conventional technology described in Patent Document 1 leaves room for improvement in terms of room temperature storage stability. [Means for solving the problem]

[0006] The present inventors have conducted extensive research to improve the storage stability of powder epoxy resin compositions at room temperature, and have discovered that by preparing the epoxy resin and the curing agent as separate powders, good resin moldability can be maintained and the promotion of the reaction between the epoxy resin and the curing agent can be effectively suppressed. According to the present invention, the following powder composition and compact, as well as techniques relating thereto, are provided.

[0007] [1] A powdery composition used in resin molding, The composition includes a first powder and a second powder having a different composition from the first powder, the first powder contains an epoxy resin, the second powder includes a curing agent; The powdery composition is obtained by melt-kneading the first powder and the second powder, and then molding the resulting mixture into a resin. [2] A powdery composition used in resin molding, The composition includes a first powder, a second powder having a different composition from the first powder, and a powdery release agent, the first powder contains an epoxy resin, the second powder includes a curing agent; The powdery composition is formed by melt-kneading the first powder, the second powder, and a powdery release agent, and then molding the resulting mixture into a resin. [3] The powder composition according to any one of [1] and [2], A powdery composition in which, when the curing torque value at 140°C is measured over time using a curing tester, the curing torque value 5 minutes after the start of measurement is 100 kgf·cm or less. [4] The powder composition according to any one of [1] to [3], A powdery composition, wherein the first powder satisfies the following condition (i): Condition (i) 150 g of the first powder is placed in a 200 cc cylindrical container with an open top, and after storing it in an open state in a 25°C thermostatic chamber for 24 hours, when the container is inverted, the first powder does not solidify and remains in a powder form. [5] The powder composition according to any one of [1] to [4], A powdery composition, wherein the ratio (mass ratio) of the first powder to the second powder is 80:20 to 50:50. [6] The powder composition according to any one of [1] to [5], A powdery composition, wherein the maximum exothermic peak in a DSC curve obtained when the powdery composition is heated from 30°C to 200°C at a heating rate of 10°C / min using a differential scanning calorimeter is 90°C or higher and 200°C or lower. [7] The powder composition according to any one of [1] to [6], Both the first powder and the second powder contain an inorganic filler, A powdery composition, wherein the proportion (mass %) of the inorganic filler in the first powder relative to the total amount of the powdery composition is higher than the proportion (mass %) of the inorganic filler in the second powder relative to the total amount of the powdery composition. [8] The powder composition according to any one of [1] to [7], A powdery composition, wherein the content of the curing agent in the first powder is 5% by mass or less. [9] The powder composition according to any one of [1] to [8], A powdery composition, wherein the softening point of the epoxy resin in the first powder is 60°C or higher.

[10] The powder composition according to any one of [1] to [9], The first powder is a powdery composition in which, in a particle size distribution measured by sieving using a JIS standard sieve, the proportion of particles of 710 μm or more is 20 mass % or more.

[11] The powder composition according to any one of [1] to

[10] , The second powder is a powdery composition containing an imidazole-based curing catalyst.

[12] The powder composition according to any one of [1] to

[11] , A powdery composition, wherein a hardening accelerator is contained in only one of the first powder or the second powder.

[13] The powder composition according to any one of [1] to

[12] , A powdery composition, wherein the first powder comprises a wax.

[14] The powder composition according to any one of [1] to

[13] , A powdery composition, wherein the second powder comprises a wax.

[15] The powder composition according to any one of [1] to

[14] , The powder composition, wherein the first powder and the second powder are contained in different containers.

[16] The powder composition according to any one of [1] to

[14] , A powdery composition, wherein the first powder and the second powder are contained in the same container.

[17] The powder composition according to [2], The powdery composition contains 0.01 to 2 parts by mass of the powdery release agent relative to 100 parts by mass of the total amount of the first powder and the second powder.

[18] The powder composition according to [2] or

[17] , The powdery release agent is one or more selected from the group consisting of wax, higher fatty acid ester, partially saponified higher fatty acid ester, metal of higher fatty acid, and metal soap.

[19] The powder composition according to any one of [1] to

[18] , A powdery composition used in one or more of the following molding processes: compression molding, injection molding, extrusion molding, and transfer molding.

[20] A molded article comprising a cured product of the powder composition described in any one of [1] to

[19] .

[21] A method for producing a molded body using the powdery composition according to any one of [1] to

[19] , A method for producing a molded body, comprising the step of kneading the first powder and the second powder.

[22] A method for producing the molded article according to

[21] , A method for producing a molded body, comprising, before the kneading step, a step of preparing the first powder and a step of preparing the second powder, in any order. [Effects of the Invention]

[0008] According to the present invention, the storage stability of a powdery composition for resin molding at room temperature can be improved. DETAILED DESCRIPTION OF THE INVENTION

[0009] In this specification, the expression "a to b" in the description of a numerical range means from a to b, unless otherwise specified. For example, "1 to 5 mass%" means "1 mass% to 5 mass%." Furthermore, the lower limit and upper limit of a numerical range can be arbitrarily combined with the lower limit and upper limit of another numerical range.

[0010] Unless otherwise specified, each of the components and materials exemplified in this specification may be used alone or in combination of two or more.

[0011] In this specification, the terms "powdered composition," "first powder," "second powder," and "powdered release agent" all refer to a particle group consisting of a plurality of particles. Under the storage conditions of the powdered composition, the "first powder," the "second powder," and the "powdered release agent" are all powders, i.e., solids.

[0012] Hereinafter, embodiments of the present invention will be described in detail.

[0013] <Powder composition> The powdered composition of this embodiment is a powdered composition for resin molding, and contains a first powder and a second powder having a composition different from that of the first powder, the first powder containing an epoxy resin, and the second powder containing a curing agent, and the first powder and the second powder are melt-kneaded together and then resin-molded.

[0014] According to the powdery composition of the present embodiment, the reaction between the epoxy resin and the curing agent is inhibited from proceeding during storage of the powdery composition, thereby improving the shelf life of the powdery composition at room temperature. Furthermore, since the powdery composition can be stored at room temperature, energy consumption required for low-temperature storage can be eliminated. Here, room temperature refers to an ambient temperature of about 15 to 35°C.

[0015] Although the details of the reason for this are not clear, conventional epoxy resin compositions processed into powder or tablet form contain a curing agent, so the epoxy resin and curing agent remain in contact with each other until use. In contrast, in this embodiment, the epoxy resin and curing agent are contained in separate powders, the first powder and the second powder, respectively. As a result, direct contact between the epoxy resin and curing agent is reduced compared to conventional products, and reaction between the two during storage can be suppressed, which is thought to improve storage stability.

[0016] Furthermore, the powdered composition of this embodiment is a powdered composition used for resin molding, and contains a first powder, a second powder having a composition different from that of the first powder, and a powdered mold release agent, wherein the first powder contains an epoxy resin and the second powder contains a curing agent, and the first powder and the second powder are melt-kneaded and then resin-molded.

[0017] Furthermore, in the powdery composition, when the first powder and the second powder are mixed together, the powdery release agent can be present between them, which can prevent the two from caking together during storage.

[0018] Resin molding involves heating, melting, and kneading a powdered composition containing a resin, followed by curing in a mold to obtain a resin molded body. For example, one or more methods selected from compression molding, injection molding, extrusion molding, and transfer molding are preferred, and an extruder may be used to melt, knead, and mold the resin. This allows the first powder and the second powder to be kneaded more uniformly.

[0019] The molding machine is not particularly limited as long as it can melt-knead the first powder and the second powder and mold them into a resin, and any known device can be used.

[0020] (Maximum exothermic peak in DSC curve) The maximum exothermic peak in the DSC curve obtained when the powdery composition is heated from 30°C to 200°C using a differential scanning calorimeter at a heating rate of 10°C / min is preferably 90°C or higher and 200°C or lower, more preferably 100°C or higher and 180°C or lower, and even more preferably 110°C or higher and 160°C or lower.

[0021] By setting the maximum exothermic peak to the above upper limit or less, it becomes easier to realize low-temperature curing of the powdery composition, which in turn makes it possible to lower the temperature during resin molding using the powdery composition, thereby reducing the thermal load on the resin molded product and enabling the production of a desired resin molded product. On the other hand, by making the maximum exothermic peak equal to or greater than the lower limit, the curability of the powdery composition can be suppressed, and good storage stability can be obtained.

[0022] (torque value measured by hardening tester) When the curing torque value of the powdery composition is measured over time at 140°C using a curing tester (Curelastometer: registered trademark), the curing torque value 5 minutes after the start of measurement is preferably 100 kgf cm or less, more preferably 80 kgf cm or less, and even more preferably 50 kgf cm or less. From the viewpoint of reducing the load during kneading, the curing torque value may be 30 kgf cm or less. On the other hand, the lower limit of the torque value is not particularly limited, but may be set to 0.5 kgf·cm or more, or 1 kgf·cm or more, in order to obtain a good resin molded product.

[0023] A powdery composition having the above properties can be achieved by adjusting the compositions of the first and second powders, the manufacturing procedure for the powdery composition, and the like.

[0024] The composition of the powder composition of this embodiment will be described below.

[0025] The powdery composition of this embodiment contains at least a first powder and a second powder having a different composition from that of the first powder. "Different compositions" refers to different constituent components or different blending amounts of the constituent components.

[0026] The ratio (mass ratio) of the first powder to the second powder is preferably 80:20 to 50:50, more preferably 78:22 to 55:45, and even more preferably 76:24 to 58:42. By setting the ratio of the first powder to the second powder within the above range, the caking tendency of each of the first powder and the second powder can be reduced, while also improving reactivity during resin molding.

[0027] Furthermore, when both the first powder and the second powder contain an inorganic filler (described below), it is preferable that the ratio (% by mass) of the inorganic filler in the first powder relative to the total amount of the powdered composition is higher than the ratio (% by mass) of the inorganic filler in the second powder relative to the total amount of the powdered composition. This effectively prevents the first powder containing an epoxy resin from caking, making it easier to obtain a good mixed state when the first powder and the second powder are mixed in a molding machine. Specifically, for example, the ratio (mass %) of the inorganic filler in the first powder to the total amount of the powdered composition is preferably 1.1 or more, more preferably 1.3 or more, relative to the ratio (mass %) of the inorganic filler in the second powder to the total amount of the powdered composition, and may be 2 or more in order to improve the prevention of caking of the powdered composition. On the other hand, the ratio (mass %) of the inorganic filler in the first powder to the total amount of the powdery composition is preferably 10 or less, more preferably 7 or less, and even more preferably 5 or less, relative to the ratio (mass %) of the inorganic filler in the second powder to the total amount of the powdery composition, thereby maintaining good moldability of the powdery composition. The ratio of the content (parts by mass) of inorganic filler in the first powder to the content (parts by mass) of inorganic filler in the second powder can be achieved by controlling the ratio (mass ratio) of the first powder to the second powder in the powder composition or by adjusting the ratio of the inorganic filler contained in the first powder and the second powder.

[0028] [First powder] (epoxy resin) The first powder includes at least an epoxy resin.

[0029] The softening point of the epoxy resin in the first powder is preferably 60° C. or higher, more preferably 65° C. or higher, and even more preferably 70° C. or higher, which can prevent the first powder from caking and improve the kneadability when melt-kneading with the second powder. On the other hand, the upper limit of the softening point of the epoxy resin in the first powder is not particularly limited, but in order to maintain good moldability, it may be, for example, 200°C or lower, and preferably 175°C or lower.

[0030] Examples of epoxy resins include monomers, oligomers, and polymers in general having two or more epoxy groups in one molecule, and are not particularly limited in terms of molecular weight or molecular structure. Examples of epoxy resins include crystalline epoxy resins such as biphenyl-type epoxy resins, bisphenol A-type epoxy resins, bisphenol F-type epoxy resins, stilbene-type epoxy resins, and hydroquinone-type epoxy resins; novolac-type epoxy resins such as cresol novolac-type epoxy resins, phenol novolac-type epoxy resins, and naphthol novolac-type epoxy resins; phenylene skeleton-containing phenol aralkyl-type epoxy resins;

[0033] Examples of epoxy resins include phenol aralkyl epoxy resins such as epoxy resins, biphenylene skeleton-containing phenol aralkyl epoxy resins, and phenylene skeleton-containing naphthol aralkyl epoxy resins; trifunctional epoxy resins such as triphenolmethane epoxy resins and alkyl-modified triphenolmethane epoxy resins; modified phenol epoxy resins such as dicyclopentadiene-modified phenol epoxy resins and terpene-modified phenol epoxy resins; and heterocycle-containing epoxy resins such as triazine nucleus-containing epoxy resins. These may be used alone or in combination of two or more. The epoxy resin is preferably a solid at room temperature in order to prevent the first powder from caking.

[0031] The content of the epoxy resin is preferably 2 to 40 mass %, more preferably 10 to 30 mass %, and even more preferably 15 to 25 mass %, relative to the total amount of the first powder. By setting the epoxy resin content to be equal to or greater than the above lower limit, good resin moldability can be obtained, while by setting the epoxy resin content to be equal to or less than the above upper limit, the caking tendency of the first powder can be reduced while maintaining good flowability and handleability of the first powder.

[0032] The first powder may further contain known components such as a curing agent, an inorganic filler, and a wax.

[0033] (hardening agent) By including a hardener in the first powder, the softening point of the first powder can be increased, and as a result, the caking resistance of the first powder can be improved. The content of the curing agent is preferably 5% by mass or less, more preferably 4.5% by mass or less, and even more preferably 1% by mass or less, based on the total amount of the first powder. Even when a curing agent is contained, it is presumed that the first powder does not contain a curing catalyst, thereby suppressing the acceleration of curing of the epoxy resin in the first powder. When the first powder contains a curing agent, the content of the curing catalyst is preferably 1% by mass or less, more preferably 0.1% by mass or less, and even more preferably 0% by mass, relative to the total amount of the first powder.

[0034] Examples of the curing agent include the same as those described below for the second powder. The curing agent contained in the first powder may be the same as or different from the curing agent contained in the second powder. If the physical properties such as softening point and reaction temperature are the same, when the first powder and the second powder are melt-kneaded, handling during kneading is improved and good solubility is obtained. Therefore, it is preferable that the curing agent contained in the first powder is the same as the curing agent contained in the second powder.

[0035] (inorganic filler) Specific examples of the inorganic filler include silicates such as talc, calcined clay, uncalcined clay, mica, and glass; oxides such as fused silica, spherical silica, crushed silica, titanium oxide (titanium dioxide, titanium white), aluminum oxide (alumina), and boehmite; carbonates such as calcium carbonate, magnesium carbonate, and hydrotalcite; hydroxides such as aluminum hydroxide, magnesium hydroxide, and calcium hydroxide; sulfates or sulfites such as barium sulfate, calcium sulfate, and calcium sulfite; borates such as zinc borate, barium metaborate, aluminum borate, calcium borate, and sodium borate; nitrides such as aluminum nitride, boron nitride, silicon nitride, and carbon nitride; titanates such as strontium titanate and barium titanate; and reinforcing fibers such as glass fiber, carbon fiber, and metal fiber. These may be used alone or in combination of two or more.

[0036] The inorganic filler preferably has an average particle size D50 of 0.01 μm or more and 75 μm or less, and more preferably 0.05 μm or more and 50 μm or less. By setting the average particle size of the inorganic filler within the above range, resin moldability and filling properties can be improved. The average particle size D50 can be the average particle size converted into volume (cumulative 50%) using a commercially available laser particle size distribution analyzer.

[0037] The content of the inorganic filler is preferably 60 to 98 mass %, more preferably 70 to 95 mass %, and even more preferably 75 to 92 mass %, relative to the total amount of the first powder. By setting the content of the inorganic filler to the above lower limit or more, the fluidity and anti-caking properties of the first powder can be improved, while by setting the content of the inorganic filler to the above upper limit or less, the kneadability and processability during production of the first powder can be improved.

[0038] The inorganic filler may be surface-treated. Examples of the surface treatment agent include methylhydrogenpolysiloxane, silicone resin, metal soap, silane coupling agent, perfluoroalkylsilane, and fluorine compounds such as perfluoroalkyl phosphate ester salt.

[0039] (wax) Examples of the wax include natural waxes such as carnauba wax, synthetic waxes such as Montan acid ester wax and oxidized polyethylene wax, and higher fatty acids such as zinc stearate and metal salts thereof.

[0040] The content of the wax is preferably 0.01 to 2 mass % relative to the total amount of the first powder, more preferably 0.05 to 1 mass %, and even more preferably 0.1 to 0.5 mass %. By setting the wax content to the above lower limit or more, good fluidity can be achieved, and good kneading properties can be obtained when producing the first powder and when kneading the first powder and the second powder, while by setting the wax content to the above upper limit or less, hardening properties can be maintained.

[0041] (Other additives) In addition, the first powder may contain various additives such as coupling agents such as various silane-based compounds such as epoxy silane, mercapto silane, amino silane, alkyl silane, ureido silane, and vinyl silane; colorants such as carbon black; release agents such as higher fatty acids or their metal salts, paraffin, and polyethylene oxide; stress reducing agents such as silicone oil and silicone rubber; flame retardants such as aluminum hydroxide; ion scavengers such as hydrotalcites or hydrous oxides of elements selected from magnesium, aluminum, bismuth, titanium, and zirconium; adhesion promoters such as thiazoline, diazole, triazole, triazine, and pyrimidine; and antioxidants.

[0042] It is preferable that the first powder does not contain a curing catalyst (curing accelerator) in order to suppress reactions during storage. The first powder may contain a thermosetting resin other than the epoxy resin, but preferably does not contain a thermosetting resin other than the epoxy resin in order to suppress reactions during storage and to obtain low-temperature curing properties.

[0043] (physical properties, etc.) The first powder preferably satisfies the following condition (i), which can suppress caking of the first powder and improve the storage stability of the powdery composition.

[0044] Condition (i) 150 g of the first powder is placed in a 200 cc cylindrical container with an open top, and after storing it in an open state in a 25°C thermostatic chamber for 24 hours, when the container is inverted, the first powder does not solidify and remains in a powder form.

[0045] In condition (i), the solidification of the first powder refers to a state in which the first powder maintains the shape of the container when the container is turned upside down and the first powder is taken out of the opening under its own weight. One cause of solidification is the progression of the reaction of the epoxy resin.

[0046] The first powder that satisfies the above condition (i) can be realized by controlling the composition and particle size distribution of the first powder.

[0047] In addition, in the particle size distribution of the first powder measured by sieving using a JIS standard sieve, the proportion of particles of 710 μm or more is preferably 20% by mass or more, more preferably 30% by mass or more, even more preferably 40% by mass or more, and particularly preferably 50% by mass or more. In other words, by increasing the proportion of particles with relatively large particle diameters in the first powder, it becomes easier to suppress caking of the first powder.

[0048] Furthermore, the first powder may contain particles of less than 250 μm in the particle size distribution, for example, 100% by mass, but from the viewpoint of obtaining longer storage stability, it is preferable that the content be 90% by mass or less, and more preferably 50% by mass or less. This makes it possible to improve the ease of handling of the first powder while suppressing adhesion of the first powder.

[0049] Specifically, the particle size distribution of the first powder is obtained by using JIS standard sieves with mesh sizes of 710 μm and 250 μm attached to a low-tap type sieve vibrator, passing 200 g of a sample (first powder) through the sieves while vibrating the sieves, and determining the mass percentage of coarse particles remaining on the 710 μm sieve and the mass percentage of fine powder passing through the 250 μm sieve relative to the sample mass before classification.

[0050] (Manufacturing method) The method for producing the first powder is not particularly limited, but for example, the raw material components can be premixed in a mixer, heated and kneaded in a kneading machine such as a roll, a kneader, or an extruder, and then cooled and pulverized to obtain a powder. Classification may also be performed.

[0051] [Second powder] (hardening agent) The second powder includes at least a curing agent.

[0052] The curing agent is not particularly limited as long as it reacts with the epoxy resin in the first powder to cure it, and examples thereof include linear aliphatic diamines having 2 to 20 carbon atoms, such as ethylenediamine, trimethylenediamine, tetramethylenediamine, and hexamethylenediamine; amines such as metaphenylenediamine, paraphenylenediamine, paraxylenediamine, 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenylpropane, 4,4'-diaminodiphenylether, 4,4'-diaminodiphenylsulfone, 4,4'-diaminodicyclohexane, bis(4-aminophenyl)phenylmethane, 1,5-diaminonaphthalene, metaxylenediamine, paraxylenediamine, 1,1-bis(4-aminophenyl)cyclohexane, and dicyanodiamide; resole-type phenolic resins, such as aniline-modified resole resins and dimethyl ether resole resins; phenol novolac resins; and cresol novolac. Examples of suitable phenolic compounds include novolac-type phenolic resins such as tert-butylphenol novolac resins and nonylphenol novolac resins; phenol aralkyl resins such as phenylene-based phenol aralkyl resins and biphenylene-based phenol aralkyl resins; phenolic resins having a condensed polycyclic structure such as a naphthalene or anthracene skeleton; polyoxystyrenes such as polyparaoxystyrene; alicyclic acid anhydrides such as hexahydrophthalic anhydride (HHPA) and methyltetrahydrophthalic anhydride (MTHPA), and acid anhydrides including aromatic acid anhydrides such as trimellitic anhydride (TMA), pyromellitic anhydride (PMDA), and benzophenonetetracarboxylic acid (BTDA); polymercaptan compounds such as polysulfides, thioesters, and thioethers; isocyanate compounds such as isocyanate prepolymers and blocked isocyanates; and organic acids such as carboxylic acid-containing polyester resins. These compounds may be used alone or in combination of two or more.

[0053] The content of the curing agent is preferably 5 to 40 mass %, more preferably 10 to 35 mass %, and even more preferably 15 to 32 mass %, relative to the total amount of the second powder. By setting the content of the curing agent to the above lower limit or more, the curing characteristics of the powdery composition can be improved, while by setting the content of the curing agent to the above upper limit or less, the storage stability of the powdery composition can be improved.

[0054] The second powder may further contain known components such as a curing catalyst (curing accelerator), an inorganic filler, and wax.

[0055] (curing catalyst) The curing catalyst is used to accelerate the curing reaction. Examples of curing catalysts include imidazoles; organic metal salts such as zinc naphthenate, cobalt naphthenate, tin octoate, cobalt octoate, cobalt bisacetylacetonate(II), and cobalt trisacetylacetonate(III); tertiary amines such as triethylamine, tributylamine, and 1,4-diazabicyclo[2.2.2]octane; organic phosphorus compounds such as triphenylphosphine, tri-p-tolylphosphine, tetraphenylphosphonium tetraphenylborate, triphenylphosphine triphenylborane, and 1,2-bis-(diphenylphosphino)ethane; phenolic compounds such as phenol, bisphenol A, and nonylphenol; organic acids such as acetic acid, benzoic acid, salicylic acid, and p-toluenesulfonic acid; and mixtures thereof.

[0056] Furthermore, the curing catalyst preferably has an active temperature range of 120°C or less, more preferably 100°C or less, in order to effectively improve storage stability and achieve low-temperature curing. The active temperature range is the temperature range in which heat is generated during curing when the powdery composition is heated. In the powdery composition of the present embodiment, by having the second powder containing the curing catalyst separate from the first powder, it is possible to use a powder having high catalytic activity while maintaining storage stability.

[0057] Specifically, imidazole-based curing catalysts, which are the above-mentioned imidazoles, are preferred. Examples of the imidazole curing catalyst include imidazole, 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-phenylimidazole, 1-benzyl-2-methylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazolium trimellitate, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazolium trimellitate, 1-cyanoethyl-2-phenylimidazole ... Examples of the hydroxybenzoates include 2,4-diamino-6-[2'-methylimidazolyl(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-undecylimidazolyl(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-ethyl-4-methylimidazolyl(1')]-ethyl-s-triazine, an isocyanuric acid adduct of 2,4-diamino-6-[2'-methylimidazolyl(1')]-ethyl-s-triazine, an isocyanuric acid adduct of 2-phenylimidazole, an isocyanuric acid adduct of 2-methylimidazole, 2-phenyl-4,5-dihydroxydimethylimidazole, and 2-phenyl-4-methyl-5-hydroxymethylimidazole. These may be used alone or in combination of two or more. Among these, from the viewpoint of improving low-temperature curing properties and filling properties, it is preferable to use one or more selected from the group consisting of 2-phenylimidazole, 2-methylimidazole, 2-phenyl-4-methylimidazole, and 2-phenyl-4-methyl-5-hydroxymethylimidazole, and it is more preferable to use 2-phenylimidazole and / or 2-methylimidazole.

[0058] Commercially available imidazole curing catalysts include Curazol 2MZ, 2PZ, 2PHZ, 2MZ-OK, 2PZ-OK, 2P4MHZ, 2PHZ, 2E4MZ, C11Z, C17Z, 2MA-OK, and 1B2MZ (all manufactured by Shikoku Chemical Industry Co., Ltd.), jER Cure IBMI-12, EMI-24, and BMI-12 (all manufactured by Japan Epoxy Resins Co., Ltd.), and Nichigo Imidazole 2PI, 2MI, 2E4MI, and 1B2MI (all manufactured by Nippon Synthetic Chemical Industry Co., Ltd.). Commercially available compounds in which the functional groups of these compounds have been appropriately substituted with inert cyanoethyl groups, salts formed with trimellitic acid, or modified with dicyandiamide include 2E4MZ-CN, 2PHZ-CN, C11Z-CNS, and 2MZ-AZINE (all manufactured by Shikoku Chemical Industry Co., Ltd.).

[0059] The content of the curing catalyst is preferably 0.5 to 7 mass %, more preferably 1 to 6 mass %, and even more preferably 2.0 to 5.5 mass %, based on the total amount of the second powder. By adjusting the content of the curing catalyst to be equal to or greater than the lower limit, the curing property of the powdery composition can be promoted, whereas by adjusting the content of the curing catalyst to be equal to or less than the upper limit, the room temperature storage stability of the powdery composition can be improved.

[0060] (inorganic filler) Examples of the inorganic filler include the same ones as those described above for the first powder. The inorganic filler contained in the second powder may be the same as or different from the inorganic filler contained in the first powder, but from the viewpoint of obtaining good kneadability when the first powder and the second powder are melt-kneaded, it is preferable that the inorganic filler contained in the second powder is the same as the inorganic filler contained in the first powder.

[0061] The content of the inorganic filler is preferably 50 to 92 mass %, more preferably 55 to 85 mass %, and even more preferably 60 to 80 mass %, based on the total amount of the second powder. By setting the content of the inorganic filler to the above lower limit or more, the fluidity of the second powder can be improved, while by setting the content of the inorganic filler to the above upper limit or less, the processability of the second powder can be improved.

[0062] (wax) Examples of the wax include the same waxes as those described above for the first powder. The wax contained in the second powder may be the same as or different from the wax contained in the first powder, but from the viewpoint of obtaining good kneadability, it is preferable that the wax contained in the second powder is the same as the wax contained in the first powder.

[0063] The content of the wax is preferably 0.01 to 2 mass %, more preferably 0.05 to 1 mass %, and even more preferably 0.1 to 0.5 mass %, based on the total amount of the second powder. By setting the wax content to the above lower limit or more, good fluidity can be achieved, and good kneading properties can be obtained when producing the second powder and when kneading the first powder and the second powder, while by setting the wax content to the above upper limit or less, hardening properties can be maintained.

[0064] (Other additives) In addition, the second powder may contain the same various additives as those described above for the first powder.

[0065] It is preferable that the second powder does not contain a thermosetting resin such as an epoxy resin, in order to suppress the progress of the curing reaction.

[0066] (Manufacturing method) The method for producing the second powder is not particularly limited, but for example, the raw material components can be premixed in a mixer, heated and kneaded in a kneading machine such as a roll, kneader, or extruder, and then cooled and pulverized to form a powder.

[0067] [others] The powder composition of this embodiment may contain components other than the first powder and the second powder, but the total amount of the first powder and the second powder is preferably 90% by mass or more, more preferably 95% by mass or more, even more preferably 98% by mass or more, and especially preferably 99% by mass or more, based on the total amount of the powder composition. On the other hand, the total amount of the first powder and the second powder may be 100% by mass or 99.5% by mass or less, based on the total amount of the powder composition.

[0068] An example of the component other than the first powder and the second powder is a powdery release agent.

[0069] (Powder release agent) The powdery release agent is in powder form, and when used together with the first powder and the second powder, it can prevent the first powder and the second powder from caking together during storage of the powdery composition. As a result, in the powdery composition of this embodiment, the first powder and the second powder can be stored in the same storage container, or the first powder and the second powder can be stored or left in a mixed state. Furthermore, by using the powdery mold release agent, when the powdery composition is applied to resin molding, adhesion of the powdery composition to a molding die can be suppressed, making it difficult to remove the resin molded product from the die and reducing the sticking of powdery composition residue to the die.Furthermore, by suppressing the powdery composition from sticking to the screw of the molding machine, production stability can be improved.

[0070] In the powdered composition of the present embodiment, the powdered release agent may be attached to the surface of at least one of the first powder and the second powder, or may be attached to the resin contained in at least one of the first powder and the second powder, or may be present separately from the resin. The state of the powdery release agent can be confirmed by observing it using an electron microscope (SEM, etc.) or an optical microscope.

[0071] Examples of the powdery release agent include one or more waxes selected from natural waxes such as carnauba wax and synthetic waxes such as Montan acid ester wax and oxidized polyethylene wax; higher fatty acid esters, partially saponified products of higher fatty acid esters, metals of higher fatty acids, and metal soaps.

[0072] The content of the powdery release agent is preferably 0.01 parts by mass or more, more preferably 0.05 parts by mass or more, even more preferably 0.1 parts by mass or more, and even more preferably 0.20 parts by mass or more, relative to 100 parts by mass of the first powder. The content of the powdery release agent is preferably 0.01 parts by mass or more, more preferably 0.05 parts by mass or more, even more preferably 0.1 parts by mass or more, and even more preferably 0.20 parts by mass or more, relative to 100 parts by mass of the second powder.

[0073] The content of the powdery release agent is preferably 2 parts by mass or less, more preferably 1.5 parts by mass or less, even more preferably 1.0 part by mass or less, and even more preferably 0.5 parts by mass or less, relative to 100 parts by mass of the first powder. The content of the powdery release agent is preferably 2 parts by mass or less, more preferably 1.5 parts by mass or less, even more preferably 1.0 part by mass or less, and even more preferably 0.5 parts by mass or less, relative to 100 parts by mass of the second powder.

[0074] The size of the powdery release agent is preferably smaller than the particle size of the first powder and the second powder, and may be, for example, 1 to 80 μm.

[0075] <Method of producing powder composition> The method for producing the powdery composition of the present embodiment includes, in any order, a step of producing a first powder and a step of producing a second powder, and may further include a step of blending a powdery release agent.

[0076] The method for adding the powdery release agent is not particularly limited. For example, after obtaining the first powder and the second powder, (i) the first powder, the second powder, and the powdery release agent may be mixed simultaneously, (ii) the first powder and the powdery release agent may be mixed in advance and then further mixed with the second powder, (iii) the second powder and the powdery release agent may be mixed in advance and then further mixed with the first powder, or (iv) the first powder and the powdery release agent may be mixed, and then the second powder and the powdery release agent may be mixed separately, and then the mixture of both may be further mixed. Among these, methods (ii) to (iv) are preferred, with method (iv) being more preferred.

[0077] The method for mixing the powders is not particularly limited, and any known method can be used.

[0078] <Set> The powdered composition of this embodiment is fed into a molding machine, where the first powder and the second powder are melt-kneaded. The powdered composition may be a mixture of the first powder and the second powder, or may be a powder set in which the first powder and the second powder are contained in different containers. By containing the powders in different containers, the reaction between the first powder and the second powder can be blocked, further improving storage stability.

[0079] When a powdery release agent is contained in addition to the first powder and the second powder, the powdery release agent may be contained in a different container from the first powder and the second powder, or the first powder, the second powder, and the powdery release agent may be contained in the same container.

[0080] The container is not particularly limited, and a conventional container for storing epoxy resin compositions can be used. The inside of the container may be an air atmosphere or may be replaced with an inert gas.

[0081] <Molded body> The molded body of this embodiment is obtained by melt-kneading the first powder, the second powder, and a powdery composition that optionally contains a mold-releasing property, and then molding the resulting mixture with resin. The resin molding is preferably one or more methods selected from compression molding, injection molding, extrusion molding, and transfer molding, and among these, an extruder may be used to melt, knead, and mold the resin.

[0082] For example, the first powder and the second powder can be melt-kneaded at 70 to 120°C in a molding machine and then cured in a mold. The curing and molding conditions can be, for example, heating the powder composition of this embodiment at 100 to 200°C for 90 to 900 seconds.

[0083] The method for producing a molded body of the present embodiment includes a step of kneading the first powder and the second powder. Furthermore, the method for producing a molded body may include a step of preparing the first powder and a step of preparing the second powder, in any order, before the kneading step.

[0084] The molded article can be widely applied to, for example, composite members for transportation equipment such as automobiles, railways, ships, and aircraft, semiconductor chips, semiconductor elements, semiconductor devices including printed wiring boards, composite members for factory equipment such as work robots, electronic devices such as electric circuit display devices, information and communication terminals, light-emitting diodes, physical batteries, and chemical batteries, composite members for civil engineering and construction, composite members for sports and recreation, etc. Among these, composite members for transportation equipment such as automobiles, semiconductor devices, etc. are preferred in view of the importance of addressing environmental issues. Specifically, the semiconductor device includes a semiconductor element and an encapsulant that encapsulates the semiconductor element, and the encapsulant is made of a cured product of the resin composition of the present embodiment. The encapsulation method is not particularly limited, and known methods can be used.

[0085] The method for producing a molded body of this embodiment includes a step of kneading the first powder and the second powder, and then molding into a desired shape using a known method.

[0086] Although the embodiments of the present invention have been described above, these are merely examples of the present invention, and various other configurations can also be adopted. [Example]

[0087] Next, the present invention will be described in detail with reference to examples, but the content of the present invention is not limited to the examples.

[0088] (1) Raw materials The raw materials shown in Table 1 were as follows: Inorganic filler 1: Fused silica "FB-105" manufactured by Denka Co., Ltd. Inorganic filler 2: Fused silica "FB-950" manufactured by Denka Co., Ltd. Inorganic filler 3: Fused silica "FMT-15C" manufactured by Fumitec Inorganic filler 4: Fine silica "SO-C2" manufactured by Admatechs

[0089] Coupling agent 1: N-phenyl-3-aminopropyltrimethoxysilane "CF-4083" manufactured by DuPont Toray Specialty Materials Co., Ltd.

[0090] Epoxy resin 1: Cresol novolac type multifunctional epoxy resin "N-670-EXP-S" manufactured by DIC Corporation, softening point 70°C Epoxy resin 2: Cresol novolac type multifunctional epoxy resin "N-662-EXP-S" manufactured by DIC Corporation, softening point 62°C

[0091] Hardener 1: Cresol novolac phenolic resin "PR-HF-3" manufactured by Sumitomo Bakelite Co., Ltd., softening point 80°C

[0092] Curing catalyst 1: Imidazole-based curing catalyst "Curezol 2P4MHZ-PW" manufactured by Shikoku Chemicals Corporation Curing catalyst 2: Imidazole-based curing catalyst "2PZ-PW" manufactured by Shikoku Chemicals Corporation Curing catalyst 3: 4-hydroxy-2-(triphenylphosphonium)phenolate (TPP-BQ) manufactured by K.I. Chemicals Co., Ltd.

[0093] Wax: Carnauba wax (Nikko Carnauba) "C-WAX" manufactured by Nikko Fine Products

[0094] Other 1: Carbon "#5" manufactured by Mitsubishi Chemical Corporation Other 2: Polyoxyalkylene epoxy modified dimethylpolysiloxane "FZ-3730" manufactured by DuPont Toray Specialty Materials

[0095] Powdered release agent 1: "Zinc Stearate D", manufactured by NOF Corporation (particle size 74 μm or less)

[0096] Example 1 The first powder and the second powder were prepared in the mass ratio shown in Table 1 by the following procedure, to obtain a powder composition (Example Composition 1). A mixture was obtained by mixing the components at the solid content ratios (parts by mass) shown in Table 1. Mixing was performed at room temperature using a Henschel mixer. The resulting mixture was then kneaded in a twin-screw kneader at 90 to 110°C to obtain a kneaded product. The resulting kneaded product was cooled and then pulverized to prepare the first powder of Example 1. In addition, a kneaded material was prepared using the same procedures and conditions as for the first powder, except that the solid content (parts by mass) was set as shown in Table 1. The resulting kneaded material was cooled and then pulverized to prepare the second powder of Example 1.

[0097] <Example 2> The first powder and the second powder were prepared in the same manner as in Example 1, except that the solid content (parts by mass) was changed to that shown in Table 1, to obtain a powdery composition (Example Composition 2).

[0098] Example 3 Example composition 1 obtained in Example 1 was sieved as follows. The first powder obtained in Example 1 was sieved while vibrating using a JIS standard sieve with a mesh size of 250 μm attached to a low-tap type sieve vibrator, and the powder that passed through the sieve (fine powder with a particle size of less than 250 μm) was used as the first powder of Example 3. In addition, a second powder was prepared in the same manner as in Example 1 to obtain a powdery composition.

[0099] Example 4 Example composition 1 obtained in Example 1 was sieved as follows. The first powder obtained in Example 1 was sieved while vibrating using a JIS standard sieve with a mesh size of 710 μm attached to a low-tap type sieve vibrator, and the material remaining on the sieve (coarse powder with a particle size of 700 μm or more) was used as the first powder of Example 4. In addition, a second powder was prepared in the same manner as in Example 1 to obtain a powdery composition.

[0100] <Example 5> The first powder and the second powder were prepared in the same manner as in Example 1, except that the solid content (parts by mass) was changed to that shown in Table 1, to obtain a powdery composition (Example Composition 3).

[0101] Example 6 The first powder and the second powder were prepared in the same manner as in Example 1, except that the solid content (parts by mass) was changed to that shown in Table 1, to obtain a powdery composition (Example Composition 4).

[0102] Example 7 The first powder and the second powder were prepared in the mass ratio shown in Table 1 by the following procedure, to obtain a powder composition (Example Composition 5). A mixture was obtained by mixing the components at the solid content ratios (parts by mass) shown in Table 3. Mixing was performed at room temperature using a Henschel mixer. The resulting mixture was then kneaded in a twin-screw kneader at 90 to 110°C to obtain a kneaded product. The resulting kneaded product was cooled and then pulverized to prepare the first powder of Example 7. In addition, a kneaded material was prepared using the same procedures and conditions as for the first powder, except that the solid content (parts by mass) was set as shown in Table 3. The resulting kneaded material was cooled and then pulverized to prepare the second powder of Example 7.

[0103] Example 8 The first powder and the second powder were prepared in the mass ratio shown in Table 3 by the following procedure, to obtain a powder composition (Example Composition 6). A mixture was obtained by mixing the components at the solid content ratios (parts by mass) shown in Table 3. Mixing was performed at room temperature using a Henschel mixer. The resulting mixture was then kneaded in a twin-screw kneader at 90 to 110°C to obtain a kneaded product. The resulting kneaded product was cooled and then pulverized to prepare the first powder of Example 7. Next, 100 parts by mass of the obtained first powder and 0.25 parts of powdery release agent 1 were placed in a container, and the container was shaken at room temperature to mix them. Separately, a kneaded material was prepared using the same procedures and conditions as for the first powder, except that the solid content (parts by mass) was set as shown in Table 3. The resulting kneaded material was cooled and then pulverized to prepare the second powder of Example 7. Next, 100 parts by mass of the obtained second powder and 0.25 parts of powdery release agent 1 were placed in a container, and the container was shaken at room temperature to mix them.

[0104] <Comparative Example 1> A kneaded mixture was obtained by kneading each component at the solid content (parts by mass) shown in Table 1 in a twin-screw kneader at 90 to 110° C. The kneaded mixture was cooled and then pulverized to obtain a powdery composition.

[0105] (2) Physical properties and measurements [First powder; Condition (i)] 150 g of each of the first powders obtained in the above Examples and Comparative Examples was placed in an open-topped 200 cc cylindrical container and stored in an open state in a thermostatic chamber at 25°C. After 24 hours of storage, the container was turned upside down and the state of the first powder was evaluated according to the following criteria. The results are shown in Tables 2 and 4. Filling: The first powder did not maintain the shape of the container and was not solidified. Not filled; the first powder maintained the shape of the container and was solidified

[0106] [First powder; particle size distribution] Each of the first powders obtained in the above Examples and Comparative Examples was measured by the following sieving using a JIS standard sieve. Specifically, JIS standard sieves with openings of 710 μm and 250 μm attached to a low-tap type sieve vibrator were used, and 200 g of the sample (first powder) was passed through the sieves to be classified while vibrating the sieves. Thereafter, the mass % of the coarse particles remaining on the 710 μm sieve relative to the sample mass before classification, and the mass % of the fine powder passing through the 250 μm sieve relative to the sample mass before classification were determined.

[0107] [Powdered composition; measurement of maximum exothermic peak] Each powder composition obtained in the above examples was heated, melted and kneaded for 2 minutes using a Laboplastomill at the kneading temperature (°C) shown in Table 2 to prepare a test powder. Each test powder and the powdered composition of Comparative Example 1 were heated from 30°C to 200°C at a heating rate of 10°C / min using a differential scanning calorimeter (DSC7020, manufactured by SII) to obtain a DSC curve. The maximum exothermic peak (°C) was determined from the obtained DSC curve. The results are shown in Tables 2 and 4.

[0108] [Torque value measurement] For each of the powder compositions obtained in Examples 7 and 8, the curing torque value at 140°C was measured over time using a Curelastometer (registered trademark, CURELASTOMETER7, manufactured by JSR Trading Co., Ltd.), and the curing torque value 5 minutes after the start of measurement was determined. The results are shown in Table 4.

[0109] (4) Evaluation [Storability] Each powder composition obtained in the above examples was stored at 25°C for one month, and then heated, melted, and kneaded using a Laboplastomill at 90°C for two minutes. Then, curability was confirmed using a spiral flow meter. Furthermore, in Comparative Example 1, Comparative Composition 1 was stored under the same conditions, and then curability was confirmed using a spiral flow meter. The storage stability was evaluated according to the following criteria, and the results are shown in Tables 2 and 4. ◯: The spiral flow length was maintained at 90% or more of the length before storage. ×: Less than 90% of the value before storage.

[0110] [Caking property] 150 g of each of the first powders obtained in the above Examples was placed in an open-topped 200 cc cylindrical container and stored in an open state in a thermostatic chamber at 25°C. After 72 hours, 168 hours, 336 hours, and 672 hours of storage, the container was turned upside down and the state of the first powder was evaluated according to the following criteria. The results are shown in Tables 2 and 4. ◯: The first powder did not maintain the shape of the container and was not solidified. ×: The first powder maintained the shape of the container and was solidified.

[0111] [Manufacturing stability] Using each of the powder compositions obtained in the above examples, resin molding was carried out according to the following procedure, and the resin was evaluated according to the following criteria. (procedure) (i) First, each powder composition was placed in an injection molding machine, and the mixture was injected by injection mixing. After that, the screw was removed from the molding machine, and the degree of wrapping of the mixture around the screw was confirmed. (ii) Next, if it was determined that the degree of wrapping around the screw was not a problem for practical use, continuous injection molding injection was then carried out using the injection molding machine in 20 consecutive shots. (standard) ◯: The degree of wrapping in (i) was judged to be no problem for practical use, and continuous injection molding in (ii) was possible. ×: It was determined that there was a problem with the wrapping in (i) and the continuous injection molding injection in (ii) was not performed. Or, it was determined that there was no problem with the wrapping in (i), but it was not possible to perform all of the 20 consecutive shots of continuous injection molding injection in (ii).

[0112] [Table 1]

[0113] [Table 2] In Table 2, "-" indicates that no measurement or test was performed.

[0114] [Table 3]

[0115] [Table 4]

Claims

1. A powdery composition used in resin molding, The composition includes a first powder and a second powder having a different composition from the first powder, the first powder includes an epoxy resin, the second powder includes a curing agent; A powdery composition, wherein the first powder and the second powder are melt-kneaded and then resin-molded.

2. A powdery composition used in resin molding, The composition includes a first powder, a second powder having a different composition from the first powder, and a powdery release agent, the first powder includes an epoxy resin, the second powder includes a curing agent; A powdery composition, wherein the first powder, the second powder, and a powdery release agent are melt-kneaded and then resin-molded.

3. 3. The powder composition according to claim 1 or 2, A powdery composition having a curing torque value of 100 kgf cm or less 5 minutes after the start of measurement at 140°C when the curing torque value is measured over time using a curing tester.

4. 3. The powder composition according to claim 1 or 2, A powdery composition, wherein the first powder satisfies the following condition (i): Condition (i) 150 g of the first powder is placed in a 200 cc cylindrical container with an open top, and is stored in an open state in a constant temperature bath at 25°C for 24 hours. When the container is then inverted, the first powder does not solidify and remains in a powder form.

5. 3. The powder composition according to claim 1 or 2, A powdery composition, wherein the ratio (mass ratio) of the first powder to the second powder is 80:20 to 50:

50.

6. 3. The powder composition according to claim 1 or 2, A powdery composition, wherein the maximum exothermic peak in a DSC curve obtained when the powdery composition is heated from 30°C to 200°C at a heating rate of 10°C / min using a differential scanning calorimeter is 90°C or higher and 200°C or lower.

7. 3. The powder composition according to claim 1 or 2, Both the first powder and the second powder contain an inorganic filler, A powdery composition, wherein the proportion (mass %) of the inorganic filler in the first powder relative to the total amount of the powdery composition is higher than the proportion (mass %) of the inorganic filler in the second powder relative to the total amount of the powdery composition.

8. 3. The powder composition according to claim 1 or 2, A powdery composition, wherein the content of the curing agent in the first powder is 5% by mass or less.

9. 3. The powder composition according to claim 1 or 2, A powdery composition, wherein the softening point of the epoxy resin in the first powder is 60°C or higher.

10. 3. The powder composition according to claim 1 or 2, The first powder is a powdery composition in which, in a particle size distribution measured by sieving using a JIS standard sieve, the proportion of particles having a size of 710 μm or more is 20 mass % or more.

11. 3. The powder composition according to claim 1 or 2, The second powder is a powdery composition containing an imidazole-based curing catalyst.

12. 3. The powder composition according to claim 1 or 2, A powdery composition, wherein a hardening accelerator is contained in only one of the first powder or the second powder.

13. 3. The powder composition according to claim 1 or 2, A powdered composition, wherein the first powder comprises a wax.

14. 3. The powder composition according to claim 1 or 2, A powdered composition, wherein the second powder comprises a wax.

15. 2. The powder composition of claim 1, The powder composition, wherein the first powder and the second powder are contained in different containers.

16. 3. The powder composition according to claim 2, The powder composition, wherein the first powder and the second powder are contained in the same container.

17. 3. The powder composition according to claim 2, The powdery composition, wherein the powdery release agent is contained in an amount of 0.01 parts by mass to 2 parts by mass relative to 100 parts by mass of the total amount of the first powder and the second powder.

18. 3. The powder composition according to claim 2, The powdery release agent is one or more selected from the group consisting of wax, higher fatty acid ester, partially saponified higher fatty acid ester, metal of higher fatty acid, and metal soap.

19. 3. The powder composition according to claim 1 or 2, A powdery composition used in one or more of the following molding processes: compression molding, injection molding, extrusion molding, and transfer molding.

20. A molded article comprising a cured product of the powdery composition according to claim 1 or 2.

21. A method for producing a molded body using the powdery composition according to claim 1 or 2, comprising: A method for producing a molded body, comprising: kneading the first powder and the second powder.

22. A method for producing the molded article according to claim 21, A method for producing a molded body, comprising, before the kneading step, a step of preparing the first powder and a step of preparing the second powder, in any order.

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