Resin composition

Abstract

PURPOSE: To provide a resin composition which enables manufacture of a substrate having both performance and workability.SOLUTION: A resin composition contains a resin, a first filler, a second filler, and a third filler. The resin contains an epoxy resin, a bismaleimide resin, a curing agent, or a combination thereof. The first filler has a first particle diameter. The second filler has a second particle diameter. The third filler has a third particle diameter. The first particle diameter is larger than the second particle diameter, and the second particle diameter is larger than the third particle diameter.SELECTED DRAWING: None

Description

[Technical Field]

[0001] The present invention relates to a resin composition. [Background technology]

[0002] With the development of semiconductor technology, current substrates are gradually unable to meet the physical property requirements, such as heat resistance, glass transition temperature (Tg), and / or coefficient of thermal expansion (CTE). For example, the use of fillers often directly affects the performance and processability of resin compositions, so filler design has become an important issue in technological development. Summary of the Invention [Problem to be solved by the invention]

[0003] The use of fillers often directly affects the performance and processability of resin compositions, and therefore, the design of fillers has become an important subject of technological development. [Means for solving the problem]

[0004] The present invention provides a resin composition that can be used to produce a substrate that combines performance and processability.

[0005] The resin composition of the present invention includes a resin, a first filler, a second filler, and a third filler. The resin includes an epoxy resin, a bismaleimide resin, a curing agent, or a combination thereof. The first filler has a first particle size. The second filler has a second particle size. The third filler has a third particle size. The first particle size is larger than the second particle size, and the second particle size is larger than the third particle size.

[0006] In one embodiment of the present invention, the first particle size range is 0.5 μm or more and 1 μm or less, the second particle size range is 0.1 μm or more and 0.3 μm or less, and the third particle size range is less than 0.1 μm.

[0007] In one embodiment of the present invention, at least two of the first filler, second filler, and third filler are the same.

[0008] In one embodiment of the present invention, the first filler, second filler, and third filler are all different.

[0009] In one embodiment of the present invention, one or more of the first filler, the second filler, and the third filler described above have an epoxy group or an amino group.

[0010] In one embodiment of the present invention, the first filler, the second filler, and the third filler are all one or more selected from silicon dioxide, boron nitride, aluminum oxide, and aluminum nitride.

[0011] In one embodiment of the present invention, the weight ratio of the above-mentioned first filler in the resin composition is between 25 wt% and 60 wt%, the weight ratio of the second filler in the resin composition is between 5 wt% and 25 wt%, and the weight ratio of the third filler in the resin composition is between 5 wt% and 25 wt%.

[0012] In one embodiment of the present invention, the weight ratio of the above-mentioned third filler in the resin composition is greater than the weight ratio of the first filler in the resin composition and the weight ratio of the second filler in the resin composition.

[0013] In one embodiment of the present invention, the total weight ratio of the first filler, the second filler, and the third filler in the resin composition is greater than the weight ratio of the resin in the resin composition.

[0014] In one embodiment of the present invention, the weight ratio of the above-mentioned epoxy resin in the resin is between 1 wt% and 10 wt%, the weight ratio of the bismaleimide resin in the resin is between 10 wt% and 20 wt%, and the weight ratio of the curing agent in the resin is between 3 wt% and 10 wt%. [Effects of the Invention]

[0015] As described above, the present invention effectively reduces the void content in the resin composition by combining three types of fillers with different particle size ranges, achieving a better lamination state, thereby improving the heat resistance, glass transition temperature, and thermal expansion coefficient of the manufactured substrate, while maintaining excellent adhesion and fluidity, thereby achieving both performance and processability.

[0016] In order to make the above features and advantages of the present invention more clearly understandable, the following embodiments are provided and described in detail. DETAILED DESCRIPTION OF THE INVENTION

[0017] In the following detailed description, for purposes of explanation and not limitation, exemplary embodiments disclosing specific details are set forth to provide a thorough understanding of various principles of the present invention. However, it will be apparent to those skilled in the art that the present invention may be practiced in other embodiments that depart from the specific details disclosed herein.

[0018] Unless otherwise specified, the term "between" used herein to qualify a range of numerical values ​​is intended to cover a range equal to and between the recited endpoints; for example, if a size range is between a first number and a second number, it means that the range can cover the first number, the second number, and any number between the first and second numbers.

[0019] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs.

[0020] In this embodiment, the resin composition includes a resin, a first filler, a second filler, and a third filler, and the resin includes an epoxy resin, a bismaleimide resin, a curing agent, or a combination thereof. More specifically, the first filler has a first particle size, the second filler has a second particle size, and the third filler has a third particle size, with the first particle size being larger than the second particle size, and the second particle size being larger than the third particle size. That is, the resin composition includes at least three fillers with different particle sizes. This embodiment effectively reduces the porosity in the resin composition by combining three fillers with different particle size ranges, achieving a better lamination state and thereby improving the heat resistance, glass transition temperature, and thermal expansion coefficient of the manufactured substrate while maintaining excellent adhesion and fluidity. This achieves both performance and processability.

[0021] For example, in recent years, semiconductor development has been moving toward heterogeneous integration to improve efficiency, and a key technology for this is advanced packaging. Advanced packaging requires high precision and reliability, and a substrate manufactured using the resin composition of the present embodiment can more appropriately meet these requirements, but the present invention is not limited thereto.

[0022] In some embodiments, the first particle size range is 0.5 micrometers (μm) to 1 μm (e.g., 0.5 μm, 0.7 μm, 0.9 μm, 1 μm, or any suitable number between 0.5 μm and 1 μm), the second particle size range is 0.1 μm to 0.3 μm (e.g., 0.1 μm, 0.15 μm, 0.2 μm, 0.3 μm, or any suitable number between 0.1 μm and 0.3 μm), and the third particle size range is less than 0.1 μm (e.g., 0.05 μm, 0.04 μm, 0.03 μm, 0.01 μm, or any suitable number less than 0.1 μm), but the invention is not limited thereto.

[0023] In some embodiments, at least two of the first, second, and third fillers are the same. That is, the first, second, and third fillers may all be the same, or the first and second fillers may be the same and the third filler may be different, or the first and third fillers may be the same and the second filler may be different, but the present invention is not limited thereto. The first, second, and third fillers may all be different.

[0024] In some embodiments, when one or more of the first filler, second filler, and third filler are inorganic, they may be further modified. For example, the inclusion of epoxy or amino groups can enhance compatibility with organic materials such as resins, but the present invention is not limited thereto. The modification method may involve mixing the inorganic material with an appropriate organic resin containing epoxy or amino groups, and then polishing the mixture with zirconium beads having a diameter of 0.5 millimeters (mm) to 5 mm, but the present invention is not limited thereto. Other suitable modification methods may also be employed, and the present invention does not limit the modification method.

[0025] In some embodiments, the first filler is one or more selected from silicon dioxide, boron nitride, aluminum oxide, and aluminum nitride, the second filler is one or more selected from silicon dioxide, boron nitride, aluminum oxide, and aluminum nitride, and the third filler is one or more selected from silicon dioxide, boron nitride, aluminum oxide, and aluminum nitride, but the present invention is not limited thereto. The first filler, the second filler, and the third filler can be selected according to actual design requirements.

[0026] In some embodiments, the weight ratio of the first filler in the resin composition is between 25 wt% and 60 wt% (e.g., 25 wt%, 35 wt%, 50 wt%, 60 wt%, or any suitable number between 25 wt% and 60 wt%), the weight ratio of the second filler in the resin composition is between 5 wt% and 25 wt% (e.g., 5 wt%, 10 wt%, 15 wt%, 25 wt%, or any suitable number between 5 wt% and 25 wt%), and the weight ratio of the third filler in the resin composition is between 5 wt% and 25 wt% (e.g., 5 wt%, 10 wt%, 15 wt%, 25 wt%, or any suitable number between 5 wt% and 25 wt%), but the present invention is not limited thereto.

[0027] In some embodiments, the weight ratio of the third filler in the resin composition is greater than the weight ratio of the first filler in the resin composition and the weight ratio of the second filler in the resin composition, thereby achieving a better void filling effect, but the present invention is not limited thereto.

[0028] In some embodiments, the resin composition is composed of a resin, a first filler, a second filler, and a third filler. That is, the total weight ratio of the resin, the first filler, the second filler, and the third filler in the resin composition is 100 wt%. Here, the total weight ratio of the first filler, the second filler, and the third filler in the resin composition may be greater than the weight ratio of the resin in the resin composition, but the present invention is not limited thereto.

[0029] In some embodiments, the weight ratio of the epoxy resin in the resin is between 1 wt % and 10 wt % (e.g., 1 wt %, 5 wt %, 7 wt %, 10 wt %, or any suitable number between 1 wt % and 10 wt %), the weight ratio of the bismaleimide resin in the resin is between 10 wt % and 20 wt % (e.g., 10 wt %, 12 wt %, 15 wt %, 20 wt %, or any suitable number between 10 wt % and 20 wt %), and the weight ratio of the curing agent in the resin is between 3 wt % and 10 wt % (e.g., 3 wt %, 5 wt %, 7 wt %, 10 wt %, or any suitable number between 3 wt % and 10 wt %), but the present invention is not limited thereto.

[0030] In some embodiments, the weight ratio of the bismaleimide resin in the resin is greater than the weight ratio of the epoxy resin in the resin, and / or the weight ratio of the bismaleimide resin in the resin is greater than the weight ratio of the curing agent in the resin, although the present invention is not limited thereto.

[0031] In some embodiments, the resin is composed of only an epoxy resin, a bismaleimide resin, and a curing agent. That is, the total weight ratio of the epoxy resin, the bismaleimide resin, and the curing agent in the resin is 100 wt %, but the present invention is not limited thereto.

[0032] In some embodiments, the epoxy resin comprises an epoxy resin having a biphenyl structure, a naphthalene structure, or a structure similar thereto.

[0033] In some embodiments, the bismaleimide (BMI) resin comprises BMI-1000 (CAS NO: 13676-54-5), BMI-2000 (CAS NO: 67784-74-1), BMI-2300 (CAS NO: 67784-74-1), BMI-3000 (CAS NO: 3006-93-7), BMI-4000 (CAS NO: 79922-55-7), BMI-5100 (CAS NO: 105391-33-1), BMI-7000 (CAS NO: 6422-83-9), or the like.

[0034] In some embodiments, the curing agent comprises an acid anhydride such as phenolic novolac resin, cresol novolac resin, bisphenol A novolak resin, benzoxazine resin, biphenyl novolac type phenolic resin, aminotriazine novolac type phenolic resin, pyromellitic anhydride, trimellitic anhydride, or benzophenonetetracarboxylic acid.

[0035] It should be noted that the resin composition of the present invention can be processed and manufactured into a prepreg or a copper foil substrate (CCL) according to actual design requirements. However, the above-mentioned specific embodiments do not limit the present invention, and anything contained in the resin composition is considered to fall within the scope of protection of the present invention.

[0036] The following examples and comparative examples are provided to clarify the effects of the present invention, but the scope of the present invention is not limited to the scope of the examples alone.

[0037] The substrates produced in each of the examples and comparative examples were evaluated by the following methods.

[0038] Glass transition temperature (°C): Tested using a dynamic mechanical analyzer (DMA).

[0039] Coefficient of thermal expansion (CTE): The coefficient of thermal expansion (xy plane direction) of the material was measured from 50℃ to 120℃ using TMA.

[0040] Water absorption rate (%): After heating the sample in a pressure cooker at 120°C and 2 atm for 120 minutes, the change in weight before and after heating was calculated.

[0041] Resin flow rate: The resin was pressed at 170°C±2.8°C and decompressed at 200±25 PSI for 10 minutes. After the melt was cooled, a disc was extruded and precisely weighed to calculate the amount of resin that flowed out.

[0042] <Examples 1 to 4, Comparative Examples 1 to 4>

[0043] The varnish formed from the resin composition shown in Table 1 was impregnated into Nan Ya glass fiber cloth (Nan Ya Plastics Corporation, fabric model number 2118S) at room temperature, and then dried at 120°C (impregnation machine) for several minutes to obtain a prepreg with a resin content of 50 wt%. 2 The test specimen was then heated to 250°C at a pressure of 1000 kJ / min and held at a constant temperature of 85°C for 20 minutes, then heated to 250°C at a heating rate of 3°C / min, held at a constant temperature for 120 minutes, and then slowly cooled to obtain a copper foil substrate. The copper foil on the surface was then removed to form a bare board, and various performance evaluations were performed. It should be noted that the test bare board described above was fabricated into the required substrate through subsequent processing steps. The values ​​for Comparative Examples 1 and 2 show similar physical properties to those of Examples 1 to 4 on this bare board, but Comparative Examples 1 and 2 suffer from issues with delamination (e.g., poor adhesion), making it impossible to fabricate the required substrate through subsequent processing steps, resulting in poor processability.

[0044] The physical properties of the obtained copper foil substrate were tested, and the results are shown in Table 1. Comparing the results of Examples 1-4 and Comparative Examples 1-4 in Table 1, the following conclusion can be drawn: the substrates produced in Examples 1-4 effectively improve the thermal properties (e.g., glass transition temperature, thermal expansion coefficient) of the substrate and maintain high fluidity compared to the substrates produced in Comparative Examples 1-4, thereby achieving both excellent performance and processability. Furthermore, as can be seen from Comparative Examples 1 and 2, the use of a single small particle size filler presents the problem of high water absorption.

[0045] [Table 1]

[0046] As described above, the present invention effectively reduces the void content in the resin composition by combining three types of fillers with different particle size ranges, achieving a better lamination state, thereby improving the heat resistance, glass transition temperature, and thermal expansion coefficient of the manufactured substrate, while maintaining excellent adhesion and fluidity, thereby achieving both performance and processability.

[0047] Although the present invention has been described with reference to the above embodiments, it is not intended to limit the present invention, and any person skilled in the art to which the present invention pertains can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention is based on the scope of the appended claims. [Industrial Applicability]

[0048] The resin composition of the present invention can be applied in the field of resin compositions.

Claims

1. a resin comprising an epoxy resin, a bismaleimide resin, a hardener, or a combination thereof; a first filler having a first particle size; a second filler having a second particle size; a third filler having a third particle size; wherein the first particle size is larger than the second particle size, and the second particle size is larger than the third particle size.

2. The resin composition according to claim 1, wherein the first particle size range is 0.5 μm or more and 1 μm or less, the second particle size range is 0.1 μm or more and 0.3 μm or less, and the third particle size range is less than 0.1 μm.

3. The resin composition according to claim 1 , wherein at least two of the first filler, the second filler, and the third filler are the same.

4. The resin composition according to claim 1 , wherein the first filler, the second filler, and the third filler are all different from each other.

5. The resin composition according to claim 1 , wherein one or more of the first filler, the second filler, and the third filler have an epoxy group or an amino group.

6. The resin composition according to claim 1, wherein the first filler, the second filler, and the third filler are all one or more selected from the group consisting of silicon dioxide, boron nitride, aluminum oxide, and aluminum nitride.

7. The resin composition according to claim 1, wherein the weight ratio of the first filler in the resin composition is between 25 wt% and 60 wt%, the weight ratio of the second filler in the resin composition is between 5 wt% and 25 wt%, and the weight ratio of the third filler in the resin composition is between 5 wt% and 25 wt%.

8. The resin composition according to claim 1 , wherein the weight ratio of the third filler in the resin composition is greater than the weight ratio of the first filler and the second filler in the resin composition.

9. The resin composition according to claim 1, wherein the sum of the weight ratios of the first filler, the second filler, and the third filler in the resin composition is greater than the weight ratio of the resin in the resin composition.

10. 2. The resin composition according to claim 1, wherein a weight ratio of the epoxy resin in the resin is between 1 wt % and 10 wt %, a weight ratio of the bismaleimide resin in the resin is between 10 wt % and 20 wt %, and a weight ratio of the curing agent in the resin is between 3 wt % and 10 wt %.

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