Cooling apparatus for electronic apparatus
The cooling device employs an adhesive sheet to seal liquid refrigerant flow paths, addressing inefficiencies and complexities of existing methods by reducing compression load and enabling easier disassembly, thus improving production efficiency and reducing foreign object risks.
JP2025166320APending Publication Date: 2025-11-06MITSUBISHI ELECTRIC CORP
Patent Information
- Application Number
- JP2024070253
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-04-24
- Publication Date
- 2025-11-06
Smart Images
Figure 2025166320000001_ABST
Abstract
To provide a cooling apparatus for an electronic apparatus with a simple structure and excellent production efficiency.SOLUTION: Production efficiency can be improved with a simple configuration by providing: a cooler having a groove serving as a flow path for a liquid refrigerant; a plate-shaped base member mounted on the cooler such that one surface covers an opening end of the groove, with electrical components mounted on a surface opposite to the one surface; and an adhesive sheet provided so as to surround the opening end of the groove between the cooler and the one surface of the base member to seal the liquid refrigerant.SELECTED DRAWING: Figure 1
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Citation Information
Patent Citations
Apparatus for generating dummy breakage signal
JP1987052457A