Polyamide resin composition and molding

JP2025167985APending Publication Date: 2025-11-07ASAHI KASEI KOGYO KABUSHIKI KAISHA
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Patent Information

Application Number
JP2024073053
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-04-26
Publication Date
2025-11-07

AI Technical Summary

Technical Problem

Existing polyamide resin compositions lack flexibility and strength at high temperatures, leading to issues such as leakage and poor moldability in applications like EV cooling pipes.

Method used

A polyamide resin composition comprising 20-50 parts by mass of polyamide resin and 50-80 parts by mass of polyolefin resin, with the polyolefin resin containing 3-20% α-olefin-derived monomer units and a melting peak above 80°C, forming a matrix, and optionally crosslinked with a crosslinking agent or aid.

Benefits of technology

The composition achieves high-temperature refrigerant resistance, flexibility, and low-temperature impact resistance, preventing liquid leakage at 100°C, with excellent high-speed extrusion moldability.

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Abstract

To provide a polyamide resin composition excellent in high-speed extrusion molding by making it possible to provide a tubular molding that is excellent in high temperature refrigerant resistance, flexibility, and low temperature impact resistance, and does not cause liquid leakage at 100°C.SOLUTION: The polyamide resin composition of the present invention comprises (A) a polyamide resin and (B) a polyolefin resin, and when the total mass of (A) and (B) is set to 100 pts.mass, the mass ratio of (A) is 20 to 50 pts.mass, and the mass ratio of (B) is 50 to 80 pts.mass. (B) contains at least one type of α-olefin-derived monomer unit, and among the monomer units constituting (B), the mass ratio of the α-olefin-derived monomer unit is 3 to 20 mass %. When heated from 23°C at 20°C / min using a differential scanning calorimeter, it exhibits at least one melting peak between 80°C and less than 150°C, and (A) forms the matrix.SELECTED DRAWING: None
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Citation Information

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