Film for semiconductor packaging, and method for manufacturing the same
JP2025168280APending Publication Date: 2025-11-07SAMSUNG ELECTRONICS CO LTD
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Patent Information
- Application Number
- JP2025067603
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-04-26
- Filing Date
- 2025-04-16
- Publication Date
- 2025-11-07
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Figure 2025168280000001_ABST
Abstract
To provide a film for semiconductor package in which adhesive force in a semiconductor packaging step which is required in pickup of chips can be set at a low level, and a method for manufacturing the film.SOLUTION: A film for semiconductor packaging according to the present invention includes a substrate layer, a middle layer and an adhesive layer, where the middle layer contains polyborosiloxane. Further, the film for semiconductor packaging according to another embodiment includes a substrate layer and an adhesive layer, where the adhesive layer contains polyborosiloxane.SELECTED DRAWING: Figure 4
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