Detection system and detection method

Abstract

To accurately detect a state inside a container.SOLUTION: A detection system includes: a light source that emits light; a condensing lens that condenses the light being the light that has been emitted from the light source, has passed through an inside of a container capable of accommodating one or more wafers and has exited from the container; an imaging device that receives the light condensed by the condensing lens and generates a photographed image; and a detection device that detects a state inside the container on the basis of the photographed image.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present invention relates to a detection system and a detection method. [Background technology]

[0002] Conventionally, a photoelectric sensor installed in a transport device is used to detect the presence or absence of wafers in a container such as a cassette. The transport device raises and lowers the photoelectric sensor to detect wafers, which takes time. While wafer detection is in progress, the transport device cannot perform transport operations, resulting in reduced productivity. Patent Document 1 describes a wafer imaging system that includes a camera installed at a known position relative to the open front of the cassette to capture an image of the cassette and the entire stack of stored wafers. Patent Document 2 describes a wafer detection device that includes an imaging device located at the front of a wafer storage container that receives reflected light from the wafers, and an illumination device that irradiates light from above and below the wafers in the wafer storage container. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Special Publication No. 2004-527116 [Patent Document 2] Patent No. 5881007 Summary of the Invention [Problem to be solved by the invention]

[0004] When detecting the presence or absence of wafers in a container using an imaging device such as a camera, the state inside the container cannot be accurately grasped because images are taken of wafers stacked on top of each other at the top and bottom of the container.

[0005] The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to accurately detect the state inside a container. [Means for solving the problem]

[0006] A detection system according to one aspect of the present invention includes a light source that emits light, a focusing lens that focuses the light emitted from the light source after passing through a container capable of holding one or more wafers and exiting the container, an imaging device that receives the light focused by the focusing lens and generates an image, and a detection device that detects the condition inside the container based on the image.

[0007] In the detection system, an imaging device captures an image of the inside of a container using a condenser lens, and the state inside the container is detected based on the captured image generated by the imaging device. The captured image accurately reflects the state inside the container, making it possible to accurately detect the state inside the container. In the detection system, while the state inside the wafer cassette is being detected, the transport device that transports wafers can perform wafer transport operations, etc., thereby improving productivity.

[0008] The detection device detects the state inside the container based on a first region and a second region in the captured image, the first region being a region where the light emitted from the light source is blocked by the one or more wafers, and the second region being a region corresponding to the light emitted from the container. The captured image has the first region where the light emitted from the light source is blocked by the one or more wafers and the second region corresponding to the light emitted from the container. Since the captured image accurately reflects the state inside the container, it is possible to accurately detect the state inside the container.

[0009] The detection device detects the presence or absence of the one or more wafers in the container based on the captured image. The detection device detects the state of the one or more wafers in the container based on the captured image. The detection device detects the number of the one or more wafers in the container based on the captured image. The detection system is capable of detecting the presence, state, and number of one or more wafers in a container based on the captured image.

[0010] At least a part of the container is a transparent member that transmits the light emitted from the light source, whereby the light emitted from the light source passes through the transparent member of the container, enters the container, passes through the container, and exits the container.

[0011] The container is disposed between the light source and the condenser lens, so that the light emitted from the light source directly enters the container, passes through the container, and exits the container.

[0012] The container has a first opening and a second opening, and is positioned so that the first opening faces the side where the condenser lens is disposed and the second opening faces the side opposite to the side where the condenser lens is disposed, and the light emitted from the light source enters the container from the second opening, passes through the container, and exits from the first opening. It is possible to accurately detect the condition inside a container having the first opening and the second opening.

[0013] The detection system includes a mirror member that reflects the light emitted from the light source, and the condenser lens condenses the light that is reflected by the mirror member and passes through the container and exits the container, with the container being disposed between the condenser lens and the mirror member. The light source can be disposed on the side of the container, which increases the degree of freedom in light source placement and improves the degree of freedom in layout in factories and manufacturing facilities.

[0014] The light source is disposed within the container, and the plurality of wafers can be accommodated within the container between the light source and the condenser lens. By not disposing the light source around the container, the degree of freedom in layout of factories and manufacturing facilities is improved.

[0015] The condenser lens is a Fresnel lens. By using a Fresnel lens as the condenser lens, costs can be reduced and the thickness in the optical axis direction can be made thinner.

[0016] A detection method according to one aspect of the present invention includes the steps of: collecting light emitted from a light source, the light passing through a container capable of holding one or more wafers, and exiting the container using a collecting lens; receiving the light collected by the collecting lens and generating an image; and detecting the condition inside the container based on the image. [Effects of the Invention]

[0017] According to the present invention, the state inside the container can be detected accurately. [Brief explanation of the drawings]

[0018] [Figure 1] FIG. 1 is a diagram showing the configuration of the control system. [Figure 2] FIG. 2 is a perspective view of a wafer cassette. [Figure 3] FIG. 3 is a perspective view of a wafer cassette. [Figure 4] FIG. 4 is a diagram showing an example of an operation of the transfer robot to remove a wafer from a wafer cassette. [Figure 5] FIG. 5 is a diagram showing the configuration of the detection system. [Figure 6] FIG. 6 is a diagram showing the configuration of the detection system. [Figure 7] FIG. 7 is a schematic diagram showing a case where an image of the inside of a wafer cassette is captured by an imaging device using a condenser lens. [Figure 8] FIG. 8 is a diagram showing an example of a captured image generated by the imaging device. [Figure 9] FIG. 9 is a schematic diagram showing a case where an image of the inside of a wafer cassette is captured by an imaging device without using a condenser lens. [Figure 10] FIG. 10 is a diagram showing an example of a captured image generated by the imaging device. [Figure 11] FIG. 11 is a block diagram showing the configuration of the control device. [Figure 12] FIG. 12 is a flowchart for explaining the overall flow of the operation of the detection system. [Figure 13] FIG. 13 is a diagram showing an example of data used to register the removal height. [Figure 14] FIG. 14 is a diagram showing an example of data used to register a determination region. [Figure 15] FIG. 15 is a perspective view of a wafer cassette according to the first modification. [Figure 16] FIG. 16 is a diagram showing an example of the arrangement of wafer cassettes according to the first modification. [Figure 17] FIG. 17 is a diagram showing the configuration of a detection system according to the second modification. [Figure 18] FIG. 18 is a diagram showing the configuration of a wafer cassette according to the third modification. DETAILED DESCRIPTION OF THE INVENTION

[0019] Application examples and embodiments will be described below with reference to the drawings. The application examples and embodiments described below are aspects of the present application and do not limit the scope of the rights of the present application.

[0020] <Application example> An application example will be described. FIG. 1 is a diagram showing the configuration of a control system 1. The control system 1 will be described with reference to FIG. 1. The control system 1 includes a transfer robot (transfer device) 10 that transfers wafers, a robot controller 20 that controls the transfer robot 10, an imaging device 30 that captures an image of an object and generates a captured image, and a control device 40 that controls the imaging device 30. Communication is performed between the transfer robot 10 and the robot controller 20 via wire or wireless. Communication is performed between the robot controller 20 and the control device 40 via wire or wireless. Communication is performed between the imaging device 30 and the control device 40 via wire or wireless.

[0021] FIG. 2 is a perspective view of a wafer cassette 50. The wafer cassette 50 is an example of a container. In the example shown in FIG. 2, the wafer cassette 50 has an outer shape of a substantially rectangular parallelepiped with one face located on the front side being open. The wafer cassette 50 has an opening 51 provided on the front side. One or more wafers can be stored in the wafer cassette 50. Multiple wafers can be stored in the wafer cassette 50 at a predetermined interval. When multiple wafers are stored in the wafer cassette 50 at a predetermined interval, the multiple wafers are arranged in one direction in the internal space of the wafer cassette 50 while being spaced apart from each other.

[0022] At least a portion of wafer cassette 50 is made of a transparent material that transmits light. The rear surface of wafer cassette 50 at a position opposite to opening 51 may be made of a transparent material that transmits light. Alternatively, the entire wafer cassette 50 may be made of a transparent material that transmits light.

[0023] Fig. 3 is a perspective view of a wafer cassette 50. Fig. 3 shows the wafer cassette 50 containing a plurality of wafers 60. As shown in Fig. 3, the wafer cassette 50 contains a plurality of wafers 60 at predetermined intervals. The wafers 60 contained in the wafer cassette 50 are, for example, semiconductor substrates cut from a cylindrical ingot of silicon or the like.

[0024] FIG. 4 shows the operation of the transfer robot 10 to remove the wafer 60 from the wafer cassette 50. 4 is a diagram showing an example. FIG. 4 is a schematic diagram showing a wafer cassette 50 as viewed from the side. The transfer robot 10 is equipped with a hand 11 for removing a wafer 60 from the wafer cassette 50. The transfer robot 10 is controlled by the robot controller 20, so that the hand 11 is inserted below the wafer 60 stored in the wafer cassette 50. The hand 11 rises, so that the wafer 60 is lifted. As a result, the wafer 60 is placed on the hand 11, and the wafer 60 is removed from the wafer cassette 50. The transfer robot 10 is controlled by the robot controller 20, so that the transfer robot 10 transports the wafer 60 placed on the hand 11.

[0025] <Description of the embodiment> FIG. 5 is a diagram showing the configuration of the detection system 2. The detection system 2 includes an imaging device 30, a control device 40, a light source 70, and a condensing lens 80. The light source 70 emits light. The condensing lens 80 condenses the light emitted from the light source 70. The imaging device 30 receives the light condensed by the condensing lens 80 and generates a captured image. The imaging device 30 is, for example, a camera having a light-receiving element that receives light. The control device 40 detects the state inside the wafer cassette 50 based on the captured image generated by the imaging device 30. The control device 40 is an example of a detection device. The open arrow in FIG. 5 indicates the direction in which light travels.

[0026] The distance between the imaging device 30 and the condensing lens 80 and the distance between the wafer cassette 50 and the condensing lens 80 may be determined based on the pitch (interval) of the multiple wafers 60 housed in the wafer cassette 50. For example, the user may adjust the distance between the imaging device 30 and the condensing lens 80 and the distance between the wafer cassette 50 and the condensing lens 80 in accordance with the pitch of the multiple wafers 60 housed in the wafer cassette 50.

[0027] FIG. 6 is a diagram showing the configuration of the detection system 2. FIG. 6 shows the configuration of the detection system 2 when viewed from the direction indicated by arrow A1 in FIG. 5. As shown in FIG. 6, the width of the condenser lens 80 is smaller than the width of the wafer cassette 50. The configuration is not limited to that shown in FIG. 6, and the width of the condenser lens 80 may be the same as the width of the wafer cassette 50 or may be larger than the width of the wafer cassette 50. The height of the condenser lens 80 may be the same as the height of the wafer cassette 50 or may be larger than the height of the wafer cassette 50.

[0028] The light source 70 is a light source that emits light. The light source 70 is, for example, a rod-shaped light source (bar light source). An organic EL lighting device may be used as the light source 70. The height of the light source 70 may be the same as or higher than the height of the wafer cassette 50. The condenser lens 80 condenses the light emitted from the light source 70. The condenser lens 80 is, for example, a Fresnel lens or a telecentric lens. Using a Fresnel lens as the condenser lens 80 can reduce costs compared to using a telecentric lens, and can reduce the thickness in the optical axis direction.

[0029] FIG. 7 is a schematic diagram illustrating the imaging of the inside of a wafer cassette 50 by the imaging device 30 using a condenser lens 80. In FIG. 7, light emitted from the light source 70, light emitted from the wafer cassette 50, and light condensed by the condenser lens 80 are indicated by hatching. Multiple wafers 60 are arranged at predetermined intervals within the wafer cassette 50 shown in FIG. 7. Light emitted from the light source 70 passes through a transparent member on the back surface of the wafer cassette 50, enters the wafer cassette 50, passes through the wafer cassette 50, and exits the wafer cassette 50. The wafer cassette 50 is arranged between the light source 70 and the condenser lens 80. Light emitted from the light source 70 enters the wafer cassette 50 directly, passes through the wafer cassette 50, and exits the container. Light emitted from the wafer cassette 50 is condensed by the condenser lens 80. The imaging device 30 receives the light condensed by the condenser lens 80 and generates a captured image. 8 is a diagram showing an example of a captured image generated by the imaging device 30. The width of the captured image generated by the imaging device 30 changes depending on the width of the zero.

[0030] As shown in FIG. 8, the captured image has multiple regions where the light emitted from the light source 70 is blocked by the multiple wafers 60, and multiple regions corresponding to the light emitted from the wafer cassette 50. In FIG. 8, the multiple regions where the light emitted from the light source 70 is blocked by the multiple wafers 60 (hereinafter also referred to as dark regions) are indicated by region Z1, and the multiple regions corresponding to the light emitted from the wafer cassette 50 (hereinafter also referred to as bright regions) are indicated by region Z2. As shown in the captured image of FIG. 8, multiple dark regions are lined up at predetermined intervals from top to bottom. In the wafer cassette 50 shown in FIG. 7, multiple wafers 60 are arranged at predetermined intervals, and the captured image shown in FIG. 8 accurately reflects the state inside the wafer cassette 50 shown in FIG. 7.

[0031] The captured image will now be described. When multiple wafers 60 are housed in the wafer cassette 50, the captured image will have multiple dark regions where the light emitted from the light source 70 is blocked by the multiple wafers 60, and multiple bright regions corresponding to the light emitted from the wafer cassette 50. When one wafer 60 is housed in the wafer cassette 50, the captured image will have one dark region where the light emitted from the light source 70 is blocked by one wafer 60, and multiple bright regions corresponding to the light emitted from the wafer cassette 50. The dark region is an example of a first region. The bright region is an example of a second region.

[0032] In the detection system 2, the imaging device 30 captures an image of the inside of the wafer cassette 50 using the condenser lens 80, and the state inside the wafer cassette 50 is detected based on the captured image generated by the imaging device 30. Since the captured image accurately reflects the state inside the wafer cassette 50, it is possible to accurately detect the state inside the wafer cassette 50.

[0033] In conventional technology, the transport device raises and lowers a photoelectric sensor to detect the wafers 60, which takes time. With the detection system 2, there is no need for the transport robot 10 to raise and lower the photoelectric sensor. While the state inside the wafer cassette 50 is being detected, the transport robot 10 can perform tasks such as transporting the wafers 60, improving productivity. With the detection system 2, it is possible to detect the state inside the wafer cassette 50 in a shorter time than the detection time required using a photoelectric sensor, improving productivity.

[0034] FIG. 9 is a schematic diagram of an image captured by the imaging device 30 inside the wafer cassette 50 without using the condenser lens 80. In FIG. 9, the light emitted from the light source 70 and the light emitted from the wafer cassette 50 are indicated by hatching. A plurality of wafers 60 are arranged at predetermined intervals inside the wafer cassette 50 shown in FIG. 9. The light emitted from the light source 70 passes through the wafer cassette 50 and exits the wafer cassette 50. The imaging device 30 receives the light emitted from the wafer cassette 50 and generates a captured image. FIG. 10 is a diagram showing an example of a captured image generated by the imaging device 30.

[0035] 10, the captured image has a plurality of regions where the light emitted from the light source 70 is blocked by the plurality of wafers 60, and a plurality of regions corresponding to the light emitted from the wafer cassette 50. In Fig. 10, the plurality of regions where the light emitted from the light source 70 is blocked by the plurality of wafers 60 (hereinafter also referred to as dark regions) are indicated by region Z3, and the plurality of regions corresponding to the light emitted from the wafer cassette 50 (hereinafter also referred to as bright regions) are indicated by region Z4.

[0036] As shown in Fig. 10, multiple dark areas are arranged at a predetermined interval in the center of the captured image, but the multiple dark areas overlap at the top and bottom of the captured image. Multiple wafers 60 are arranged at a predetermined interval in the wafer cassette 50 shown in Fig. 9. However, the captured image shown in Fig. 10 does not reflect the state inside the wafer cassette 50 shown in Fig. 9.

[0037] 11 is a block diagram showing the configuration of the control device 40. The control device 40 has a control unit 110, a storage unit 120, and a communication unit 130. The control unit 110 controls each operation of the control device 40. The control unit 110 includes a CPU (Central Processing Unit), RAM (Random Access Memory), ROM (Read Only Memory), etc., and controls each part of the control unit 110 and The storage unit 120 stores programs executed by the control unit 110 and various data used in the processes executed by the control unit 110. For example, the storage unit 120 may be an auxiliary storage device such as an HDD (Hard Disk Drive) or an SSD (Solid State Drive). The storage unit 120 may be realized by a removable storage medium. The communication unit 130 is a communication interface that executes communication with the transport robot 10 and the robot controller 20. The communication unit 130 includes at least one of a wired communication module and a wireless communication module.

[0038] The control unit 110 is configured to include an acquisition unit 111, a detection unit 112, and an output unit 113. The acquisition unit 111 acquires a captured image from the imaging device 30. The detection unit 112 detects the state inside the wafer cassette 50 based on the captured image. The output unit 113 outputs the detection result of the detection unit 112 to the robot controller 20. Not all of the components of the control unit 110 shown in FIG. 11 are essential, and components of the control unit 110 may be added or deleted as appropriate. Furthermore, at least some of the functions of the control unit 110 may be realized by a computer on the cloud. Furthermore, the control device 40 may be integrated with the robot controller 20.

[0039] The overall flow of operation of the detection system 2 will be described using FIG. 12. FIG. 12 is a flowchart for describing the overall flow of operation of the detection system 2. In step S1, the removal height of the wafer 60 (hereinafter referred to as the "removal height") is registered in the robot controller 20. Also in step S1, a judgment area for determining the presence or absence of the wafer 60 (hereinafter referred to as the "judgment area") is registered in the control device 40. The robot controller 20 may extract data related to the removal height from an external database and store the data related to the removal height in the memory unit 120, thereby registering the removal height. The control device 40 may extract coordinate data of the judgment area from the external database and store the coordinate data of the judgment area in the memory unit 120, thereby registering the judgment area. A user may register the removal height and the judgment area in the robot controller 20 and the control device 40.

[0040] 13 is a diagram showing an example of data used to register the removal height. The robot controller 20 grasps the positions (heights) of the multiple wafers 60 in the wafer cassette 50 based on the registered removal height. In the example shown in FIG. 13, the number of stages for storing the wafers 60 is 25, but this is not limiting and the number of stages for storing the wafers 60 can be set depending on the type of wafer cassette 50. The removal height (mm) of the wafers 60 can also be set depending on the type of wafer cassette 50.

[0041] Fig. 14 is a diagram showing an example of data used to register a judgment area. A line 200 shown in Fig. 14 corresponds to the outline of the wafer cassette 50. A plurality of rectangular areas within the line 200 in Fig. 14 correspond to the judgment area. The control device 40 uses the judgment area when detecting the state inside the wafer cassette 50 based on the captured image.

[0042] In step S2, the acquisition unit 111 acquires a captured image from the imaging device 30. In step S2, the detection unit 112 detects the state inside the wafer cassette 50 based on the captured image. Detect.

[0043] An example of a process for detecting the state inside the wafer cassette 50 by the detection unit 112 will be described. The detection unit 112 detects the state inside the wafer cassette 50 based on dark and light areas in the captured image. The detection unit 112 may detect the state of one or more wafers 60 inside the wafer cassette 50 based on the dark and light areas in the captured image. The detection unit 112 may detect the presence or absence of one or more wafers 60 inside the wafer cassette 50 based on the captured image. The detection unit 112 may detect the state of one or more wafers 60 inside the wafer cassette 50 based on the captured image. The state of the wafer 60 includes the position, tilt, warpage, thickness, etc. of the wafer 60 inside the wafer cassette 50. The detection unit 112 may detect the number of one or more wafers 60 inside the wafer cassette 50 based on the captured image.

[0044] The detection unit 112 determines whether or not a dark area exists in each of the multiple judgment areas in the captured image. For example, if a dark area exists in the first judgment area in the captured image, the detection unit 112 determines that a wafer 60 exists in the first row of the wafer cassette 50. In this case, the detection unit 112 may determine the position of the dark area in the first judgment area in the captured image as the position of the wafer 60 in the wafer cassette 50. For example, if a dark area does not exist in the 25th judgment area in the captured image, the detection unit 112 may determine that a wafer 60 does not exist in the 25th row of the wafer cassette 50. The detection unit 112 may calculate the inclination of the dark area in the judgment area in the captured image by performing image analysis on the captured image, and detect the inclination of the wafer 60 in the wafer cassette 50 based on the inclination of the dark area in the judgment area in the captured image. The detection unit 112 may calculate the shape of a dark region within a judgment region in the captured image by performing image analysis on the captured image, and detect warpage of the wafer 60 in the wafer cassette 50 based on the shape of the dark region within the judgment region in the captured image. For example, the detection unit 112 may detect warpage of the wafer 60 in the wafer cassette 50 by comparing the shape of the dark region within the judgment region in the captured image with a reference shape. The detection unit 112 may calculate the vertical (lengthwise) width of the dark region within the judgment region in the captured image by performing image analysis on the captured image, and detect the thickness of the wafer 60 in the wafer cassette 50 based on the vertical width of the dark region within the judgment region in the captured image. The detection unit 112 may detect the number of one or more wafers 60 in the wafer cassette 50 by counting the number of judgment regions in which a dark region exists among the multiple judgment regions in the captured image.

[0045] In step S3, the output unit 113 outputs the detection result of the detection unit 112 to the robot controller 20. In step S3, the robot controller 20 controls the transfer robot 10 based on the detection result of the detection unit 112, and the transfer robot 10 removes the wafer 60 from the n-th stage of the wafer cassette 50. In this case, the robot controller 20 may determine the movement height of the hand 11 based on the removal height registered in step S1 and control the transfer robot 10. Alternatively, the robot controller 20 may determine (calculate) the movement height of the hand 11 based on the position of the dark area in the determination area and control the transfer robot 10. In step S4, the transfer robot 10 transports the wafer 60 removed from the wafer cassette 50 and places the wafer 60 on a processing stage.

[0046] In step S5, the robot controller 20 determines whether the wafer 60 to be removed is present in the wafer cassette 50. If the wafer 60 to be removed is present in the wafer cassette 50 (step S5: YES), the process proceeds to step S3. If the wafer 60 to be removed is not present in the wafer cassette 50 (step S5: NO), the flowchart of FIG. 12 ends.

[0047] Modifications will now be described. Modifications 1 to 3 below may be combined as appropriate. <Variation 1> FIG. 15 is a perspective view of a wafer cassette 50A according to Modification 1. The wafer cassette 50A is an example of a container. In the example shown in FIG. 15, the wafer cassette 50A has a generally rectangular parallelepiped shape with one face located on the front side and one face located on the back side open. The wafer cassette 50A has an opening 51 on the front side and an opening 52 on the back side. The opening 51 is an example of a first opening. The opening 52 is an example of a second opening. One or more wafers can be accommodated in the wafer cassette 50A. A plurality of wafers 60 can be accommodated in the wafer cassette 50A at a predetermined interval. When a plurality of wafers 60 are accommodated in the wafer cassette 50A at a predetermined interval, the plurality of wafers 60 are arranged in one direction in the internal space of the wafer cassette 50A while being spaced apart from one another.

[0048] FIG. 16 is a diagram showing an example of the arrangement of a wafer cassette 50A according to Modification 1. As shown in FIG. 16, the wafer cassette 50A is arranged so that the opening 51 faces the side where the condenser lens 80 is arranged and the opening 52 faces the side opposite the side where the condenser lens 80 is arranged. In the example of FIG. 16, the opening 51 is provided on the side of the wafer cassette 50A where the condenser lens 80 is arranged, and the opening 52 is provided on the side opposite the side where the condenser lens 80 is arranged (the side where the light source 70 is arranged). Light emitted from the light source 70 enters the wafer cassette 50A through the opening 52, passes through the wafer cassette 50A, and exits through the opening 51. The light emitted from the wafer cassette 50A is condensed by the condenser lens 80. The white arrows in FIG. 16 indicate the direction in which light travels.

[0049] The imaging device 30 receives the light focused by the focusing lens 80 and generates a captured image. The control device 40 detects the state inside the wafer cassette 50A based on the captured image generated by the imaging device 30. According to the first modification, the state inside the wafer cassette 50A can be accurately detected using a wafer cassette 50A whose back surface is not made of a transparent material.

[0050] In the first modification, an example has been described in which a wafer cassette 50A whose rear surface is not made of a transparent material is used, but this is not limiting. At least a portion of the wafer cassette 50A may be made of a transparent material that transmits light. The entire wafer cassette 50A may be made of a transparent material that transmits light. The entire wafer cassette 50A may be made of a material that does not transmit light.

[0051] <Variation 2> FIG. 17 is a diagram showing the configuration of a detection system 2A according to Modification 2. The detection system 2A includes an imaging device 30, a control device 40, a light source 70, a condensing lens 80, and a mirror 90. The light source 70 emits light. The mirror 90 reflects the light emitted from the light source 70. The mirror 90 is an example of a mirrored member. As shown in FIG. 17, a wafer cassette 50 is disposed between the condensing lens 80 and the mirror 90. The light emitted from the light source 70 is reflected by the mirror 90, thereby indirectly entering the wafer cassette 50 and passing through the wafer cassette 50 before exiting the container. The condensing lens 80 condenses the light reflected by the mirror 90, passing through the wafer cassette 50, and exiting the wafer cassette 50. The imaging device 30 receives the light condensed by the condensing lens 80 and generates a captured image. The imaging device 30 and the control device 40 detect the state inside the wafer cassette 50 based on the captured image generated by the imaging device 30 .

[0052] According to the second modification, the light source 70 can be disposed on the side of the wafer cassette 50, which increases the degree of freedom in arranging the light source 70 and in the layout of the factory or manufacturing equipment.

[0053] <Variation 3> FIG. 18 is a structural diagram of a wafer cassette 50B according to Modification 3. FIG. 18 shows a structural diagram of the wafer cassette 50B as viewed from the side. A light source 70 is arranged in the wafer cassette 50B. A plurality of wafers 60 can be accommodated in the wafer cassette 50B between the light source 70 and the condenser lens 80. The condenser lens 80 condenses light emitted from the light source 70 arranged in the wafer cassette 50B, which passes through the wafer cassette 50B and emerges from the wafer cassette 50B. The hollow arrow in FIG. 18 indicates the traveling direction of the light.

[0054] According to the third modification, the light source 70 can be disposed inside the wafer cassette 50B. By not disposing the light source 70 near the wafer cassette 50B, the degree of freedom in the layout of the factory or manufacturing equipment is improved.

[0055] <Other> The present invention can also be understood as a detection method, control method, or manufacturing method including at least a part of the above-described process, a program for causing a computer to execute at least a part of the above-described process, or a computer-readable recording medium on which such a program is non-temporarily recorded. It can also be understood as a control system or manufacturing system including at least a part of the above-described process. The above configurations and processes can be combined to constitute the present invention as long as no technical contradictions arise.

[0056] <Appendix 1> a light source (70) that emits light; a condenser lens (80) (80) for condensing the light emitted from the light source (70), the light passing through a container (50) capable of containing one or more wafers (60) and emitting from the container (50); an imaging device (30) that receives the light collected by the collecting lens (80) and generates a captured image; a detection device (40) that detects the state inside the container (50) based on the captured image; Equipped with Detection system (2). <Appendix 2> the detection device (40) detects a state inside the container (50) based on the first region and the second region in the captured image; the first region is a region where the light emitted from the light source (70) is blocked by the one or more wafers (60); The second region corresponds to the light emitted from the container (50). 2. The detection system (2) of claim 1. <Appendix 3> The detection device (40) detects the presence or absence of the one or more wafers (60) in the container (50) based on the captured image. 2. The detection system (2) according to claim 1 or 2. <Appendix 4> The detection device (40) detects the state of the one or more wafers (60) in the container (50) based on the captured image. 10. A detection system (2) according to any one of claims 1 to 3. <Appendix 5> The detection device (40) detects the number of the one or more wafers (60) in the container (50) based on the captured image. 5. A detection system (2) according to any one of claims 1 to 4. <Appendix 6> At least a part of the container (50) is a transparent member that transmits the light emitted from the light source (70). 6. A detection system (2) according to any one of claims 1 to 5. <Appendix 7> The container (50) is disposed between the light source (70) and the condenser lens (80). 7. A detection system (2) according to any one of claims 1 to 6. <Appendix 8> The container (50) has a first opening (51) and a second opening (52), the container (50) is arranged so that the first opening (51) faces a side on which the condenser lens (80) is arranged and the second opening (52) faces a side opposite to the side on which the condenser lens (80) is arranged; The light emitted from the light source (70) enters the container (50) through the second opening (52), passes through the container (50), and exits through the first opening (51). 8. A detection system (2) according to any one of claims 1 to 7. <Appendix 9> a mirror member that reflects the light emitted from the light source (70), the condenser lens (80) condenses the light that is reflected by the mirror member, passes through the container (50), and exits the container (50); The container (50) is disposed between the condenser lens (80) and the mirror member. 10. The detection system (2) according to any one of claims 1 to 6 and 8. <Appendix 10> The light source (70) is disposed within the container (50), The plurality of wafers (60) can be accommodated in the container (50) between the light source (70) and the condenser lens (80). 7. A detection system (2) according to any one of claims 1 to 6. <Appendix 11> The condenser lens (80) is a Fresnel lens. 11. A detection system (2) according to any one of claims 1 to 10. <Appendix 12> a step of collecting light emitted from a light source (70), the light passing through a container (50) capable of containing one or more wafers (60), and the light exiting the container (50) by a collecting lens (80); receiving the light collected by the collecting lens (80) and generating a captured image; detecting a state inside the container (50) based on the captured image; Equipped with Detection method. [Explanation of symbols]

[0057] 1: Control system 2. 2A: Detection system 10:Transport robot 20: Robot controller 30: Imaging device 40: Control device 50, 50A, 50B: Wafer cassette 51, 52: Aperture 60: Wafer 70:Light source 80: Condenser lens 90: Mirror

Claims

1. A light source that emits light; a condenser lens that condenses the light emitted from the light source, the light passing through a container capable of accommodating one or more wafers, and the light exiting the container; an imaging device that receives the light condensed by the condensing lens and generates a captured image; a detection device that detects a state inside the container based on the captured image; Equipped with Detection system.

2. the detection device detects a state inside the container based on a first region and a second region in the captured image; the first region is a region where the light emitted from the light source is blocked by the one or more wafers, The second region corresponds to the light emitted from the container. The detection system of claim 1 .

3. the detection device detects the presence or absence of the one or more wafers in the container based on the captured image. The detection system of claim 1 .

4. the detection device detects a state of the one or more wafers in the container based on the captured image. The detection system of claim 1 .

5. the detection device detects the number of the one or more wafers in the container based on the captured image. The detection system of claim 1 .

6. At least a part of the container is a transparent member that transmits the light emitted from the light source. The detection system of claim 1 .

7. The container is disposed between the light source and the condenser lens. The detection system of claim 1 .

8. the container has a first opening and a second opening; the container is arranged so that the first opening faces a side on which the condensing lens is arranged and the second opening faces a side opposite to the side on which the condensing lens is arranged; The light emitted from the light source enters the container through the second opening, passes through the container, and exits through the first opening. The detection system of claim 1 .

9. a mirror member that reflects the light emitted from the light source, the condensing lens condenses the light that is reflected by the mirror member, passes through the container, and exits the container; The container is disposed between the condenser lens and the mirror member. The detection system of claim 1 .

10. The light source is disposed within the container; The plurality of wafers can be accommodated in the container between the light source and the condenser lens. The detection system of claim 1 .

11. The condenser lens is a Fresnel lens. A detection system according to any one of claims 1 to 10.

12. a step of collecting light emitted from a light source, the light passing through a container capable of containing one or more wafers, and the light exiting the container by a collecting lens; receiving the light collected by the collecting lens and generating a captured image; detecting a state inside the container based on the captured image; Equipped with Detection method.

Images