Resin molding apparatus and method for manufacturing resin molded products

Abstract

To provide a resin molding apparatus that enables improvement in design flexibility.SOLUTION: A resin molding apparatus comprising: a support plate for supporting a mold; a movable body to which the support plate is fixed and which is movable in a predetermined direction; and a position adjustment mechanism for adjusting a position of the support plate relative to the movable body; the position adjustment mechanism comprises: a main body fixed to either one of the support plate and the movable body; and a ball group including a plurality of balls accommodated in the main body; the ball group comprises a first ball position-adjustable along a first direction, and a second ball movable, in accordance with position adjustment of the first ball, in a second direction different from the first direction and capable of imparting force to the other of the support plate and the movable body.SELECTED DRAWING: Figure 7

Description

[Technical Field]

[0001] The present invention relates to a resin molding apparatus and a method for manufacturing a resin molded product. [Background technology]

[0002] Patent Document 1 discloses a resin molding apparatus including a fixed platen to which an upper mold is fixed, a movable platen to which a lower mold is fixed, a moving body that supports the movable platen and is movable up and down, and a clamping mechanism that raises and lowers the movable platen. In this resin molding apparatus, the mold clamping mechanism raises and lowers the movable platen, thereby clamping and opening the molding dies. In this resin molding apparatus, the positions of the movable platen and / or the fixed platen are adjusted so that the movable platen is positioned parallel to the fixed platen in order to maintain parallelism between the upper and lower molds. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2019-077144 Summary of the Invention [Problem to be solved by the invention]

[0004] In a resin molding apparatus such as that described in Patent Document 1, the position of the movable platen is generally adjusted using an adjustment screw that can adjust the vertical position of the movable platen relative to the movable body. For example, the adjustment screw is fastened to the movable platen with its axis facing the vertical direction, and is positioned so that its tip contacts the movable body. The vertical position of the movable platen relative to the movable body can be adjusted by appropriately changing the fastening position of the adjustment screw relative to the movable platen.

[0005] However, in a configuration using such a general adjustment screw, it is necessary to secure space in the vertical direction in order to attach and turn the adjustment screw, which reduces the design freedom of the device and leaves room for improvement.

[0006] The present invention has been made in consideration of the above-mentioned circumstances, and the problem it aims to solve is to provide a resin molding apparatus and a method for manufacturing resin molded products that enable improved design freedom of the apparatus. [Means for solving the problem]

[0007] The problem that the present invention aims to solve is as described above, and in order to solve this problem, the resin molding apparatus of the present invention is a resin molding apparatus comprising: a support plate that supports a molding mold; a movable body to which the support plate is fixed and that is movable in a predetermined direction; and a position adjustment mechanism that can adjust the position of the support plate relative to the movable body, wherein the position adjustment mechanism comprises a main body portion that is fixed to either the support plate or the movable body, and a group of spheres that includes a plurality of spheres contained in the main body portion, and the group of spheres comprises a first sphere that can be adjusted in position along a first direction, and a second sphere that can move in a second direction different from the first direction as the position of the first sphere is adjusted, and that can apply a force to the other of the support plate or the movable body.

[0008] In addition, the method for manufacturing a resin molded product according to the present invention is a method for manufacturing a resin molded product using the resin molding apparatus, and includes a step of loading an object to be molded and a resin material into the molding mold, and a step of clamping the molding mold. [Effects of the Invention]

[0009] According to the present invention, it is possible to improve the degree of freedom in designing the device. [Brief explanation of the drawings]

[0010] [Figure 1] 1 is a schematic plan view showing the overall configuration of a resin molding apparatus according to an embodiment; [Figure 2] FIG. 2 is a front view showing the configuration of a resin molding mechanism. [Figure 3] FIG. 2 is a side view showing the configuration of a mold clamping mechanism. [Figure 4]FIG. 10 is a perspective view showing the position adjustment mechanism attached to the intermediate plate. [Figure 5] FIG. [Figure 6] (a) A plan view showing the position adjustment mechanism, (b) A front view showing the position adjustment mechanism. [Figure 7] (a) AA cross section. (b) BB cross section. [Figure 8] (a) A side cross-sectional view showing the intermediate plate being moved upward, and (b) A side cross-sectional view showing the intermediate plate being moved downward. [Figure 9] FIG. 10 is a plan view showing a position adjustment mechanism according to a modified example. DETAILED DESCRIPTION OF THE INVENTION

[0011] In the following explanation, the directions indicated by arrows U, D, L, R, F, and B in the figure will be defined as upward, downward, leftward, rightward, forward, and backward, respectively.

[0012] <Overall configuration of resin molding device 1> First, the configuration of a resin molding apparatus 1 of this embodiment will be described with reference to FIG. 1. The resin molding apparatus 1 performs resin molding by compression molding. The resin molding apparatus 1 can resin-seal electronic elements such as semiconductor chips fixed to a pre-resin-sealed substrate Sa, which is a molding object, to produce a resin molded product. The pre-resin-sealed substrate Sa can be a semiconductor substrate such as a silicon wafer, a metal substrate, a glass substrate, a ceramic substrate, or a resin substrate. The pre-resin-sealed substrate Sa may or may not be provided with wiring. The shape of the pre-resin-sealed substrate Sa is not particularly limited, and it can be formed into, for example, a rectangular shape, a circular shape, or the like.

[0013] The resin molding apparatus 1 mainly includes a supply module 2, a resin sealing module 3, and a storage module 4. In this embodiment, an example is shown in which the resin molding apparatus 1 includes four resin sealing modules 3. The supply module 2, the four resin sealing modules 3, and the storage module 4 are arranged side by side in the left-right direction. The supply module 2, the resin sealing module 3, and the storage module 4 are each detachable from the other modules. Furthermore, the number of each module can be increased or decreased as needed.

[0014] The supply module 2 supplies a substrate S (pre-resin-sealed substrate Sa) on which a chip is fixed before being sealed with resin, and a resin material R. The supply module 2 includes a substrate supply device 21 that supplies the pre-resin-sealed substrate Sa, and a resin material supply device 22 that supplies the resin material R.

[0015] The resin-sealed module 3 performs resin molding on the pre-resin-sealed substrate Sa to obtain a resin-sealed substrate Sb (resin-molded product). The resin-sealed module 3 includes a resin molding mechanism 31 for performing resin molding.

[0016] The storage module 4 stores the substrate S after resin sealing (resin-sealed substrate Sb). The storage module 4 includes a resin molded product storage device 41 that stores the resin-sealed substrate Sb.

[0017] The resin molding apparatus 1 also includes a transport mechanism 51 that is movable between the supply module 2, the resin sealing module 3, and the storage module 4. The transport mechanism 51 is movable along a front-rear moving rail 52 and a left-right moving rail 53. The front-rear moving rail 52 is provided to extend in the front-rear direction in each of the supply module 2, the resin sealing module 3, and the storage module 4. The left-right moving rail 53 is provided to extend in the left-right direction between the supply module 2, the resin sealing module 3, and the storage module 4.

[0018] A control unit (not shown) is provided at an arbitrary position in the resin molding apparatus 1. The control unit can control the operation of each of the above-mentioned units in order to perform resin molding on the pre-resin-sealed substrate Sa and obtain a resin-sealed substrate Sb.

[0019] <Configuration of resin molding mechanism 31> The configuration of the resin molding mechanism 31 will be described below. The resin molding mechanism 31 shown in FIG. 2 includes a fixed platen 110, an intermediate plate 130, and a movable platen 120 arranged vertically. The intermediate plate 130 is one embodiment of a support plate according to the present invention. Molds (metal dies) used for resin molding can be arranged between the fixed platen 110 and the intermediate plate 130, and between the intermediate plate 130 and the movable platen 120. The resin molding mechanism 31 can perform resin molding using molds arranged in two upper and lower stages by raising and lowering the intermediate plate 130 and the movable platen 120 relative to the fixed platen 110. The specific configuration of the resin molding mechanism 31 will be described below.

[0020] The resin molding mechanism 31 shown in FIGS. 2 and 3 mainly includes a main body 100 and a mold clamping mechanism 200.

[0021] <Main body 100> 2 constitutes a main portion of the resin molding mechanism 31. The main body 100 mainly includes a fixed platen 110, a movable platen 120, an intermediate plate 130, a press frame 140, and a base portion 150.

[0022] The stationary platen 110, the movable platen 120, and the intermediate plate 130 support a molding die used in resin molding. The stationary platen 110, the movable platen 120, and the intermediate plate 130 are formed in a substantially rectangular parallelepiped shape. The movable platen 120 is disposed below the stationary platen 110. The intermediate plate 130 is disposed between the stationary platen 110 and the movable platen 120. The stationary platen 110, the intermediate plate 130, and the movable platen 120 are disposed at equal intervals above and below. Note that the parallelism of the intermediate plate 130 relative to the stationary platen 110 is maintained by adjusting the position of the intermediate plate 130 using a position adjustment mechanism 300, which will be described later.

[0023] Molds used for resin molding are disposed between the fixed platen 110 and the intermediate plate 130, and between the intermediate plate 130 and the movable platen 120. Specifically, an upper mold UM is disposed on the bottom surface of the fixed platen 110, and a lower mold LM that pairs with the upper mold UM is disposed on the top surface of the intermediate plate 130. Similarly, an upper mold UM is disposed on the bottom surface of the intermediate plate 130, and a lower mold LM is disposed on the top surface of the movable platen 120. Each mold can be fixed to the fixed platen 110 or the like using an appropriate mounting member.

[0024] The press frame 140 connects and holds the fixed platen 110 to the base portion 150. The press frame 140 is formed to extend downward from both left and right end portions of the fixed platen 110. As a result, a pair of press frames 140 are formed facing each other in the left-right direction. The lower end of the press frame 140 is fixed to the upper surface of the base portion 150. A plurality of linear motion blocks 141 are provided on the left and right inner surfaces of the press frame 140 at intervals in the up-down direction.

[0025] Side plates 131 are provided on both left and right ends of the intermediate plate 130. The side plates 131 are one embodiment of a moving body according to the present invention. The side plates 131 are arranged so as to face the left and right press frames 140. Long, vertically extending linear guides 132 are provided on the left and right outer surfaces of the side plates 131. A linear block 141 provided on the press frame 140 is fitted into the linear guide 132 so as to be movable along the longitudinal direction of the linear guide 132. It is also possible to provide the linear guide 132 on the press frame 140 and the linear block 141 on the side plate 131.

[0026] A molding die used for resin molding can be attached to the bottom surface of the fixed platen 110, the top surface of the movable platen 120, and the top and bottom surfaces of the intermediate plate .

[0027] <Mold clamping mechanism 200> 2 and 3 performs mold clamping and mold opening by raising and lowering the movable platen 120 and the intermediate plate 130. The mold clamping mechanism 200 mainly includes a ball screw 210, an interlocking mechanism 220 (see FIG. 3), and an absorbing mechanism 240 (see FIG. 3).

[0028] The ball screw 210 shown in Fig. 2 raises and lowers the movable platen 120. A pair of ball screws 210 are arranged side by side on the left and right between the movable platen 120 and the base portion 150. The lower end of the ball screw 210 is connected to the base portion 150. The upper end of the ball screw 210 is connected to the movable platen 120. The ball screw 210 can raise and lower the movable platen 120 up and down using power from a drive source (not shown).

[0029] The interlocking mechanism 220 shown in Fig. 3 moves the intermediate plate 130 up and down in conjunction with the movable platen 120. For ease of explanation, the interlocking mechanism 220 is shown only in Fig. 3, and is omitted from other figures as appropriate. Although the interlocking mechanism 220 is provided on both the left and right sides of the resin molding mechanism 31, the following description will focus on the interlocking mechanism 220 on the right side shown in Fig. 3. The interlocking mechanism 220 mainly includes a first block 224, a second block 226, a third block 228, and an arm 232.

[0030] The first block 224 is a member that is fixed so as to be immovable. The first block 224 is fixed to, for example, the press frame 140. This prevents the first block 224 from moving relative to the press frame 140.

[0031] The second block 226 is a member that is connected to the intermediate plate 130. The second block 226 is connected to the intermediate plate 130 via an absorbing mechanism 240, which will be described later. A long hole 226a that extends in the front-rear direction is formed on the side surface of the second block 226.

[0032] The third block 228 is a member that is connected to the movable platen 120. The third block 228 is fixed to the movable platen 120 (see FIG. 2) via an appropriate connecting member (not shown). This allows the third block 228 to move up and down integrally with the movable platen 120. A long hole 228a that extends in the front-to-rear direction is formed on the side surface of the third block 228.

[0033] The arm 232 moves the second block 226 up and down in conjunction with the third block 228. The arm 232 is formed in a substantially rectangular plate shape. One end of the arm 232 is rotatably connected to the first block 224 via a first bearing member 232a. This allows the one end of the arm 232 to be rotatable about the first bearing member 232a but immovably supported relative to the first block 224.

[0034] The other end of the arm 232 is rotatably connected to the third block 228 via a third bearing member 232c. The third bearing member 232c is provided so as to be movable within an elongated hole 228a formed in the third block 228 along the longitudinal direction (front-rear direction) of the elongated hole 228a.

[0035] A front-rear intermediate portion of the arm 232 is rotatably connected to the second block 226 via a second bearing member 232b. The second bearing member 232b is provided so as to be movable within an elongated hole 226a formed in the second block 226 along the longitudinal direction (front-rear direction) of the elongated hole 226a. The second bearing member 232b is disposed so as to be located midway between the first bearing member 232a and the third bearing member 232c in the longitudinal direction of the arm 232.

[0036] When the third block 228 rises in conjunction with the rise of the movable platen 120, the arm 232 rotates around the first bearing member 232a. When the arm 232 rotates, the second block 226 also rises via the second bearing member 232b. When the second block 226 rises, the intermediate plate 130 rises via the absorbing mechanism 240. In this way, the interlocking mechanism 220 allows the intermediate plate 130 to be raised and lowered in conjunction with the movable platen 120.

[0037] At this time, because the second bearing member 232b is disposed so as to be positioned midway between the first bearing member 232a and the third bearing member 232c, the amount of lift (movement distance) of the second block 226 is half the amount of movement of the third block 228. Similarly, when the movable platen 120 is lowered, the amount of lowering of the second block 226 is half the amount of lowering of the third block 228.

[0038] The absorbing mechanism 240 absorbs variations in thickness of the object to be molded when resin molding is performed. The absorbing mechanism 240 mainly comprises an inner plate 242, an outer plate 244, and an elastic member 246. Although an absorbing mechanism 240 is provided on each side of the resin molding mechanism 31, the following description will focus on the absorbing mechanism 240 on the right side shown in Figure 3.

[0039] The inner plate 242 is a member connected to the second block 226. The inner plate 242 is formed in a longitudinal shape extending vertically. The lower end of the inner plate 242 is fixed to the second block 226. Protrusions 242a that protrude in the front-rear direction are formed at the middle of the upper and lower parts of the inner plate 242.

[0040] The outer plate 244 is a member connected to the intermediate plate 130. The outer plates 244 are provided on both the front and rear sides of the inner plate 242. The outer plates 244 are fixed to the side plates 131 (see FIG. 2). As a result, the outer plates 244 are connected to the intermediate plate 130 via the side plates 131. A pair of first recesses 244a, one above the other, and a second recess 244b formed between the pair of first recesses 244a are provided on the inner sides in the front-rear direction of the pair of outer plates 244 located at the front and rear. The protrusions 242a of the inner plate 242 are fitted into the second recesses 244b via spacers (not shown).

[0041] The elastic members 246 are configured by elastic springs etc. The elastic members 246 are arranged in the first recesses 244a so as to be elastic in the up and down direction.

[0042] With this configuration, the second block 226 and the intermediate plate 130 are linked via the elastic member 246. By appropriately expanding and contracting the elastic member 246, even if there is a difference in thickness between the object to be resin-molded on the upper side of the intermediate plate 130 and the object to be resin-molded on the lower side, this difference in thickness can be absorbed.

[0043] <Manufacturing method for resin molded products> A method for manufacturing a resin molded product using the resin molding apparatus 1 will be described below.

[0044] First, a step is executed in which the pre-resin-sealed substrate Sa and the resin material R are loaded into the molding die of the resin molding mechanism 31. Specifically, the pre-resin-sealed substrate Sa, which is the object to be molded in resin molding, is supplied to the upper side of the transport mechanism 51 from the substrate supply device 21 shown in Fig. 1. Furthermore, the resin material R is supplied to the lower side of the transport mechanism 51 from the resin material supply device 22. The transport mechanism 51 holds the pre-resin-sealed substrate Sa on its upper side and the resin material R on its lower side.

[0045] The transport mechanism 51 carries the held pre-sealing substrate Sa and resin material R into the resin molding mechanism 31 (see FIG. 2) of the resin-sealing module 3. The pre-sealing substrate Sa is adsorbed and held by the upper mold UM with the electronic elements to be sealed facing downward. The resin material R is accommodated in the cavity of the lower mold LM. Note that the resin material R can be in various forms, such as granular, powdery, particulate, paste, or liquid. If necessary, a release film can be placed on the molding die in advance.

[0046] Next, the process of closing the forming mold (mold clamping) is carried out. Specifically, first, the resin material R contained in the cavity is melted by a heating mechanism (not shown) provided in the lower mold LM. Next, the ball screw 210 (see FIG. 1, etc.) is driven to raise the movable platen 120. As the movable platen 120 rises, the intermediate plate 130 also rises via the interlocking mechanism 220. When the movable platen 120 and the intermediate plate 130 have risen to a predetermined position, the lower mold LM comes into contact with the upper mold UM, and mold clamping is completed.

[0047] When clamping the molds, even if there is a difference in thickness between the upper and lower pre-resin-sealing substrates Sa, the difference in thickness is absorbed by the appropriate expansion and contraction of the elastic member 246 as described above. This allows the upper and lower molding dies to be clamped appropriately.

[0048] Next, a process of resin molding is performed on the pre-resin-sealing substrate Sa. Specifically, the resin material R in the cavity is held in a pressurized state for a predetermined time. The resin material R is hardened by waiting for the predetermined time to pass while the resin material R is held in a pressurized state. At this time, the magnitude of the pressure applied to the resin material R and the holding time can be adjusted as desired.

[0049] Next, the step of opening the forming mold (mold opening) is carried out. Specifically, the ball screw 210 (see FIG. 2, etc.) is driven to lower the movable platen 120. When the movable platen 120 lowers, the intermediate plate 130 also lowers via the interlocking mechanism 220. As a result, the lower mold LM lowers so as to separate from the upper mold UM.

[0050] Next, a step of carrying out the resin-sealed substrate S (resin-sealed substrate Sb) from the molding die is carried out. Specifically, the resin-sealed substrate Sb is held by the transfer mechanism 51 shown in FIG. 1. The transfer mechanism 51 transfers the held resin-sealed substrate Sb to the storage module 4. The resin-sealed substrate Sb transferred to the storage module 4 by the transfer mechanism 51 is stored in the resin-molded product storage device 41. In this way, a resin-molded product (resin-sealed substrate Sb) can be manufactured using the resin molding device 1.

[0051] <Configuration of position adjustment mechanism 300> The following describes a position adjustment mechanism 300 that can adjust the position of the intermediate plate 130.

[0052] As described above, in the resin molding apparatus 1 (see FIG. 2), resin molding is performed using the upper mold UM provided on the fixed platen 110 and the lower mold LM provided on the intermediate plate 130, so it is necessary to maintain the parallelism of the intermediate plate 130 with respect to the fixed platen 110. Therefore, the resin molding apparatus 1 according to this embodiment is equipped with a position adjustment mechanism 300 that can adjust the vertical position of the intermediate plate 130 with respect to the side plate 131.

[0053] Although FIG. 4 illustrates the position adjustment mechanism 300 provided at the front left portion of the intermediate plate 130, the position adjustment mechanism 300 may be provided at multiple locations on the intermediate plate 130. For example, a position adjustment mechanism 300 may be provided at each of the four corners of the intermediate plate 130 (the front left portion, rear left portion, front right portion, and rear right portion shown in FIG. 4). By providing the position adjustment mechanisms 300 at the four corners of the intermediate plate 130 in this manner, the vertical position of each of the four corners of the intermediate plate 130 can be adjusted. This makes it possible to adjust the parallelism of the intermediate plate 130 with respect to the fixed platen 110.

[0054] In the following, the configuration of the position adjustment mechanism 300 will be described, focusing on the position adjustment mechanism 300 provided at the front left portion of the intermediate plate 130 as shown in FIG.

[0055] The position adjustment mechanism 300 shown in FIGS. 4 to 7 mainly comprises a main body 310, a first group of spheres 330, a second group of spheres 340, a first position adjustment member 350, and a second position adjustment member 360.

[0056] The main body 310 accommodates the first sphere group 330 and the second sphere group 340. The main body 310 is formed in a polyhedral shape. In this embodiment, the main body 310 is formed in a substantially rectangular parallelepiped shape having a front surface 311, a back surface 312, an upper surface 313, a lower surface 314, a left side surface 315, and a right side surface 316. The front surface 311, the upper surface 313, and the lower surface 314 are embodiments of the first surface, the second surface, and the third surface, respectively, according to the present invention. The main body 310 is formed with a notch 317, a fixing hole 318, a first guide portion 319, and a second guide portion 320.

[0057] The cutout 317 is formed by cutting out the left rear portion of the main body 310. As a result, the width in the front-rear direction near the left end of the main body 310 is formed smaller than the width in the front-rear direction of the other portions.

[0058] The fixing holes 318 are holes into which fixing devices (bolts, etc.) for fixing the main body 310 are inserted. The fixing holes 318 are formed so as to penetrate the left part of the main body 310 from front to back. The rear ends of the fixing holes 318 are formed so as to open into the notch 317. In this embodiment, two fixing holes 318 are formed, one at the top and one at the bottom, but the number and positions of the fixing holes 318 are not particularly limited.

[0059] First guide section 319 accommodates first sphere group 330 and guides first sphere group 330 to move in a predetermined direction. As shown in Fig. 7(a), first guide section 319 mainly includes first accommodation section 319a, second accommodation section 319b, and step section 319c.

[0060] The first accommodating portion 319a is a hole that accommodates a first sphere 331, which will be described later. The first accommodating portion 319a is formed to open to the front surface 311 of the main body 310. The first accommodating portion 319a is formed to the right of the fixing hole 318 (near the center of the main body 310). The first accommodating portion 319a is formed to extend in the front-rear direction from the front surface 311 of the main body 310 to near the rear end of the main body 310. The first accommodating portion 319a is formed to have a circular cross section when viewed in the axial direction (front-rear direction). An internal thread is formed on the inner circumferential surface of the first accommodating portion 319a.

[0061] The second accommodating portion 319b is a hole that accommodates a second sphere 332 (described later). The second accommodating portion 319b is formed to open to the upper surface 313 of the main body 310. The second accommodating portion 319b is formed at the same position as the first accommodating portion 319a in the left-right direction. The second accommodating portion 319b is formed to extend in the up-down direction from the upper surface 313 of the main body 310 to near the lower end of the main body 310. The lower end of the second accommodating portion 319b is connected to the rear end of the first accommodating portion 319a. In this way, the first accommodating portion 319a and the second accommodating portion 319b form an L-shaped hole. The second accommodating portion 319b is formed to have a circular cross section when viewed in the axial direction (up-down direction). The inner diameter of the second accommodating portion 319b is formed to be the same as the inner diameter of the first accommodating portion 319a.

[0062] Step portion 319c displaces second sphere 332 (described later) upward relative to first sphere 331. Step portion 319c is one embodiment of a displacement portion according to the present invention. Step portion 319c is formed at a portion where first accommodating portion 319a and second accommodating portion 319b are connected (at a corner formed by first accommodating portion 319a and second accommodating portion 319b). Step portion 319c is formed to be slightly higher than the bottom surface of first accommodating portion 319a (more specifically, the lowest position of the inner circumferential surface).

[0063] The second guide section 320 shown in Figures 4 to 7 accommodates the second sphere group 340 and guides the second sphere group 340 to move in a predetermined direction. As shown in Figure 7(b), the second guide section 320 mainly includes a first accommodation section 320a, a second accommodation section 320b, and a step section 320c. The second guide section 320 is formed in a shape obtained by turning the first guide section 319 upside down. Therefore, detailed description of the second guide section 320 will be omitted below as appropriate.

[0064] Second guide portion 320 is formed to the right of first guide portion 319 (right portion of main body portion 310). First accommodating portion 320a is formed to open to front surface 311 of main body portion 310. In other words, first accommodating portion 320a of second guide portion 320 is formed to open to the same surface (front surface 311) as first accommodating portion 319a of first guide portion 319. First accommodating portion 320a accommodates first sphere 341, which will be described later.

[0065] Second accommodating portion 320b is formed to open to lower surface 314 of main body portion 310. That is, second accommodating portion 320b of second guide portion 320 is formed to open to the surface (opposite surface) (lower surface 314) facing the surface (upper surface 313) where second accommodating portion 319b of first guide portion 319 opens. Second accommodating portion 320b accommodates second sphere 342, which will be described later. Step portion 320c is formed to be slightly lower than the upper surface of first accommodating portion 320a (more specifically, the uppermost position of the inner circumferential surface).

[0066] The first accommodating portion 320a of the second guide portion 320 is formed at a position displaced in the vertical direction relative to the first accommodating portion 319a of the first guide portion 319. Specifically, the first accommodating portion 320a of the second guide portion 320 is formed at a position displaced upward relative to the first accommodating portion 319a of the first guide portion 319. By displacing the first accommodating portion 319a and the first accommodating portion 320a, which have circular cross sections, in the vertical direction in this manner, the first accommodating portion 319a and the first accommodating portion 320a can be formed closer to each other in the horizontal direction. This allows the position adjustment mechanism 300 to be made smaller.

[0067] 7(a) is a plurality of spheres housed in the first guide portion 319. Specifically, the first sphere group 330 includes a first sphere 331 and a second sphere 332.

[0068] The first sphere 331 is housed in the first housing portion 319a of the first guide portion 319. The first sphere 331 has a diameter that is approximately the same as the inner diameter of the first housing portion 319a. The first sphere 331 can move within the first housing portion 319a along the axial direction (front-rear direction) of the first housing portion 319a.

[0069] The second sphere 332 is accommodated in the second accommodation portion 319b of the first guide portion 319. The second sphere 332 has the same diameter as the first sphere 331. The second sphere 332 has a diameter that is approximately the same as the inner diameter of the second accommodation portion 319b. The second sphere 332 can move within the second accommodation portion 319b along the axial direction (up and down direction) of the second accommodation portion 319b.

[0070] 7(b) is a plurality of spheres housed in the second guide section 320. Specifically, the second sphere group 340 includes a first sphere 341 and a second sphere 342.

[0071] The first sphere 341 is housed in the first housing portion 320a of the second guide portion 320. The first sphere 341 has a diameter that is approximately the same as the inner diameter of the first housing portion 320a. The first sphere 341 can move within the first housing portion 320a along the axial direction (front-rear direction) of the first housing portion 320a.

[0072] The second sphere 342 is housed in the second housing portion 320b of the second guide portion 320. The second sphere 342 has the same diameter as the first sphere 341. The second sphere 342 has a diameter that is approximately the same as the inner diameter of the second housing portion 320b. The second sphere 342 can move within the second housing portion 320b along the axial direction (up and down direction) of the second housing portion 320b.

[0073] As described above, the position adjustment mechanism 300 of this embodiment includes two sets of sphere groups (first sphere group 330 and second sphere group 340).

[0074] The first position adjustment member 350 shown in FIG. 7(a) is used to adjust the position of the first sphere 331 housed in the first guide portion 319 (first housing portion 319a). The first position adjustment member 350 is formed with a screw (e.g., a common screw) that can be fitted into a female screw formed in the first housing portion 319a. A hexagonal hole 351 is formed in the end surface of the first position adjustment member 350. The first position adjustment member 350 is disposed in front of the first sphere 331. The first position adjustment member 350 is fitted into the first housing portion 319a with the hole 351 facing forward. The position of the first position adjustment member 350 can be changed in the front-to-rear direction by inserting an appropriate tool into the hole 351 of the first position adjustment member 350 from the front and rotating the first position adjustment member 350.

[0075] The second position adjustment member 360 shown in FIG. 7(b) is used to adjust the position of the first sphere 341 housed in the second guide portion 320 (first housing portion 320a). The second position adjustment member 360 is formed in a manner generally similar to the first position adjustment member 350. The second position adjustment member 360 is disposed in front of the first sphere 341. The second position adjustment member 360 is fitted into the first housing portion 320a with the hole 361 facing forward. The position of the second position adjustment member 360 can be changed in the front-to-rear direction by inserting an appropriate tool into the hole 361 of the second position adjustment member 360 and rotating the second position adjustment member 360.

[0076] <Method for adjusting the position of the intermediate plate 130> As shown in FIGS. 4 and 8 , the position adjustment mechanism 300 configured as described above is disposed so as to be housed in a recess 130a formed across the side plate 131 and the intermediate plate 130. The recess 130a is formed so as to open forward. The recess 130a is formed in a shape generally similar to that of the position adjustment mechanism 300 (main body portion 310). This allows the recess 130a to house the position adjustment mechanism 300 (main body portion 310) with the front surface 311 exposed. As described above, in this embodiment, the position adjustment mechanisms 300 are provided at the four corners of the intermediate plate 130. The position adjustment mechanisms 300 provided on the rear side (left rear portion and right rear portion) of the intermediate plate 130 are housed in recesses (not shown) that open rearward.

[0077] A fastener (such as a bolt) is inserted into the fixing hole 318 from the front, and this fastener is fastened to the side plate 131. In this way, the position adjustment mechanism 300 is fixed to the side plate 131.

[0078] Using the position adjustment mechanism 300 arranged in this manner, it is possible to adjust the vertical position of the intermediate plate 130 relative to the side plate 131. This will be specifically described below with reference to FIG.

[0079] For example, when moving the intermediate plate 130 upward relative to the side plate 131, as shown in FIG. 8(a), the first position adjustment member 350 is rotated and moved rearward using an appropriate tool. At this time, the tool can be used from the front (front) of the resin molding mechanism 31, making it easy to ensure a working space. When the first position adjustment member 350 moves rearward, the first sphere 331 in contact with the first position adjustment member 350 is pushed rearward along the first accommodation portion 319a.

[0080] When first sphere 331 is pushed rearward, second sphere 332, which is in contact with first sphere 331, is also pushed rearward. Here, second sphere 332 is disposed at a position displaced upward relative to first sphere 331 by step portion 319c. Therefore, when second sphere 332 is pushed rearward by first sphere 331, an upward component force acts on second sphere 332. This component force causes second sphere 332 to move upward along second housing portion 319b.

[0081] When the second spheres 332 move upward and protrude from the upper ends of the second housing portions 319b, a force is applied to the intermediate plate 130 by the second spheres 332, pushing up the intermediate plate 130. This allows the intermediate plate 130 to move upward relative to the side plates 131.

[0082] Furthermore, when the intermediate plate 130 is moved downward relative to the side plate 131, the first position adjustment member 350 is rotated to move it forward. The weight of the intermediate plate 130 is applied to the first sphere 331 via the second sphere 332. Therefore, the first sphere 331 moves forward to follow the movement of the first position adjustment member 350. As the first sphere 331 moves forward, the second sphere 332 also moves downward. This allows the intermediate plate 130 to move downward relative to the side plate 131.

[0083] Furthermore, when the first position adjustment member 350 is moved as described above to move the intermediate plate 130 downward, it is conceivable that the intermediate plate 130 will not descend under its own weight due to friction between the intermediate plate 130 and other members (e.g., the side plate 131, etc.).

[0084] In such a case, as shown in Fig. 7(b), the intermediate plate 130 can be reliably moved downward by moving the second position adjustment member 360. Specifically, when moving the intermediate plate 130 downward relative to the side plate 131, the second position adjustment member 360 is rotated and moved rearward. As a result, the first sphere 341 in contact with the second position adjustment member 360 is pushed rearward along the first housing portion 320a.

[0085] When first sphere 341 is pushed rearward, second sphere 342, which is in contact with first sphere 341, is also pushed rearward. Here, second sphere 342 is disposed at a position displaced downward relative to first sphere 341 by step portion 320c. Therefore, when second sphere 342 is pushed rearward by first sphere 341, a downward component force acts on second sphere 342. This component force causes second sphere 342 to move downward along second housing portion 320b.

[0086] When the second spheres 342 move downward and protrude from the lower ends of the second housing portions 320b, the second spheres 342 press down on the intermediate plate 130. This allows the intermediate plate 130 to move downward relative to the side plate 131.

[0087] In this way, the position adjustment mechanism 300 can be used to adjust the vertical position of the intermediate plate 130 relative to the side plate 131. The position adjustment mechanism 300 shown in FIG. 4 is provided at the front left portion of the intermediate plate 130, and therefore can adjust the vertical position of the front left portion of the intermediate plate 130. In this way, by using the position adjustment mechanisms 300 provided at the four corners of the intermediate plate 130, the vertical positions of the four corners of the intermediate plate 130 can be adjusted individually. By individually adjusting the vertical positions of the four corners of the intermediate plate 130, the parallelism of the intermediate plate 130 relative to the fixed platen 110 can be maintained.

[0088] As described above, by using the position adjustment mechanism 300, the position of the intermediate plate 130 can be adjusted from the front (or back) of the device, where there is relatively more space, and therefore the adjustment work can be easily performed. Furthermore, because the adjustment work can be performed from the front, there is no need to ensure work space above or below the intermediate plate 130, for example. This improves the degree of freedom (design freedom) in the shape and dimensions of various components such as the intermediate plate 130.

[0089] Furthermore, as described above, the direction in which force acts can be changed using one set of spheres (first sphere group 330), which allows for a simple configuration of position adjustment mechanism 300. Furthermore, by using one set of spheres (first sphere group 330), position adjustment mechanism 300 can be formed at relatively low cost and with low damage resistance.

[0090] After the position adjustment of the intermediate plate 130 by the position adjustment mechanism 300 is completed, the intermediate plate 130 is fixed to the side plate 131 by an appropriate fastener 133 (for example, a bolt, etc.), as shown in Fig. 4. In this way, since the intermediate plate 130 is fixed by the fastener 133, an excessive load is not applied to the position adjustment mechanism 300.

[0091] Although one embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and appropriate modifications are possible within the scope of the technical idea of ​​the invention described in the claims.

[0092] For example, the configuration (shape, arrangement, number, etc.) of each part of the resin molding apparatus 1 described in this embodiment is not particularly limited and can be changed as desired. Also, in this embodiment, the resin molding apparatus 1 in which the base part 150 and the fixed platen 110 are fixed to the pair of press frames 140 has been exemplified, but the pair of press frames 140 can also have four tie bars.

[0093] Furthermore, in this embodiment, a resin molding apparatus 1 using molding dies arranged in two levels, one above the other, is exemplified, but the present invention is not limited to this. For example, it is also possible to arrange molding dies in one level, or in three or more levels above and below. When arranging molding dies in three or more levels above and below, it is possible to arrange multiple intermediate plates 130, as exemplified in this embodiment, vertically in a row. In this case, by providing a position adjustment mechanism 300 to each intermediate plate 130, it is possible to maintain the parallelism of each intermediate plate 130. Note that when there is one level of molding dies, the position adjustment mechanism 300 can be provided to the fixed platen that fixes the upper mold UM, thereby maintaining the parallelism.

[0094] In addition, in this embodiment, a resin molding apparatus 1 that performs resin molding using a compression molding method is exemplified, but the present invention is not limited to this and can also be applied to a resin molding apparatus 1 that performs resin molding using, for example, a transfer molding method.

[0095] Furthermore, in this embodiment, an example has been shown in which the position adjustment mechanism 300 (main body 310) is fixed to the side plate 131 and adjusts the vertical position of the intermediate plate 130 relative to the side plate 131, but the present invention is not limited to this. For example, it is also possible to configure the position adjustment mechanism 300 to be fixed to the intermediate plate 130 and adjust the vertical position of the side plate 131 relative to the intermediate plate 130.

[0096] Furthermore, in this embodiment, the position adjustment mechanism 300 is illustrated as having two sets of ball groups (first ball group 330 and second ball group 340), but the number of ball groups is not particularly limited. For example, the position adjustment mechanism 300 can also be configured to have one set of ball groups, or three or more sets of ball groups. Explaining this using the position adjustment mechanism 300 of this embodiment, it is also possible to configure the position adjustment mechanism 300 to have only the first ball group 330 (the ball group that pushes up the intermediate plate 130) of the first ball group 330 and the second ball group 340.

[0097] Furthermore, in this embodiment, an example has been shown in which the main body 310 of the position adjustment mechanism 300 is formed in a rectangular parallelepiped shape, but the present invention is not limited to this, and the main body 310 can be formed in any shape.

[0098] In addition, in this embodiment, an example has been shown in which first guide portion 319 (first accommodating portion 319a and second accommodating portion 319b) is formed to be bent in an L-shape, but the present invention is not limited to this. For example, first guide portion 319 can also be formed in a smoothly curved shape. The same applies to second guide portion 320.

[0099] Furthermore, in this embodiment, an example has been shown in which screws (common screws) are used as the position adjustment members (first position adjustment member 350 and second position adjustment member 360), but the present invention is not limited to this, and any member (for example, a headed bolt, etc.) can also be used.

[0100] In addition, in this embodiment, an example has been shown in which one set of sphere groups (for example, first sphere group 330) includes two spheres (first sphere 331 and second sphere 332), but the present invention is not limited to this, and the number of spheres can be changed as desired. For example, if first storage section 319a in which first sphere 331 is stored is longer than in this embodiment, it is also possible to arrange multiple first spheres 331 side by side according to the length of first storage section 319a.

[0101] Furthermore, as shown in Fig. 9, first accommodating portion 319a that accommodates multiple first spheres 331 can also be bent. In the modified example of position adjustment mechanism 300 shown in Fig. 9, first accommodating portion 319a is bent in a generally S-shape in plan view. More specifically, first accommodating portion 319a shown in Fig. 9 is formed so as to extend rearward from front surface 311 of main body portion 310 and then gradually bend toward the left. Then, first accommodating portion 319a is formed so as to gradually bend rearward, and the rear end portion of first accommodating portion 319a extends straight rearward.

[0102] 9, the second accommodating portion 319b is formed at a position that is twisted relative to the vicinity of the front end of the first accommodating portion 319a (the portion where the first position adjustment member 350 is disposed).

[0103] 9, by accommodating a plurality of first spheres 331 in the first accommodation portion 319a, the movement of the first position adjustment member 350 can be transmitted to the second sphere 332 via the plurality of first spheres 331. In this way, by using a plurality of first spheres 331, the movement of the first position adjustment member 350 can be transmitted to the second sphere 332 that is not on an extension of the movement direction (front-back direction) of the first position adjustment member 350.

[0104] Note that first housing portion 319a can be formed into any shape, not limited to the example shown in Fig. 9. Similarly to first housing portion 319a, the shape of second housing portion 319b can also be changed arbitrarily, and a plurality of second spheres 332 can also be provided.

[0105] <Additional Notes> The resin molding apparatus 1 according to the first aspect of the present disclosure includes: a support plate (intermediate plate 130) for supporting the mold; a movable body (side plate 131) to which the support plate is fixed and which is movable in a predetermined direction; a position adjustment mechanism 300 capable of adjusting the position of the support plate relative to the movable body; A resin molding apparatus 1 comprising: The position adjustment mechanism 300 is a main body 310 fixed to either the support plate or the movable body (side plate 131); a sphere group (first sphere group 330) including a plurality of spheres housed in the main body portion 310; Equipped with The group of spheres is a first sphere 331 whose position can be adjusted along a first direction (front-rear direction); a second sphere 332 that is movable in a second direction (vertical direction) different from the first direction in accordance with the position adjustment of the first sphere 331 and that can apply a force to the other of the support plate and the movable body (intermediate plate 130); It is equipped with the following. According to the resin molding apparatus 1 of the first aspect of the present disclosure, it is possible to improve the degree of freedom in designing the apparatus. That is, by moving the first spheres 331 in a first direction (front-back direction), it is possible to apply a force to the intermediate plate 130 along a second direction (up-down direction) different from the first direction. This allows the position of the intermediate plate 130 to be adjusted by operating (adjusting the position of the first spheres 331) from a direction different from the direction of the force applied to the intermediate plate 130, thereby improving the degree of freedom in designing the apparatus. For example, it is no longer necessary to secure space for installing adjustment screws or the like in the vertical direction of the intermediate plate 130.

[0106] In the resin molding apparatus 1 of the second aspect according to the first aspect of the present disclosure, The main body 310 is formed in a polyhedral shape, The main body 310 has: The main body 310 has a first storage section 319a that opens onto a first surface (front surface 311) thereof and stores the first sphere 331, and a second storage section 319b that opens onto a surface (top surface 313) of the main body 310 that is different from the first surface thereof and stores the second sphere 332. According to the resin molding apparatus 1 of the second aspect of the present disclosure, it is possible to improve the degree of freedom in designing the apparatus. That is, by adjusting the position of the first sphere 331 from the first surface (front surface 311) side, it is possible to apply a force from the second sphere 332 to the surface (upper surface 313) different from the first surface.

[0107] In the resin molding apparatus 1 of a third aspect according to the second aspect of the present disclosure, The position adjustment mechanism 300 includes a plurality of sets of the sphere groups (a first sphere group 330 and a second sphere group 340), The second accommodating portion 319b, which accommodates a first group of spheres 330 among the plurality of groups of spheres, is formed to open to a second surface (upper surface 313) different from the first surface (front surface 311) of the main body portion 310, The second storage section 320b, which stores a second group of spheres 340 different from the first group of spheres 330 among the multiple sets of groups of spheres, is formed to open to a third surface (lower surface 314) opposite the second surface (upper surface 313) of the main body section 310. According to the resin molding apparatus 1 of the third aspect of the present disclosure, forces can be applied in multiple directions by multiple sets of spheres. This makes it easier and more reliable to adjust the position of the intermediate plate 130. For example, as in this embodiment, forces can be applied to the intermediate plate 130 in both upward and downward directions, so that the vertical position of the intermediate plate 130 can be easily and reliably adjusted.

[0108] In a resin molding apparatus 1 of a fourth aspect according to a third aspect of the present disclosure, The first storage section 320a that stores the second group of spheres 340 is formed at a position that is displaced in the vertical direction relative to the first storage section 319a that stores the first group of spheres 330. According to the resin molding apparatus 1 of the fourth aspect of the present disclosure, it is possible to reduce the size of the position adjustment mechanism 300. That is, by displacing the first accommodating portion 319a and the first accommodating portion 320a in the vertical direction, it is possible to form the first accommodating portion 319a and the first accommodating portion 320a closer to each other in the horizontal direction. Accordingly, it is possible to reduce the size of the main body portion 310 and the like.

[0109] A resin molding apparatus 1 according to a fifth aspect of the first to fourth aspects of the present disclosure includes: It further includes a displacement portion (step portion 319c) that positions the second sphere 332 at a position displaced in the second direction (up-down direction) relative to the first sphere 331 when viewed from the first direction (front-to-back direction). According to the resin molding apparatus 1 of the fifth aspect of the present disclosure, it is possible to make it easier for a component force to act on the second sphere 332 in the second direction.

[0110] A resin molding apparatus 1 according to a sixth aspect of the first to fifth aspects of the present disclosure includes: It further includes position adjustment members (first position adjustment member 350, second position adjustment member 360) that are fitted into the main body 310 and are capable of changing their position along the first direction (front-to-back direction), and that adjust the position of the first sphere 331 by coming into contact with the first sphere 331. In the resin molding apparatus 1 according to the sixth aspect of the present disclosure, the position of the first sphere 331 can be easily adjusted.

[0111] A method for producing a resin molded product according to a seventh aspect of the present disclosure includes: A method for manufacturing a resin molded product using a resin molding apparatus 1 according to any one of the first to sixth aspects, a step of loading a molding object (a pre-resin-encapsulated substrate Sa) and a resin material R into the molding die; clamping the molding die; It includes: According to the resin molding apparatus 1 of the first aspect of the present disclosure, it is possible to improve the degree of freedom in designing the apparatus. [Explanation of symbols]

[0112] 1 Resin molding equipment 130 Intermediate Plate 131 Side plate 300 Position adjustment mechanism 310 Main body 319 First Information Section 319a First Receptacle 319b Secondary Storage Unit 320 Second Information Section 320a First storage section 320b Second storage section 330 First Sphere Group 340 Second Sphere Group 350 First position adjustment member 360 second position adjustment member

Claims

1. a support plate that supports the mold; a movable body to which the support plate is fixed and which is movable in a predetermined direction; a position adjustment mechanism that adjusts the position of the support plate relative to the movable body; A resin molding apparatus comprising: The position adjustment mechanism includes: a main body portion fixed to either the support plate or the movable body; a sphere group including a plurality of spheres housed in the main body; Equipped with The group of spheres is a first sphere positionably movable along a first direction; a second sphere that is movable in a second direction different from the first direction in accordance with the position adjustment of the first sphere and that can apply a force to the other of the support plate and the movable body; A resin molding device comprising:

2. The main body is formed in a polyhedral shape, The main body portion includes: a first storage portion that is formed to open on a first surface of the main body portion and that stores the first sphere; and a second storage portion that is formed to open on a surface different from the first surface of the main body portion and that stores the second sphere. The resin molding device according to claim 1 .

3. the position adjustment mechanism includes a plurality of groups of the spheres; the second housing portion that houses a first group of spheres among the plurality of groups of spheres is formed to open to a second surface different from the first surface of the main body portion, the second accommodating portion accommodating a second group of spheres different from the first group of spheres among the plurality of groups of spheres is formed to open to a third surface opposite to the second surface of the main body portion; The resin molding device according to claim 2 .

4. the first housing portion housing the second group of spheres is formed at a position displaced in the up-down direction relative to the first housing portion housing the first group of spheres, The resin molding apparatus according to claim 3 .

5. a displacement unit that disposes the second sphere at a position displaced in the second direction relative to the first sphere when viewed from the first direction; The resin molding apparatus according to any one of claims 1 to 4.

6. a position adjustment member that is fitted to the main body portion, is positionally adjustable along the first direction, and adjusts the position of the first sphere by contacting the first sphere; The resin molding apparatus according to any one of claims 1 to 5.

7. A method for manufacturing a resin molded product using the resin molding apparatus according to any one of claims 1 to 6, a step of carrying a molding object and a resin material into the molding die; clamping the molding die; A method for producing a resin molded product comprising the steps of:

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