Electronic device

Abstract

To reduce airflow resistance of the air discharged from a fan, thereby improving cooling performance.SOLUTION: An electronic device includes: an enclosure having a first vent hole, a second vent hole, and a third vent hole located between the first vent hole and the second vent hole; a heat generator equipped in the enclosure; and a cooling module equipped in the enclosure and cooling the heat generator. The cooling module includes: a pair of heat sinks; a heat transport device; a pair of fans each having a first discharge hole for discharging the air toward the heat sinks, one of fans being arranged to face one heat sink and the other one being arranged to face the other heat sink; and a metal plate arranged between the fans so that one edge may face the third vent hole for diffusing the heat of the heat generator. The metal plate includes a plurality of fins erected from a surface and arranged along the one edge, and a hole section penetrating in a plate thickness direction.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present invention relates to an electronic device and a cooling module. [Background technology]

[0002] Electronic devices such as notebook PCs are equipped with heat-generating elements such as CPUs. Such electronic devices often incorporate cooling modules equipped with fans and heat sinks. The cooling modules can absorb heat generated by the heat-generating elements and dissipate it to the outside (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 7371170 Summary of the Invention [Problem to be solved by the invention]

[0004] In the configuration of Patent Document 1, the left and right fans each have a pair of outlets, allowing air to be discharged in two directions. The air that leaves one of the outlets passes through a heat sink located immediately behind it and is discharged outside the housing. The air that leaves the other outlet flows along the surface of the board located between the left and right fans, cooling the mounted components before being discharged outside the housing.

[0005] However, there is a strong demand for miniaturization of the housings of electronic devices such as those described above. As a result, the space around the cooling module is narrow, which tends to increase the ventilation resistance of the air discharged from the fan. For example, in the configuration of Patent Document 1, the circuit board and vapor chamber extend close to the exhaust port located on the rear side of the housing. These components create ventilation resistance for the air flowing from the fan to the exhaust port. Therefore, even in such a configuration, there is a demand for reducing the ventilation resistance of the air discharged from the fan, increasing the fan's airflow, and improving the cooling performance of the cooling module.

[0006] The present invention has been made in consideration of the problems with the prior art described above, and aims to provide an electronic device and a cooling module that can reduce the ventilation resistance of the air discharged from the fan and improve cooling capacity. [Means for solving the problem]

[0007] An electronic device according to a first aspect of the present invention comprises a housing having a first air vent, a second air vent, and a third air vent located between the first and second air vents, a heat generating element mounted within the housing, and a cooling module mounted within the housing and cooling the heat generating element, wherein the cooling module comprises a pair of heat sinks, one of which is arranged facing the first air vent and the other of which is arranged facing the second air vent, a heat transport device that transports heat from the heat generating element to the heat sink, a pair of fans, each of which has a first outlet capable of discharging air toward the heat sink, one of which is arranged facing one of the heat sinks and the other of which is arranged facing the other heat sink, and a metal plate, which is arranged between the pair of fans so that one edge faces the third air vent and can dissipate heat from the heat generating element, and the metal plate has a plurality of fins standing from its surface and arranged along the one edge, and holes penetrating in the thickness direction of the plate.

[0008] A cooling module according to a second aspect of the present invention is a cooling module to be mounted on an electronic device, and comprises a pair of heat sinks, a heat transport device connected to the heat sinks, a pair of fans each having a first outlet capable of discharging air toward the heat sinks, one of which is arranged facing one of the heat sinks and the other of which is arranged facing the other heat sink, and a metal plate arranged between the pair of fans, wherein the metal plate has a plurality of fins standing from the surface and lined up along one edge of the metal plate, and a hole portion penetrating in the thickness direction of the plate. [Effects of the Invention]

[0009] According to the above aspect of the present invention, it is possible to reduce the ventilation resistance of the air discharged from the fan and improve the cooling capacity. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 1 is a schematic plan view of an electronic device according to an embodiment, viewed from above. [Figure 2] FIG. 2 is a plan view schematically showing the internal structure of the housing. [Figure 3] FIG. 3 is a perspective view of the rear part of the electronic device as seen from the bottom side. [Figure 4] FIG. 4 is a schematic perspective view of a metal plate. [Figure 5] FIG. 5 is a schematic cross-sectional side view of the rear edge of the housing and its surrounding area. [Figure 6] FIG. 6 is a schematic rear cross-sectional view of the rear edge of the housing and its surrounding area. DETAILED DESCRIPTION OF THE INVENTION

[0011] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of an electronic device and a cooling module according to the present invention will be described in detail with reference to the accompanying drawings.

[0012] FIG. 1 is a schematic plan view of an electronic device 10 according to one embodiment, viewed from above. As shown in FIG. 1, the electronic device 10 according to this embodiment is a clamshell notebook PC. The electronic device 10 has a configuration in which a cover 11 and a housing 12 are connected by a hinge 14 so that they can rotate relative to each other. In this embodiment, the electronic device 10 is a notebook PC, but the electronic device may be other than a notebook PC, such as a tablet PC, a smartphone, or a portable game console.

[0013] The cover 11 is a thin, flat, box-shaped housing. The cover 11 is equipped with a display 16. The display 16 is, for example, an organic EL display or a liquid crystal display.

[0014] The housing 12 is a thin, flat box. A keyboard device 18 and a touchpad 19 face the top surface (surface 12a) of the housing 12. Hereinafter, the housing 12 and each of the components mounted thereon will be described based on the posture of an operator operating the keyboard device 18, with the width direction (left and right) of the housing 12 referred to as the X1 and X2 directions, the depth direction (front and back) of the housing 12 referred to as the Y1 and Y2 directions, and the thickness direction (top and bottom) of the housing 12 referred to as the Z1 and Z2 directions. The X1 and X2 directions may be collectively referred to as the X direction, and the Y1, Y2 directions and the Z1, Z2 directions may similarly be referred to as the Y direction and the Z direction. These directions are defined for convenience of explanation and may naturally change depending on the usage state or installation posture of the electronic device 10, etc.

[0015] The housing 12 is composed of a housing member 20 that forms the top surface and four peripheral side surfaces, and a cover material 21 that forms the bottom surface. The housing member 20 is formed by forming standing walls 20B on the four peripheral edges of a cover plate 20A that forms the surface 12a of the housing 12. Therefore, the housing member 20 has a roughly bathtub shape with an open bottom surface. The cover material 21 has a roughly flat plate shape and serves as a lid that closes the bottom opening of the housing member 20. The housing member 20 and the cover material 21 are overlapped in the thickness direction and are detachably connected to each other. The standing walls 20B may be formed on the cover material 21. In this case, the housing member 20 may be composed of only the cover plate 20A.

[0016] The hinge 14 is installed in a concave hinge placement groove 12b formed in the rear edge of the housing 12, and connects the housing 12 and the cover 11. The hinge 14 has a structure in which, for example, hinge shafts 14a serving as rotation axes are supported at both longitudinal ends of the hinge housing 14b (see FIG. 5). The hinge 14 of this embodiment is configured in a so-called one-bar shape in which the hinge housing 14b extends along the longitudinal direction of the hinge placement groove 12b. The hinge 14 rotates integrally with the cover 11 and descends obliquely rearward (see FIG. 5). The hinge 14 has a structure that increases the rotation angle of the cover 11 in this way, a so-called drop-down structure. The hinge 14 may have a structure other than that described above.

[0017] Fig. 2 is a plan view schematically showing the internal structure of the housing 12. Fig. 2 is a view of the inside of the housing member 20 from the bottom side with the cover material 21 removed.

[0018] 2, the housing 12 accommodates a cooling module 24, a motherboard 25, and a battery device 26. The housing 12 also accommodates various electronic components, mechanical components, and the like.

[0019] The motherboard (substrate) 25 is a circuit board that serves as the main board of the electronic device 10. The motherboard 25 is disposed near the Y2 side of the housing 12 and extends in the X direction. The battery device 26 is a rechargeable battery that serves as the power source for the electronic device 10. The battery device 26 is disposed near the Y1 side of the motherboard 25 and extends in the X direction.

[0020] The motherboard 25 of this embodiment is equipped with a CPU (Central Processing Unit) 25a and a GPU (Graphics Processing Unit) 25b. The CPU 25a is a processing device that performs calculations related to the main control and processing of the electronic device 10. The GPU 25b is a processing device that performs calculations necessary for image rendering such as 3D graphics. Power supply components and memories for the CPU 25a and GPU 25b are also mounted around the CPU 25a and GPU 25b. Various electronic components, such as a memory module 25c, a storage device 25d, and a communication module, are also mounted on the motherboard 25. The memory module 25c is, for example, a compression attached memory module (CAMM) or a dual inline memory module (DIMM). The storage device 25d is, for example, an SSD (Solid State Drive).

[0021] The motherboard 25 has, for example, an upper surface (first surface 25A) that serves as an attachment surface to the housing member 20, and a lower surface (second surface 25B) that serves as a mounting surface for the CPU 25a and the like.

[0022] The CPU 25a and the GPU 25b are heat-generating elements that generate the largest amount of heat among the electronic components mounted in the housing 12. The cooling module 24 can absorb and diffuse the heat generated by the CPU 25a and the GPU 25b and discharge it to the outside of the housing 12. The cooling module 24 of this embodiment can also cool the memory module 25c and the like.

[0023] As shown in FIG. 2, the cooling module 24 of this embodiment includes a pair of heat pipes 27, a pair of heat sinks 28, 28, a pair of fans 30, 30, and a metal plate 31.

[0024] The heat pipe 27 is a pipe-type heat transport device. The heat pipe 27 is configured by flattening a metal pipe to form a thin, elliptical cross section, with a working fluid sealed inside the sealed space. Examples of the working fluid include water, alternative chlorofluorocarbons, acetone, and butane. For example, two heat pipes 27 can be used as a set. A portion of the heat pipe 27 overlaps with the CPU 25a and GPU 25b in the Z direction and is connected to the CPU 25a and GPU 25b. Both ends of the heat pipe 27 are connected to left and right heat sinks 28, respectively. This allows the heat pipe 27 to transport heat generated by the CPU 25a and GPU 25b to the left and right heat sinks 28 with high efficiency.

[0025] The heat pipe 27 is thermally connected to the CPU 25a and the GPU 25b, for example, near the center in the longitudinal direction. A metal plate 31 is interposed between the heat pipe 27 and the CPU 25a and the GPU 25b (see also FIG. 5).

[0026] The metal plate 31 is a thin plate made of a metal with high thermal conductivity, such as copper or aluminum. In this embodiment, the metal plate 31 is a copper plate. The metal plate 31 functions as a heat spreader that absorbs and diffuses heat from the CPU 25a and GPU 25b. The metal plate 31 also functions as a heat transfer member that transfers the heat from the CPU 25a and GPU 25b to the heat pipe 27.

[0027] The metal plate 31 extends in a generally rectangular shape so as to fill the spaces between the left and right fans 30 and the left and right heat sinks 28 in the plan view shown in FIG. 2. The metal plate 31 covers a portion (portion 25C) of the motherboard 25 disposed between the left and right fans 30 and the CPU 25a and other components mounted on portion 25C from the second surface 25B side (Z2 side) (see also FIG. 5). The Y2-side edge (one edge 31a) of the metal plate 31 is disposed facing the inner wall surface of the Y2-side standing wall 20B at a portion corresponding to the hinge placement groove 12b. Hereinafter, the portion of the standing wall 20B corresponding to the hinge placement groove 12b may also be referred to as the "outer wall 20B." The one edge 31a of the metal plate 31 is disposed with a small gap between it and the inner wall surface of the outer wall 20B (see FIG. 5). A plurality of fins 32 and a plurality of holes 33 are arranged in parallel on one edge 31a of the metal plate 31. The specific configurations of the fins 32 and holes 33 will be described later.

[0028] Each heat sink 28 is provided near the X1- and X2-side edges of the housing 12. One heat sink 28 is positioned facing the Y2-side side surface (first outlet 30a) of one fan 30. The other heat sink 28 is positioned facing the Y2-side side surface (first outlet 30a) of the other fan 30. The heat sink 28 is made of a metal with high thermal conductivity, such as aluminum or copper. The heat sink 28 has a structure in which multiple fins made of thin metal plates are arranged at equal intervals in the X direction. Each fin stands in the Z direction and extends in the Y direction. The upper and lower end surfaces (Z-direction end surfaces) of each fin are integrally supported by thin plate-shaped portions. A gap is formed between adjacent fins through which air sent from the fans 30 passes. This allows air sent from the first outlet 30a of each fan 30 to pass through each heat sink 28.

[0029] As shown in FIG. 2, the fans 30 are provided at positions close to the Y1 sides of the left and right heat sinks 28, respectively. The fans 30 have a first outlet 30a and a second outlet 30b. The fan 30 has an intake port 30c on one or both of its top and bottom surfaces. The fan 30 is a centrifugal fan that rotates an impeller 30d housed inside the housing by a motor (see FIG. 6). The fan 30 draws in air through the intake port 30c and discharges it from the outlet ports 30a and 30b. The intake port 30c can also draw in air from outside the housing 12 through a bottom vent 40 that opens on the bottom surface (cover material 21) of the housing 12 (see FIGS. 3 and 5).

[0030] The first outlet 30a discharges air in the Y2 direction. The air sent from the first outlet 30a passes through the heat sink 28. The air that has passed through the heat sink 28 is exhausted to the outside of the housing 12 from the ventilation holes 36, 37 formed in the outer wall 20B of the housing 12.

[0031] The second outlets 30b discharge air in the X1 or X2 direction. The fan 30 arranged on the X1 side in FIG. 2 has the second outlets 30b opening on its X2 side surface. The fan 30 arranged on the X2 side in FIG. 2 has the second outlets 30b opening on its X1 side surface. As a result, the second outlets 30b of the left and right fans 30 face each other with the portion 25C of the motherboard 25 and the metal plate 31 sandwiched between them.

[0032] The second outlet 30b is preferably positioned in the Z direction to face the side end surfaces of the motherboard 25 and the metal plate 31 (see FIG. 5). This allows the second outlet 30b of each fan 30 to discharge air toward the upper and lower surfaces (surfaces 25A and 25B) of the motherboard 25 and the upper and lower surfaces 31b and 31c of the metal plate 31. The air discharged from the second outlet 30b flows along the surfaces 25A and 25B and the surfaces 31b and 31c, cooling the CPU 25a, GPU 25b, memory module 25c, etc. This air further cools the surfaces 31b and 31c of the metal plate 31 and the fins 32, and is then discharged to the outside of the housing 12 through a third ventilation opening 38 formed in the outer wall 20B of the housing 12.

[0033] FIG. 3 is a perspective view of the rear part of the electronic device 10 as seen from the bottom side.

[0034] 3, the housing 12 has a first ventilation opening 36, a second ventilation opening 37, and a third ventilation opening 38 in the outer wall 20B. Each of the ventilation openings 36 to 38 can be configured, for example, as a plurality of small window-like openings lined up along the longitudinal direction of the outer wall 20B.

[0035] The first ventilation opening 36 is located near the X1 side end of the outer wall 20B. The first ventilation opening 36 is adjacent to and faces the heat sink 28 on the X1 side (see also FIG. 2). The second ventilation opening 37 is located near the X2 side end of the outer wall 20B. The second ventilation opening 37 is adjacent to and faces the heat sink 28 on the X2 side. The third ventilation opening 38 is located between the first ventilation opening 36 and the second ventilation opening 37 in the X direction. The third ventilation opening 38 is adjacent to and faces one edge 31a of the metal plate 31 and the Y2 side edge of the portion 25C of the motherboard 25 (see also FIG. 5).

[0036] Next, a specific example of the configuration of the metal plate 31 will be described.

[0037] Fig. 4 is a schematic perspective view of the metal plate 31. Fig. 5 is a schematic side cross-sectional view of the rear edge portion of the housing 12 and its surrounding area. Fig. 6 is a schematic rear cross-sectional view of the rear edge portion of the housing 12 and its surrounding area. Figs. 5 and 6 show enlarged views of the fins 32, holes 33 and their surrounding area of ​​the metal plate 31.

[0038] 2 to 6, the Y2 side edge (one edge 31a) of the metal plate 31 extends to a position close to the third vent hole 38. As a result, the metal plate 31 covers the portion 25C of the motherboard 25 that extends to a position close to the third vent hole 38. The metal plate 31 has fins 32 and holes 33 on the one edge 31a facing the third vent hole 38.

[0039] The fins 32 are plate pieces that stand up in the Z2 direction from the surface 31c of the metal plate 31 and extend in the Y direction. A plurality of fins 32 are provided so as to be aligned in the X direction along one edge 31a. This forms gaps (air passages) extending in the Y direction between adjacent fins 32. Each fin 32 can be made of a cut-up piece obtained by cutting out a part of the metal plate 31.

[0040] The holes 33 are through-holes that penetrate the metal plate 31 in the plate thickness direction (Z direction). A plurality of holes 33 are provided so as to be aligned in the X direction along one edge 31a. Each hole 33 can be configured as a cut-out hole formed in a cut-out portion of the fin 32. In this case, each hole 33 is disposed adjacent to each fin 32 in the X direction.

[0041] As described above, the Y2-side edge of the portion 25C of the motherboard 25 extends to a position close to the third ventilation opening 38 (see FIGS. 2 and 5). The electronic device 10 is, for example, a portable notebook PC. The housing 12 needs to be as small as possible, and the internal space is limited. Therefore, the motherboard 25 extends to a position close to the outer wall 20B to ensure mounting space for mounted components. Due to this configuration, in this embodiment, the portion 25C of the motherboard 25 vertically overlaps the fins 32 and the holes 33. Therefore, electronic components 25e may be mounted on the motherboard 25 at positions that vertically overlap the fins 32 (see FIGS. 5 and 6). Examples of the electronic components 25e include power supply components for the CPU 25a and GPU 25b, memory, and the like.

[0042] Therefore, it is preferable that the fins 32 stand up in the Z2 direction from the surface 31c of the metal plate 31 opposite the surface (surface 31b) facing the motherboard 25 (see FIGS. 5 and 6). This prevents the fins 32 from interfering with the motherboard 25 and its electronic components 25e. This interference can also prevent problems such as short circuits in the electronic components 25e from occurring. The fins 32 can be ensured to have a sufficient standing height, thereby increasing the heat exchange surface area. Furthermore, by reducing the height in the Z direction between the motherboard 25 and the metal plate 31, the housing 12 can be made thinner. The standing height of the fins 32 from the surface 31c can be, for example, approximately the same as or slightly higher than the thickness of the heat pipes 27 (see FIG. 5).

[0043] In this way, the metal plate 31 has fins 32 and holes 33 on one edge 31a facing the third ventilation port 38. As a result, air discharged from the second outlets 30b of the left and right fans 30 passes around the fins 32 from the surfaces 25A and 25B of the motherboard 25 and the surfaces 31b and 31c of the metal plate 31, and is discharged to the outside of the housing 12 through the third ventilation port 38. At that time, part of the air that flows between the surface 31c and the cover material 21 (flow path 44) passes through the holes 33 and is discharged to the third ventilation port 38 from the surface 31b side.

[0044] Specifically, in the electronic device 10 of this embodiment, air circulation paths 42 to 44 leading from the second outlet 30b to the third ventilation port 38 are formed within the housing 12, and the fins 32 and the holes 33 are arranged on this circulation path 42.

[0045] The circulation path 42 closest to the Z1 side is a path that passes between the keyboard device 18 and the first surface 25A of the motherboard 25 and heads toward the third ventilation port 38. The intermediate circulation path 43 is a path that passes between the second surface 25B of the motherboard 25 and the surface 31b of the metal plate 31 and heads toward the third ventilation port 38. The circulation path 44 closest to the Z2 side is a path that passes between the surface 31c of the metal plate 31 and the cover material 21 and heads toward the third ventilation port 38. This circulation path 44 communicates with the circulation path 43 via the hole portion 33. The arrows shown by dashed lines in Figures 2, 4, 5, and 6 schematically show the flow of air.

[0046] 2, a space (duct structure 45) for smoothing the air flow through the airflow paths 42-44 can be formed inside the housing 12. The range of the duct structure 45 is formed between the first surface 25A, the keyboard device 18, and the cover material 21 in the Z direction. The range of the duct structure 45 is formed between the left and right fans 30, 30 and between the heat sinks 28, 28 in the X direction. The third air vent 38 is located on the Y2 side of the duct structure 45.

[0047] It is preferable to provide an airtight wall 45a on the periphery of the duct structure 45 except for the side of the third air vent 38. The airtight wall 45a is, for example, a member made of sponge or rubber formed into a strip shape. The airtight wall 45a does not need to be able to completely block the passage of air, but it does need to have a certain degree of ventilation resistance so as to be able to regulate the direction of air flow.

[0048] Next, the operation and effects of the cooling module 24 in the electronic device 10 will be described.

[0049] As shown in FIGS. 2 to 6, the electronic device 10 includes a housing 12 having vents 36 to 38 in an outer wall 20B, and a cooling module 24. The housing 12 is equipped with a board (motherboard 25) on which heat-generating elements such as a CPU 25a and a GPU 25b are mounted. The cooling module 24 includes a heat sink 28 arranged facing the vents 36 and 37, a heat transport device (heat pipe 27) that transports heat from the CPU 25a and other components to the heat sink 28, a fan 30 having a first outlet 30a capable of discharging air toward each heat sink 28, and a metal plate 31. The metal plate 31 is arranged between the fans 30, 30 so that one edge 31a faces the third vent 38, and is capable of dissipating heat from the CPU 25a and other components. The metal plate 31 has a plurality of fins 32 arranged along the one edge 31a, and holes 33.

[0050] Therefore, in the electronic device 10, heat generated by a heat generating element such as the CPU 25a is transferred to the heat pipe 27 via the metal plate 31 and is also efficiently transported to the heat sink 28. The heat transported to the heat sink 28 is smoothly discharged to the outside of the housing 12 by air flowing from the first outlet 30a of the fan 30 to the vents 36 and 37.

[0051] Furthermore, in the electronic device 10, a portion of the heat transferred from the CPU 25a etc. to the metal plate 31 and a portion of the heat generated by the memory module 25c and the electronic components 25e etc. are diffused by the metal plate 31. The heat diffused by the metal plate 31 is radiated to the circulation paths 42 to 44 and is also conducted to the fins 32. The heat radiated to the circulation paths 42 to 44 is smoothly discharged to the outside of the housing 12 by air flowing from the second outlet 30b to the third ventilation hole 38.

[0052] At this time, the air flowing through the flow path 44 cools the fins 32, thereby efficiently cooling the metal plate 31 and improving the cooling efficiency of the CPU 25a and the like. Furthermore, part of the air flowing through the flow path 44 passes through the holes 33 and flows out to the third ventilation opening 38 via the flow path 43. This prevents the edge 31a of the metal plate 31 from creating a resistance to the air flowing through the flow path 44. This increases the air volume of the fan 30. In this way, the cooling performance of the cooling module 24 is improved by the cooling effect of the fins 32 on the metal plate 31 and the effect of the holes 33 on increasing the air volume of the fan 30.

[0053] In the cooling module 24, each fin 32 can be formed from a cut-and-raised piece, and each hole 33 can be formed from a cut-and-raised hole formed in the cut-and-raised portion of each fin 32. In this way, the metal plate 31 can reduce ventilation resistance while ensuring a heat exchange surface area with the air flowing through the circulation paths 43 and 44. In particular, in the electronic device 10, not only the metal plate 31 but also the motherboard 25 extends up to just before the third ventilation opening 38, and the path extending from the circulation paths 42 to 44 to the third ventilation opening 38 is narrowed. Therefore, by providing the hole 33 together with the fin 32 on one edge 31a of the metal plate 31, the electronic device 10 can suppress an increase in ventilation resistance.

[0054] Fan 30 may also be configured without second outlet 30b. In this case, third vent 38 functions as an air intake port through which fan 30 draws air from outside housing 12 toward intake port 30c. The outside air drawn in through third vent 38 cools fins 32 and is introduced into intake port 30c through holes 33. In this case, hole 33 also connects flow paths 43 and 44, reducing ventilation resistance and improving the airflow of fan 30.

[0055] It should be noted that the present invention is not limited to the above-described embodiment, and can be freely modified without departing from the spirit of the present invention.

[0056] The fin 32 may not be a cut-and-raised piece, but may be formed as a separate member and fixed to the surface 31c. In this case, the hole 33 may be appropriately formed near the fin 32, and may be formed as, for example, a single elongated hole extending in the X direction. [Explanation of symbols]

[0057] 10 Electronic equipment 11 Lid 12. Case 24 Cooling Module 25 Motherboard 25a CPU 25b GPU 25e Electronic Components 27 Heat Pipe 28 Heatsink 30 fans 30a 1st discharge port 30b 2nd discharge port 31 Metal Plate 31a One edge 36 First Vent 37 Second Vent 38 Third Vent 42~44 Distribution Channels

Claims

1. An electronic device, a housing having a first vent, a second vent, and a third vent located between the first vent and the second vent; a heating element mounted within the housing; a cooling module mounted in the housing and configured to cool the heat generating element; Equipped with The cooling module comprises: a pair of heat sinks, one of which is disposed facing the first vent hole and the other of which is disposed facing the second vent hole; a heat transport device that transports heat from the heat generating element to the heat sink; a pair of fans each having a first outlet capable of discharging air toward the heat sink, one of which is disposed facing one of the heat sinks and the other of which is disposed facing the other of the heat sinks; a metal plate disposed between the pair of fans with one edge facing the third air vent and capable of diffusing heat from the heat generating element; Equipped with The metal plate is a plurality of fins extending from the surface and aligned along the edge; a hole portion penetrating in the plate thickness direction; have An electronic device characterized by:

2. 10. The electronic device according to claim 1, the pair of fans each have a second outlet capable of discharging air toward the surface of the metal plate; The fins and the holes are disposed on a flow path of air flowing from the second outlet to the third vent. An electronic device characterized by:

3. 3. The electronic device according to claim 1, The hole portion is provided in plurality so as to be aligned along the one edge portion, the fin is a cut-up piece formed by cutting up a part of the metal plate, The hole portion is a cut-and-raised hole formed in a cut-and-raised portion of the fin. An electronic device characterized by:

4. 10. The electronic device according to claim 1, a substrate on which the heating element is mounted, A portion of the substrate vertically overlaps the fin and the hole. An electronic device characterized by:

5. 5. The electronic device according to claim 4, electronic components mounted on portions of the substrate that overlap the fins in the vertical direction, The fins stand upright from the surface of the metal plate opposite to the surface facing the substrate. An electronic device characterized by:

6. A cooling module mounted on an electronic device, A pair of heat sinks; a heat transport device connected to the heat sink; a pair of fans each having a first outlet capable of discharging air toward the heat sink, one of which is disposed facing one of the heat sinks and the other of which is disposed facing the other of the heat sinks; a metal plate disposed between the pair of fans; Equipped with The metal plate is a plurality of fins extending from the surface and aligned along one edge of the metal plate; a hole portion penetrating in the plate thickness direction; have A cooling module characterized by:

7. 7. The cooling module of claim 6, The pair of fans each have a second outlet that can discharge air toward the surface of the metal plate. A cooling module characterized by:

8. 8. The cooling module according to claim 6 or 7, The hole portion is provided in plurality so as to be aligned along the one edge portion, the fin is a cut-up piece formed by cutting up a part of the metal plate, The hole portion is a cut-and-raised hole formed in a cut-and-raised portion of the fin. A cooling module characterized by:

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