Door-opening detection sensor

Abstract

To provide a door-opening detection sensor that can improve the detection accuracy of a door-opening history.SOLUTION: A door-opening detection sensor detects the opening of a door that can be opened and closed relative to an object to be operated. The door-opening detection sensor includes a base material pasted across the object to be operated and the door, an antenna for wireless communication, an IC chip electrically connected to the antenna, and detection wiring electrically connected to the IC chip. The base material has a first adhesive portion and a second adhesive portion pasted to the door and the object to be operated by respective adhesive layers. The detection wiring is formed across the first adhesive portion and the second adhesive portion. The detection wiring irreversibly enters a low conductivity state when the first adhesive portion and the second adhesive portion separate from each other due to the door opening operation.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a door opening detection sensor. [Background technology]

[0002] A system has been proposed that uses an RFID tag to detect the open / closed state of a door (see, for example, Patent Document 1). This system includes an RFID tag installed on the side edge surface of the door and a reader that can communicate with the RFID tag. This system can determine whether the door is open or closed based on whether the reader can communicate with the RFID tag. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2017-218766 Summary of the Invention [Problem to be solved by the invention]

[0004] However, in this system, the accuracy of detecting the door opening history can be low.

[0005] An object of one aspect of the present invention is to provide a door-opening detection sensor that can improve the accuracy of detecting the door opening history. [Means for solving the problem]

[0006] One aspect of the present invention provides a door-opening detection sensor that detects the opening of a door that can be opened and closed relative to an object to be operated, comprising: a substrate that is attached across the object to be operated and the door; an antenna for wireless communication; an IC chip electrically connected to the antenna; and detection wiring electrically connected to the IC chip, wherein the substrate has a first adhesive portion and a second adhesive portion that are attached to the door and the object to be operated, respectively, by adhesive layers, and the detection wiring is formed across the first adhesive portion and the second adhesive portion, and the door-opening operation causes the first adhesive portion and the second adhesive portion to separate, thereby irreversibly entering a low conductivity state.

[0007] It is preferable that the detection wiring has a main wiring portion, at least a portion of which is provided on the first adhesive portion, at least a portion of which is formed between the first adhesive portion and the adhesive layer, and that the adhesive strength to the adhesive layer is stronger than the adhesive strength to the first adhesive portion, and that the main wiring portion breaks when it peels off from the first adhesive portion as the first adhesive portion peels off from the adhesive layer.

[0008] One of the first adhesive portion and the second adhesive portion may be attached to an end surface of the object to be moved, and the other of the first adhesive portion and the second adhesive portion may be attached to a main surface of the door.

[0009] The base material may further include a connecting portion connecting the first adhesive portion and the second adhesive portion, and the detection wiring may be disconnected and enter the low conductivity state when the connecting portion breaks due to separation between the first adhesive portion and the second adhesive portion.

[0010] The base material preferably has a reconnection restricting structure that restricts reconnection of the detection wiring that has become in the low conductivity state. [Effects of the Invention]

[0011] According to one aspect of the present invention, it is possible to provide a door-opening detection sensor that can improve the accuracy of detecting the door opening history. [Brief explanation of the drawings]

[0012] [Figure 1] 1 is a schematic diagram showing an installation state of a door-opening detection sensor according to a first embodiment. FIG. [Figure 2] FIG. 2 is a cross-sectional view showing an installation state of the door-opening detection sensor according to the first embodiment. [Figure 3] 5A to 5C are schematic diagrams showing the operation of the door open detection sensor according to the first embodiment. [Figure 4] 4A and 4B are cross-sectional views showing the operation of the door open detection sensor according to the first embodiment. [Figure 5] FIG. 10 is a schematic diagram showing an installation state of a door-opening detection sensor according to a second embodiment. [Figure 6] FIG. 10 is a cross-sectional view showing an installation state of a door-opening detection sensor according to a second embodiment. [Figure 7] 10A and 10B are schematic diagrams showing the operation of the door open detection sensor according to the second embodiment. [Figure 8] 10A and 10B are cross-sectional views showing the operation of the door open detection sensor according to the second embodiment. [Figure 9] FIG. 10 is a cross-sectional view of a door-opening detection sensor according to a third embodiment. [Figure 10] FIG. 10 is a schematic diagram showing an installation state of a door open detection sensor according to a third embodiment. [Figure 11] FIG. 10 is a cross-sectional view showing an installation state of a door-opening detection sensor according to a third embodiment. [Figure 12] 10A and 10B are schematic diagrams showing the operation of the door open detection sensor according to the third embodiment. [Figure 13] 10A and 10B are cross-sectional views showing the operation of the door open detection sensor according to the third embodiment. [Figure 14] 10A and 10B are schematic diagrams showing the operation of the door open detection sensor according to the third embodiment. [Figure 15] FIG. 10 is a cross-sectional view of a door-opening detection sensor according to a fourth embodiment. [Figure 16] FIG. 10 is a schematic diagram showing an installation state of a door-opening detection sensor according to a fourth embodiment. [Figure 17] FIG. 10 is a cross-sectional view showing an installation state of a door-opening detection sensor according to a fourth embodiment. [Figure 18]10A and 10B are schematic diagrams showing the operation of the door open detection sensor according to the fourth embodiment. [Figure 19] 10A and 10B are cross-sectional views showing the operation of the door open detection sensor according to the fourth embodiment. [Figure 20] 10A and 10B are schematic diagrams showing the operation of the door open detection sensor according to the fourth embodiment. [Figure 21] FIG. 10 is a plan view of a door open detection sensor according to a fifth embodiment. [Figure 22] FIG. 10 is a cross-sectional view showing an installation state of a door-opening detection sensor according to a fifth embodiment. [Figure 23] 10A and 10B are schematic diagrams showing the operation of the door open detection sensor according to the fifth embodiment. [Figure 24] FIG. 10 is a plan view of a first modified example of the substrate. [Figure 25] FIG. 10 is a plan view of a second modified example of the substrate. [Figure 26] FIG. 10 is a plan view of a third modified example of the base material. [Figure 27] FIG. 10 is a plan view of a fourth modified example of the substrate. [Figure 28] FIG. 10 is a schematic diagram showing an installation state of a door-opening detection sensor according to a sixth embodiment. [Figure 29] 13A and 13B are schematic diagrams showing the operation of the door open detection sensor according to the sixth embodiment. [Figure 30] FIG. 13 is a schematic diagram showing an installation state of a door-opening detection sensor according to a seventh embodiment. [Figure 31] 13 is a schematic diagram showing the operation of the door open detection sensor according to the seventh embodiment. FIG. [Figure 32] FIG. 13 is a plan view of a door-opening detection sensor according to an eighth embodiment. [Figure 33] 13 is a schematic diagram showing the operation of the door open detection sensor according to the eighth embodiment. FIG. [Figure 34] FIG. 13 is a schematic diagram showing an installation state of a door-opening detection sensor according to an eighth embodiment. [Figure 35] 13 is a schematic diagram showing the operation of the door open detection sensor according to the eighth embodiment. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0013] Hereinafter, the door open detection sensor of the embodiment will be specifically described with reference to the drawings.

[0014] [Door Open Detection Sensor] (First Embodiment) Fig. 1 is a schematic diagram showing an installation state of a door-opening detection sensor 100 according to the first embodiment. Fig. 2 is a cross-sectional view showing an installation state of the door-opening detection sensor 100. Fig. 3 is a schematic diagram showing the operation of the door-opening detection sensor 100. Fig. 4 is a cross-sectional view showing the operation of the door-opening detection sensor 100.

[0015] As shown in FIG. 1, a door open detection sensor 100 detects that a door 101 is open. The door-opening detection sensor 100 includes a base material 1, an antenna 2, an IC chip 3, a detection wiring 4, a first adhesive layer 5, a second adhesive layer 6, and a cover member 7. The door-opening detection sensor 100 is an RFID (Radio Frequency Identification) tag.

[0016] The door 101 (first door) is formed in a plate shape. The door 101 can be opened and closed relative to the moved object 102. The door 101 can rotate, for example, around a rotation axis provided at the second side end (the side end opposite to the first side end 101a). When the door 101 is closed relative to the moved object 102, the end surface 101b of the first side end 101a of the door 101 faces the end surface 102b of the first side end 102a of the moved object 102. The first main surface 101c (main surface) is one surface (the surface on the +Z side) of the door 101. The constituent material of the door 101 may be a non-metallic material (wood, resin, etc.) or a metal.

[0017] The moved object 102 is formed, for example, in a plate shape. The moved object 102 may be a door (second door) that can be opened and closed relative to the door 101. When the moved object 102 is a door, the moved object 102 is rotatable, for example, around a rotation axis provided at a second side edge (the side edge opposite to the first side edge 102a). The moved object 102 may be a door frame that surrounds the door 101. The moved object 102 may be a wall that constitutes a building. The first main surface 102c is one surface (the surface on the +Z side) of the moved object 102. When the door 101 is closed relative to the moved object 102, the first main surface 102c of the moved object 102 is flush with, for example, the first main surface 101c of the door 101. The constituent material of the moved object 102 may be a non-metallic material (wood, resin, etc.) or a metal.

[0018] The "main surface" refers to the widest surface of the plate-like body, specifically the front surface and back surface of the plate-like body. The end surface refers to the surface formed on the edge of the plate-like body, and is usually a surface perpendicular to the main surface.

[0019] The door 101 is opened by rotating it relative to the operated body 102. The door 101 is opened by rotating either the door 101 or the operated body 102, or both. To open the door 101, for example, only the door 101 may be rotated, or only the operated body 102 may be rotated, or both the door 101 and the operated body 102 may be rotated.

[0020] In FIG. 1, the door 101 is in a closed state relative to the operated object 102. In FIG. 1, the direction in which the operated object 102 and the door 101 in a closed state are aligned (the left-right direction in FIG. 1) is the X direction. One side of the X direction (the right side in FIG. 1) is the +X side. The direction opposite to the +X side is the -X side. The direction in which the first side ends 101a, 102a of the door 101 and the operated object 102 extend (the up-down direction in FIG. 1) is the Y direction. The Y direction is orthogonal to the X direction. One side of the Y direction (the upper side in FIG. 1) is the +Y side. The direction opposite to the +Y side is the -Y side.

[0021] The Z direction is perpendicular to the X and Y directions. The Z direction is the thickness direction of the operated body 102 and the door 101 in the closed state. One direction in the Z direction is the +Z side. The direction opposite to the +Z side is the -Z side. Viewing from the Z direction is called planar view. The up and down directions are tentatively defined according to Figure 1. The upper side (+Y side) in Figure 1 is the upper side. The lower side (-Y side) in Figure 1 is the lower side. The up and down directions defined here do not limit the orientation of the door open detection sensor when in use.

[0022] The door-opening detection sensor 100 is installed across the operated object 102 and the door 101 . The base material 1 is attached across the moved object 102 and the door 101. That is, the base material 1 is provided from one side of the moved object 102 to the other side of the door 101.

[0023] The substrate 1 includes a first substrate portion 11 and a second substrate portion 12 . The first substrate portion 11 is formed in a rectangular shape in a plan view. The first substrate portion 11 is formed in a rectangular shape having long sides along the X direction, for example. The second main surface 11b is the surface on the -Z side of the first substrate portion 11 (see FIG. 2).

[0024] As shown in FIG. 2, the first substrate portion 11 is attached to the first main surface 101c of the door 101 by a first adhesive layer 5 (adhesive layer). The first adhesive layer 5 is formed in a region including the end (first end 11c) on the +X side of the first substrate portion 11. The first attachment portion 13 is a region of the first substrate portion 11 that is attached to the door 101 by the first adhesive layer 5. The first attachment portion 13 is a partial region including the first end 11c of the first substrate portion 11.

[0025] 1, a partial region including the first end 11c of the first substrate portion 11 is positioned to overlap the door 101 in a plan view. A partial region including the end (second end 11d) on the -X side of the first substrate portion 11 is positioned to overlap the moved object 102. Therefore, the first substrate portion 11 is attached across the moved object 102 and the door 101. In other words, the first substrate portion 11 is provided from one side of the moved object 102 to the other side of the door 101. A portion including the second end 11d of the first substrate portion 11 is positioned to overlap the second substrate portion 12.

[0026] The second substrate portion 12 is formed in a rectangular shape in a plan view. The second substrate portion 12 is formed in a rectangular shape having long sides along the Y direction, for example. The second substrate portion 12 is a separate body from the first substrate portion 11. The first main surface 12a is the surface of the second substrate portion 12 on the +Z side.

[0027] 2, the second substrate portion 12 is attached to the first main surface 102c of the object to be moved 102 by a second adhesive layer 6 (adhesive layer). The second adhesive layer 6 is formed on the entire area of ​​the second substrate portion 12. The second attachment portion 14 is the area of ​​the second substrate portion 12 that is attached to the object to be moved 102 by the second adhesive layer 6. The second attachment portion 14 is, for example, the entire area of ​​the second substrate portion 12.

[0028] The substrate 1 (i.e., the first substrate portion 11 and the second substrate portion 12) is, for example, a resin substrate, a paper substrate, etc. Materials for the resin substrate include polyester resins such as polyethylene terephthalate (PET), polyolefin resins, polyethylene fluoride resins, polyamide resins, vinyl polymers, acrylic resins, polystyrene, polycarbonate, etc. It is desirable that the first substrate portion 11 and the second substrate portion 12 have flexibility.

[0029] 1, the antenna 2 is capable of wireless communication (contactless communication) with the outside. The antenna 2 is an antenna for wireless communication. The antenna 2 has two radiating portions 21 and 22. The antenna 2 is formed on the first main surface 12a of the second base portion 12.

[0030] The two radiating portions 21, 22 extend in directions away from each other along the longitudinal direction (Y direction) of the second base material portion 12. The two radiating portions 21, 22 are located symmetrically with respect to the center of the longitudinal direction of the second base material portion 12. The radiating portions 21, 22 gradually become wider in the extending direction (direction away from each other).

[0031] The antenna 2 can be formed from, for example, a conductive ink such as a polymer-type conductive ink or a silver ink composition. The antenna 2 may also be formed from, for example, a metal foil, a metal thin film formed by plating or the like, a metal thin film formed by metal vapor deposition or the like, a metal plate, or the like.

[0032] The IC chip 3 is not particularly limited as long as it is capable of writing and reading information contactlessly via the antenna 2. Examples of the IC chip 3 include a contactless IC tag, a contactless IC label, and a contactless IC card. The IC chip 3 is mounted on the first main surface 12a of the second substrate portion 12. The IC chip 3 is electrically connected to the antenna 2.

[0033] The detection wiring 4 includes a first wiring 31 , a second wiring 32 , and a connection wiring 33 . The first wiring 31 includes a first base wiring 34, a first conductive adhesive layer 35, and a first extension wiring 36. The second wiring 32 includes a second base wiring 37, a second conductive adhesive layer 38, and a second extension wiring 39.

[0034] The first base end wiring 34 and the second base end wiring 37 are formed on the first main surface 12a of the second substrate portion 12. The first base end wiring 34 and the second base end wiring 37 are referred to as the "base end wirings 34, 37." One end of the base end wirings 34, 37 is electrically connected to the IC chip 3. In a plan view, the base end wirings 34, 37 extend from the one end connected to the IC chip 3 in a direction approaching the first substrate portion 11 while moving away from each other.

[0035] The first conductive adhesive layer 35 and the second conductive adhesive layer 38 are formed between the first main surface 12a of the second base member 12 and the second main surface 11b of the first base member 11. The first conductive adhesive layer 35 and the second conductive adhesive layer 38 are spaced apart in the Y direction. The first conductive adhesive layer 35 and the second conductive adhesive layer 38 are referred to as "conductive adhesive layers 35, 38." The first base member 11 is attached to the second base member 12 via the conductive adhesive layers 35, 38. The conductive adhesive layers 35, 38 are formed of a conductive adhesive. The conductive adhesive layers 35, 38 contain a conductive material, such as a polymer-type conductive ink or metal powder.

[0036] The first conductive adhesive layer 35 is in contact with the tip end portion of the first base end wiring 34. The first conductive adhesive layer 35 is electrically connected to the first base end wiring 34. The second conductive adhesive layer 38 is in contact with the tip end portion of the second base end wiring 37. The second conductive adhesive layer 38 is electrically connected to the second base end wiring 37.

[0037] The first extension wiring 36 and the second extension wiring 39 are formed on the second main surface 11b of the first base member 11. The first extension wiring 36 and the second extension wiring 39 are referred to as "extension wirings 36, 39."

[0038] One end (the end on the -X side) of the first extension wiring 36 is in contact with the first conductive adhesive layer 35. The first extension wiring 36 is electrically connected to the first conductive adhesive layer 35. The first extension wiring 36 extends from the first conductive adhesive layer 35 to the +X side. The first extension wiring 36 is electrically connected to the first base end wiring 34 via the first conductive adhesive layer 35. One end (the end on the -X side) of the second extension wiring 39 is in contact with the second conductive adhesive layer 38. The second extension wiring 39 is electrically connected to the second conductive adhesive layer 38. The second extension wiring 39 extends from the second conductive adhesive layer 38 to the +X side. The second extension wiring 39 is electrically connected to the second base end wiring 37 via the second conductive adhesive layer 38.

[0039] The connection wiring 33 electrically connects the other end (the end on the +X side) of the first extension wiring 36 and the other end (the end on the +X side) of the second extension wiring 39. The connection wiring 33 is formed on the second main surface 11b of the first base member 11.

[0040] The connecting wire 33 and the portions including the other ends (ends on the +X side) of the extension wires 36 and 39 are formed on the first adhesive part 13. The detection wiring 4 includes the first wiring 31, the second wiring 32, and the connection wiring 33, and is therefore formed across the first adhesive part 13 and the second adhesive part .

[0041] The extension wires 36, 39 and the connection wires 33 can be formed from, for example, a conductive ink such as a polymer-type conductive ink or a silver ink composition. The extension wires 36, 39 and the connection wires 33 may also be formed from, for example, a metal foil, a metal thin film formed by plating or the like, or a metal thin film formed by metal vapor deposition or the like.

[0042] The connection wiring 33 and the portions including the other ends (ends on the +X side) of the extension wirings 36, 39 are provided on the first adhesive portion 13. The connection wiring 33 and the portions including the other ends (ends on the +X side) of the extension wirings 36, 39 are formed between the first adhesive portion 13 and the first adhesive layer 5. The extension wirings 36, 39 and the connection wiring 33 are examples of a "main wiring portion". It is sufficient that at least a portion of the main wiring portion (in this embodiment, the extension wirings 36, 39 and the connection wiring 33) is provided on the first adhesive portion. At least a portion of the main wiring portion is formed between the first adhesive portion 13 and the first adhesive layer 5. The entire length of the main wiring portion may be formed on the first adhesive portion. A main wiring portion that is not broken has sufficient conductivity (high conduction state).

[0043] The extension wires 36 and 39 and the connection wire 33 have stronger adhesive strength to the first adhesive layer 5 than to the first adhesive portion 13 .

[0044] As shown in FIG. 2, the first adhesive portion 13 of the first substrate portion 11 is attached to the first main surface 101c of the door 101 by a first adhesive layer 5. The second adhesive portion 14 of the second substrate portion 12 is attached to the first main surface 102c of the object to be moved 102 by a second adhesive layer 6. The first adhesive layer 5 and the second adhesive layer 6 are referred to as "adhesive layers 5, 6." The adhesive layers 5, 6 are formed of, for example, a known adhesive. The door-opening detection sensor 100 has the adhesive layers 5, 6, and can be attached to the surfaces of the object to be moved 102 and the door 101.

[0045] The cover member 7 covers a portion of the first main surface 12a of the second base material portion 12. The cover member 7 covers the antenna 2 and the IC chip 3. The cover member 7 also covers portions of the base wirings 34, 37. The cover member 7 is formed of, for example, resin, paper, etc. Examples of resins include polyester resins such as polyethylene terephthalate (PET), polyolefin resins, polyethylene fluoride resins, polyamide resins, vinyl polymers, acrylic resins, polystyrene, and polycarbonate. It is desirable that the cover member 7 be flexible.

[0046] If the door 101 is made of metal, a non-metallic spacer (not shown) may be provided between the adhesive layer 5 and the door 101 to ensure communication performance by keeping the door-opening detection sensor 100 a certain distance away from the door 101. Similarly, if the object to be moved 102 is made of metal, a non-metallic spacer (not shown) may be provided between the adhesive layer 6 and the object to be moved 102 to ensure communication performance by keeping the door-opening detection sensor 100 a certain distance away from the object to be moved 102. The spacer may be formed of, for example, a non-conductive resin. Similarly, in the following embodiments, a spacer may be provided between the adhesive layer 5 and the door 101. A spacer may be provided between the adhesive layer 6 and the object to be moved 102.

[0047] [Door open detection sensor operation] The operation of the door open detection sensor 100 will be described with reference to FIGS. 3 and 4, the door 101 is opened by rotating the operated object 102 in the +Z direction relative to the door 101. The rotation of the operated object 102 (opening operation of the door 101) causes the first adhesive portion 13 and the second adhesive portion 14 to move apart. "The first adhesive portion 13 and the second adhesive portion 14 move apart" means that at least one of the first adhesive portion 13 and the second adhesive portion 14 moves in a direction away from the other from a state in which the first adhesive portion 13 and the second adhesive portion 14 are attached to the door 101 and the operated object 102, respectively.

[0048] As described above, the extension wirings 36, 39 and the connection wiring 33 (see FIG. 1) have stronger adhesive strength to the first adhesive layer 5 than to the first adhesive portion 13. Therefore, when the first adhesive portion 13 peels off from the first adhesive layer 5 as the operated object 102 moves, parts of the extension wirings 36, 39 and the connection wiring 33 (see FIG. 1) peel off from the first adhesive portion 13 and remain on the first adhesive layer 5.

[0049] At this time, a portion including one end of the extension wiring 36, 39 is not in contact with the first adhesive layer 5 and is therefore not peeled off from the first base material 11, but remains on the first base material 11. As a result, the extension wiring 36, 39 is disconnected and enters a low conductivity state. It is preferable that the extension wiring 36, 39 enters a non-conductive state. The "low conductivity state" is a state in which the conductivity is lower (i.e., a state in which the electrical resistance is higher) than in the normal state (see Figures 1 and 2).

[0050] Because the first substrate portion 11 is flexible, the first substrate portion 11 that has peeled off from the first adhesive layer 5 is likely to bend. Therefore, even when the operated object 102 and the door 101 are closed, the first substrate portion 11 is unlikely to return to the same configuration as the installed state (see FIGS. 1 and 2) (a configuration in which the entire area of ​​the first adhesive portion 13 is in contact with the first adhesive layer 5). Therefore, reconnection of the extension wirings 36, 39 is unlikely to occur (i.e., it is unlikely to return to a high conductivity state). In this way, the first substrate portion 11 has a structure (reconnection restriction structure) that makes it difficult for reconnection to occur after the extension wirings 36, 39 have entered a low conductivity state. Therefore, it can be said that the extension wirings 36, 39 irreversibly enter a low conductivity state.

[0051] When the extension wirings 36, 39 are in a low conductivity state, the electrical resistance of the detection wiring 4 increases. This allows the door open detection sensor 100 to detect the opening history of the door 101. The door open detection sensor 100 can transmit the detection result to an external device (e.g., a reader / writer) by wireless communication via the antenna 2.

[0052] [Effects of the door opening detection sensor according to the embodiment] In the door-open detection sensor 100 of this embodiment, the first adhesive portion 13 and the second adhesive portion 14 are separated by the rotation of the operated body 102 (opening operation of the door 101), and the detection wiring 4 (more specifically, the extension wirings 36, 39) is irreversibly put into a low conduction state. Therefore, the opening history of the door 101 can be detected with high accuracy.

[0053] The first base material 11 is flexible. Since the first base material 11 is likely to bend when peeled off from the first adhesive layer 5 (see FIGS. 3 and 4), it can be said that the first base material 11 has a structure (reconnection restricting structure) that makes it difficult for the extension wirings 36, 39 to reconnect after they have entered a low conductivity state. Therefore, even after the door 101 is closed, it is possible to detect the opening history of the door 101.

[0054] In the door-opening detection sensor 100, as the first adhesive portion 13 peels off from the first adhesive layer 5, a part of the extension wirings 36, 39 (see FIG. 3) peels off from the first adhesive portion 13 and breaks. Because the extension wirings 36, 39 are broken, they are difficult to reconnect even when the door 101 is closed (i.e., they are difficult to return to a high conductivity state). Therefore, the opening history of the door 101 can be detected with high accuracy.

[0055] In the door opening detection sensor 100, the first substrate part 11 and the second substrate part 12 are separate bodies, so even if the first substrate part 11 is peeled off when the door 101 is opened, the second substrate part 12, the antenna 2 and the IC chip 3 can be reused while still attached to the object to be operated 102.

[0056] [Door Opening Detection Sensor] (Second Embodiment) Fig. 5 is a schematic diagram showing the installation state of the door-opening detection sensor 200 according to the second embodiment. Fig. 6 is a cross-sectional view showing the installation state of the door-opening detection sensor 200. Fig. 7 is a schematic diagram showing the operation of the door-opening detection sensor 200. Fig. 8 is a cross-sectional view showing the operation of the door-opening detection sensor 200. Components common to other embodiments are given the same reference numerals and descriptions thereof will be omitted.

[0057] As shown in FIG. 5, the door open detection sensor 200 includes a base material 201, an antenna 2, an IC chip 3, a detection wiring 204, a first adhesive layer 5, and a second adhesive layer 6. The open door detection sensor 200 differs from the open door detection sensor 100 (see FIG. 1) in that a base material 201 is used instead of the base material 1, and a detection wire 204 is used instead of the detection wire 4.

[0058] The door-opening detection sensor 200 is installed across the operated object 102 and the door 101. The base material 201 is attached across the operated object 102 and the door 101.

[0059] The substrate 201 includes a first substrate portion 211 and a second substrate portion 212 . The first base material portion 211 is formed in a rectangular shape in a plan view. The first base material portion 211 is formed in a rectangular shape having long sides along the X direction, for example. The second main surface 211b is the surface on the -Z side of the first base material portion 211 (see FIG. 6).

[0060] As shown in Fig. 6, the first base material portion 211 is attached to the first main surface 101c of the door 101 by a first adhesive layer 5. The first adhesive layer 5 is formed in an area including the end (first end 211c) of the first base material portion 211 on the +X side. The first attachment portion 13 is an area of ​​the first base material portion 211 that is attached to the door 101 by the first adhesive layer 5. The first attachment portion 13 is an area including the first end 211c of the first base material portion 211.

[0061] 5, a partial region including the first end 211c of the first substrate portion 211 is located at a position overlapping with the door 101 in a plan view. A partial region including the end on the -X side of the first substrate portion 211 is located at a position overlapping with the moved body 102 in a plan view. Therefore, the first substrate portion 211 is attached across the moved body 102 and the door 101. The first substrate portion 211 extends from the center of the second substrate portion 212 in the longitudinal direction to the +X side. The substrate 201 is T-shaped in a plan view.

[0062] The second substrate portion 212 is formed in a rectangular shape in a plan view. The second substrate portion 212 is formed in a rectangular shape having long sides along the Y direction, for example. The second substrate portion 212 is formed integrally with the first substrate portion 211. The second main surface 212b is the surface on the -Z side of the second substrate portion 212 (see FIG. 6).

[0063] 6, the second substrate portion 212 is attached to the first main surface 102c of the object to be moved 102 by the second adhesive layer 6. The second adhesive layer 6 is formed on the entire area of ​​the second substrate portion 212. The second attachment portion 14 is the area of ​​the second substrate portion 212 that is attached to the object to be moved 102 by the second adhesive layer 6. The second attachment portion 14 is, for example, the entire area of ​​the second substrate portion 212.

[0064] The substrate 201 (that is, the first substrate portion 211 and the second substrate portion 212) is, for example, a resin substrate, a paper substrate, etc. It is desirable that the first substrate portion 211 and the second substrate portion 212 have flexibility. The antenna 2 is formed on the second main surface 212 b of the second base material portion 212 .

[0065] As shown in FIG. 5, the detection wiring 204 includes a first wiring 231, a second wiring 232, and a connection wiring 33. One end of the first wiring 231 and one end of the second wiring 232 are electrically connected to the IC chip 3. The first wiring 231 and the second wiring 232 are formed on the second main surfaces 212b, 211b from the second substrate portion 212 to the first substrate portion 211. The first wiring 231 and the second wiring 232 formed on the first substrate portion 211 are parallel to each other. The first wiring 231 and the second wiring 232 formed on the first substrate portion 211 are formed with a gap between them. The first wiring 231 and the second wiring 232 are referred to as "wirings 231, 232." The connection wiring 33 electrically connects the +X side end of the first wiring 231 and the +X side end of the second wiring 232.

[0066] A portion including the −X side end of the wirings 231, 232 is formed on the second adhesive part 14. A portion including the +X side end of the wirings 231, 232 and the connection wiring 33 is formed on the first adhesive part 13. The detection wiring 204 has the first wiring 231, the second wiring 232 and the connection wiring 33, and is therefore formed across the first adhesive part 13 and the second adhesive part 14.

[0067] The connection wiring 33 and the portions including the +X side ends of the wirings 231, 232 are provided on the first adhesive portion 13. The connection wiring 33 and the portions including the +X side ends of the wirings 231, 232 are formed between the first adhesive portion 13 and the first adhesive layer 5. The connection wiring 33 and the portions including the +X side ends of the wirings 231, 232 are examples of a "main wiring portion". It is sufficient that at least a part of the main wiring portion is provided on the first adhesive portion 13. It is sufficient that at least a part of the main wiring portion is formed between the first adhesive portion 13 and the first adhesive layer 5.

[0068] The connection wiring 33 and the portions including the ends of the wirings 231 and 232 on the +X side have stronger adhesive strength to the first adhesive layer 5 than to the first attachment portion 13 .

[0069] 6, the first adhesive portion 13 is attached to the first main surface 101c of the door 101 by the first adhesive layer 5. The second adhesive portion 14 is attached to the first main surface 102c of the operated body 102 by the second adhesive layer 6.

[0070] [Door open detection sensor operation] 7 and 8, the door 101 is opened by rotating the operated object 102 in the +Z direction relative to the door 101. The rotation of the operated object 102 (opening operation of the door 101) causes the first adhesive portion 13 and the second adhesive portion 14 to move away from each other.

[0071] As described above, the adhesive strength of the parts of the wirings 231, 232 and the connection wiring 33 (see FIG. 5) to the first adhesive layer 5 is stronger than the adhesive strength to the first adhesive portion 13. Therefore, when the first adhesive portion 13 peels off from the first adhesive layer 5 as the operated body 102 moves, the parts of the wirings 231, 232 and the connection wiring 33 (see FIG. 5) peel off from the first adhesive portion 13 and remain on the first adhesive layer 5.

[0072] At this time, the other parts of the wirings 231, 232 are not in contact with the first adhesive layer 5 and are therefore not peeled off from the first base material 211, but remain on the first base material 211. As a result, the wirings 231, 232 are disconnected and enter a low conductivity state (for example, a non-conductive state).

[0073] Because the first base material portion 211 is flexible, the first base material portion 211 that has peeled off from the first adhesive layer 5 is likely to bend. Therefore, even when the operated body 102 and the door 101 are closed, the wirings 231, 232 are unlikely to reconnect. In this way, the first base material portion 211 has a structure (reconnection prevention structure) that makes it difficult for the wirings 231, 232 to reconnect after they have entered a low conductivity state. Therefore, it can be said that the wirings 231, 232 irreversibly enter a low conductivity state.

[0074] When the wiring 231, 232 enters a low conductivity state, the electrical resistance of the detection wiring 204 increases. This allows the door open detection sensor 200 to detect the opening history of the door 101. The door open detection sensor 200 can transmit the detection result to an external device (e.g., a reader / writer) by wireless communication via the antenna 2.

[0075] [Effects of the door opening detection sensor according to the embodiment] In the door-open detection sensor 200 of this embodiment, the first adhesive portion 13 and the second adhesive portion 14 are separated by the rotation of the operated body 102 (opening operation of the door 101), and the detection wiring 204 (more specifically, the wirings 231 and 232) is irreversibly put into a low conduction state. Therefore, the opening history of the door 101 can be detected with high accuracy.

[0076] The first base material 211 is flexible. Since the first base material 211 that has been peeled off from the first adhesive layer 5 is likely to bend (see FIGS. 7 and 8), it can be said that the first base material 211 has a structure (reconnection restricting structure) that makes it difficult for the wiring 231, 232 to reconnect after it has become in a low conduction state. Therefore, even after the door 101 has been closed, it is possible to detect the opening history of the door 101.

[0077] In the door-opening detection sensor 200, the wirings 231, 232 are separated from the first adhesive portion 13 and become disconnected as the first adhesive portion 13 is peeled off from the first adhesive layer 5. Because the wirings 231, 232 are disconnected, they are difficult to reconnect even when the door 101 is closed (i.e., they are difficult to return to a high conductivity state). Therefore, the opening history of the door 101 can be detected with high accuracy.

[0078] In the door opening detection sensor 200, the first substrate portion 211 and the second substrate portion 212 are integrally formed, so that the sensor can be easily installed on the door 101 and the operated object 102.

[0079] [Door Opening Detection Sensor] (Third Embodiment) Fig. 9 is a cross-sectional view of a door-opening detection sensor 300 according to the third embodiment. Fig. 10 is a schematic diagram showing an installation state of the door-opening detection sensor 300. Fig. 11 is a cross-sectional view showing an installation state of the door-opening detection sensor 300. Fig. 12 is a schematic diagram showing the operation of the door-opening detection sensor 300. Fig. 13 is a cross-sectional view showing the operation of the door-opening detection sensor 300. Fig. 14 is a schematic diagram showing the operation of the door-opening detection sensor 300. Configurations common to other embodiments are assigned the same reference numerals and descriptions thereof will be omitted.

[0080] As shown in Figure 9, the door opening detection sensor 300 includes a base material 201 (see Figure 6), an antenna 2, an IC chip 3, a detection wiring 204 (see Figure 6), a first adhesive layer 305, a second adhesive layer 6, and a cover member 307. The door-opening detection sensor 300 differs from the door-opening detection sensor 200 (see FIG. 6) in that a cover member 307 is provided and that a first adhesive layer 305 is used instead of the first adhesive layer 5.

[0081] The substrate 201 is, for example, a resin substrate, a paper substrate, etc. The substrate 201 is flexible. It is desirable that the substrate 201 (at least the first substrate portion 211) has bending elasticity. The antenna 2, the IC chip 3, and the detection wiring 204 are provided on the +Z side surface (first principal surfaces 211a, 212a) of the base material 201.

[0082] The cover member 307 has the same shape as the base material 201. The cover member 307 is, for example, a resin base material, a paper base material, or the like. The cover member 307 is flexible. The cover member 307 (at least the portion overlapping the first base material portion 211) may have bending elasticity.

[0083] The cover member 307 is placed on the +Z side surface (first principal surfaces 211a, 212a) of the base material 201. Therefore, the antenna 2, the IC chip 3, and the detection wiring 204 are sandwiched between the base material 201 and the cover member 307.

[0084] The cover member 307 has a weakened portion 308 formed at the midpoint in the longitudinal direction of the portion overlapping the first base material portion 211. The weakened portion 308 has a structure that reduces the tensile strength of the cover member 307. The weakened portion 308 is, for example, a half-cut portion or a thin-walled portion.

[0085] The first adhesive layer 305 is provided on the +Z side surface of the cover member 307. The first adhesive layer 305 is formed in a region including the tip of the cover member 307 (the tip of the portion overlapping the first base member 211). The second adhesive layer 6 is provided on the second main surface 212 b of the second base member 212 .

[0086] 10 and 11, the door-opening detection sensor 300 is installed across the operated object 102 and the door 101. The base material 201 is attached across the operated object 102 and the door 101.

[0087] The second adhesive portion 14 of the second base material portion 212 is attached to the first main surface 101c of the door 101 by the second adhesive layer 6. The first adhesive portion 13 of the first base material portion 211 is attached to the end surface 102b of the moved body 102 by the first adhesive layer 305. The end surface 102b of the moved body 102 is a surface that intersects with the first main surface 101c of the door 101 (for example, a surface perpendicular to the first main surface 101c). Therefore, the portion of the door opening detection sensor 300 that includes the first base material portion 211 is bent in the thickness direction.

[0088] The detection wiring 204 includes the first wiring 231, the second wiring 232, and the connection wiring 33, and is therefore formed across the first attachment part 13 and the second attachment part .

[0089] [Door open detection sensor operation] 12 and 13, the door 101 is opened by rotating the door 101 in the +Z direction relative to the operated body 102. The rotation of the door 101 (opening operation of the door 101) causes the first adhesive portion 13 and the second adhesive portion 14 to move away from each other.

[0090] When the first adhesive portion 13 and the second adhesive portion 14 are separated from each other, a tensile force acts on the portion including the first base material portion 211, causing the first base material portion 211 and the cover member 307 in this portion to break. As a result, the wiring 231, 232 is broken and becomes in a low conductivity state (for example, a non-conductive state). If the cover member 307 has a weakened portion 308, the cover member 307 is more likely to break at the weakened portion 308.

[0091] In the door-opening detection sensor 300, the first substrate portion 211 has bending elasticity, so the first substrate portion 211 does not easily return to its bent state (see FIG. 11). Therefore, as shown in FIG. 14, even when the door 101 is closed, the wirings 231, 232 do not easily reconnect (i.e., do not easily return to a high conductivity state). In this way, the first substrate portion 211 has a structure (reconnection-preventing structure) that makes it difficult for the wirings 231, 232 to reconnect after they have entered a low conductivity state. Therefore, it can be said that the wirings 231, 232 irreversibly enter a low conductivity state.

[0092] When the wiring 231, 232 enters a low conductivity state, the electrical resistance of the detection wiring 204 increases. This allows the door open detection sensor 300 to detect the opening history of the door 101. The door open detection sensor 300 can transmit the detection result to an external device (e.g., a reader / writer) by wireless communication via the antenna 2.

[0093] [Effects of the door opening detection sensor according to the embodiment] In the door-open detection sensor 300 of this embodiment, the first adhesive portion 13 and the second adhesive portion 14 are separated by the rotation of the operated body 102 (opening operation of the door 101), and the detection wiring 204 (more specifically, the wirings 231 and 232) is irreversibly put into a low conduction state. Therefore, the opening history of the door 101 can be detected with high accuracy.

[0094] Since the first base material portion 211 has bending elasticity, it can be said to have a structure (reconnection prevention structure) that makes it difficult for reconnection to occur after the wirings 231, 232 are in a low conduction state. Therefore, even after the door 101 is closed, it is possible to detect the opening history of the door 101.

[0095] [Door Opening Detection Sensor] (Fourth Embodiment) Fig. 15 is a cross-sectional view of a door-opening detection sensor 400 according to the fourth embodiment. Fig. 16 is a schematic diagram showing an installation state of the door-opening detection sensor 400. Fig. 17 is a cross-sectional view showing an installation state of the door-opening detection sensor 400. Fig. 18 is a schematic diagram showing the operation of the door-opening detection sensor 400. Fig. 19 is a cross-sectional view showing the operation of the door-opening detection sensor 400. Fig. 20 is a schematic diagram showing the operation of the door-opening detection sensor 400. Configurations common to other embodiments are assigned the same reference numerals and descriptions thereof will be omitted.

[0096] As shown in FIG. 15, the door opening detection sensor 400 includes a base material 201 (see FIG. 6), an antenna 2, an IC chip 3, a detection wiring 404, a first adhesive layer 405, a second adhesive layer 6, and a cover member 407.

[0097] The door-opening detection sensor 400 differs from the door-opening detection sensor 300 (see FIG. 9) in that a first adhesive layer 405 is used instead of the first adhesive layer 305, a detection wiring 404 is used instead of the detection wiring 204, and a cover member 407 is used instead of the cover member 307.

[0098] The detection wiring 404 (see FIG. 20) has a first wiring 231 and a second wiring 232. The detection wiring 404 differs from the detection wiring 204 (see FIG. 5) in that it does not have the connection wiring 33. The detection wiring 404 is formed across the first adhesive part 13 and the second adhesive part 14.

[0099] The cover member 407 differs from the cover member 307 (see FIG. 9) in that the cover member 407 has a shape in which the area including the tip (the tip of the portion overlapping the first base material portion 211) is cut away. Therefore, the portion including the tip of the wirings 231, 232 is outside the cover member 407.

[0100] The first adhesive layer 405 is a conductive adhesive layer. The first adhesive layer 405 covers portions including the tips of the wirings 231 and 232. The first wiring 231 and the second wiring 232 are electrically connected to each other by coming into contact with the first adhesive layer 405, which is a conductive adhesive layer.

[0101] 16 and 17, the door-opening detection sensor 400 is installed across the operated body 102 and the door 101. The base material 201 is attached across the operated body 102 and the door 101.

[0102] The second adhesive portion 14 of the second base material portion 212 is attached to the first main surface 101c of the door 101 by the second adhesive layer 6. The first adhesive portion 13 of the first base material portion 211 is attached to the end surface 102b of the operated body 102 by the first adhesive layer 405. The portion of the door opening detection sensor 400 including the first base material portion 211 is bent in the thickness direction.

[0103] [Door open detection sensor operation] 18 and 19, the door 101 is opened by rotating the door 101 in the +Z direction relative to the operated body 102. The rotation of the door 101 (opening operation of the door 101) causes the first adhesive portion 13 and the second adhesive portion 14 to move away from each other.

[0104] As the first adhesive portion 13 and the second adhesive portion 14 are separated from each other, a tensile force acts on the portion including the first base material portion 211, causing this portion to peel off from the first adhesive layer 405. Since the wirings 231 and 232 peel off from the first adhesive layer 405 together with the first base material portion 211, the wirings 231 and 232 are disconnected and enter a low conductivity state (for example, a non-conductive state).

[0105] In the door-open detection sensor 400, the first substrate portion 211 has bending elasticity, so the first substrate portion 211 does not easily return to its bent state (see FIG. 17). Therefore, as shown in FIG. 20, even when the door 101 is closed, the wirings 231, 232 do not easily reconnect (i.e., do not easily return to a high conductivity state). In this way, the first substrate portion 211 has a structure (reconnection-preventing structure) that makes it difficult for the wirings 231, 232 to reconnect after they have entered a low conductivity state. Therefore, it can be said that the wirings 231, 232 irreversibly enter a low conductivity state.

[0106] When the wiring 231, 232 enters a low conductivity state, the electrical resistance of the detection wiring 404 increases. This allows the door open detection sensor 400 to detect the opening history of the door 101. The door open detection sensor 400 can transmit the detection result to an external device (e.g., a reader / writer) by wireless communication via the antenna 2.

[0107] [Effects of the door opening detection sensor according to the embodiment] In the door-open detection sensor 400 of this embodiment, the first adhesive portion 13 and the second adhesive portion 14 are separated by the rotation of the operated body 102 (opening operation of the door 101), and the detection wiring 404 (more specifically, the wirings 231 and 232) is irreversibly put into a low conduction state. Therefore, the opening history of the door 101 can be detected with high accuracy.

[0108] Since the first base material portion 211 has bending elasticity, it can be said to have a structure (reconnection prevention structure) that makes it difficult for reconnection to occur after the wirings 231, 232 are in a low conduction state. Therefore, even after the door 101 is closed, it is possible to detect the opening history of the door 101.

[0109] [Door Opening Detection Sensor] (Fifth Embodiment) Fig. 21 is a plan view of a door-opening detection sensor 500 according to the fifth embodiment. Fig. 22 is a schematic diagram showing the installation state of the door-opening detection sensor 500. Fig. 23 is a schematic diagram showing the operation of the door-opening detection sensor 500. Configurations common to other embodiments are given the same reference numerals and descriptions thereof will be omitted.

[0110] As shown in FIG. 21, the door-opening detection sensor 500 includes a base material 501, an antenna 2, an IC chip 3, a detection wiring 204, a first adhesive layer 5, and a second adhesive layer 6.

[0111] The base material 501 includes a first base material portion 511 , a second base material portion 512 , and a connecting portion 513 . The first substrate portion 511 is formed in a rectangular shape in a plan view. The second substrate portion 512 is formed in a rectangular shape in a plan view. The connecting portion 513 connects the first substrate portion 511 and the second substrate portion 512. The width (dimension in the Y direction) of the connecting portion 513 is smaller than the widths of the substrate portions 511, 512. The first substrate portion 511, the second substrate portion 512, and the connecting portion 513 are, for example, formed integrally.

[0112] 22, the first base material portion 511 is attached to the first main surface 101c of the door 101 by the first adhesive layer 5. The first attachment portion 13 is a region of the first base material portion 511 that is attached to the door 101 by the first adhesive layer 5. The first attachment portion 13 is, for example, the entire region of the first base material portion 511.

[0113] The second substrate portion 512 is attached to the object to be moved 202 by the second adhesive layer 6. The second attachment portion 14 is the area of ​​the second substrate portion 512 that is attached to the object to be moved 202 by the second adhesive layer 6. The second attachment portion 14 is, for example, the entire area of ​​the second substrate portion 512. A portion of the second substrate portion 512 is attached to the inner surface 202b of the object to be moved 202.

[0114] Since the first substrate part 511 is attached to the door 101 and the second substrate part 512 is attached to the moved body 202, the substrate 501 is attached across the moved body 202 and the door 101.

[0115] The moved object 202 is, for example, a door frame. The moved object 202 is formed in a rectangular frame shape having, for example, two vertical frames arranged at a distance from each other on the left and right, an upper frame connecting the upper ends of the two vertical frames, and a lower frame connecting the lower ends of the two vertical frames. The inner surface 202b of the moved object 202 is, for example, the inner surface of the vertical frames. The inner surface 202b of the moved object 202 is, for example, perpendicular to the first main surface 101c of the door 101 in the closed state.

[0116] In this embodiment, a portion of the second substrate portion 512 is attached to the inner surface 202b of the moved object 202 (door frame), but the installation target of the door-opening detection sensor 500 relative to the door and the moved object is not particularly limited. The door-opening detection sensor 500 can also be installed on the door 101 and the moved object 102 (see FIG. 1). In this case, the second substrate portion 512 can be attached to the first main surface 102c (see FIG. 1) of the moved object 102. The first substrate portion 511 can be attached to the first main surface 101c of the door 101. In this way, the substrate 501 is attached across the first main surface 102c (see FIG. 1) of the moved object 102 and the first main surface 101c of the door 101.

[0117] The wires 231 and 232 of the detection wire 204 extend from the second substrate part 512 through the connecting part 513 to the first substrate part 511. Therefore, the detection wire 204 is formed across the first adhesive part 13 and the second adhesive part 14.

[0118] [Door open detection sensor operation] 22 and 23, the door 101 is opened by rotating the door 101 relative to the operated body 202. By rotating the door 101 (opening operation of the door 101), the first adhesive portion 13 and the second adhesive portion 14 are separated from each other.

[0119] When the first adhesive part 13 and the second adhesive part 14 are separated from each other, a tensile force acts on the connecting part 513, causing the connecting part 513 to break. As a result, the wirings 231 and 232 (see FIG. 21) are disconnected and become in a low conductivity state (for example, a non-conductive state).

[0120] In the open door detection sensor 500, the base material 501 has a connecting portion 513 that is narrower than the base material portions 511 and 512. Because the connecting portion 513 is narrow, it is prone to bending. Therefore, even when the door 101 is closed, the broken portions are unlikely to reconnect (i.e., are unlikely to return to a high conductivity state). In this way, the connecting portion 513 has a structure (reconnection restriction structure) that makes it difficult for the wirings 231 and 232 to reconnect after they have entered a low conductivity state. Therefore, it can be said that the wirings 231 and 232 irreversibly enter a low conductivity state.

[0121] When the wiring 231, 232 enters a low conductivity state, the electrical resistance of the detection wiring 204 increases. This allows the door open detection sensor 500 to detect the opening history of the door 101. The door open detection sensor 500 can transmit the detection result to an external device (e.g., a reader / writer) by wireless communication via the antenna 2.

[0122] [Effects of the door opening detection sensor according to the embodiment] In the door-open detection sensor 500 of this embodiment, the first adhesive portion 13 and the second adhesive portion 14 are separated by the opening operation of the door 101, and the detection wiring 204 (more specifically, the wirings 231 and 232) is irreversibly put into a low conduction state. Therefore, the opening history of the door 101 can be detected with high accuracy.

[0123] The base material 501 has a narrow connecting portion 513. Because the connecting portion 513 is narrow, it is prone to bend when broken. Therefore, it can be said that the structure has a reconnection prevention structure that makes it difficult for the wirings 231 and 232 to reconnect after they have entered a low conductivity state. Therefore, even after the door 101 has been closed, it is possible to detect the opening history of the door 101.

[0124] [Base material] (First modified example) FIG. 24 is a plan view of a base material 501A which is a first modified example of the base material 501. As shown in FIG. Base material 501A is formed in a rectangular shape (oblong shape) overall. V-shaped notch 502A is formed on one side edge of base material 501A. The portion whose width is narrowed by notch 502A is connecting portion 513A. The portion of base material 501A on the +X side of notch 502A is first base material portion 511A. The portion of base material 501A on the -X side of notch 502A is second base material portion 512A.

[0125] [Base material] (Second modified example) FIG. 25 is a plan view of a base material 501B which is a second modified example of the base material 501. As shown in FIG. Notches 502B are formed on one and the other side edges of the base material 501B. The notches 502B are slit-shaped along the width direction of the base material 501B. The two notches 502B are formed at positions facing each other. The portion whose width is narrowed by the notches 502B is a connecting portion 513B. The portion of the base material 501B on the +X side of the notches 502B is a first base material portion 511B. The portion of the base material 501B on the -X side of the notches 502B is a second base material portion 512B.

[0126] [Base material] (Third modified example) FIG. 26 is a plan view of a base material 501C which is a third modified example of the base material 501. As shown in FIG. A circular notch 502C is formed in the center of base material 501C. The portion whose width is narrowed by notch 502C is connecting portion 513C. The portion of base material 501C on the +X side of notch 502C is first base material portion 511C. The portion of base material 501C on the -X side of notch 502C is second base material portion 512C.

[0127] [Base material] (Fourth modified example) FIG. 27 is a plan view of a base material 501D which is a fourth modified example of the base material 501. As shown in FIG. Base material 501D includes a rectangular first base material portion 511D, a rectangular second base material portion 512D, and a connecting portion 513D. Connecting portion 513D is, for example, an adhesive layer. Connecting portion 513D connects an end portion on the -X side of first base material portion 511D to an end portion on the +X side of second base material portion 512D.

[0128] [Door Opening Detection Sensor] (Sixth Embodiment) Fig. 28 is a schematic diagram showing the installation state of the door-opening detection sensor 600 according to the sixth embodiment. Fig. 29 is a schematic diagram showing the operation of the door-opening detection sensor 600. The same reference numerals are used for the same components as in the other embodiments, and the description thereof will be omitted.

[0129] As shown in Figure 28, the door opening detection sensor 600 includes a base material 601, an antenna 2, an IC chip (not shown), detection wiring 404 (see Figure 20), a first adhesive layer 5, a second adhesive layer 6, a first connector 641, and a second connector 642.

[0130] The IC chip (not shown) may be provided, for example, inside the second connector 642. Since the second connector 642 is provided on the second base material portion 612, it can be said that the IC chip is provided on the second base material portion 612.

[0131] The substrate 601 includes a first substrate portion 611 , a second substrate portion 612 , and a connecting portion 613 . The first substrate portion 611 is formed in a rectangular shape in a plan view, and the second substrate portion 612 is formed in a rectangular shape in a plan view.

[0132] The connection portion 613 is a strip-shaped sheet. It electrically connects the first base material portion 611 and the second base material portion 612. The connection portion 613 is made of resin, paper, or the like. The connection portion 613 is flexible. For example, the connection portion 613 has bending elasticity.

[0133] The detection wiring 404 has a first wiring 231 and a second wiring 232. The first wiring 231 and the second wiring 232 are formed on one surface of the connection portion 613. The first wiring 231 and the second wiring 232 are parallel to each other. The first wiring 231 and the second wiring 232 are formed with a gap between them.

[0134] The first connector 641 is mounted on the first base material portion 611. One end (first end) of the connection portion 613 is detachably connected to the first connector 641. The first connector 641 electrically connects the first wiring 231 and the second wiring 232 at the one end of the connection portion 613.

[0135] The second connector 642 is mounted on the second base material portion 612. The other end (second end) of the connection portion 613 is detachably connected to the second connector 642. One end of the first wiring 231 and one end of the second wiring 232 are electrically connected to the IC chip in the second connector 642.

[0136] The first substrate portion 611 is attached to the first main surface 101c of the door 101 by the first adhesive layer 5. The first attachment portion 13 is a region of the first substrate portion 611 that is attached to the door 101 by the first adhesive layer 5. The second substrate portion 612 is attached to the first main surface 102c of the object to be moved 102 by the second adhesive layer 6. The second attachment portion 14 is a region of the second substrate portion 612 that is attached to the object to be moved 102 by the second adhesive layer 6.

[0137] Since the first substrate part 611 is attached to the door 101 and the second substrate part 612 is attached to the moved body 102, the substrate 601 is attached across the moved body 102 and the door 101.

[0138] [Door open detection sensor operation] 28 and 29, the door 101 is opened by rotating the door 101 relative to the operated body 102. By rotating the door 101 (opening operation of the door 101), the first adhesive part 13 and the second adhesive part 14 are separated from each other.

[0139] When the first adhesive portion 13 and the second adhesive portion 14 are separated from each other, a tensile force acts on the connection portion 613, causing the connection portion 613 to come off from the first connector 641. As a result, the wirings 231 and 232 are disconnected and enter a low conductivity state (for example, a non-conductive state).

[0140] In this embodiment, the wirings 231, 232 are put into a low conductivity state (non-conductive state) when the connection portion 613 is detached from the first connector 641, but the wirings 231, 232 may also be put into a low conductivity state (non-conductive state) when the connection portion 613 is detached from the second connector 642. In this way, in the open door detection sensor of the embodiment, the wirings 231, 232 may be put into a low conductivity state (non-conductive state) when the connection portion 613 is detached from at least one of the first connector 641 and the second connector 642.

[0141] The open door detection sensor 600 includes a first connector 641 and a second connector 642. Because alignment is required to connect the connectors and the connecting portions, the first connector 641 and the second connector 642 are difficult to reconnect once the connecting portion 613 is disconnected (i.e., difficult to return to a high conductivity state). In this way, the base material 601 has a structure (reconnection restriction structure) that makes it difficult for the wirings 231, 232 to reconnect after they enter a low conductivity state. Therefore, it can be said that the wirings 231, 232 irreversibly enter a low conductivity state.

[0142] When the wiring 231, 232 enters a low conductivity state, the electrical resistance of the detection wiring 404 increases. This allows the door open detection sensor 600 to detect the opening history of the door 101. The door open detection sensor 600 can transmit the detection result to an external device (e.g., a reader / writer) by wireless communication via the antenna 2.

[0143] [Effects of the door opening detection sensor according to the embodiment] In the door-open detection sensor 600 of this embodiment, the first adhesive portion 13 and the second adhesive portion 14 are separated by the opening operation of the door 101, and the detection wiring 404 (more specifically, the wiring 231, 232) is irreversibly put into a low conduction state. Therefore, the opening history of the door 101 can be detected with high accuracy.

[0144] The base material 601 has a connection portion 613 that can be connected to the first connector 641 and the second connector 642. It can be said that the door-open detection sensor 600 has a structure (reconnection-preventing structure) that makes it difficult for the wiring 231, 232 to be reconnected after it has entered a low conductivity state. Therefore, even after the door 101 has been closed, it can detect the opening history of the door 101.

[0145] [Door Opening Detection Sensor] (Seventh Embodiment) Fig. 30 is a schematic diagram showing the installation state of the door-opening detection sensor 700 according to the seventh embodiment. Fig. 31 is a schematic diagram showing the operation of the door-opening detection sensor 700. Components common to the other embodiments are given the same reference numerals and will not be described.

[0146] As shown in Figure 30, the door opening detection sensor 700 includes a base material 601, an antenna 2, an IC chip (not shown), a detection wiring 404 (see Figure 20), a first adhesive layer 405 (conductive adhesive layer), a first adhesive layer 5, a second adhesive layer 6, and a second connector 642.

[0147] The door opening detection sensor 700 is provided with a first adhesive layer 405 (see FIG. 15) instead of the first connector 641. The first adhesive layer 405 is a conductive adhesive layer. The first wiring 231 and the second wiring 232 are electrically connected to each other by coming into contact with the first adhesive layer 405, which is a conductive adhesive layer.

[0148] The first substrate portion 611 (first adhesive portion 13) is attached to the first main surface 101c of the door 101 by a first adhesive layer 5. The second substrate portion 612 (second adhesive portion 14) is attached to the first main surface 102c of the object to be moved 102 by a second adhesive layer 6.

[0149] Since the first substrate part 611 is attached to the door 101 and the second substrate part 612 is attached to the moved body 102, the substrate 601 is attached across the moved body 102 and the door 101.

[0150] [Door open detection sensor operation] 30 and 31, the door 101 is opened by rotating the door 101 relative to the operated body 102. By rotating the door 101 (opening operation of the door 101), the first adhesive part 13 and the second adhesive part 14 are separated from each other.

[0151] When the first adhesive portion 13 and the second adhesive portion 14 are separated from each other, a tensile force acts on the connection portion 613, causing the connection portion 613 to peel off from the first adhesive layer 405. The portions of the wirings 231, 232 that were attached to the first adhesive layer 405 remain on the first adhesive layer 405, and the wirings 231, 232 are therefore disconnected and enter a low conductivity state (for example, a non-conductive state).

[0152] In the open door detection sensor 700, the connecting portion 613 has flexibility and bending elasticity, so when it peels off from the first adhesive layer 405, it is unlikely to return to the same configuration (in contact with the entire area of ​​the first adhesive layer 405) as in the installed state (see FIG. 30). In this way, the connecting portion 613 has a structure (reconnection prevention structure) that makes it difficult for the wirings 231, 232 to reconnect after they have entered a low conductivity state. Therefore, it can be said that the wirings 231, 232 irreversibly enter a low conductivity state.

[0153] When the wiring 231, 232 enters a low conductivity state, the electrical resistance of the detection wiring 404 increases. This allows the door open detection sensor 700 to detect the opening history of the door 101. The door open detection sensor 700 can transmit the detection result to an external device (e.g., a reader / writer) by wireless communication via the antenna 2.

[0154] [Effects of the door opening detection sensor according to the embodiment] In the door-open detection sensor 700 of this embodiment, the first adhesive portion 13 and the second adhesive portion 14 are separated by the opening operation of the door 101, and the detection wiring 404 (more specifically, the wiring 231, 232) is irreversibly put into a low conduction state. Therefore, the opening history of the door 101 can be detected with high accuracy.

[0155] Since the connection part 613 has bending elasticity, it can be said to have a structure (reconnection prevention structure) that makes it difficult for reconnection to occur after the wirings 231, 232 are in a low conduction state. Therefore, even after the door 101 is closed, it is possible to detect the opening history of the door 101.

[0156] [Door Opening Detection Sensor] (Eighth Embodiment) Fig. 32 is a plan view of a door-opening detection sensor 800 according to the eighth embodiment. Fig. 33 is a schematic diagram showing the operation of the door-opening detection sensor 800. Fig. 34 is a schematic diagram showing the installation state of the door-opening detection sensor 800. Fig. 35 is a schematic diagram showing the operation of the door-opening detection sensor 800. Configurations common to other embodiments are given the same reference numerals and descriptions thereof will be omitted.

[0157] As shown in FIG. 32, the door open detection sensor 800 includes a base material 801, an antenna 2, an IC chip 3, a detection wiring 804, a first adhesive layer 5, and a second adhesive layer 6.

[0158] The substrate 801 includes a first substrate portion 811 and a second substrate portion 812 . The first substrate portion 811 is formed in a rectangular shape in a plan view. The second substrate portion 812 is formed in a rectangular shape in a plan view. The first substrate portion 811 and the second substrate portion 812 are formed integrally.

[0159] The detection wiring 804 is formed in a loop shape. The detection wiring 804 has a stronger adhesive strength to the first adhesive layer 5 than to the first base material portion 811. The antenna 2 has a weaker adhesive strength to the second adhesive layer 6 than to the second base material portion 812.

[0160] As shown in FIGS. 33 and 34, the first substrate part 811 and the second substrate part 812 can be folded in half at the boundary line 813 so that the detection wiring 804 faces outward.

[0161] 34, the first base material portion 811 is attached to the end surface 101b of the door 101 by the first adhesive layer 5. The first attachment portion 13 is a region of the first base material portion 811 that is attached to the door 101 by the first adhesive layer 5.

[0162] The second base material portion 812 is attached to the end surface 102b of the object to be moved 102 by the second adhesive layer 6. The second attachment portion 14 is a region of the second base material portion 812 that is attached to the object to be moved 102 by the second adhesive layer 6.

[0163] It is necessary that the second substrate portion 812 does not peel off from the object to be moved 102 when the first adhesive portion 13 and the second adhesive portion 14 are separated. Examples of a structure that prevents the second substrate portion 812 from peeling off from the object to be moved 102 include making the area of ​​the second adhesive layer 6 larger than that of the first adhesive layer 5, and making the adhesive strength of the second adhesive layer 6 to the end face 102b stronger than the adhesive strength of the first adhesive layer 5 to the end face 101b.

[0164] Since the first substrate part 811 is attached to the door 101 and the second substrate part 812 is attached to the moved body 102, the substrate 801 is attached across the moved body 102 and the door 101.

[0165] The door-opening detection sensor 800 can be installed so that the portion including the boundary line 813 protrudes from the first main surfaces 101c and 102c.

[0166] [Door open detection sensor operation] 34 and 35, the door 101 is opened by rotating the door 101 relative to the operated body 102. By rotating the door 101 (opening operation of the door 101), the first adhesive part 13 and the second adhesive part 14 are separated from each other.

[0167] As the first adhesive portion 13 and the second adhesive portion 14 are separated from each other, a part of the detection wiring 804 is peeled off from the first base material portion 811 together with the first adhesive layer 5. As a result, the detection wiring 804 is disconnected and enters a low conductivity state (for example, a non-conductive state).

[0168] When the detection wiring 804 is in a low conductivity state, the electrical resistance of the detection wiring 804 increases. This allows the door open detection sensor 800 to detect the opening history of the door 101. The door open detection sensor 800 can transmit the detection result to an external device (e.g., a reader / writer) by wireless communication via the antenna 2.

[0169] [Effects of the door opening detection sensor according to the embodiment] In the door-open detection sensor 800 of this embodiment, the first adhesive portion 13 and the second adhesive portion 14 are separated by the opening operation of the door 101, and the detection wiring 804 is irreversibly put into a low conduction state. Therefore, the opening history of the door 101 can be detected with high accuracy.

[0170] The above describes an embodiment of the present invention, but each configuration and their combination in the embodiment is an example, and additions, omissions, substitutions, and other modifications of the configuration are possible within the scope that does not deviate from the spirit of the present invention. 11, the first adhesive portion 13 is attached to the end surface 102b of the operated object 102, and the second adhesive portion 14 is attached to the first main surface 101c of the door 101, but the installation form of the door opening detection sensor of the embodiment is not limited to this. For example, the first adhesive portion 13 may be attached to the first main surface 102c, and the second adhesive portion 14 may be attached to the end surface 101b. In this way, the door opening detection sensor of the embodiment may have one of the first adhesive portion and the second adhesive portion attached to the end surface of the operated object, and the other of the first adhesive portion and the second adhesive portion attached to a main surface (e.g., the first main surface) of the door.

[0171] The antenna 2 in the door-opening detection sensor 100 shown in FIG. 1 has radiating portions 21 and 22, but the shape of the antenna is not particularly limited. [Explanation of symbols]

[0172] 1,201,501,501A,501B,501C,501D,601,801...base material, 2...antenna, 3...IC chip, 4,204,404,804...detection wiring, 5,305,405...first adhesive layer (adhesive layer), 6...second adhesive layer (adhesive layer), 13...first adhesive portion, 14...second adhesive portion, 36...first extension wiring (main wiring portion), 39...second extension wiring (main wiring portion), 100,200,300,400,500,600,700,800...door opening detection sensor, 101...door, 101c...first main surface (main surface), 102,202...operated body, 102b...end surface, 231...first wiring (main wiring portion), 232...second wiring (main wiring portion).

Claims

1. A door open detection sensor that detects the opening of a door that can be opened and closed relative to an operated object, a base material attached across the operated body and the door; an antenna for wireless communication; an IC chip electrically connected to the antenna; a detection wiring electrically connected to the IC chip; the base material has a first adhesive portion and a second adhesive portion that are attached to the door and the object to be moved by adhesive layers, respectively; the detection wiring is formed across the first adhesive portion and the second adhesive portion, and is irreversibly brought into a low conduction state when the first adhesive portion and the second adhesive portion are separated by an opening operation of the door; Door open detection sensor.

2. the detection wiring has a main wiring portion, at least a portion of which is provided on the first attachment portion, At least a part of the main wiring portion is formed between the first attachment portion and the adhesive layer, and the adhesive strength to the adhesive layer is stronger than the adhesive strength to the first attachment portion; the main wiring portion is separated from the first adhesive portion as the first adhesive portion is separated from the adhesive layer, thereby causing a disconnection. The door opening detection sensor according to claim 1.

3. one of the first adhesive portion and the second adhesive portion is attached to an end surface of the object to be moved, The other of the first adhesive portion and the second adhesive portion is attached to the main surface of the door. The door opening detection sensor according to claim 1.

4. the base material further includes a connecting portion that connects the first adhesive portion and the second adhesive portion, the detection wiring is disconnected and enters the low conduction state when the first adhesive portion and the second adhesive portion are separated and the connecting portion is broken. The door opening detection sensor according to claim 1.

5. the substrate has a reconnection prevention structure that prevents the detection wiring from being reconnected when the detection wiring is in the low conductivity state. The door opening detection sensor according to claim 1.

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