Polyamic acid, polyimide, resin film, metal-clad laminate, circuit board, electronic device, and electronic equipment

Abstract

To provide a polyimide having a sufficiently low coefficient of moisture absorption in a use environment and a sufficiently low dielectric loss tangent in a high frequency band, and a resin film using the same.SOLUTION: The polyamic acid contains a tetracarboxylic acid residue derived from a tetracarboxylic dianhydride component and a diamine residue derived from a diamine component, wherein the diamine residue derived from a dimer acid type diamine in which two terminal carboxylic acid groups of a dimer acid are substituted with a primary aminomethyl group or an amino group is contained in an amount of 20 mol% or more based on the total diamine residue, and the tetracarboxylic acid residue derived from a tetracarboxylic dianhydride represented by the following general formula (1) is contained in an amount of 25 mol% or more based on the total tetracarboxylic acid residue.SELECTED DRAWING: None

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