Piezoelectric vibration device, mold piezoelectric vibration device and method for manufacturing piezoelectric vibration device

Abstract

To provide: a piezoelectric vibration device capable of controlling a crawl into a through hole formed in a second sealing member of filler metal for connecting an external terminal with the mounting pad of a circuit board; a mold piezoelectric vibration device; and a method for manufacturing the piezoelectric vibration device.SOLUTION: A second sealing member 30 includes a first through hole 161 penetrated from a first main surface 301 to a second main surface 302 and a resin member 161d provided in the first through hole 161 and closing the first through hole 161. The first through hole 161 includes a conductive electrode 161c on the inner wall surface; the conductive electrode 161c includes a nickel metal layer 161c2 and an Au metal layer 161c3 having wettability to filler metal 7 higher than that of the nickel metal layer 161c2; the Au metal layer 161c3 is not directly connected with an external terminal 32a; and a crystal oscillator 100 has a second main surface side end surface 161c4 covered with the resin member 161d.SELECTED DRAWING: Figure 8

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