Planarizing method, planarizing system, and method of manufacturing article

Abstract

To provide a method for planarizing a surface in semiconductor manufacturing.SOLUTION: A method comprises the steps of: positioning a substrate with drops of formable material underneath a chuck assembly; heating a superstrate held by a superstrate chuck by irradiating a photothermal coating layer on a surface of the superstrate; heating and planarizing the formable material by contacting the heated superstrate with the formable material; curing the formable material; separating the superstrate from the cured layer; and baking the cured layer.SELECTED DRAWING: Figure 7

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