Electronic device

Abstract

To provide an electronic device capable of shortening a development time and dealing with large current and high breakdown voltage.SOLUTION: An electronic device S100 includes a first electronic component 10, and an adapter 30 having a housing portion 35 for housing the first electronic component 10 formed therein. The adapter 30 has: an adapter body 31 having a first surface 31a and a second surface 31b opposite the first surface 31a in a thickness direction of the adapter 30; and a conductive post 38 penetrating the adapter body 31 from the first surface 31a to the second surface 31b. The housing portion 35 is formed as a recess on the first surface 31a, and a mounting portion P1 for mounting the second electronic component 20 is formed on the second surface 31b.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to electronic devices. [Background technology]

[0002] Conventionally, electronic devices have been known in which multiple electronic components are molded with resin and packaged (see, for example, Patent Document 1). The molded electronic components are electrically connected to a circuit pattern of a substrate on which the electronic device is mounted, via external terminals formed on the bottom surface of the electronic device. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2018-018867 Summary of the Invention [Problem to be solved by the invention]

[0004] In conventional configurations, molded electronic components are connected to external circuit patterns through the external terminals of the electronic device, which means that each time an electronic device is developed, it is necessary to design the circuit configuration inside the package and evaluate its performance, which causes a long development period.On the other hand, in recent years, there has been a demand for electrical devices that can handle large currents and high voltages.

[0005] The present invention has been made in view of these points, and has as its object to provide an electric device that can shorten the development period and can handle large currents and high withstand voltages. [Means for solving the problem]

[0006] An electronic device according to one embodiment of the present invention for solving the above problem comprises a first electronic component and an adapter having a housing portion for housing the first electronic component, the adapter having an adapter body having a first surface and a second surface opposite the first surface in the thickness direction of the adapter, and a conductive post penetrating the adapter body from the first surface to the second surface, the housing portion being formed as a recess on the first surface, and a mounting portion on the second surface on which a second electronic component is mounted.

[0007] The conductive post may include a first conductive post and a second conductive post provided on the opposite side of the first conductive post with the accommodating section therebetween, and the second electronic component mounted on the mounting section may be electrically connected to the first conductive post and the second conductive post.

[0008] The conductive posts may include a first conductive post and a second conductive post provided on the opposite side of the first conductive post with the accommodating portion therebetween, and the adapter body may be divided into a plurality of constituent members, the plurality of constituent members including a first member on which the first conductive post is provided and a second member on which the second conductive post is provided, the first member having a first thick portion where the first conductive post is provided and a first extending portion extending from the first thick portion toward the second member, the second member having a second thick portion where the second conductive post is provided and a second extending portion extending from the second thick portion toward the first member, the first extending portion and the second extending portion extending to cover the first electronic component, and a gap may be formed between the first extending portion and the second extending portion when the electronic device is assembled.

[0009] The gap may extend from one end surface to the other end surface of the adapter body, forming a heat dissipation path through which air can flow.

[0010] The heat dissipation path may face a part of an outer surface of the second electronic component.

[0011] The adapter may further have at least one of a first protruding electrode portion formed to protrude from the first conductive post toward the second conductive post and exposed to the second surface in the mounting portion, and a second protruding electrode portion formed to protrude from the second conductive post toward the first conductive post and exposed to the second surface in the mounting portion.

[0012] The adapter may further have another mounting portion on the second surface on which a third electronic component is mounted, the third electronic component having electrode portions on both ends, the distance between the electrode portions being shorter than the distance between the electrode portions of the second electronic component.

[0013] The adapter may further include a connection electrode portion extending from the conductive post toward a side end surface of the adapter body and exposed at the side end surface. [Effects of the Invention]

[0014] The present invention has the effect of shortening the development period and providing an electric device that can handle large currents and high voltages. [Brief explanation of the drawings]

[0015] [Figure 1] 1 is a diagram illustrating an electronic device according to a first embodiment. [Figure 2] FIG. 2 is a diagram illustrating the electronic device of FIG. [Figure 3] FIG. 10 is a diagram illustrating an electronic device according to a second embodiment. [Figure 4] FIG. 4 is a diagram showing the electronic device of FIG. 3 in an exploded state. [Figure 5] FIG. 10 is a diagram illustrating an electronic device according to a third embodiment. [Figure 6] FIG. 10 is a diagram showing a modified example of the third embodiment. [Figure 7] FIG. 10 is a diagram illustrating an electronic device according to a fourth embodiment. [Figure 8] FIG. 8 is a cross-sectional view taken along line BB in FIG. [Figure 9] FIG. 10 is a diagram showing an electronic device according to a modified example of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0016] First Embodiment Fig. 1 is a diagram showing an electronic device of a first embodiment, Fig. 1(a) is a side view, and Fig. 1(b) is a cross-sectional view taken along line AA in Fig. 2. Fig. 2 is a diagram showing the electronic device of Fig. 1, Fig. 2(a) is a plan view, and Fig. 2(b) is a bottom view.

[0017] In the following description, terms such as up, down, left, right, front, and rear are used to indicate directions according to the orientation of objects depicted in the drawings, but these terms are not intended to limit the present invention. The up and down directions correspond to the thickness direction of the electronic device and the adapter.

[0018] The electronic device S100 is a single packaged device, and includes a first electronic component 10, a second electronic component 20, and an adapter 30.

[0019] The first electronic component 10 is any electronic component, and in this embodiment, as an example, it is a DFN (Dual-Flat No-Leads) type component. The first electronic component 10 has a structure in which a semiconductor chip is molded with resin. As an example, the first electronic component 10 has a rectangular parallelepiped shape, and has a rectangular outline shape in a plan view as shown in FIG. 2(b). The first electronic component 10 is not limited to a specific thickness, but as an example, it is 1 mm or less, specifically, for example, 0.7 mm or less. A plurality of terminals 11 are formed on the underside of the first electronic component 10.

[0020] The terminals 11 are formed of a conductive material and are electrically connected to the internal semiconductor chip. The terminals 11 are exposed on the bottom and side surfaces of the first electronic component 10. The terminals 11 are soldered to a predetermined printed circuit board, for example. In this embodiment, the first electronic component 10 forms part of the outer shape of the electronic device S100, and therefore it can also be said that the terminals 11 are exposed on the bottom and side surfaces of the electronic device S100.

[0021] The second electronic component 20 is disposed on the upper surface of the adapter 30. The second electronic component 20 may be any electronic component such as an inductor, a capacitor, a resistor, or a semiconductor device, but in this embodiment, it is a coil (chip inductor) as an example. The second electronic component 20 has a main body 21 and a pair of electrodes 22. The use of the electronic device S100 is not particularly limited, but when a semiconductor chip including a transistor that switches current is built into the electronic device S100, a small DC / DC converter can be configured by mounting such a chip inductor.

[0022] The adapter 30 is a member to which the first electronic component 10 and the second electronic component 20 are fixed. The adapter 30 has, for example, a substantially rectangular parallelepiped outer shape. The adapter 30 has an adapter body 31 and conductive posts 38.

[0023] 1 and 2, the adapter body 31 has a first surface 31a which is the lower surface, a second surface 31b which is the upper surface, a front surface 31c, a rear surface 31d, a first side surface 31e, and a second side surface 31f. The second surface 31b is the surface opposite to the first surface 31a in the thickness direction of the adapter 30.

[0024] A storage section 35 is formed on the first surface 31a of the adapter 30. The storage section 35 is a portion that stores the first electronic component 10. Specifically, as shown in FIGS. 1(b) and 2(b), the storage section 35 is a recess that has a rectangular cross section in the thickness direction of the electronic device S100 and extends linearly from the front surface 31c to the back surface 31d. As one example, the storage section 35 is formed to a depth such that, when the first electronic component 10 is placed inside, the bottom surface of the first electronic component 10 does not protrude from the first surface 31a.

[0025] The accommodation portion 35 can be formed by any processing step, and as an example, may be formed by making cuts in the first surface 31a of the adapter body 31 using a dicer.

[0026] In this embodiment, the accommodation portion 35 is a recess that connects the front surface 31c and the back surface 31d, but the accommodation portion 35 may also be a recess that is carved from the first surface 31a and is not exposed on any of the front surface 31c, the back surface 31d, the first side surface 31e, and the second side surface 31f of the adapter body 31. Any manufacturing method may be used to form such a recess, and the recess may be formed, for example, using a mold or by machining using an end mill or the like.

[0027] 1(b), a mounting portion P1 on which the second electronic component 20 is mounted is formed on the second surface 31b. The mounting portion P1 is an area that includes an area on which the second electronic component 20 is placed and the upper surfaces of the two conductive posts 38.

[0028] The conductive posts 38 are conductive members that penetrate the adapter body 31. The conductive posts 38 are made of copper, for example. In this embodiment, a first conductive post 38-1 and a second conductive post 38-2 are provided as the conductive posts 38. The first conductive post 38-1 is provided on the left side of FIG. 1, and the second conductive post 38-2 is provided on the right side of FIG. 1, i.e., on the opposite side of the first conductive post 38-1 with the receiving portion 35 interposed therebetween. Because the first conductive post 38-1 and the second conductive post 38-2 have the same structure, they will hereinafter be described simply as conductive posts 38 without any distinction between them.

[0029] The conductive posts 38 are formed to penetrate from the first surface 31a to the second surface 31b of the adapter body 31. The upper surfaces of the conductive posts 38 are exposed on the second surface 31b, and the lower surfaces of the conductive posts 38 are exposed on the first surface 31a. The upper surfaces of the conductive posts 38 function as lands for mounting the second electronic component 20. The lower surfaces of the conductive posts 38 are electrically connected to the circuit pattern of a predetermined substrate.

[0030] In this embodiment, each electrode 22 of the second electronic component 20 is electrically connected to each conductive post 38. The electrodes 22 and the conductive posts 38 may be electrically connected by any means, but in this embodiment, the connection is made by solder, for example.

[0031] The horizontal cross-sectional shape of the conductive post 38 may be any shape, such as a rectangle, a polygon, or a circle, but in this example it is a rectangle.

[0032] As can be seen from FIG. 2 , the conductive posts 38 are embedded inside the adapter body 31. The conductive posts 38 are not exposed on any of the front surface 31c, the back surface 31d, the first side surface 31e, and the second side surface 31f. Because the conductive posts 38 are not exposed on the side surfaces of the electronic device S100, signals flowing through the conductive posts 38 are unlikely to appear on the side surfaces of the electronic device S100. Therefore, even if another electronic device is placed near the electronic device S100, the current flowing through the conductive posts 38 has little effect on the other electronic device S100. This configuration has the advantage of enabling the size of an apparatus in which the electronic device S100 is mounted to be reduced.

[0033] The cross-sectional area of ​​the conductive post 38 in the horizontal direction, i.e., the direction parallel to the first surface 31a or the second surface 31b, is relatively large. The horizontal cross-sectional area of ​​the conductive post 38 is, for example, 5% or more, preferably 10% or more, of the area of ​​the adapter body 31 in a plan view. The front-rear dimension of the conductive post 38 is, for example, ¼ or more, preferably ⅓ or more, of the front-rear dimension of the adapter body 31. The left-right (width) dimension of the conductive post 38 is, for example, 1 / 10 or more of the left-right (width) dimension of the adapter body 31. With this configuration, the cross-sectional area of ​​the conductive post 38 is large and the current capacity of the conductive post 38 is large, allowing the second electronic component 20 through which a large current flows to be mounted on the adapter 30. Furthermore, the conductive post 38 has a higher thermal conductivity than the resin material, and therefore the conductive post 38 functions as a heat dissipation member, effectively dissipating heat from the electronic device S100. In the configuration of this embodiment, when the electronic device S100 is assembled, the upper surfaces of the conductive posts 38 are partially exposed on the upper surface of the adapter 30, thereby enabling effective heat dissipation. In addition, the heat from the conductive posts 38 can also be dissipated to the outside of the device through the pattern of the substrate on which the electronic device S100 is mounted.

[0034] From the viewpoint of being able to pass a large current through the conductive post 38, it is preferable that the horizontal area of ​​the conductive post 38 is formed large as described above, but the present invention is not limited to this, and the horizontal cross-sectional area of ​​the conductive post 38 may be smaller than the above range.

[0035] (Functions of the electronic device S100) In the electronic device S100 configured as described above, the lower surfaces of the conductive posts 38 and the plurality of terminals 11 function as external terminals of the electronic device S100. That is, the lower surfaces of the conductive posts 38 and the plurality of terminals 11 are electrically connected to a circuit pattern of a predetermined substrate, thereby mounting the electronic device S100 on the predetermined substrate.

[0036] (Effects of the Electronic Device S100) According to the electronic device S100 of this embodiment, the terminals 11 of the first electronic component 10 housed in the housing portion 35 of the adapter body 31 can be used as external terminals of the electronic device S100 as they are, eliminating the need to build in a connection circuit to connect the first electronic component 10 and the external terminals of the electronic device S100, as is the case with conventional structures in which electronic components are molded. Therefore, for example, it is possible to use an existing first electronic component 10 as is, thereby shortening the development period for the electronic device S100.

[0037] Furthermore, according to the configuration of this embodiment, the cross-sectional area (meaning the cross-sectional area in the horizontal direction) of the conductive posts 38 is large, so that in a configuration in which the second electronic component 20 is electrically connected to the first conductive post 38-1 and the second conductive post 38-2, it is possible to accommodate the second electronic component 20 with a large current and high withstand voltage. Furthermore, the conductive posts 38 have a higher thermal conductivity than resin materials, and particularly in this embodiment, the upper surfaces of the conductive posts 38 are exposed to the second surface 31b of the adapter 30, so that heat from the electronic device S100 can be efficiently dissipated.

[0038] In addition, in the configuration of this embodiment, the accommodation portion 35 is formed to extend from the front surface 31c to the back surface 31d. This configuration has the advantage that the accommodation portion 35, which is a recess, can be easily formed by processing with a dicer or the like.

[0039] In the above description, a configuration in which a plurality of terminals 11 are exposed on the bottom surface of the first electronic component 10 is exemplified, but the terminals of the first electronic component 10 do not necessarily have to be exposed on the bottom surface.

[0040] Second Embodiment In the configuration of the first embodiment, the width dimension of the accommodation section 35 needs to be changed appropriately depending on the size of the first electronic component 10 to be accommodated in the accommodation section 35. Therefore, in order to be able to accommodate various sizes of the first electronic component 10, the electronic device of one embodiment of the present invention may be configured as follows.

[0041] Fig. 3 is a diagram showing an electronic device according to a second embodiment, and Fig. 4 is a diagram showing the electronic device of Fig. 3 in an exploded state.

[0042] The electronic device S101 includes a first electronic component 10, a second electronic component 20, and an adapter 130. The electronic device S101 has the same configuration as the electronic device S100 of the first embodiment, except that the adapter 130 has a different structure from the adapter 30 of the first embodiment.

[0043] The adapter 130 includes a first adapter body 131-1, a first conductive post 38-1, a second adapter body 131-2, and a second conductive post 38-2. The first adapter body 131-1 and the second adapter body 131-2 have symmetrical shapes, so the following description will be given using the first adapter body 131-1 as an example.

[0044] The first adaptor body 131-1 is a first member constituting the adaptor body 131, and has a first thick portion 132-1 and a first extending portion 133-1.

[0045] The first thick portion 132-1 is a portion where the first conductive post 38-1 is provided. The first thick portion 132-1 corresponds to a portion of the adapter body 31 adjacent to the side of the accommodation portion 35 in the adapter body 31 of the first embodiment.

[0046] The first extending portion 133-1 corresponds to a part of the region of the adapter main body 31 above the accommodation portion 35 in the adapter main body 31 of the first embodiment. The first extending portion 133-1 extends horizontally from the upper end of the first thick portion 132-1 toward the second adapter main body 131-2. The first extending portion 133-1 partially covers the upper surface of the first electronic component 10.

[0047] The second adaptor body 131-2 is configured similarly to the first adaptor body 131-1. The second adaptor body 131-2 is a second member constituting the adaptor body 131, and has a second thick portion 132-2 and a second extending portion 133-2.

[0048] Similar to the first adaptor body 131-1, the second thick portion 132-2 is a portion where the second conductive post 38-2 is provided. The second extending portion 133-2 extends from the second thick portion 132-2 toward the first adaptor body 131-1.

[0049] 3, the first extending portion 133-1 and the second extending portion 133-2 extend so as to cover the first electronic component 10, and in the assembled state of the electronic device S101, a gap Sa is formed between the first extending portion 133-1 and the second extending portion 133-2. In other words, the tip of the first extending portion 133-1 and the tip of the second extending portion 133-2 are not in contact with each other, and a gap Sa is formed therebetween.

[0050] As an example, the top surface of the first electronic component 10 is fixed to the first extending portion 133-1 and the second extending portion 133-2. An adhesive may be used for fixing.

[0051] The gap Sa extends from one end face of the adapter body 131 (the front face 31c of the adapter body 31) to the other end face (the back face 31d of the adapter body 31). The gap Sa forms a heat dissipation path that allows air to flow from one end face of the adapter body 131 to the other end face. The gap Sa extends so as to face a part of the outer surface (top face) of the first electronic component 10. The gap Sa also extends so as to face a part of the outer surface (bottom face) of the second electronic component 20. In this embodiment, the gap Sa is provided in this manner, forming a heat dissipation path that dissipates heat from the first electronic component 10 and / or the second electronic component 20, thereby enabling the heat to be dissipated effectively during operation of the electronic device 101.

[0052] The manufacture of the electronic device S101 will be briefly described with reference to FIG. 4. The first adapter body 131-1 and the second adapter body 131-2 can be manufactured, for example, by cutting the thin-walled portion (the portion above the accommodation portion 35) of the adapter body 31 of the first embodiment. As shown in FIG. 4, the first adapter body 131-1 and the second adapter body 131-2 are arranged to sandwich the first electronic component 10 from both sides. With the first electronic component 10 fixed inside the first adapter body 131-1 and the second adapter body 131-2, the second electronic component 20 is placed on the upper surfaces of the first adapter body 131-1 and the second adapter body 131-2. Then, the electrodes 22 of the second electronic component 20 are electrically connected to the conductive posts 38, thereby manufacturing the electronic device S101.

[0053] According to the configuration of the second embodiment, first electronic components 10 of various sizes can be attached to the adapter 130 satisfactorily, and therefore there is no need to prepare a plurality of adapters 130 with accommodating portions 35 of different shapes.

[0054] According to the configuration of this embodiment, when the electronic device S100 is in an assembled state, a gap Sa is formed between the first extending portion 133-1 and the second extending portion 133-2. This gap Sa functions as a heat dissipation path, allowing heat to be efficiently released during operation of the electronic device S101. When the gap Sa is formed to extend from the front to the back of the adapter 130, that is, when the ends of the heat dissipation path are exposed to the front and back of the adapter 130, heat can be particularly efficiently dissipated through the ends of the heat dissipation path. Heat may be efficiently dissipated by flowing air through the gap Sa.

[0055] Furthermore, since air is present in the gap Sa, there is an advantage that heat transfer from one of the first electronic component 10 and the second electronic component 20 to the other can be suppressed compared to a configuration in which the first electronic component 10 and the second electronic component 20 are adjacent to each other via a thin-walled portion of an adapter member made of resin, for example.

[0056] The effect of the gap Sa has been described above, but the main feature of the second embodiment is that the first electronic component 10 is sandwiched between a pair of adapter bodies 131, and it is not essential that the gap Sa be hollow. For example, the gap Sa may be filled with a material such as an adhesive.

[0057] <Third embodiment> The adapter in the electronic device of the present invention can mount second electronic components 20 of various sizes. As described above, the conductive posts 38 are formed with a relatively large horizontal cross-sectional area and are also long in width (the dimension in the left-right direction in FIG. 1 ), so even with the configurations of the first and second embodiments, it is possible to mount second electronic components 20 of a certain degree of different sizes. However, the electronic device may be configured as follows so that second electronic components 20 of a wider variety of sizes can be mounted.

[0058] 5A and 5B are diagrams showing an electronic device according to a third embodiment, with Fig. 5A being a cross-sectional view and Fig. 5B being a plan view omitting the second electronic component 20. The electronic device S102 is similar in basic structure to the electronic device S100 according to the first embodiment, but differs in that a protruding electrode portion 39 is formed.

[0059] In this example, a first protruding electrode 39-1 and a second protruding electrode 39-2 are provided as the protruding electrode portion 39. The first protruding electrode 39-1 is formed to protrude from the first conductive post 38-1 toward the second conductive post 38-2. Specifically, the first protruding electrode 39-1 is formed to extend to a region above the first electronic component 10. The first protruding electrode 39-1 is exposed on the second surface 31b of the adapter in the mounting portion where the second electronic component 20 is mounted. Similarly, the second protruding electrode 39-2 protrudes from the second conductive post 38-2 toward the first conductive post 38-1, and its upper surface is exposed on the second surface 31b.

[0060] According to this configuration, by forming the protruding electrode portion 39, in addition to the upper surface of the conductive post 38, the upper surface of the protruding electrode portion 39 also becomes a land to which the electrode 22 of the second electronic component 20 can be connected, thereby increasing the area of ​​the land and achieving the effect of enabling the mounting of second electronic components 20 of various sizes.

[0061] Furthermore, since the protruding electrode portion 39, which is made of a conductive material, can also function as a shielding member for the first electronic component 10, such a configuration is expected to have the effect of reducing the mutual influence of electronic components due to leakage of electromagnetic waves.

[0062] In the above description, a configuration in which both the first protruding electrode 39-1 and the second protruding electrode 39-2 are provided has been exemplified, but only one of these may be formed.

[0063] Fig. 6 is a diagram showing a modified example of the third embodiment. The above-described configuration may be applied to a configuration similar to that of the second embodiment in which the gap Sa is formed, as shown in Fig. 6.

[0064] <Fourth embodiment> The electronic device of the present invention may also include one or more third electronic components in addition to the first electronic component 10 and the second electronic component 20. Fig. 7 is a diagram showing an electronic device according to a fourth embodiment. Fig. 8 is a cross-sectional view taken along line BB in Fig. 7.

[0065] The electronic device S103 includes a first electronic component 10, a second electronic component 20, a third electronic component 50, and an adapter 230. Except for the provision of the third electronic component 50 and the provision of a structural portion in the adapter 230 that is electrically connected to the third electronic component 50, the basic structure is the same as that of the first embodiment, and therefore a duplicated description will be omitted. Note that, although an example in which the basic structure is common to the first embodiment will be described here, the configuration in which the third electronic component 50 is provided may be combined with the configuration of the second embodiment, for example.

[0066] In this example, two third electronic components 50 are provided: a third electronic component 50-1 and a third electronic component 50-2. Because the third electronic components 50-1 and 50-2 have the same configuration, only the third electronic component 50-1 will be described below. As an example, the third electronic component 50 is an electronic component smaller than the first electronic component 10 and the second electronic component 20. The third electronic component 50 may be any electronic component, such as a chip capacitor. Electrodes are provided on both ends of the third electronic component 50. The distance between the electrodes of the third electronic component 50 is shorter than the distance between the electrodes of the second electronic component 20.

[0067] As shown in FIG. 7(a), the adapter 230 has a mounting portion P 2. Mounting portion P2 is provided on the top surface (second surface) of adapter 230. In the configuration of FIG. 7, one mounting portion P2 is provided on the front side and one on the back side of adapter 230, but the present invention is not limited to this.

[0068] 7 and 8, the adapter 230 is also formed with a conductive member 240 that is connected to the third electronic component 50. Specifically, the conductive member 240 includes a first conductive member 240-1 and a second conductive member 240-2. Since the first conductive member 240-1 and the second conductive member 240-2 have the same structure, the following description will be given using the first conductive member 240-1 as an example.

[0069] 8, first conductive member 240-1 has through electrode portion 245 and protruding electrode portion 246. First conductive member 240-1 is made of copper, for example.

[0070] Similar to the conductive post 38, the through electrode portion 245 is formed to penetrate the adapter 230 in its thickness direction. The upper surface of the through electrode portion 245 is exposed at the upper surface of the adapter 230, and the lower surface of the through electrode portion 245 is exposed at the lower surface of the adapter 230.

[0071] The protruding electrode portion 246 is an electrode that extends from the upper end of the through electrode portion 245 toward the second conductive member 240-2. The upper surface of the protruding electrode portion 246 is exposed on the upper surface of the adapter 230. The protruding electrode portion 246 of the second conductive member 240-2 is configured in a similar manner. The third electronic component 50 is mounted on the pair of protruding electrode portions 246 formed in this manner. The electrodes at the ends of the third electronic component 50 are each electrically connected to the protruding electrode portion 246.

[0072] As described above, the modular configuration of the first electronic component 10, the second electronic component 20, and the third electronic component 50 allows the electronic device S100 to have higher functionality.

[0073] Fig. 9 is a diagram showing modified electronic devices of the present invention. All of the electric devices in Fig. 9 are examples in which electrodes are provided near the conductive posts 38 of the electronic device S100 in Fig. 1. As shown in Fig. 9(a), the electronic device of one embodiment of the present invention may have a connection electrode portion 41.

[0074] The connection electrode portion 41 is an electrode portion provided inside the adapter 30. In the example of FIG. 9, the first connection electrode portion 41-1 and the second connection electrode portion 41-2 are provided as the connection electrode portion 41. Since they have the same structure, the first connection electrode portion 41-1 will be described as an example below.

[0075] The first connection electrode portion 41-1 is provided on the lower side of the conductive post 38 and extends from the first conductive post 38-1 toward the side end face (the first side face 31e) of the adapter body 31. The end face of the first connection electrode portion 41-1 is exposed on the first side face 31e.

[0076] Similarly, the second connection electrode portion 41-2 extends from the second conductive post 38-2 toward the second side face 31f. The end face of the second connection electrode portion 41-2 is exposed on the second side face 31f.

[0077] According to such a configuration, since the connection electrode portion 41 can be used as an external connection terminal of the electronic device, it becomes easier to electrically connect the electronic device to other devices or circuit patterns.

[0078] The connection electrode portion 41 may be provided at a position as shown in FIG. 9(b) instead of at a position as shown in FIG. 9(a). Specifically, in the electronic device of FIG. 9(b), the connection electrode portion 41 is provided at an intermediate position in the height direction of the conductive post 38. The connection electrode portion 41 is exposed on the first side face 31e but not exposed on either the first face 31a or the second face 31b. That is, resin members of the adapter 30 exist above and below the connection electrode portion 41.

[0079] According to such a configuration, the following effects are achieved. That is, in the configuration as shown in FIG. 9(a), when manufacturing the electronic device (specifically, when separating the adapter 30 from a predetermined member), burrs may occur on the members of the connection electrode portion 41. Specifically, when attempting to separate the adapter 30 from the upper surface to the lower surface of the adapter 30, for example, using a dicing saw, the connection electrode portion 41 made of a material such as copper may not be cleanly cut, and burrs may occur at the lower end of the connection electrode portion 41.

[0080] In contrast, a configuration as shown in Figure 9(b), in which the connection electrode portion 41 is located at the midpoint in the height direction of the conductive post 38 and the top and bottom of the connection electrode portion 41 are sandwiched between molding materials, is advantageous in that burrs are less likely to occur compared to the configuration in Figure 9(a).

[0081] The present invention has been described above using embodiments, but the technical scope of the present invention is not limited to the scope described in the above embodiments, and various modifications and changes are possible within the scope of the gist of the present invention. For example, all or part of the device can be configured by functionally or physically distributing or integrating any unit. Furthermore, new embodiments resulting from any combination of multiple embodiments are also included in the embodiments of the present invention. The effects of the new embodiments resulting from the combination also have the effects of the original embodiments. [Explanation of symbols]

[0082] 10 First Electronic Parts 11 terminals 20 Secondary Electronic Components 21 Main body 22 electrodes 30 adapters 31 Adapter body 31a 1st page 31b 2nd side 31c front 31d back 31e 1st side 31f 2nd side 35 Storage section 38 Conductive Post 38-1 First conductive post 38-2 Second conductive post 39 Protruding electrode part 39-1 1st protruding electrode 39-2 2nd protruding electrode 41 Connection electrode part 41-1 First connection electrode part 41-2 Second connection electrode part 50 Third Electronic Components 130 adapter 131 Adapter body 131-1 First adapter body 131-2 Second adapter body 132-1 1st thick part 132-2 2nd thick part 133-2 Second extension part 230 adapter 240 Conductive materials 245 Through electrode section 246 Protruding electrode part P1, P2 mounting area S100 Electronic Device S101 Electronic Device S102 Electronic Devices S103 Electronic Devices Sa void

Claims

1. a first electronic component; an adapter having a housing portion formed therein for housing the first electronic component; Equipped with The adapter is an adapter body having a first surface and a second surface opposite to the first surface in a thickness direction of the adapter; a conductive post that penetrates the adapter body from the first surface to the second surface; and the housing portion is formed as a recess on the first surface, and a mounting portion on which a second electronic component is mounted is formed on the second surface, The conductive posts include: a first conductive post; a second conductive post provided on the opposite side of the first conductive post with the receiving portion interposed therebetween; and The adapter body is divided into a plurality of components, The plurality of components include: a first member provided with the first conductive post; a second member provided with the second conductive post; and the first member has a first thick portion where the first conductive post is provided, and a first extending portion that extends from the first thick portion toward the second member, the second member has a second thick portion where the second conductive post is provided, and a second extending portion that extends from the second thick portion toward the first member, the first extending portion and the second extending portion extend so as to cover the first electronic component, and a gap is formed between the first extending portion and the second extending portion in an assembled state of the electronic device. Electronic devices.

2. The second electronic component mounted on the mounting portion is electrically connected to the first conductive post and the second conductive post, and The electronic device of claim 1 .

3. The void is a heat dissipation passage extending from one end surface to the other end surface of the adapter body and allowing air to flow; 3. The electronic device according to claim 1 or 2.

4. the heat dissipation path faces a part of an outer surface of the second electronic component; The electronic device according to claim 3 .

5. The adapter is a first protruding electrode portion formed to protrude from the first conductive post toward the second conductive post and exposed on the second surface of the mounting portion; and, a second protruding electrode portion formed to protrude from the second conductive post toward the first conductive post and exposed on the second surface of the mounting portion; and further having at least one of 3. The electronic device according to claim 1 or 2.

6. The adapter is the second surface further includes another mounting portion on which a third electronic component is mounted, the third electronic component having electrodes on both ends, the distance between the electrodes being shorter than the distance between the electrodes of the second electronic component; 3. The electronic device according to claim 1 or 2.

7. the adapter further includes a connection electrode portion extending from the conductive post toward a side end surface of the adapter body and exposed at the side end surface.

3. The electronic device according to claim 1 or 2.

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