Heat pipes, methods for transferring heat using heat pipes, and heat transfer fluids for use in heat pipes

Abstract

To provide methods of transferring heat.SOLUTION: Methods for transferring heat using heat pipes comprise: (a) providing a heat pipe comprising an evaporating section containing a liquid working fluid comprising at least about 60 wt.% of cis 1-chloro-3,3,3-trifluoropropene, and a condensing section containing a working fluid vapor comprising cis 1-chloro-3,3,3-trifluoropropene; (b) placing the evaporating section in thermal communication with a body, fluid, surface or the like to be cooled; and (c) placing the condensing section in thermal communication with a body, fluid, surface or the like to be heated.SELECTED DRAWING: Figure 1a

Description

[Technical Field]

[0001] (cross reference) This application claims the benefit of priority to U.S. Provisional Patent Application No. 62 / 562,005, filed September 22, 2017, and U.S. Provisional Patent Application No. 62 / 607,397, filed December 19, 2017, each of which is incorporated herein by reference.

[0002] FIELD OF THE INVENTION The present invention relates to heat pipes and methods, systems, and compositions used within or employing heat pipe(s). [Background technology]

[0003] As used herein, the term "heat pipe" means a heat transfer device that includes a liquid working fluid in an evaporative section and a vapor working fluid in a condensing section, and that uses substantially only the motive force of evaporation to move the vapor working fluid from the evaporative section to the condensing section, and that uses little or no energy input to return the liquid working fluid to the evaporative section.

[0004] One of the most common types of heat pipes is depicted in Figure A, commonly known as a gravity return, gravity return-driven, or thermosiphon heat pipe. It relies on gravity return to return a liquid working fluid from the condensing section to the evaporating section. As shown in Figure A, in a typical configuration, a heat pipe is an upright, enclosed vessel with an evaporating section located below a partition wall and a condensing section located above the partition wall. The evaporating section contains a working fluid in liquid form that absorbs heat from an item, body, or fluid to be cooled, thereby boiling to form a working fluid vapor. The boiling of the working fluid in the evaporating section creates a pressure differential, driving the vapor to the condensing section. The vaporous working fluid in the condensing section releases heat to a selected heat sink (e.g., ambient air), thereby condensing to form a liquid working fluid at or near the vessel's inner surface. This liquid then returns to the evaporating section under gravity return force and joins the liquid working fluid contained therein. As previously mentioned, boiling increases the mass of the vapor in the evaporating section and decreases the mass of the vapor in the condensing section, creating a pressure difference that drives the vapor from the boiling section to the condensing section, thus creating a continuous heat transfer cycle that requires no energy input (other than the heat absorbed in the cooling operation) to transport the working fluid.

[0005] In some applications, it is desirable to have heat pipes oriented horizontally or at an angle, and one common type of heat pipe for use in such applications is known as a capillary return heat pipe, or wicking heat pipe, an example of which is shown in Figure B.

[0006] In an arrangement of the type shown in Diagram B, heat is absorbed by the working fluid in the evaporation section (shown on the left side of the diagram), causing the liquid to boil, which provides the pressure differential that moves the vapor to the condensation section as described above. However, rather than relying solely on gravity return to return the condensed liquid working fluid, a wicking structure is provided adjacent the vessel wall that uses capillary action to direct the flow of condensed working fluid from the condensation section back to the evaporation section.

[0007] As a result of their extremely high heat transfer coefficients for boiling and condensation, heat pipes are very effective heat conductors, and as such, they are used in many applications, particularly in cooling electronic devices such as cooling central processing units (CPUs), energy recovery such as data center cooling recovery between cold and hot air, and spacecraft thermal control such as satellite thermal control.

[0008] In addition to the gravity return and capillary return heat pipes mentioned above, there are several other heat pipes that can be characterized according to the mechanism that uses little or no additional energy to return the condensate of the working fluid to the evaporative section, as summarized in the table below.

[0009] [Table 1]

[0010] One of the most commonly used working fluids for capillary return heat pipes is 1,1,1,2-tetrafluororethane (R-134a). R-134a has the desirable property of not contributing to ozone depletion, but the undesirable property of having a relatively high Global Warming Potential (GWP) of approximately 1300. Therefore, there is a need in the art for more desirable working fluids for capillary return heat pipes, including a need to find replacements for R-134a that have more environmentally acceptable properties while simultaneously providing the working fluid with transport and heat transfer properties suitable for capillary return heat pipe operation.

[0011] As explained in U.S. Patent Application Publication No. 2004 / 0105233, the information technology and computer industries need means for providing increasingly efficient and effective heat removal techniques. For example, portable electronic devices such as notebook computers, smartphones, tablets, and iPads are becoming lighter, thinner, shorter, and / or smaller while providing powerful computing, communication, and data processing capabilities. As a result, central processing units (CPUs) and other electronic components used in such devices have become more complex to provide more powerful functionality to users and application software, but these advances have come at the expense of higher power consumption and increased operating temperatures for these components. High operating temperatures can cause instability in operating systems, especially in small, portable devices. It is increasingly important to provide effective means for removing these higher levels of heat from increasingly smaller devices to maintain the stability of modern CPUs and the like.

[0012] Generally, heat generated by a CPU or the like must be dissipated by rejecting the heat to the ambient air. Typically, this is done by bringing ambient air into an enclosure housing the electronic components, either by forced or natural convection, rejecting the heat to the air, and then expelling the heated air from the device. Because notebook computers, tablets, iPads, and the like are generally intended for use both indoors and outdoors, ambient conditions can vary significantly. As ambient temperatures increase, the need for and difficulty in obtaining cooling for electronic components increases. Thus, for example, systems and devices must be able to remain stable even under high ambient temperature conditions. Accordingly, applicants have come to realize that it is desirable for devices, particularly those that remove heat from electronic components and the like, to be able to operate as effectively or nearly as effectively under the most unfavorable conditions of high ambient temperatures and a full load of components as they do under more moderate ambient temperature conditions.

[0013] In many cities around the world, average summer temperatures can be above 40°C. Furthermore, the temperature of the air inside a device from which heat must be rejected is higher than the external ambient air because the air is warmed as it circulates through the enclosure before being expelled from the casing of a notebook or similar device. Thus, the temperature of the air that must reject heat can reach 50°C or higher (see U.S. Patent Application Publication No. 2004 / 0105233), and modern CPUs and other electronic components are designed to operate at maximum operating temperatures of approximately 60°C to approximately 90°C. See, for example, U.S. Patent Application Publication No. 2002 / 0033247. Furthermore, even in situations where electronic devices are intended for use in temperature-controlled environments, such as server rooms, means for maintaining the ambient air relatively cool (e.g., air conditioning) may fail. In such cases, applicants have come to recognize that it would be desirable for heat pipes for use in these and similar situations to be able to continue to operate effectively even when ambient temperatures rise into the 50°C to 100°C range.

[0014] Accordingly, Applicants have come to recognize that significant benefits could be achieved with a heat removal device that is highly effective in removing heat from bodies, fluids, or components, particularly electronic devices or components used in notebooks, laptops, tablets, iPad® computing devices, servers, desktop computers, and the like, over an operating temperature range including temperatures greater than about 50°C, including the range of about 50°C to about 100°C.

[0015] Additionally, applicants have come to recognize that advantages can be gained by discovering a working fluid that is more environmentally acceptable than R-134a and that is effective for use in both capillary return and gravity return heat pipes.

[0016] The development of alternative working fluids for heat pipes, particularly capillary return heat pipes, and more particularly for capillary return heat pipes for cooling small electronic components, is a complex, difficult, and unpredictable undertaking. This is due to the significant need to operate the heat pipe with little or no energy input other than the absorbed heat, while at the same time providing highly efficient heat transfer over the operating temperature range. As an example, for a heat pipe to operate effectively with a new alternative working fluid, the following operational difficulties must be addressed and replaced: In both gravity return and capillary return designs, there is a synchronization problem caused by vapor and liquid moving in opposite directions within the same vessel, which can reduce or degrade the return of working fluid condensate to the evaporator section. - Sonic flow problems, which can create limitations on the rate at which vapor can be delivered from the evaporation section to the condensation section in both gravity return and capillary return designs; - in the capillary return design, ensuring that the working fluid liquid can generate sufficient capillary pressure to effectively transfer the working fluid condensate from the condensate section to the evaporator section; - In capillary return designs, the formation of working fluid vapor bubbles in the wick, which can cause undesirable hot spots in the evaporator section and impede or block the return of liquid from the condenser section to the evaporator section.

[0017] These operating considerations and all others are based on the heat transfer properties of the working fluid, both in the liquid and vapor phases. The interrelationships of these properties involve both the delivery and transport properties and the interrelationships of these properties that will allow successful operation within a heat pipe, particularly over the operating temperature ranges present for cooling small electronic components, and cannot be determined with certainty prior to obtaining experimental data. [Brief explanation of the drawings]

[0018] [Figure A] FIG. 1 is a schematic diagram of a gravity return heat pipe. [Figure B]FIG. 1 is a schematic diagram of a capillary return heat pipe. [Figure 1a] FIG. 1 is a schematic diagram of a thermosyphon heat pipe. [Figure 1b] FIG. 1 is a schematic diagram of a vapor chamber / flat heat pipe. [Figure 1c] FIG. 1 is a schematic diagram of a pulsating heat pipe. [Figure 1d] 1 is a photograph of a capillary heat pipe showing the capillary material in cross section within the heat pipe. [Figure 1e] This is a photograph of a loop heat pipe. [Figure 3a] 1 provides a comparison of temperature figures of merit for cis 1-chloro-3,3,3-trifluoropropene and R-134a in (a) a capillary return heat pipe and (b) a gravity return heat pipe, according to an example herein. [Figure 3b] 1 provides a comparison of the temperature figure of merit for 1-chloro-3,3,3-trifluoropropene and R-134a in (a) capillary return heat pipe and (b) gravity return heat pipe systems according to an example herein. [Figure 4a] 1 provides a chart of evaporation temperature versus thermal resistance data according to examples herein. [Figure 4b] 1 provides a chart of evaporator temperature difference data versus heat transfer capacity according to examples herein. [Figure 5a] 1 provides a chart of evaporator temperature difference data versus heat transfer capacity according to examples herein. [Figure 5b] 1 provides a chart of evaporator temperature difference data versus evaporating temperature according to examples herein. Summary of the Invention

[0019] The present invention provides a heat pipe having a sealed container, (a) an interior space having an interior surface, the interior space comprising: (i) an evaporation section at least partially comprising the walls of the vessel and containing a liquid working fluid comprising, consisting essentially of, or consisting of at least about 60% by weight of cis 1-chloro-3,3,3-trifluoropropene in contact with the interior surface of the walls; (ii) an interior space including a condensation section at least partially formed by the wall of the enclosure, the condensation section containing a working fluid vapor including cis 1-chloro-3,3,3-trifluoropropene in fluid communication with the condensation section and in contact with an interior surface of the wall; (b) an exterior surface formed by at least a portion of the wall forming the condensing section; and (c) a heat pipe having a sealed container with heat transfer enhancing protrusions extending from the outer surface.

[0020] The present invention also provides a method of transferring heat, comprising: (a) providing a heat pipe including an evaporating section containing a liquid working fluid comprising at least about 60% by weight of cis 1-chloro-3,3,3-trifluoropropene and a condensing section containing a working fluid vapor comprising cis 1-chloro-3,3,3-trifluoropropene; (b) placing the evaporative section in thermal communication with a body, fluid, surface, etc. to be cooled; (c) placing the coalescing section in thermal communication with a body, fluid, surface, etc. to be heated.

[0021] The body, fluid, surface, etc. being heated may be referred to herein for convenience as a heat sink.

[0022] As used herein, the term "heat transfer" between a first body, fluid, surface, etc. and a second body, fluid, surface, etc. means that the first body and second body are separated only by a thermally conductive material, if any, that allows for the ready transfer of heat from the first body to the second body, as is well understood by those skilled in the art.

[0023] The present invention also includes a heat transfer system for transferring heat from a body or fluid to be cooled and a heat sink body or fluid, the system comprising a heat pipe, (a) an evaporation section containing a liquid working fluid comprising at least about 60% by weight of cis 1-chloro-3,3,3-trifluoropropene, the evaporation section being in heat transfer contact with the object or body to be cooled; (b) a condensing section containing a working fluid vapor comprising cis 1-chloro-3,3,3-trifluoropropene, the condensing section being in heat transfer contact with the heat sink. DETAILED DESCRIPTION OF THE INVENTION

[0024] Applicants have unexpectedly discovered that, in accordance with the methods, systems, uses, articles and compositions of the present invention, the above-mentioned needs and advantages, among others, can be achieved and / or the operational problems of heat pipes can be effectively overcome, while at the same time providing improved performance from an environmental perspective compared to operation with R-134a.

[0025] As described herein, applicants have discovered that unexpected advantages are achieved by using a working fluid in a heat pipe that comprises at least 60% by weight of cis 1-chloro-3,3,3-trifluoropropene, and that in accordance with the teachings contained herein, other components can be added to the working fluid without negating these advantages, and that the use of such heat pipes in the methods and systems of the present invention has unexpected advantages.

[0026] Heat Transfer Method The present invention includes a method of transferring heat from a body or fluid to be cooled to a heat sink, the method comprising: (a) providing a heat pipe including an evaporating section containing a liquid working fluid comprising at least about 60% by weight of cis 1-chloro-3,3,3-trifluoropropene and a condensing section containing a working fluid vapor comprising cis 1-chloro-3,3,3-trifluoropropene; (b) placing the evaporating section in thermal communication with the body or fluid to be cooled; and (c) placing the condensing section in thermal communication with a heat sink. For convenience, the heat transfer method according to this paragraph will be referred to herein as Heat Transfer Method 1.

[0027] The present invention includes a method of transferring heat, preferably comprising: (a) providing a heat pipe including an evaporating section containing a liquid working fluid comprising at least about 70% by weight of cis 1-chloro-3,3,3-trifluoropropene and a condensing section containing a working fluid vapor comprising cis 1-chloro-3,3,3-trifluoropropene; (b) placing the evaporating section in thermal communication with a body, fluid, surface, etc. to be cooled; and (c) placing the condensing section in thermal communication with a heat sink. For convenience, the heat transfer method according to this paragraph will be referred to herein as Heat Transfer Method 2.

[0028] The present invention includes a method of transferring heat, preferably comprising: (a) providing a heat pipe including an evaporating section containing a liquid working fluid comprising at least about 90% by weight of cis 1-chloro-3,3,3-trifluoropropene and a condensing section containing a working fluid vapor comprising cis 1-chloro-3,3,3-trifluoropropene; (b) placing the evaporating section in thermal communication with a body, fluid, surface, etc. to be cooled; and (c) placing the condensing section in thermal communication with a heat sink. For convenience, the heat transfer method according to this paragraph will be referred to herein as Heat Transfer Method 3.

[0029] The present invention includes a method of transferring heat, preferably comprising: (a) providing a heat pipe including an evaporating section containing a liquid working fluid comprising at least about 95% by weight of cis 1-chloro-3,3,3-trifluoropropene and a condensing section containing a working fluid vapor comprising cis 1-chloro-3,3,3-trifluoropropene; (b) placing the evaporating section in thermal communication with a body, fluid, surface, etc. to be cooled; and (c) placing the condensing section in thermal communication with a heat sink. For convenience, the heat transfer method according to this paragraph will be referred to herein as Heat Transfer Method 4.

[0030] The present invention includes a method of transferring heat, preferably comprising: (a) providing a heat pipe including an evaporating section containing a liquid working fluid comprising at least about 97% by weight cis 1-chloro-3,3,3-trifluoropropene and a condensing section containing a working fluid vapor comprising cis 1-chloro-3,3,3-trifluoropropene; (b) placing the evaporating section in thermal communication with a body, fluid, surface, etc. to be cooled; and (c) placing the condensing section in thermal communication with a heat sink. For convenience, the heat transfer method according to this paragraph will be referred to herein as Heat Transfer Method 5.

[0031] The present invention includes a method of transferring heat, preferably comprising: (a) providing a heat pipe including an evaporating section containing a liquid working fluid comprising at least about 99.5% by weight of cis 1-chloro-3,3,3-trifluoropropene and a condensing section containing a working fluid vapor comprising cis 1-chloro-3,3,3-trifluoropropene, (b) placing the evaporating section in thermal communication with a body, fluid, surface, etc. to be cooled, and (c) placing the condensing section in thermal communication with a heat sink. For convenience, the heat transfer method according to this paragraph will be referred to herein as Heat Transfer Method 6.

[0032] The present invention includes a method of transferring heat, preferably comprising: (a) providing a heat pipe including an evaporating section containing a liquid working fluid consisting essentially of cis 1-chloro-3,3,3-trifluoropropene and a condensing section containing a working fluid vapor consisting essentially of cis 1-chloro-3,3,3-trifluoropropene; (b) placing the evaporating section in thermal communication with a body, fluid, surface, etc. to be cooled; and (c) placing the condensing section in thermal communication with a heat sink. For convenience, the heat transfer method according to this paragraph will be referred to herein as Heat Transfer Method 7.

[0033] The present invention is a method of transferring heat, preferably comprising: (a) providing a heat pipe including an evaporating section containing a liquid working fluid comprising cis 1-chloro-3,3,3-trifluoropropene and a condensing section containing a working fluid vapor comprising cis 1-chloro-3,3,3-trifluoropropene; and (b) connecting the evaporating section to a cooled (c) placing the condensing section in thermal communication with a body, fluid, surface, etc., that is connected to the condensing section; and (d) placing the condensing section in thermal communication with a heat sink. For convenience, heat transfer methods according to this paragraph will be referred to herein as Heat Transfer Method 8.

[0034] The present invention includes a heat transfer method 1 in which the heat pipe has an operating temperature range of at least about 20°C.

[0035] As used herein, the term "operating temperature range" refers to the temperature range encompassing the temperature of the working fluid in the evaporator section.

[0036] The present invention includes a heat transfer method 1 in which the operating temperature range of the heat pipe is from about 20°C to about 100°C.

[0037] The present invention includes a heat transfer method 1 in which the heat pipe is a gravity return heat pipe and the operating temperature range of the heat pipe is from about 20°C to about 100°C.

[0038] As used herein, the term "gravity return heat pipe" means a heat pipe in which liquid working fluid returns at least partially, preferably substantially, from the condenser section to the evaporator section by the action of gravity return on the working fluid.

[0039] The present invention includes a heat transfer method 1 in which the heat pipe is a gravity return heat pipe and the operating temperature range of the heat pipe is from about 50°C to about 100°C.

[0040] The present invention includes a heat transfer method 1, wherein the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is about 50°C to about 100°C, and the heat sink is at a temperature of about 15°C to about 80°C.

[0041] The present invention includes a heat transfer method 1, wherein the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is about 50°C to about 100°C, and the heat sink is at a temperature of about 15°C to about 40°C.

[0042] The present invention includes a heat transfer method 1, wherein the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is about 50°C to about 100°C, and the heat sink is at a temperature of about 20°C to about 30°C.

[0043] The present invention includes a heat transfer method 1 in which the heat pipe is a gravity return heat pipe and the operating temperature range of the heat pipe is about 70°C to about 100°C.

[0044] The present invention includes a heat transfer method 1, wherein the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is about 70°C to about 100°C, and the heat sink is at a temperature of about 15°C to about 80°C.

[0045] The present invention includes a heat transfer method 1, wherein the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is about 70°C to about 100°C, and the heat sink is at a temperature of about 15°C to about 40°C.

[0046] The present invention includes a heat transfer method 1, wherein the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is about 70°C to about 100°C, and the heat sink is at a temperature of about 20°C to about 30°C.

[0047] The present invention includes a heat transfer method 1 in which the heat pipe is a gravity return heat pipe and the operating temperature range of the heat pipe is about 85°C to about 95°C.

[0048] The present invention includes a heat transfer method 1, wherein the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is about 85°C to about 100°C, and the heat sink is at a temperature of about 15°C to about 80°C.

[0049] The present invention includes a heat transfer method 1, wherein the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is about 85°C to about 100°C, and the heat sink is at a temperature of about 15°C to about 40°C.

[0050] The present invention includes a heat transfer method 1, wherein the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is about 85°C to about 100°C, and the heat sink is at a temperature of about 20°C to about 30°C.

[0051] The present invention includes a heat transfer method 1 in which the heat pipe is a gravity return heat pipe and the operating temperature range of the heat pipe is about 85°C to about 95°C.

[0052] The present invention includes a heat transfer method 1, wherein the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is about 85°C to about 95°C, and the heat sink is at a temperature of about 15°C to about 80°C.

[0053] The present invention includes a heat transfer method 1 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is about 85°C to about 95°C, and the heat sink is at a temperature of about 15°C to about 40°C.

[0054] The present invention includes a heat transfer method 1 in which the heat pipe is a gravity return heat pipe, the heat pipe has an operating temperature range of about 85°C to about 95°C, and the heat sink is at a temperature of about 20°C to about 30°C.

[0055] The present invention includes a heat transfer method 1 in which the heat pipe is a gravity return heat pipe and the operating temperature range of the heat pipe is greater than about 85°C.

[0056] The present invention includes a heat transfer method 1 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is greater than about 85°C, and the heat sink is at a temperature between about 15°C and about 80°C.

[0057] The present invention includes a heat transfer method 1, in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is greater than about 85°C, and the heat sink is at a temperature of about 15°C to about 40°C.

[0058] The present invention includes a heat transfer method 1 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is greater than about 85°C, and the heat sink is at a temperature of about 20°C to about 30°C.

[0059] The present invention includes a heat transfer method 1, in which the heat pipe is a gravity return heat pipe, and the operating temperature range of the heat pipe is greater than about 88°C.

[0060] The present invention relates to a heat pipe that is a gravity return heat pipe, the operating temperature range of the heat pipe is greater than about 88°C, and the heat sink is a heat transfer device that is at a temperature between about 15°C and about 80°C. This includes method 1.

[0061] The present invention includes a heat transfer method 1 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is greater than about 88°C, and the heat sink is at a temperature of about 15°C to about 40°C.

[0062] The present invention includes a heat transfer method 1 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is greater than about 88°C, and the heat sink is at a temperature of about 20°C to about 30°C.

[0063] The present invention includes a heat transfer method 1 in which the heat pipe is a gravity return heat pipe and the heat pipe operates with a heat capacity ratio of greater than or equal to 1. As used herein, heat capacity ratio means the ratio of the heat capacity of the working fluid in the heat pipe compared to the heat capacity of a heat pipe having a working fluid comprised of R-134a.

[0064] The present invention includes a heat transfer method 1 in which the heat pipe is a gravity return heat pipe and has a thermal resistance of about 0.5°C / watt or less when measured as defined herein.

[0065] The present invention includes a heat transfer method 2 in which the operating temperature range of the heat pipe is from about 20°C to about 100°C.

[0066] The present invention includes a heat transfer method 2 in which the heat pipe is a gravity return heat pipe and the operating temperature range of the heat pipe is from about 20°C to about 100°C.

[0067] The present invention includes a heat transfer method 2 in which the heat pipe is a gravity return heat pipe and the operating temperature range of the heat pipe is about 50°C to about 100°C.

[0068] The present invention includes a heat transfer method 2 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is about 50°C to about 100°C, and the heat sink is at a temperature of about 15°C to about 80°C.

[0069] The present invention includes a heat transfer method 2 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is about 50°C to about 100°C, and the heat sink is at a temperature of about 15°C to about 40°C.

[0070] The present invention includes a heat transfer method 2 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is about 50°C to about 100°C, and the heat sink is at a temperature of about 20°C to about 30°C.

[0071] The present invention includes a heat transfer method 2 in which the heat pipe is a gravity return heat pipe and the operating temperature range of the heat pipe is about 70°C to about 100°C.

[0072] The present invention includes a heat transfer method 2 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is about 70°C to about 100°C, and the heat sink is at a temperature of about 15°C to about 80°C.

[0073] The present invention includes a heat transfer method 2 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is about 70°C to about 100°C, and the heat sink is at a temperature of about 15°C to about 40°C.

[0074] The present invention includes a heat transfer method 2 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is about 70°C to about 100°C, and the heat sink is at a temperature of about 20°C to about 30°C.

[0075] The present invention includes a heat transfer method 2 in which the heat pipe is a gravity return heat pipe and the operating temperature range of the heat pipe is about 85°C to about 95°C.

[0076] The present invention includes a heat transfer method 2, in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is from about 85°C to about 100°C, and the heat sink is at a temperature of from about 15°C to about 80°C.

[0077] The present invention includes a heat transfer method 2 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is about 85°C to about 100°C, and the heat sink is at a temperature of about 15°C to about 40°C.

[0078] The present invention includes a heat transfer method 2 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is about 85°C to about 100°C, and the heat sink is at a temperature of about 20°C to about 30°C.

[0079] The present invention includes a heat transfer method 2 in which the heat pipe is a gravity return heat pipe and the operating temperature range of the heat pipe is about 85°C to about 95°C.

[0080] The present invention includes a heat transfer method 2, in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is about 85°C to about 95°C, and the heat sink is at a temperature of about 15°C to about 80°C.

[0081] The present invention includes a heat transfer method 2 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is about 85°C to about 95°C, and the heat sink is at a temperature of about 15°C to about 40°C.

[0082] The present invention includes a heat transfer method 2 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is about 85°C to about 95°C, and the heat sink is at a temperature of about 20°C to about 30°C.

[0083] The present invention includes a heat transfer method 2, in which the heat pipe is a gravity return heat pipe, and the operating temperature range of the heat pipe is greater than about 85°C.

[0084] The present invention includes a heat transfer method 2 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is greater than about 85°C, and the heat sink is at a temperature of about 15°C to about 80°C.

[0085] The present invention includes a heat transfer method 2 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is greater than about 85°C, and the heat sink is at a temperature of about 15°C to about 40°C.

[0086] The present invention includes a heat transfer method 2 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is greater than about 85°C, and the heat sink is at a temperature of about 20°C to about 30°C.

[0087] The present invention relates to a heat pipe that is a gravity return heat pipe, and the operating temperature of the heat pipe is The range includes heat transfer method 2, which is greater than about 88°C.

[0088] The present invention includes a heat transfer method 2 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is greater than about 88°C, and the heat sink is at a temperature of about 15°C to about 80°C.

[0089] The present invention includes a heat transfer method 2 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is greater than about 88°C, and the heat sink is at a temperature of about 15°C to about 40°C.

[0090] The present invention includes a heat transfer method 2 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is greater than about 88°C, and the heat sink is at a temperature of about 20°C to about 30°C.

[0091] The present invention includes a heat transfer method 2 in which the heat pipe is a gravity return heat pipe and the heat pipe operates with a heat capacity ratio of greater than or equal to 1. As used herein, heat capacity ratio means the ratio of the heat capacity of the working fluid in the heat pipe compared to the heat capacity of a heat pipe having a working fluid comprised of R-134a.

[0092] The present invention includes a heat transfer method 2, wherein the heat pipe is a gravity return heat pipe and has a thermal resistance of about 0.5°C / watt or less when measured as measured in Example 5 herein.

[0093] The present invention includes a heat transfer method 3 in which the operating temperature range of the heat pipe is from about 20°C to about 100°C.

[0094] The present invention includes a heat transfer method 3 in which the heat pipe is a gravity return heat pipe and the operating temperature range of the heat pipe is from about 20°C to about 100°C.

[0095] The present invention includes a heat transfer method 3 in which the heat pipe is a gravity return heat pipe and the operating temperature range of the heat pipe is about 50°C to about 100°C.

[0096] The present invention includes a heat transfer method 3, in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is from about 50°C to about 100°C, and the heat sink is at a temperature of from about 15°C to about 80°C.

[0097] The present invention includes a heat transfer method 3 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is about 50°C to about 100°C, and the heat sink is at a temperature of about 15°C to about 40°C.

[0098] The present invention includes a heat transfer method 3 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is about 50°C to about 100°C, and the heat sink is at a temperature of about 20°C to about 30°C.

[0099] The present invention includes a heat transfer method 3 in which the heat pipe is a gravity return heat pipe and the operating temperature range of the heat pipe is from about 70°C to about 100°C.

[0100] The present invention includes a heat transfer method 3, in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is from about 70°C to about 100°C, and the heat sink is at a temperature of from about 15°C to about 80°C.

[0101] The present invention includes a heat transfer method 3 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is about 70°C to about 100°C, and the heat sink is at a temperature of about 15°C to about 40°C.

[0102] The present invention includes a heat transfer method 3 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is about 70°C to about 100°C, and the heat sink is at a temperature of about 20°C to about 30°C.

[0103] The present invention includes a heat transfer method 3 in which the heat pipe is a gravity return heat pipe and the operating temperature range of the heat pipe is about 85°C to about 95°C.

[0104] The present invention includes a heat transfer method 3, in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is from about 85°C to about 100°C, and the heat sink is at a temperature of from about 15°C to about 80°C.

[0105] The present invention includes a heat transfer method 3 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is about 85°C to about 100°C, and the heat sink is at a temperature of about 15°C to about 40°C.

[0106] The present invention includes a heat transfer method 3 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is about 85°C to about 100°C, and the heat sink is at a temperature of about 20°C to about 30°C.

[0107] The present invention includes a heat transfer method 3 in which the heat pipe is a gravity return heat pipe and the operating temperature range of the heat pipe is about 85°C to about 95°C.

[0108] The present invention includes a heat transfer method 3, in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is from about 85°C to about 95°C, and the heat sink is at a temperature of from about 15°C to about 80°C.

[0109] The present invention includes a heat transfer method 3 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is about 85°C to about 95°C, and the heat sink is at a temperature of about 15°C to about 40°C.

[0110] The present invention includes a heat transfer method 3 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is about 85°C to about 95°C, and the heat sink is at a temperature of about 20°C to about 30°C.

[0111] The present invention includes a heat transfer method 3, in which the heat pipe is a gravity return heat pipe, and the operating temperature range of the heat pipe is greater than about 85°C.

[0112] The present invention includes a heat transfer method 3, wherein the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is greater than about 85°C, and the heat sink is at a temperature of about 15°C to about 80°C.

[0113] The present invention includes a heat transfer method 3, wherein the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is greater than about 85°C, and the heat sink is at a temperature of about 15°C to about 40°C.

[0114] The present invention includes a heat transfer method 3 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is greater than about 85°C, and the heat sink is at a temperature of about 20°C to about 30°C.

[0115] The present invention includes a heat transfer method 3, in which the heat pipe is a gravity return heat pipe, and the operating temperature range of the heat pipe is greater than about 88°C.

[0116] The present invention includes a heat transfer method 3 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is greater than about 88°C, and the heat sink is at a temperature of about 15°C to about 80°C.

[0117] The present invention includes a heat transfer method 3, in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is greater than about 88°C, and the heat sink is at a temperature of about 15°C to about 40°C.

[0118] The present invention includes a heat transfer method 3 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is greater than about 88°C, and the heat sink is at a temperature of about 20°C to about 30°C.

[0119] The present invention includes a heat transfer method 3 in which the heat pipe is a gravity return heat pipe and the heat pipe operates with a heat capacity ratio of greater than or equal to 1. As used herein, heat capacity ratio means the ratio of the heat capacity of the working fluid in the heat pipe compared to the heat capacity of a heat pipe having a working fluid comprised of R-134a.

[0120] The present invention includes a heat transfer method 3, wherein the heat pipe is a gravity return heat pipe and has a thermal resistance of about 0.5°C / watt or less when measured as measured in Example 5 herein.

[0121] The present invention includes a heat transfer method 4 in which the operating temperature range of the heat pipe is from about 20°C to about 100°C.

[0122] The present invention includes a heat transfer method 4 in which the heat pipe is a gravity return heat pipe and the operating temperature range of the heat pipe is from about 20°C to about 100°C.

[0123] The present invention includes a heat transfer method 4 in which the heat pipe is a gravity return heat pipe and the operating temperature range of the heat pipe is from about 50°C to about 100°C.

[0124] The present invention includes a heat transfer method 4, wherein the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is from about 50°C to about 100°C, and the heat sink is at a temperature of from about 15°C to about 80°C.

[0125] The present invention includes a heat transfer method 4 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is about 50°C to about 100°C, and the heat sink is at a temperature of about 15°C to about 40°C.

[0126] The present invention includes a heat transfer method 4 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is about 50°C to about 100°C, and the heat sink is at a temperature of about 20°C to about 30°C.

[0127] The present invention relates to a heat pipe that is a gravity return heat pipe, and the operating temperature of the heat pipe is The range includes heat transfer method 4, which is about 70°C to about 100°C.

[0128] The present invention includes a heat transfer method 4, wherein the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is from about 70°C to about 100°C, and the heat sink is at a temperature of from about 15°C to about 80°C.

[0129] The present invention includes a heat transfer method 4 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is about 70°C to about 100°C, and the heat sink is at a temperature of about 15°C to about 40°C.

[0130] The present invention includes a heat transfer method 4 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is about 70°C to about 100°C, and the heat sink is at a temperature of about 20°C to about 30°C.

[0131] The present invention includes a heat transfer method 4 in which the heat pipe is a gravity return heat pipe and the operating temperature range of the heat pipe is about 85°C to about 95°C.

[0132] The present invention includes a heat transfer method 4, wherein the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is from about 85°C to about 100°C, and the heat sink is at a temperature of from about 15°C to about 80°C.

[0133] The present invention includes a heat transfer method 4 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is about 85°C to about 100°C, and the heat sink is at a temperature of about 15°C to about 40°C.

[0134] The present invention includes a heat transfer method 4 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is about 85°C to about 100°C, and the heat sink is at a temperature of about 20°C to about 30°C.

[0135] The present invention includes a heat transfer method 4 in which the heat pipe is a gravity return heat pipe and the operating temperature range of the heat pipe is about 85°C to about 95°C.

[0136] The present invention includes a heat transfer method 4, wherein the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is from about 85°C to about 95°C, and the heat sink is at a temperature of from about 15°C to about 80°C.

[0137] The present invention includes a heat transfer method 4, wherein the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is about 85°C to about 95°C, and the heat sink is at a temperature of about 15°C to about 40°C.

[0138] The present invention includes a heat transfer method 4 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is about 85°C to about 95°C, and the heat sink is at a temperature of about 20°C to about 30°C.

[0139] The present invention includes a heat transfer method 4 in which the heat pipe is a gravity return heat pipe and the operating temperature range of the heat pipe is greater than about 85°C.

[0140] The present invention includes a heat transfer method 4 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is greater than about 85°C, and the heat sink is at a temperature of about 15°C to about 80°C.

[0141] The present invention includes a heat transfer method 4, wherein the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is greater than about 85°C, and the heat sink is at a temperature of about 15°C to about 40°C.

[0142] The present invention includes a heat transfer method 4 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is greater than about 85°C, and the heat sink is at a temperature of about 20°C to about 30°C.

[0143] The present invention includes a heat transfer method 4, in which the heat pipe is a gravity return heat pipe, and the operating temperature range of the heat pipe is greater than about 88°C.

[0144] The present invention includes a heat transfer method 4 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is greater than about 88°C, and the heat sink is at a temperature of about 15°C to about 80°C.

[0145] The present invention includes a heat transfer method 4, wherein the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is greater than about 88°C, and the heat sink is at a temperature of about 15°C to about 40°C.

[0146] The present invention includes a heat transfer method 4 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is greater than about 88°C, and the heat sink is at a temperature of about 20°C to about 30°C.

[0147] The present invention includes a heat transfer method 4 in which the heat pipe is a gravity return heat pipe and the heat pipe operates with a heat capacity ratio of greater than or equal to 1. As used herein, heat capacity ratio means the ratio of the heat capacity of the working fluid in the heat pipe compared to the heat capacity of a heat pipe having a working fluid comprised of R-134a.

[0148] The present invention includes a heat transfer method 4, wherein the heat pipe is a gravity return heat pipe and has a thermal resistance of about 0.5°C / watt or less when measured as measured in Example 5 herein.

[0149] The present invention includes a heat transfer method 5 in which the operating temperature range of the heat pipe is from about 20°C to about 100°C.

[0150] The present invention includes a heat transfer method 5 in which the heat pipe is a gravity return heat pipe and the operating temperature range of the heat pipe is from about 20°C to about 100°C.

[0151] The present invention includes a heat transfer method 5 in which the heat pipe is a gravity return heat pipe and the operating temperature range of the heat pipe is from about 50°C to about 100°C.

[0152] The present invention includes a heat transfer method 5, wherein the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is from about 50°C to about 100°C, and the heat sink is at a temperature of from about 15°C to about 80°C.

[0153] The present invention includes a heat transfer method 5 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is from about 50°C to about 100°C, and the heat sink is at a temperature of from about 15°C to about 40°C.

[0154] The present invention includes a heat transfer method 5 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is from about 50°C to about 100°C, and the heat sink is at a temperature of from about 20°C to about 30°C.

[0155] The present invention includes a heat transfer method 5 in which the heat pipe is a gravity return heat pipe and the operating temperature range of the heat pipe is from about 70°C to about 100°C.

[0156] The present invention includes a heat transfer method 5, wherein the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is from about 70°C to about 100°C, and the heat sink is at a temperature of from about 15°C to about 80°C.

[0157] The present invention includes a heat transfer method 5 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is from about 70°C to about 100°C, and the heat sink is at a temperature of from about 15°C to about 40°C.

[0158] The present invention includes a heat transfer method 5 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is from about 70°C to about 100°C, and the heat sink is at a temperature of from about 20°C to about 30°C.

[0159] The present invention includes a heat transfer method 5 in which the heat pipe is a gravity return heat pipe and the operating temperature range of the heat pipe is about 85°C to about 95°C.

[0160] The present invention includes a heat transfer method 5, wherein the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is from about 85°C to about 100°C, and the heat sink is at a temperature of from about 15°C to about 80°C.

[0161] The present invention includes a heat transfer method 5 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is from about 85°C to about 100°C, and the heat sink is at a temperature of from about 15°C to about 40°C.

[0162] The present invention includes a heat transfer method 5 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is from about 85°C to about 100°C, and the heat sink is at a temperature of from about 20°C to about 30°C.

[0163] The present invention includes a heat transfer method 5 in which the heat pipe is a gravity return heat pipe and the operating temperature range of the heat pipe is about 85°C to about 95°C.

[0164] The present invention includes a heat transfer method 5, wherein the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is from about 85°C to about 95°C, and the heat sink is at a temperature of from about 15°C to about 80°C.

[0165] The present invention includes a heat transfer method 5 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is from about 85°C to about 95°C, and the heat sink is at a temperature of from about 15°C to about 40°C.

[0166] The present invention includes a heat transfer method 5 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is about 85°C to about 95°C, and the heat sink is at a temperature of about 20°C to about 30°C.

[0167] The present invention relates to a heat pipe that is a gravity return heat pipe, and the operating temperature of the heat pipe is The range includes heat transfer method 5 greater than about 85°C.

[0168] The present invention includes a heat transfer method 5 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is greater than about 85°C, and the heat sink is at a temperature between about 15°C and about 80°C.

[0169] The present invention includes a heat transfer method 5 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is greater than about 85°C, and the heat sink is at a temperature of about 15°C to about 40°C.

[0170] The present invention includes a heat transfer method 5 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is greater than about 85°C, and the heat sink is at a temperature of about 20°C to about 30°C.

[0171] The present invention includes a heat transfer method 5 in which the heat pipe is a gravity return heat pipe and the operating temperature range of the heat pipe is greater than about 88°C.

[0172] The present invention includes a heat transfer method 5 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is greater than about 88°C, and the heat sink is at a temperature of about 15°C to about 80°C.

[0173] The present invention includes a heat transfer method 5, wherein the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is greater than about 88°C, and the heat sink is at a temperature of about 15°C to about 40°C.

[0174] The present invention includes a heat transfer method 5 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is greater than about 88°C, and the heat sink is at a temperature of about 20°C to about 30°C.

[0175] The present invention includes a heat transfer method 5 in which the heat pipe is a gravity return heat pipe and the heat pipe operates with a heat capacity ratio of greater than or equal to 1. As used herein, heat capacity ratio means the ratio of the heat capacity of the working fluid in the heat pipe compared to the heat capacity of a heat pipe having a working fluid comprised of R-134a.

[0176] The present invention includes a heat transfer method 5, wherein the heat pipe is a gravity return heat pipe and has a thermal resistance of about 0.5°C / watt or less when measured as measured in Example 5 herein.

[0177] The present invention includes a heat transfer method 6 in which the operating temperature range of the heat pipe is from about 20°C to about 100°C.

[0178] The present invention includes a heat transfer method 6 in which the heat pipe is a gravity return heat pipe and the operating temperature range of the heat pipe is from about 20°C to about 100°C.

[0179] The present invention includes a heat transfer method 6 in which the heat pipe is a gravity return heat pipe and the operating temperature range of the heat pipe is from about 50°C to about 100°C.

[0180] The present invention includes a heat transfer method 6, wherein the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is from about 50°C to about 100°C, and the heat sink is at a temperature of from about 15°C to about 80°C.

[0181] The present invention includes a heat transfer method 6 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is from about 50°C to about 100°C, and the heat sink is at a temperature of from about 15°C to about 40°C.

[0182] The present invention includes a heat transfer method 6 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is from about 50°C to about 100°C, and the heat sink is at a temperature of from about 20°C to about 30°C.

[0183] The present invention includes a heat transfer method 6 in which the heat pipe is a gravity return heat pipe and the operating temperature range of the heat pipe is from about 70°C to about 100°C.

[0184] The present invention includes a heat transfer method 6, wherein the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is from about 70°C to about 100°C, and the heat sink is at a temperature of from about 15°C to about 80°C.

[0185] The present invention includes a heat transfer method 6 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is from about 70°C to about 100°C, and the heat sink is at a temperature of from about 15°C to about 40°C.

[0186] The present invention includes a heat transfer method 6 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is from about 70°C to about 100°C, and the heat sink is at a temperature of from about 20°C to about 30°C.

[0187] The present invention includes a heat transfer method 6 in which the heat pipe is a gravity return heat pipe and the operating temperature range of the heat pipe is about 85°C to about 95°C.

[0188] The present invention includes a heat transfer method 6, wherein the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is from about 85°C to about 100°C, and the heat sink is at a temperature of from about 15°C to about 80°C.

[0189] The present invention includes a heat transfer method 6 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is from about 85°C to about 100°C, and the heat sink is at a temperature of from about 15°C to about 40°C.

[0190] The present invention includes a heat transfer method 6 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is from about 85°C to about 100°C, and the heat sink is at a temperature of from about 20°C to about 30°C.

[0191] The present invention includes a heat transfer method 6 in which the heat pipe is a gravity return heat pipe and the operating temperature range of the heat pipe is about 85°C to about 95°C.

[0192] The present invention includes a heat transfer method 6, wherein the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is from about 85°C to about 95°C, and the heat sink is at a temperature of from about 15°C to about 80°C.

[0193] The present invention includes a heat transfer method 6 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is from about 85°C to about 95°C, and the heat sink is at a temperature of from about 15°C to about 40°C.

[0194] The present invention includes a heat transfer method 6 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is about 85°C to about 95°C, and the heat sink is at a temperature of about 20°C to about 30°C.

[0195] The present invention includes a heat transfer method 6 in which the heat pipe is a gravity return heat pipe and the operating temperature range of the heat pipe is greater than about 85°C.

[0196] The present invention includes a heat transfer method 6 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is greater than about 85°C, and the heat sink is at a temperature between about 15°C and about 80°C.

[0197] The present invention includes a heat transfer method 6, wherein the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is greater than about 85°C, and the heat sink is at a temperature of about 15°C to about 40°C.

[0198] The present invention includes a heat transfer method 6 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is greater than about 85°C, and the heat sink is at a temperature of about 20°C to about 30°C.

[0199] The present invention includes a heat transfer method 6 in which the heat pipe is a gravity return heat pipe and the operating temperature range of the heat pipe is greater than about 88°C.

[0200] The present invention includes a heat transfer method 6 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is greater than about 88°C, and the heat sink is at a temperature between about 15°C and about 80°C.

[0201] The present invention includes a heat transfer method 6 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is greater than about 88°C, and the heat sink is at a temperature of about 15°C to about 40°C.

[0202] The present invention includes a heat transfer method 6 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is greater than about 88°C, and the heat sink is at a temperature of about 20°C to about 30°C.

[0203] The present invention includes a heat transfer method 7 in which the heat pipe is a gravity return heat pipe and the heat pipe operates with a heat capacity ratio of greater than or equal to 1. As used herein, heat capacity ratio means the ratio of the heat capacity of the working fluid in the heat pipe compared to the heat capacity of a heat pipe having a working fluid comprised of R-134a.

[0204] The present invention includes a heat transfer method 7, wherein the heat pipe is a gravity return heat pipe and has a thermal resistance of about 0.5°C / watt or less when measured as measured in Example 5 herein.

[0205] The present invention includes a heat transfer method 8 in which the operating temperature range of the heat pipe is from about 20°C to about 100°C.

[0206] The present invention includes a heat transfer method 8 in which the heat pipe is a gravity return heat pipe and the operating temperature range of the heat pipe is from about 20°C to about 100°C.

[0207] The present invention relates to a heat pipe that is a gravity return heat pipe, and the operating temperature of the heat pipe is The range includes heat transfer method 8, which is about 50°C to about 100°C.

[0208] The present invention includes a heat transfer method 8, wherein the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is from about 50°C to about 100°C, and the heat sink is at a temperature of from about 15°C to about 80°C.

[0209] The present invention includes a heat transfer method 8 in which the heat pipe is a gravity return heat pipe, the heat pipe has an operating temperature range of about 50°C to about 100°C, and the heat sink is at a temperature of about 15°C to about 40°C.

[0210] The present invention includes a heat transfer method 8 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is from about 50°C to about 100°C, and the heat sink is at a temperature of from about 20°C to about 30°C.

[0211] The present invention includes a heat transfer method 8 in which the heat pipe is a gravity return heat pipe and the operating temperature range of the heat pipe is from about 70°C to about 100°C.

[0212] The present invention includes a heat transfer method 8, wherein the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is from about 70°C to about 100°C, and the heat sink is at a temperature of from about 15°C to about 80°C.

[0213] The present invention includes a heat transfer method 8 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is from about 70°C to about 100°C, and the heat sink is at a temperature of from about 15°C to about 40°C.

[0214] The present invention includes a heat transfer method 8 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is from about 70°C to about 100°C, and the heat sink is at a temperature of from about 20°C to about 30°C.

[0215] The present invention includes a heat transfer method 8 in which the heat pipe is a gravity return heat pipe and the operating temperature range of the heat pipe is from about 85°C to about 95°C.

[0216] The present invention includes a heat transfer method 8, wherein the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is from about 85°C to about 100°C, and the heat sink is at a temperature of from about 15°C to about 80°C.

[0217] The present invention includes a heat transfer method 8 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is from about 85°C to about 100°C, and the heat sink is at a temperature of from about 15°C to about 40°C.

[0218] The present invention includes a heat transfer method 8 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is from about 85°C to about 100°C, and the heat sink is at a temperature of from about 20°C to about 30°C.

[0219] The present invention includes a heat transfer method 8 in which the heat pipe is a gravity return heat pipe and the operating temperature range of the heat pipe is from about 85°C to about 95°C.

[0220] The present invention includes a heat transfer method 8, wherein the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is from about 85°C to about 95°C, and the heat sink is at a temperature of from about 15°C to about 80°C.

[0221] The present invention includes a heat transfer method 8 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is from about 85°C to about 95°C, and the heat sink is at a temperature of from about 15°C to about 40°C.

[0222] The present invention includes a heat transfer method 8 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is about 85°C to about 95°C, and the heat sink is at a temperature of about 20°C to about 30°C.

[0223] The present invention includes a heat transfer method 8 in which the heat pipe is a gravity return heat pipe and the operating temperature range of the heat pipe is greater than about 85°C.

[0224] The present invention includes a heat transfer method 8 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is greater than about 85°C, and the heat sink is at a temperature between about 15°C and about 80°C.

[0225] The present invention includes a heat transfer method 8, wherein the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is greater than about 85°C, and the heat sink is at a temperature of about 15°C to about 40°C.

[0226] The present invention includes a heat transfer method 8 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is greater than about 85°C, and the heat sink is at a temperature of about 20°C to about 30°C.

[0227] The present invention includes a heat transfer method 8 in which the heat pipe is a gravity return heat pipe and the operating temperature range of the heat pipe is greater than about 88°C.

[0228] The present invention includes a heat transfer method 8 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is greater than about 88°C, and the heat sink is at a temperature between about 15°C and about 80°C.

[0229] The present invention includes a heat transfer method 8, wherein the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is greater than about 88°C, and the heat sink is at a temperature of about 15°C to about 40°C.

[0230] The present invention includes a heat transfer method 8 in which the heat pipe is a gravity return heat pipe, the operating temperature range of the heat pipe is greater than about 88°C, and the heat sink is at a temperature of about 20°C to about 30°C.

[0231] The present invention includes a heat transfer method 8 in which the heat pipe is a gravity return heat pipe and the heat pipe operates with a heat capacity ratio of greater than or equal to 1. As used herein, heat capacity ratio means the ratio of the heat capacity of the working fluid in the heat pipe compared to the heat capacity of a heat pipe having a working fluid comprised of R-134a.

[0232] The present invention includes a heat transfer method 8, wherein the heat pipe is a gravity return heat pipe and has a thermal resistance of about 0.5°C / watt or less when measured as measured in Example 5 herein.

[0233] In a preferred embodiment, the present invention provides a method for transferring heat, comprising: (a) providing a liquid working fluid containing greater than 60% by weight of cis 1-chloro-3,3,3-trifluoropropene; and a condensing section containing a vapor working fluid comprising cis 1-chloro-3,3,3-trifluoropropene; (b) placing the evaporating section in thermal communication with a body, fluid, surface, etc. to be cooled; (c) placing the condensing section in thermal communication with a body, fluid, surface, etc. to be heated; and (d) removing heat from the body, fluid, surface, etc. to be cooled by operation of the heat pipe, wherein the operating temperature range of the capillary return heat pipe is greater than about 20°C.

[0234] The present invention includes a heat transfer method 1 in which the heat pipe is a capillary return heat pipe and the operating temperature range of the heat pipe is from about 20°C to about 100°C.

[0235] The present invention includes a heat transfer method 1 in which the heat pipe is a capillary return heat pipe and the operating temperature range of the heat pipe is from about 50°C to about 100°C.

[0236] The present invention includes a heat transfer method 2 in which the heat pipe is a capillary return heat pipe and the operating temperature range of the heat pipe is from about 20°C to about 100°C.

[0237] The present invention includes a heat transfer method 2 in which the heat pipe is a capillary return heat pipe and the operating temperature range of the heat pipe is from about 50°C to about 100°C.

[0238] The present invention includes a heat transfer method 3 in which the heat pipe is a capillary return heat pipe and the operating temperature range of the heat pipe is from about 20°C to about 100°C.

[0239] The present invention includes a heat transfer method 3 in which the heat pipe is a capillary return heat pipe and the operating temperature range of the heat pipe is from about 50°C to about 100°C.

[0240] The present invention includes a heat transfer method 4 in which the heat pipe is a capillary return heat pipe and the operating temperature range of the heat pipe is from about 20°C to about 100°C.

[0241] The present invention includes a heat transfer method 4 in which the heat pipe is a capillary return heat pipe and the operating temperature range of the heat pipe is from about 50°C to about 100°C.

[0242] The present invention includes a heat transfer method 5 in which the heat pipe is a capillary return heat pipe and the operating temperature range of the heat pipe is from about 20°C to about 100°C.

[0243] The present invention includes a heat transfer method 5 in which the heat pipe is a capillary return heat pipe and the operating temperature range of the heat pipe is from about 50°C to about 100°C.

[0244] The present invention includes a heat transfer method 6 in which the heat pipe is a capillary return heat pipe and the operating temperature range of the heat pipe is from about 20°C to about 100°C.

[0245] The present invention includes a heat transfer method 6 in which the heat pipe is a capillary return heat pipe and the operating temperature range of the heat pipe is from about 50°C to about 100°C.

[0246] The present invention includes a heat transfer method 7 in which the heat pipe is a capillary return heat pipe and the operating temperature range of the heat pipe is from about 20°C to about 100°C.

[0247] The present invention includes a heat transfer method 7 in which the heat pipe is a capillary return heat pipe and the operating temperature range of the heat pipe is from about 50°C to about 100°C.

[0248] The present invention includes a heat transfer method 8 in which the heat pipe is a capillary return heat pipe and the operating temperature range of the heat pipe is from about 20°C to about 100°C.

[0249] The present invention includes a heat transfer method 8 in which the heat pipe is a capillary return heat pipe and the operating temperature range of the heat pipe is from about 50°C to about 100°C.

[0250] In a preferred embodiment, the present invention comprises a method of transferring heat, the method comprising: (a) providing a heat pipe including an evaporating section containing a liquid working fluid comprising greater than about 60% by weight of cis 1-chloro-3,3,3-trifluoropropene; and a condensing section containing a vapor working fluid comprising cis 1-chloro-3,3,3-trifluoropropene; (b) placing the evaporating section in thermal communication with a body or fluid to be cooled; (c) placing the condensing section in thermal communication with a body, fluid, surface, etc. from which heat can be rejected; and (d) removing heat from the body, fluid, surface, etc. to be cooled by operation of the heat pipe; wherein the power limits of a heat pipe operating at about 50°C do not degrade by more than 40% relative percent over an operating temperature range of about 20°C to about 100°C, and more preferably by no more than 30% relative percent over an operating temperature range of about 20°C to about 100°C. Further, the method described in this paragraph of preferred embodiments is the same as the described method except that the liquid working fluid and the vapor working fluid each comprise, consist essentially of, or consist of at least about 70% by weight, or at least about 80% by weight, or at least about 90% by weight, or at least about 95% by weight, or at least about 97% by weight, or at least about 99.5% by weight cis 1-chloro-3,3,3-trifluoropropene.

[0251] As used herein, the term "power limit" refers to the maximum heat transfer possible in a heat pipe without a substantial imbalance in the amount of heat transfer occurring in the evaporation and condensation sections, such as may occur when, for example, in a particular application, the working fluid encounters a capillary limit where working fluid condensate cannot return to the evaporation section at the same rate as vapor is produced in the evaporation section.

[0252] In a preferred embodiment, the present invention comprises a method of transferring heat comprising: (a) providing a gravity return heat pipe including an evaporating section containing a liquid working fluid comprising greater than about 60% by weight of cis 1-chloro-3,3,3-trifluoropropene; and a condensing section containing a vapor working fluid comprising cis 1-chloro-3,3,3-trifluoropropene; (b) placing the evaporating section in thermal communication with a body or fluid to be cooled; (c) placing the condensing section in thermal communication with a body, fluid, surface, etc. from which heat can be rejected; and (d) removing heat from the body, fluid, surface, etc. to be cooled by operation of the heat pipe; wherein the power limits of the heat pipe operating at about 50°C do not degrade by more than 15% relative percent over an operating temperature range of about 50°C to about 100°C, more preferably by no more than 10% relative percent over an operating temperature range of about 50°C to about 100°C. Further, the method described in this paragraph of preferred embodiments is the same as the described method except that the liquid working fluid and the vapor working fluid each comprise, consist essentially of, or consist of at least about 70% by weight, or at least about 80% by weight, or at least about 90% by weight, or at least about 95% by weight, or at least about 97% by weight, or at least about 99.5% by weight cis 1-chloro-3,3,3-trifluoropropene.

[0253] As described in more detail below, Applicants have discovered that the methods, heat pipes, electronic devices, electronic components, systems, and compositions described herein can achieve high levels of operational effectiveness and efficiency for both capillary return and gravity return heat pipes, particularly for methods and systems involving cooling of small electronic components. One measure of effectiveness of heat pipe operation is the ability of the heat pipe to provide a high level of cooling when a heat load is applied, i.e., when an electronic component is turned on, preferably at a relatively rapid rate in some embodiments. Another measure of the effectiveness of heat pipe operation, particularly for methods and systems involving cooling small electronic components, is the ability to achieve a required level of cooling while maintaining a relatively small temperature difference (e.g., less than 5°C) between the evaporator section and the condenser section of the heat pipe. Another measure of the effectiveness of heat pipe operation, particularly for methods and systems involving cooling small electronic components, is the ability to achieve a required level of cooling while maintaining a temperature difference between the evaporator section and the heat sink at or below such a temperature difference when the heat pipe operates with R-134a as the working fluid. Applicants have discovered that the methods, systems, devices, components, and compositions of the present invention in preferred embodiments can provide highly desirable and unexpectedly superior performance with respect to one or more of these criteria.

[0254] In a preferred embodiment, the present invention comprises a method of transferring heat comprising: (a) providing a heat pipe including an evaporator section containing a liquid working fluid comprising at least about 60% by weight of cis 1-chloro-3,3,3-trifluoropropene; and a condenser section containing a vapor working fluid comprising at least about 60% by weight of cis 1-chloro-3,3,3-trifluoropropene; (b) placing the evaporator section in thermal communication with a body or fluid to be cooled; (c) placing the condenser section in thermal communication with a body, fluid, surface, etc. to be heated; and (d) removing heat from the body, fluid, surface, etc. to be cooled by operation of the heat pipe; wherein the performance of the heat pipe, as measured by the temperature difference between the evaporator section and the condenser section, is equal to or better than the performance of R-134a in the same heat pipe. Further, the method described in this paragraph of preferred embodiments is the same as the described method except that the liquid working fluid and the vapor working fluid each comprise, consist essentially of, or consist of at least about 70% by weight, or at least about 80% by weight, or at least about 90% by weight, or at least about 95% by weight, or at least about 97% by weight, or at least about 99.5% by weight cis 1-chloro-3,3,3-trifluoropropene.

[0255] In a preferred embodiment, the present invention comprises a method of transferring heat comprising: (a) providing a heat pipe including an evaporator section containing a liquid working fluid comprising at least about 60% by weight of cis 1-chloro-3,3,3-trifluoropropene; and a condenser section containing a vapor working fluid comprising at least about 60% by weight of cis 1-chloro-3,3,3-trifluoropropene; (b) placing the evaporator section in thermal communication with a body or fluid to be cooled; (c) placing the condenser section in thermal communication with a body, fluid, surface, etc. to be heated; and (d) removing heat from the body, fluid, surface, etc. to be cooled by operation of the heat pipe; wherein the performance of the heat pipe, as measured by the temperature difference between the evaporator section and the condenser section, is equal to or better than the performance of R-134a in the same heat pipe. Further, the method described in this paragraph of preferred embodiments is the same as the described method except that the liquid working fluid and the vapor working fluid each comprise, consist essentially of, or consist of at least about 70% by weight, or at least about 80% by weight, or at least about 90% by weight, or at least about 95% by weight, or at least about 97% by weight, or at least about 99.5% by weight cis 1-chloro-3,3,3-trifluoropropene.

[0256] In a preferred embodiment, the present invention is a method for transferring heat, comprising: (a) providing a heat pipe including an evaporating section containing a liquid working fluid comprising at least about 60% by weight of cis 1-chloro-3,3,3-trifluoropropene and a condensing section containing a vapor working fluid comprising at least about 60% by weight of cis 1-chloro-3,3,3-trifluoropropene; (b) placing the evaporating section in thermal communication with a body or fluid to be cooled; and (c) connecting the condensing section to the body, fluid, or surface to be heated. and (d) removing heat from the body, fluid, surface, etc., cooled by operation of the heat pipe, wherein the heat pipe has an operating temperature range of about −20° C. to 200° C. Further, the method described in this paragraph of preferred embodiments is the same as the described method except that the liquid working fluid and the vapor working fluid each comprise, consist essentially of, or consist of at least about 70% by weight, or at least about 80% by weight, or at least about 90% by weight, or at least about 95% by weight, or at least about 97% by weight, or at least about 99.5% by weight cis 1-chloro-3,3,3-trifluoropropene.

[0257] In a preferred embodiment, the present invention comprises a method of transferring heat, the method comprising: (a) providing a heat pipe including an evaporating section containing a liquid working fluid comprising at least about 60% by weight of cis 1-chloro-3,3,3-trifluoropropene; and a condensing section containing a vapor working fluid comprising at least about 60% by weight of cis 1-chloro-3,3,3-trifluoropropene; (b) placing the evaporating section in thermal communication with a body or fluid to be cooled; (c) placing the condensing section in thermal communication with a body, fluid, surface, etc. to be heated; and (d) removing heat from the body, fluid, surface, etc. to be cooled by operation of the heat pipe, wherein the operating temperature range of the heat pipe is about −0° C. to 140° C. Further, the method described in this paragraph of preferred embodiments is the same as the described method except that the liquid working fluid and the vapor working fluid each comprise, consist essentially of, or consist of at least about 70% by weight, or at least about 80% by weight, or at least about 90% by weight, or at least about 95% by weight, or at least about 97% by weight, or at least about 99.5% by weight cis 1-chloro-3,3,3-trifluoropropene.

[0258] In a preferred embodiment, the present invention comprises a method of transferring heat, the method comprising: (a) providing a heat pipe including an evaporating section containing a liquid working fluid comprising at least about 60% by weight of cis 1-chloro-3,3,3-trifluoropropene; and a condensing section containing a vapor working fluid comprising at least about 60% by weight of cis 1-chloro-3,3,3-trifluoropropene; (b) placing the evaporating section in thermal communication with a body or fluid to be cooled; (c) placing the condensing section in thermal communication with a body, fluid, surface, etc. to be heated; and (d) removing heat from the body, fluid, surface, etc. to be cooled by operation of the heat pipe, wherein the operating temperature range of the heat pipe is about 20°C to 140°C. Further, the method described in this paragraph of preferred embodiments is the same as the described method except that the liquid working fluid and the vapor working fluid each comprise, consist essentially of, or consist of at least about 70% by weight, or at least about 80% by weight, or at least about 90% by weight, or at least about 95% by weight, or at least about 97% by weight, or at least about 99.5% by weight cis 1-chloro-3,3,3-trifluoropropene.

[0259] The present invention, in a preferred embodiment, includes a method of transferring heat, comprising: (a) providing a heat pipe including an evaporating section containing a liquid working fluid comprising at least about 60% by weight of cis 1-chloro-3,3,3-trifluoropropene and a condensing section containing a vapor working fluid comprising at least about 60% by weight of cis 1-chloro-3,3,3-trifluoropropene; (b) placing the evaporating section in thermal communication with a body or fluid to be cooled; (c) placing the condensing section in thermal communication with a body, fluid, surface, etc. to be heated; and (d) removing heat from the body, fluid, surface, etc. to be cooled by operation of the heat pipe, wherein the operating temperature range of the heat pipe is about 40° C. to 140° C. Further, the method described in this paragraph of a preferred embodiment further includes a heat pipe in which the liquid working fluid and the vapor working fluid are each at least about 70% by weight, or at least about 80% by weight, or at least about 90% by weight, or at least about 95% by weight. %, or at least about 97% by weight, or at least about 99.5% by weight of cis 1-chloro-3,3,3-trifluoropropene.

[0260] The present invention includes a method of cooling an article using a heat pipe, the heat pipe containing the heat transfer composition as defined above, the heat pipe being a capillary return heat pipe, a gravity return heat pipe, a centripetal return heat pipe, an osmotic return heat pipe, a electrokinetic return heat pipe or a magnetic return heat pipe.

[0261] Preferably, the heat pipe is a capillary return or gravity return heat pipe.

[0262] The method of the invention particularly involves the cooling of electrical or electronic components, in particular electrical devices, electric vehicles, data centers or light emitting diodes. diodes, LEDs) or for spacecraft thermal management or heat recovery.

[0263] Where the method relates to cooling an electrical device, the method may particularly include cooling an insulated gate bipolar transistor (IGBT), a projector, or a game console computer.

[0264] When the method relates to cooling an electric vehicle, the method includes in particular cooling a battery, a motor or a power control unit (PCU) in the electric vehicle.

[0265] When the method relates to cooling a data center, the method may specifically include cooling a central processing unit (CPU), a graphic processing unit (GPU), memory, a blade, or a rack.

[0266] Where the method relates to cooling light emitting diodes (LEDs), the method particularly includes for cooling light emitting diode (LED) lights or quantum dot light emitting diode (QLED) TVs, organic light emitting diodes (OLEDs) or other displays that use heat pipes to enhance heat dissipation.

[0267] Where the method relates to the thermal management of a spacecraft, particularly a military or commercial spacecraft, the method may include, inter alia, the thermal management of a radar, a laser, a satellite, or a space station.

[0268] When the method relates to heat recovery, the method particularly includes data center heat recovery between hot fresh air and cool internal air.

[0269] Where the method relates to cooling a communications device, the method may include cooling radio frequency (RF) chips, cooling WiFi systems, cooling base stations, cooling mobile phones, or cooling switches, among others.

[0270] Where the method relates to refrigeration and / or freezer applications, the method may include, inter alia, defrosting, making ice, for example, improving air temperature uniformity in a refrigerated compartment.

[0271] Electronic Components As noted above, the present invention, in certain embodiments, relates to electronic components that are advantageously cooled by the heat pipes of the present invention. Accordingly, the present invention, in preferred embodiments, a component operating at a temperature above ambient temperature, the component including: (a) an electronic component that generates heat during operation to raise the temperature of the component above ambient temperature; and (b) a heat pipe including an evaporator section containing a liquid working fluid comprising greater than 60% by weight of cis 1-chloro-3,3,3-trifluoropropene and a condenser section containing a vapor working fluid comprising cis 1-chloro-3,3,3-trifluoropropene, the evaporator section being thermally connected to the electronic component, the condenser section being thermally connected to a heat sink, and the heat pipe being Further, in preferred embodiments, the electronic device described in this paragraph is the same as the described method except that the liquid working fluid and the vapor working fluid each comprise, consist essentially of, or consist of at least about 70% by weight, or at least about 80% by weight, or at least about 90% by weight, or at least about 95% by weight, or at least about 97% by weight, or at least about 99.5% by weight, of cis 1-chloro-3,3,3-trifluoropropene.

[0272] In a preferred embodiment, the present invention includes an electronic device comprising a component operating at a temperature higher than ambient temperature, the component comprising: (a) an electronic component that generates heat during operation, causing the temperature of the component to be higher than ambient temperature; and (b) a heat pipe including an evaporator section containing a liquid working fluid comprising at least 60% by weight of cis 1-chloro-3,3,3-trifluoropropene and a condenser section containing a vapor working fluid comprising at least 60% by weight of cis 1-chloro-3,3,3-trifluoropropene, wherein the evaporator section is thermally connected to the electronic component and the condenser section is thermally connected to a heat sink, the heat sink having a temperature of about 20°C to about 100°C, more preferably about 50°C to about 100°C, and the operating temperature range of the heat pipe is 20°C to 100°C. Further, the electronic device described in this paragraph of preferred embodiments is the same as the described method except that the liquid working fluid and the vapor working fluid each comprise, consist essentially of, or consist of at least about 70% by weight, or at least about 80% by weight, or at least about 90% by weight, or at least about 95% by weight, or at least about 97% by weight, or at least about 99.5% by weight cis 1-chloro-3,3,3-trifluoropropene.

[0273] In a preferred embodiment, the present invention includes an electronic device comprising a component operating at a temperature above ambient temperature, the component comprising: (a) an electronic component that generates heat during operation, causing the temperature of the component to be above ambient temperature; and (b) a capillary return heat pipe including an evaporator section containing a liquid working fluid comprising greater than 60% by weight of cis 1-chloro-3,3,3-trifluoropropene and a condenser section containing a vapor working fluid comprising cis 1-chloro-3,3,3-trifluoropropene, wherein the evaporator section is thermally connected to the electronic component and the condenser section is thermally connected to a heat sink, the heat sink having a temperature of about 20°C to about 100°C, more preferably about 50°C to about 100°C, and wherein the operating temperature range of the capillary return heat pipe is greater than about 20°C. Further, the electronic device described in this paragraph of preferred embodiments is the same as the described method except that the liquid working fluid and the vapor working fluid each comprise, consist essentially of, or consist of at least about 70% by weight, or at least about 80% by weight, or at least about 90% by weight, or at least about 95% by weight, or at least about 97% by weight, or at least about 99.5% by weight cis 1-chloro-3,3,3-trifluoropropene.

[0274] In a preferred embodiment, the present invention relates to a component operating at a temperature above ambient temperature, the component comprising: (a) an electronic component that generates heat during operation, causing the temperature of the component to be above ambient temperature; (b) an evaporation section containing a liquid working fluid comprising greater than 60% by weight of cis 1-chloro-3,3,3-trifluoropropene; and a capillary return heat pipe including a condenser section containing a vapor working fluid comprising trifluoropropene, wherein the evaporator section is thermally connected to the electronic component and the condenser section is thermally connected to a heat sink, the heat sink being at a temperature of about 20° C. to about 100° C., more preferably at a temperature of about 50° C. to about 100° C., and the operating temperature range of the capillary return heat pipe is about 20° C. to about 100° C. Further, the electronic device described in this paragraph of preferred embodiments is the same as the described method except that the liquid working fluid and the vapor working fluid each comprise, consist essentially of, or consist of at least about 70% by weight, or at least about 80% by weight, or at least about 90% by weight, or at least about 95% by weight, or at least about 97% by weight, or at least about 99.5% by weight cis 1-chloro-3,3,3-trifluoropropene.

[0275] In a preferred embodiment, the present invention includes an electronic device comprising a component operating at a temperature higher than ambient temperature, the component comprising: (a) an electronic component that generates heat during operation, causing the temperature of the component to be higher than ambient temperature; and (b) a gravity return heat pipe including an evaporator section containing a liquid working fluid comprising greater than 60% by weight of cis 1-chloro-3,3,3-trifluoropropene and a condenser section containing a vapor working fluid comprising cis 1-chloro-3,3,3-trifluoropropene, wherein the evaporator section is thermally connected to the electronic component and the condenser section is thermally connected to a heat sink, the heat sink having a temperature of about 20°C to about 100°C, more preferably about 50°C to about 100°C, and the operating temperature range of the gravity return heat pipe is greater than about 40°C. Further, the electronic device described in this paragraph of preferred embodiments is the same as the described method except that the liquid working fluid and the vapor working fluid each comprise, consist essentially of, or consist of at least about 70% by weight, or at least about 80% by weight, or at least about 90% by weight, or at least about 95% by weight, or at least about 97% by weight, or at least about 99.5% by weight cis 1-chloro-3,3,3-trifluoropropene.

[0276] In a preferred embodiment, the present invention includes an electronic device comprising: (a) an electronic component that operates at a temperature higher than ambient temperature, the electronic component generating heat during operation to raise the temperature of the component above ambient temperature; and (b) a gravity return heat pipe including an evaporator section containing a liquid working fluid comprising greater than 60% by weight of cis 1-chloro-3,3,3-trifluoropropene and a condenser section containing a vapor working fluid comprising cis 1-chloro-3,3,3-trifluoropropene, wherein the evaporator section is thermally connected to the electronic component and the condenser section is thermally connected to a heat sink, the heat sink having a temperature of about 20°C to about 100°C, more preferably about 50°C to about 100°C, and the gravity return heat pipe has an operating temperature range of about 40°C to 100°C. Further, the electronic device described in this paragraph of preferred embodiments is the same as the described method except that the liquid working fluid and the vapor working fluid each comprise, consist essentially of, or consist of at least about 70% by weight, or at least about 80% by weight, or at least about 90% by weight, or at least about 95% by weight, or at least about 97% by weight, or at least about 99.5% by weight cis 1-chloro-3,3,3-trifluoropropene.

[0277] The present invention includes an electronic device comprising an electronic component and a heat pipe of the present invention thermally connected to the device for cooling the device during operation. As used herein, the term "electronic device" means a device that operates or generates electricity through the flow of electricity. Accordingly, a preferred embodiment of the present invention comprises: (a) an insulated gate bipolar transistor (IGBT) that generates heat during operation and increases in temperature above ambient temperature; and (b) a liquid working fluid comprising at least about 60% by weight of cis 1-chloro-3,3,3-trifluoropropene. and a condenser section containing a vapor working fluid comprising at least about 60% by weight of cis 1-chloro-3,3,3-trifluoropropene, wherein the evaporator section is thermally connected to the IGBT and the condenser section is thermally connected to a heat sink at a temperature lower than that of the IGBT, and the operating temperature range of the heat pipe is about 20° C. to about 100° C. Further, the IGBT described in this paragraph of preferred embodiments is the same as the described method except that the liquid working fluid and the vapor working fluid each comprise, consist essentially of, or consist of at least about 70% by weight, or at least about 80% by weight, or at least about 90% by weight, or at least about 95% by weight, or at least about 97% by weight, or at least about 99.5% by weight of cis 1-chloro-3,3,3-trifluoropropene.

[0278] A preferred embodiment of the present invention includes a projector comprising: (a) at least one electronic component that generates heat during operation and whose temperature rises above ambient temperature; and (b) a heat pipe, preferably a capillary return heat pipe or a gravity return heat pipe or a capillary / gravity return heat pipe, comprising: (a) an evaporator section containing a liquid working fluid comprising at least about 60% by weight of cis 1-chloro-3,3,3-trifluoropropene; and (b) a condenser section containing a vapor working fluid comprising at least about 60% by weight of cis 1-chloro-3,3,3-trifluoropropene; wherein the evaporator section is thermally connected to the at least one electronic component and the condenser section is thermally connected to a heat sink at a temperature lower than that of the at least one electronic component; and wherein the operating temperature range of the heat pipe is from about 20°C to about 100°C. Further, the projector described in this paragraph of preferred embodiments is the same as the described method except that the liquid working fluid and the vapor working fluid each comprise, consist essentially of, or consist of at least about 70% by weight, or at least about 80% by weight, or at least about 90% by weight, or at least about 95% by weight, or at least about 97% by weight, or at least about 99.5% by weight cis 1-chloro-3,3,3-trifluoropropene.

[0279] A preferred embodiment of the present invention includes a game console computer comprising: (a) at least one electronic component that generates heat during operation and whose temperature rises above ambient temperature; and (b) a heat pipe, preferably a capillary return heat pipe or a gravity return heat pipe or a capillary / gravity return heat pipe, comprising: (a) an evaporator section containing a liquid working fluid comprising at least about 60% by weight of cis 1-chloro-3,3,3-trifluoropropene; and (b) a condenser section containing a vapor working fluid comprising at least about 60% by weight of cis 1-chloro-3,3,3-trifluoropropene; wherein the evaporator section is thermally connected to the at least one electronic component; and the condenser section is thermally connected to a heat sink at a temperature lower than that of the at least one electronic component; and the operating temperature range of the heat pipe is from about 20°C to about 100°C. Further, the game console computer described in this paragraph of preferred embodiments is the same as the described method except that the liquid working fluid and the vapor working fluid each comprise, consist essentially of, or consist of at least about 70% by weight, or at least about 80% by weight, or at least about 90% by weight, or at least about 95% by weight, or at least about 97% by weight, or at least about 99.5% by weight cis 1-chloro-3,3,3-trifluoropropene.

[0280] A preferred embodiment of the present invention is a heat pump comprising: (a) at least one electronic component that generates heat during operation and that increases in temperature above ambient temperature, preferably selected from a battery, a motor, or a power control unit (PCU); and (b) a heat pump comprising: an evaporator section containing a liquid working fluid comprising at least about 60% by weight of cis 1-chloro-3,3,3-trifluoropropene; and a condenser section containing a vapor working fluid comprising at least about 60% by weight of cis 1-chloro-3,3,3-trifluoropropene. and a heat pipe, preferably a capillary return heat pipe or a gravity return heat pipe or a capillary / gravity return heat pipe, wherein the evaporator section is thermally connected to the at least one electronic component and the condenser section is thermally connected to a heat sink at a temperature lower than that of the at least one electronic component, and the operating temperature range of the heat pipe is from about 20° C. to about 100° C. Further, the game console computer described in this paragraph of a preferred embodiment is the same as the described method except that the liquid working fluid and the vapor working fluid each comprise, consist essentially of, or consist of at least about 70% by weight, or at least about 80% by weight, or at least about 90% by weight, or at least about 95% by weight, or at least about 97% by weight, or at least about 99.5% by weight cis 1-chloro-3,3,3-trifluoropropene.

[0281] A preferred embodiment of the present invention includes (a) an at-center electronic component that generates heat during operation and whose temperature rises above ambient temperature, preferably including a central processing unit (CPU), a graphics processing unit (GPU), a memory, a blade or rack, or a combination thereof; and (b) a heat pipe, preferably a capillary return heat pipe or a gravity return heat pipe or a capillary / gravity return heat pipe, including an evaporator section containing a liquid working fluid comprising at least about 60% by weight of cis 1-chloro-3,3,3-trifluoropropene and a condenser section containing a vapor working fluid comprising at least about 60% by weight of cis 1-chloro-3,3,3-trifluoropropene, wherein the evaporator section is thermally connected to the at least one electronic component and the condenser section is thermally connected to a heat sink at a temperature lower than that of the at least one electronic component, and the operating temperature range of the heat pipe is about 20°C to about 100°C. Further, the electronic components described in this paragraph of preferred embodiments are the same as the described methods except that the liquid working fluid and the vapor working fluid each comprise, consist essentially of, or consist of at least about 70% by weight, or at least about 80% by weight, or at least about 90% by weight, or at least about 95% by weight, or at least about 97% by weight, or at least about 99.5% by weight cis 1-chloro-3,3,3-trifluoropropene.

[0282] A preferred embodiment of the present invention includes: (a) an electronic component of a display device, such as a television, computer display, or the like, that generates heat during operation and increases in temperature above ambient temperature, the electronic component being preferably selected from light-emitting diodes (LEDs), quantum dot light-emitting diodes (QLEDs), and organic light-emitting diodes (OLEDs); and (b) a heat pipe, preferably a capillary return heat pipe or a gravity return heat pipe or a capillary / gravity return heat pipe, including an evaporator section containing a liquid working fluid comprising at least about 60% by weight of cis 1-chloro-3,3,3-trifluoropropene and a condenser section containing a vapor working fluid comprising at least about 60% by weight of cis 1-chloro-3,3,3-trifluoropropene, wherein the evaporator section is thermally connected to the at least one electronic component and the condenser section is thermally connected to a heat sink at a temperature lower than that of the at least one electronic component, and the operating temperature range of the heat pipe is about 20°C to about 100°C. Further, the electronic components described in this paragraph of preferred embodiments are the same as the described methods except that the liquid working fluid and the vapor working fluid each comprise, consist essentially of, or consist of at least about 70% by weight, or at least about 80% by weight, or at least about 90% by weight, or at least about 95% by weight, or at least about 97% by weight, or at least about 99.5% by weight cis 1-chloro-3,3,3-trifluoropropene.

[0283] In preferred embodiments, the methods, systems, heat pipes and compositions are used in connection with: Thermal management of spacecraft devices, in particular military or commercial spacecraft, in particular thermal management, more particularly cooling of radars, lasers, satellites or space stations, Heat recovery, especially from data centers, where the heat recovery is between hot fresh air and cold internal air, Communication devices, in particular cooling radio frequency (RF) chips, WiFi systems, base station cooling, mobile phones or switch cooling; Refrigeration and / or freezer applications such as defrosting, making ice, increasing and / or maintaining uniformity of air temperature within a refrigerator compartment, for example.

[0284] heat pipe The present invention includes a heat pipe including an evaporator section containing a liquid working fluid comprising at least about 60% by weight of cis 1-chloro-3,3,3-trifluoropropene and a condenser section containing a vapor working fluid of at least about 60% by weight of cis 1-chloro-3,3,3-trifluoropropene. Further, the heat pipe described in this paragraph of preferred embodiments is the same as the described method except that the liquid working fluid and the vapor working fluid each comprise, consist essentially of, or consist of at least about 70% by weight, or at least about 80% by weight, or at least about 90% by weight, or at least about 95% by weight, or at least about 97% by weight, or at least about 99.5% by weight of cis 1-chloro-3,3,3-trifluoropropene.

[0285] In a preferred embodiment, the evaporative section and condensing section of any heat pipe described herein are distinct portions of a sealed vessel, and the working fluid of the present invention is permanently sealed within the vessel. As used herein, the term "vessel" refers to a container or combination of vessels, conduits, etc. that allow liquid and vapor transfer between the evaporative section and the condensing section, as described herein. Additionally, the vessel may include various fins, etc., known to those skilled in the art, to enhance heat transfer between the evaporative section and the item, surface, or body to be cooled, and / or between the condensing section and the item, surface, or body from which heat is rejected, i.e., a heat sink.

[0286] In a preferred embodiment, the present invention provides a gravity return heat pipe including an evaporator section containing a liquid working fluid comprising at least about 60% by weight of cis 1-chloro-3,3,3-trifluoropropene and a condenser section containing a vapor working fluid of at least about 60% by weight of cis 1-chloro-3,3,3-trifluoropropene. Further, the heat pipe described in this paragraph of a preferred embodiment is the same as the described method except that the liquid working fluid and the vapor working fluid each comprise, consist essentially of, or consist of at least about 70% by weight, or at least about 80% by weight, or at least about 90% by weight, or at least about 95% by weight, or at least about 97% by weight, or at least about 99.5% by weight of cis 1-chloro-3,3,3-trifluoropropene.

[0287] In a preferred embodiment, the present invention provides a capillary return heat pipe including an evaporating section containing a liquid working fluid comprising at least about 60% by weight of cis 1-chloro-3,3,3-trifluoropropene, and a condensing section containing a vapor working fluid of at least about 60% by weight of cis 1-chloro-3,3,3-trifluoropropene. Further, the method described in this paragraph of the preferred embodiment is the same as the described method except that the liquid working fluid and the vapor working fluid each comprise, consist essentially of, or consist of at least about 70% by weight, or at least about 80% by weight, or at least about 90% by weight, or at least about 95% by weight, or at least about 97% by weight, or at least about 99.5% by weight of cis 1-chloro-3,3,3-trifluoropropene.

[0288] In a preferred embodiment, the present invention comprises an evaporation section containing a liquid working fluid comprising at least about 60% by weight of cis 1-chloro-3,3,3-trifluoropropene and a vapor working fluid of at least about 60% by weight of cis 1-chloro-3,3,3-trifluoropropene. and a condensing section containing the evaporating fluid. As used herein, the term "capillary / gravity return" heat pipe refers to a heat pipe in which the liquid working fluid returns to the evaporating section as a result of at least gravity and capillary forces. Embodiments of the invention include capillary / gravity return heat pipes in which the liquid working fluid returns to the evaporating section as a result of gravity and capillary forces alone. Furthermore, the heat pipe described in this paragraph of preferred embodiments is the same as the described method except that the liquid working fluid and the vapor working fluid each comprise, consist essentially of, or consist of at least about 70% by weight, or at least about 80% by weight, or at least about 90% by weight, or at least about 95% by weight, or at least about 97% by weight, or at least about 99.5% by weight, cis 1-chloro-3,3,3-trifluoropropene.

[0289] For purposes of the present invention, compositions comprising, consisting essentially of, or consisting of cis 1-chloro-3,3,3-trifluoropropene can also be provided using centripetal-driven heat pipes (or rotary heat pipes), electrokinetically-driven heat pipes (electrohydrodynamic heat pipes and electroosmotic heat pipes), magnetically-driven heat pipes, oscillating heat pipes, or osmotic heat pipes, and combinations of these with each other, and / or gravity-return heat pipes, capillary-return heat pipes, and / or gravity-return / capillary-return heat pipes.

[0290] In preferred embodiments, the present invention comprises a heat pipe comprising an enclosed vessel containing a working fluid comprising at least about 60% by weight of cis-1-chloro-3,3,3-trifluoropropene, the enclosed vessel having at least one wall for transferring heat to and / or from the working fluid, the at least one wall having a thickness of less than about 0.065 mm, and even more preferably less than about 0.05 mm to about 0.002 mm, the vessel being cylindrical and having an outer diameter of about 5 mm. Heat pipes according to these preferred embodiments are advantageous because such thin walls allow for a reduction in heat pipe thermal resistance, which has other commercial and environmental benefits.

[0291] One measure of heat pipe performance can be measured by thermal resistance, which is defined by the following equation: R=(Twe-Twc) / Q according to standard GB / T14812-2008. During the ceremony, Twc is the average temperature of the heat pipe condensing section in °C according to standard GB / T14812-2008, Twe is the average temperature of the heat pipe evaporator section ℃ according to standard GB / T14812-2008, Q is the heat pipe heat transfer capacity according to standard GB / T14812-2008.

[0292] Applicants have found that with the exception of heat pipe performance, including as measured by thermal resistance, is achieved in accordance with preferred embodiments of the present invention.

[0293] Another measurement that can be used to estimate the ability of a particular working fluid to operate effectively within a heat pipe for a selected operating temperature is called the Merit Number (described in more detail below), which is a number that reflects the effect the working fluid has on heat pipe performance, including the estimated maximum power transfer for a given operating temperature. Specifically, the amount of power a heat pipe can carry is governed by the minimum heat pipe limit at a given temperature. The Merit Number can be used to estimate the maximum heat pipe power when the heat pipe is capillary limited relative to the capillary return heat pipe. The capillary limit is reached when the sum of the liquid, vapor, and gravity drop equals the capillary pumping capacity. The Merit Number estimates the working fluid performance limit inside the heat pipe, ignoring vapor and gravity pressures and assuming that the capillary pumping capacity is equal to the liquid pressure drop. Nevertheless, to provide confirmation of the unexpected results achieved in accordance with the present invention, applicants used experimentally generated data regarding the properties of cis 1-chloro-3,3,3-trifluoropropene to determine figures of merit for various operating temperatures selected by applicants.

[0294] Applicants have found that for heat pipe operation having an operating temperature range greater than about 40°C, preferably from about 40°C to about 100°C, heat pipes according to the present invention having only gravity return (e.g., no capillary action) have a figure of merit equal to or greater than R134a. Furthermore, Applicants have also surprisingly found that for heat pipe operation having an operating temperature range greater than about 20°C, preferably from about 20°C to about 100°C, heat pipes according to the present invention having only capillary return (e.g., no gravity return contribution) have a figure of merit equal to or greater than R134a. The details of these unexpected results are described in more detail below. Another advantage achieved by preferred methods, apparatus, and compositions of the present invention is the ability of the heat pipe to operate effectively at lower internal pressures compared to R134a, thereby enabling the use of thinner heat pipe walls and improving the overall thermal conductivity of the heat pipe.

[0295] The present invention further relates to a heat pipe containing a working fluid, the working fluid comprising at least about 60% by weight cis 1-chloro-3,3,3-trifluoropropene.

[0296] The present invention relates to a heat pipe containing a working fluid, the working fluid comprising at least about 70% by weight cis 1-chloro-3,3,3-trifluoropropene.

[0297] The present invention relates to a heat pipe containing a working fluid, the working fluid comprising at least about 80% by weight cis 1-chloro-3,3,3-trifluoropropene.

[0298] The present invention relates to a heat pipe containing a working fluid, the working fluid comprising at least about 90% by weight cis 1-chloro-3,3,3-trifluoropropene.

[0299] The present invention relates to a heat pipe containing a working fluid, the working fluid comprising at least about 95% by weight cis 1-chloro-3,3,3-trifluoropropene.

[0300] The present invention relates to a heat pipe containing a working fluid, the working fluid comprising at least about 97% by weight cis 1-chloro-3,3,3-trifluoropropene.

[0301] The present invention relates to a heat pipe containing a working fluid, the working fluid comprising at least about 99.5% by weight cis 1-chloro-3,3,3-trifluoropropene.

[0302] The present invention relates to a heat pipe containing a working fluid, the working fluid consisting essentially of cis 1-chloro-3,3,3-trifluoropropene.

[0303] The present invention relates to a heat pipe containing a working fluid, the working fluid comprising cis 1-chloro-3,3,3-trifluoropropene.

[0304] The heat pipe is selected from a capillary return heat pipe, a gravity return heat pipe, a centripetal return heat pipe, an osmotic return heat pipe, an electrokinetic return heat pipe, and a magnetic return heat pipe.

[0305] The heat pipe is preferably a capillary return or gravity return heat pipe.

[0306] Working fluid composition The present invention involves the use of a composition comprising at least about 60% by weight of cis 1-chloro-3,3,3-trifluoropropene as a working fluid in a heat pipe.

[0307] The present invention further includes the use of a composition comprising at least about 70% by weight of cis 1-chloro-3,3,3-trifluoropropene as a working fluid in a heat pipe.

[0308] The present invention further includes the use of a composition comprising at least about 80% by weight cis 1-chloro-3,3,3-trifluoropropene as a working fluid in a heat pipe.

[0309] The present invention further includes the use of a composition comprising at least about 90% by weight cis 1-chloro-3,3,3-trifluoropropene as a working fluid in a heat pipe.

[0310] The present invention further includes the use of a composition comprising at least about 95% by weight cis 1-chloro-3,3,3-trifluoropropene as a working fluid in a heat pipe.

[0311] The present invention further includes the use of a composition comprising at least about 97% by weight cis 1-chloro-3,3,3-trifluoropropene as a working fluid in a heat pipe.

[0312] The present invention further includes the use of a composition comprising at least about 99.5% by weight cis 1-chloro-3,3,3-trifluoropropene as a working fluid in a heat pipe.

[0313] The present invention further includes the use of a composition consisting essentially of cis 1-chloro-3,3,3-trifluoropropene as a working fluid in a heat pipe.

[0314] The present invention further includes the use of a composition comprising cis 1-chloro-3,3,3-trifluoropropene as a working fluid in a heat pipe.

[0315] Electronic Devices working fluid Accordingly, the present invention provides a working fluid for heat pipes, particularly gravity return heat pipes, capillary return heat pipes, and gravity return / capillary return heat pipes, comprising at least about 60% by weight of cis 1-chloro-3,3,3-trifluoropropene. Cis 1-chloro-3,3,3-trifluoropropene is a known compound and can be produced according to one or more of several known methods, including, but not limited to, the method disclosed in commonly assigned US 2014 / 0275644.

[0316] Thus, the compositions of the present invention are particularly provided for use in applications requiring operating temperatures above about 100°C, including cooling insulated gate bipolar transistors (IGBTs), projectors, motors, power control units (PCUs), light emitting diode (LED) lights, quantum dot light emitting diodes (QLEDs), or cooling radio frequency (RF) chips, WiFi systems, base stations, cooling communication devices including mobile phones or switches, or for the thermal management of spacecraft, e.g., radars, satellites, space stations, etc.

[0317] The compositions comprising cis 1-chloro-3,3,3-trifluoropropene of the present invention are particularly advantageous for use in capillary return heat pipes, The number of merits for cis 1-chloro-3,3,3-trifluoropropene is greater than that for R134a at temperatures greater than about 20°C, for example, the number of merits for cis 1-chloro-3,3,3-trifluoropropene is at least about 65% greater than that for R134a at about 50°C. Cis-1-chloro-3,3,3-trifluoropropene exhibits lower internal pressures than R134a, allowing for the use of thinner heat pipe walls. Specifically, at approximately 50°C, R134a requires a minimum wall thickness of approximately 0.065 mm, while cis-1-chloro-3,3,3-trifluoropropene requires a minimum wall thickness of approximately 0.002 mm for a pipe with an outer diameter of approximately 5 mm. This reduces the thermal resistance of the heat pipe. Furthermore, heat pipes can be produced using less metal, which offers both commercial and environmental benefits. The number of merit for cis-1-chloro-3,3,3-trifluoropropene is consistent between operating temperatures of about 40° C. and about 140° C., allowing its use in applications with operating temperatures above about 100° C. For example, as the operating temperature changes from about 40° C. to about 80° C., the number of merit for R134a decreases by about 75% compared to about 5% for cis-1-chloro-3,3,3-trifluoropropene.

[0318] Accordingly, the present invention provides the use of a composition comprising at least about 95% by weight of 1-chloro-3,3,3-trifluoropropene, wherein the 1-chloro-3,3,3-trifluoropropene is at least about 90% by weight of cis 1-chloro-3,3,3-trifluoropropene, in a heat pipe having an operating temperature of about -20°C to about 200°C.

[0319] The present invention further provides the use of the composition as defined above in a capillary return heat pipe, wherein the operating temperature of the heat pipe is from about 0°C to about 140°C, preferably from about 20°C to about 140°C, or from about 40°C to about 80°C.

[0320] Compositions containing cis 1-chloro-3,3,3-trifluoropropene of the present invention are particularly advantageous for use in gravity return heat pipes, as follows. The number of merit for cis 1-chloro-3,3,3-trifluoropropene is higher than that for R134a at temperatures greater than about 40° C. For example, the number of merit for cis 1-chloro-3,3,3-trifluoropropene is about 22% higher than that for R134a at about 80° C. Cis-1-chloro-3,3,3-trifluoropropene exhibits lower internal pressures than R134a, allowing for the use of thinner heat pipe walls. Specifically, at approximately 50°C, R134a requires a minimum wall thickness of approximately 0.065 mm, while cis-1-chloro-3,3,3-trifluoropropene requires a minimum wall thickness of approximately 0.002 mm for a pipe with an outer diameter of approximately 5 mm. This reduces the thermal resistance of the heat pipe. Furthermore, heat pipes can be produced using less metal, which offers both commercial and environmental benefits. The number of merit for cis-1-chloro-3,3,3-trifluoropropene is consistent between operating temperatures of about 40° C. and about 140° C., allowing its use in applications with operating temperatures above about 100° C. For example, as the operating temperature changes from about 40° C. to about 80° C., the number of merit for R134a decreases by about 23% compared to about 6% for cis-1-chloro-3,3,3-trifluoropropene.

[0321] Accordingly, the present invention provides the use of a composition comprising at least about 95% by weight of 1-chloro-3,3,3-trifluoropropene, wherein the 1-chloro-3,3,3-trifluoropropene is at least about 90% by weight of cis 1-chloro-3,3,3-trifluoropropene, in a heat pipe having an operating temperature of about -20°C to about 200°C.

[0322] The present invention further provides the use of the composition as defined above in a capillary return heat pipe, wherein the operating temperature of the heat pipe is from about 0°C to about 140°C, preferably from about 20°C to about 140°C, or from about 40°C to about 80°C.

[0323] Therefore, the working fluid of the present invention has a viscosity of about 1000 or less, preferably about 750 or less, and more preferably Preferably, it has a global warming potential (GWP) of about 500 or less, and even more preferably about 150 or less. As used herein, "GWP" is measured relative to that of carbon dioxide and over a 100-year time horizon, as defined in "The Scientific Assessment of Ozone Depletion, 2002, a report of the World Meteorological Association's Global Ozone Research and Monitoring Project," which is incorporated herein by reference.

[0324] Thus, the compositions of the present invention have an Ozone Depletion Potential (ODP) of about 0.05 or less, preferably about 0.02 or less, and even more preferably about zero. As used herein, "ODP" is as defined in "The Scientific Assessment of Ozone Depletion, 2002, A report of the World Meteorological Association's Global Ozone Research and Monitoring Project," which is incorporated herein by reference.

[0325] Heat pipe preparation method The present invention further relates to a process for preparing a heat pipe containing a working fluid of the present invention, the working fluid being as defined above, the process comprising adding the working fluid to the heat pipe.

[0326] Preferably, any contents of the heat pipe are removed under vacuum prior to the adding step. Alternatively, the working fluid can be added to the heat pipe and then heated to remove air from the heat pipe.

[0327] The adding step preferably includes adding working fluid to the heat pipe until the design weight of the working fluid is contained within the heat pipe. While it is contemplated that the amount of working fluid may vary depending on, among other things, the specific heat pipe design, the particular body to be cooled, and the expected ambient conditions, preferably, in embodiments involving cooling electronic devices, the working fluid is present within the heat pipe in an amount of about 1 to about 2000 grams. Alternatively, in embodiments involving cooling electronic devices, including electronic communication systems such as Wi-Fi systems, the working fluid is present within the heat pipe in an amount of about 2 to about 500 grams, or about 2 to about 100 grams, about 10 to about 80 grams, about 20 to about 60 grams, or about 30 to about 50 grams. The heat pipe is then preferably sealed. The heat pipe may be sealed, for example, by soldering or pressure extrusion.

[0328] The present invention is further illustrated by the following non-limiting examples. [Example]

[0329] Comparative Example 1 - Capillary heat pipe with R-134a as working fluid at 50°C A capillary heat pipe having a working fluid consisting essentially of HFC-134a and having no substantial gravity return assistance for the return of the liquid phase working fluid from the condenser to the evaporator is evaluated at an operating temperature of 50°C. The required parameters, i.e., liquid fluid density, liquid fluid conductivity, liquid fluid viscosity, and fluid latent heat, are performed at the specified temperature and the temperature difference along the heat pipe is assumed to be negligible as explained by D.A. Reay, P.A. Kew, and R.J. McGlen, Heat Pipes Theory, Design and Applications, Sixth edition, UK: Elsevier, 2014. To the extent required, published and publicly available information on R-134a and specific information regarding operating temperatures is provided by NIST (National Institute of Standards and Technology). Estimated using Refprop 9.1, developed by the National Institute of Standards and Technology, USA (https: / / www.nist.gov / refpropic).

[0330] The operating pressure for this configuration with R-134a as the working fluid was determined to be 1317.9 KPa as determined by Refprop 9.1.

[0331] Based on the operating pressure, the maximum wall thickness is estimated using standard ASME B31.3 as follows:

[0332]

number

[0333] During the ceremony, t is the minimum wall thickness required (in inches) P is the design pressure (Psig), which is equal to the 50°C saturation pressure of the working fluid in this calculation. D is the outside diameter of the pipe in inches S is the allowable stress in the pipe material (Psi), equal to 6700 psi for aluminum alloy 3003 in Table A-1 of ASME B31.3B; E is the joint factor, which is equal to 1.0 for a seamless pipe, C is the corrosion tolerance, which is equal to 0 in this calculation; Y is the wall thickness factor in ASME B31.3 Table 304.1.1, which is equal to 0.4 for this calculation.

[0334] This indicates that at an operating temperature of 50°C, R134a requires a minimum wall thickness of approximately 0.065mm for a pipe diameter of 5mm.

[0335] Example 1 - Capillary heat pipe with cis1233zd as the working fluid at 50°C Example 1 is repeated except that the working fluid consists of cis1233zd, and with some of the physical property values ​​of cis1233zd determined experimentally by applicants.

[0336] The operating pressure of this configuration was determined to be 140.8 KPa, which is an order of magnitude less than the operating pressure of R-134a. These results demonstrate one significant advantage of the present invention, in particular, that the heat pipe of the present invention has a minimum wall thickness of approximately 0.002 mm for a 5 mm pipe diameter due to the low operating pressure. Furthermore, the figure of merit for each of Comparative Example 1 and this Example 1 was determined according to the formula set forth in D.A. Reay, P.A. Kew, and R.J. McGlen, Heat Pipes Theory, Design and Applications, Sixth edition, UK: Elsevier, 2014.

[0337]

number

[0338] During the ceremony, M is the number of merits of the capillary return heat pipe, ρ f is the liquid working fluid density (kg / m 3 ) and σ f is the surface tension of the liquid working fluid, N / m, μ f is the liquid working fluid viscosity in Pa S, γ is the latent heat of fluid working, J / kg.

[0339] The figure of merit for this Example 1 was determined to be 169% greater than the figure of merit for Comparative Example 1, thus providing further evidence of the advantageous and unexpected results achieved in accordance with the present invention.

[0340] Comparative Example 2 - Power Limit Reduction of Heat Pipe with R-134a To estimate the reduction in power limits for a capillary heat pipe whose working fluid is R-134a, the same process as described in connection with Comparative Example 1 was used to determine figures of merit at operating temperatures ranging from about 20°C to about 100°C; these determinations are reported in Table C2 below, based on the power limit at 50°C, which is the baseline from which the relative power limits at each temperature are reported.

[0341] [Table C2]

[0342] As can be seen from the table above, the power limits of a capillary heat pipe having a working fluid comprised of R-134a are estimated to experience a rapid decline of approximately 100% as the operating temperature reaches approximately 100° C. Applicants have come to recognize and expect, for reasons explained elsewhere herein, and possibly elsewhere, based on this work, that R-134a is likely to be disadvantaged when the heat pipe's operating temperature ranges from about 20° C. to about 100° C., particularly including the range of 50° C. to about 100° C.

[0343] Example 2 - Power Limit Reduction of Capillary Heat Pipe with CIS1233ZD To estimate the reduction in power limits of a capillary heat pipe whose working fluid is cis1233zd, the same process as described in connection with Comparative Example 2 was used to determine figures of merit at operating temperatures ranging from about 0°C to about 120°C; these determinations are reported in Table E2 below, based on the power limit at 50°C, which is the baseline from which the relative power limits at each temperature are reported.

[0344] [Table E2]

[0345] As can be seen from the above table, and based on Applicants' experimental work and analysis, the power limits of capillary heat pipes using a working fluid comprised of cis1233zd produce a dramatically and advantageously much more stable power limit profile than that exhibited by R-134a over the operating temperature range of 20°C to 100°C. As can be seen, over this entire range, the power limit does not degrade by more than 13 relative percent. Furthermore, the data shows that over the range of about 20°C to about 150°C, the power limit does not degrade by more than 46 relative percent. For reasons explained elsewhere herein, and perhaps elsewhere, the methods and heat pipes of the present invention possess important and unexpected advantages, which are particularly important in those applications requiring heat pipe operating temperatures between 20°C and about 100°C, and between 50°C and 100°C, such as those for electronic components used in portable devices such as notebooks, laptops, and tablets.

[0346] Comparative Example 3 - Gravity return heat pipe with R-134a as working fluid at 50°C A gravity-return heat pipe with a working fluid consisting essentially of HFC-134a and no capillary tubes supporting the return of the liquid-phase working fluid from the condenser to the evaporator is evaluated at an operating temperature of 50°C. The required parameters, namely, liquid fluid density, liquid fluid conductivity, liquid fluid viscosity, and fluid latent heat, are assumed to be at specific temperatures, and the temperature difference along the heat pipe is assumed to be negligible as explained by D.A. Reay, P.A. Kew, and R.J. McGlen, Heat Pipes Theory, Design and Applications, Sixth Edition, UK: Elsevier, 2014. Published and publicly available information on R-134a and specific information on operating temperatures, to the extent required, are estimated using Refprop 9.1, developed by NIST (National Institute of Standards and Technology, USA) (https: / / www.nist.gov / refpropic).

[0347] The working pressure of this configuration using R-134a as the working fluid was determined to be 1317.9 KPa, which is the same as the value determined for R-134a in Comparative Example 1, and therefore yielded the same minimum wall thickness as reported in Comparative Example 1.

[0348] Example 3 - Gravity return heat pipe with cis1233zd as the working fluid at 50°C Comparative Example 3 is repeated except that the working fluid consists of cis1233zd, and except for some of the physical property values ​​of cis1233zd that were experimentally determined by applicants.

[0349] The operating pressure of this configuration was determined to be 140.8 KPa for R-1233zd at 50°C, which is an order of magnitude less than the operating pressure of R-134a. These results demonstrate one significant advantage in accordance with the present invention, particularly due to the low operating pressure of the heat pipe of the present invention and the minimum wall thickness of approximately 0.002 mm for a pipe diameter of 5 mm.

[0350] Comparative Example 4 - Power Limit Reduction for Gravity Return Heat Pipe with R-134a To estimate the power derating limit of a gravity return heat pipe whose working fluid is R-134a, the number of merits has been determined for operating temperatures ranging from about 20°C to about 100°C. The number of merit of the working fluid for a gravity return heat pipe can be determined according to the equations set forth in D.A. Reay, P.A. Kew, and R.J. McGlen, Heat Pipes Theory, Design and Applications, Sixth edition, UK: Elsevier, 2014.

[0351]

number

[0352] During the ceremony, M' is the number of merits of the gravity return heat pipe, ρ fis the working liquid density (kg / m 3 ) and λ f is the working liquid flow conductivity (W / mK), μ f is the working liquid fluid viscosity (Pa S), γ is the working fluid latent heat (J / kg).

[0353] The required parameters, i.e., liquid density, liquid conductivity, liquid viscosity, and fluid latent heat, are determined at specific temperatures and the temperature difference along the heat pipe is assumed to be negligible as explained by D.A. Reay, P.A. Kew, and R.J. McGlen, Heat Pipes Theory, Design and Applications, Sixth Edition, UK: Elsevier, 2014. Published and publicly available information on R-134a and specific information regarding operating temperatures, to the extent required, are estimated using Refprop 9.1, developed by NIST (National Institute of Standards and Technology, USA) (https: / / www.nist.gov / refpropic). These determinations are reported in Table C4 below, based on the power limits at 50°C, which is the baseline against which the relative power limits at each temperature are reported.

[0354] [Table C4]

[0355] As can be seen from the table above, the power limits of a gravity return heat pipe having a working fluid comprised of R-134a are estimated to suffer a steep decline of about 50% as the operating temperature reaches about 100° C. Applicants have come to recognize and expect based on this work, for reasons explained elsewhere herein, and possibly elsewhere, that R-134a is likely to be disadvantaged when the heat pipe's operating temperature ranges from about 20° C. to about 100° C., particularly including the range of 50° C. to about 100° C.

[0356] Example 4 - Power Limit Reduction of Gravity Return Heat Pipe with cis1233zd To estimate how the power limits of a gravity return heat pipe vary with temperature when the working fluid consists of cis1233zd, the same process as described in connection with Comparative Example 4 was used to determine figures of merit at operating temperatures ranging from about 0°C to about 100°C, and these determinations are reported in Table E4 below, based on the power limit at 50°C, which is the baseline from which the relative power limits at each temperature are reported.

[0357] Table E4

[0358] As can be seen from the above table, and based on applicant's experimental work and analysis, the power limits of capillary heat pipes using a working fluid comprised of cis1233zd produce a dramatically and advantageously much more stable power limit profile than that exhibited by R-134a over the operating temperature range of 20°C to 100°C. As can be seen, over this entire range, the power limit does not degrade by more than 9 relative percent. Furthermore, the data shows that over the range of about 20°C to about 210°C, the power limit does not degrade by more than 48 relative percent. For reasons explained elsewhere herein, and perhaps elsewhere, the method and heat pipe of the present invention possess important and unexpected advantages, which are particularly important in those applications requiring heat pipe operating temperatures between 20°C and about 100°C, and between 50°C and 100°C, such as those for electronic components used in portable devices such as notebooks, laptops, and tablets.

[0359] Example 5 - Performance of gravity return heat pipe with CIS-1233zd An experimental heat transfer unit in the form of a gravity-return heat pipe was constructed. The test unit included a heat pipe with an evaporator section attached to an electric heater insulated with foam to obtain accurate measurements of heat flowing through the heat pipe. The condensing section of the heat pipe was fitted with cross-shaped aluminum fins to provide additional heat transfer surface for transferring heat to ambient air at approximately 25°C. The section of the heat pipe between the evaporator and condenser sections was also insulated with insulating foam. The tests and results reported herein were conducted in accordance with standard GB / T 14812-2008. The heat pipe was a substantially straight hollow cylinder with the following dimensions: ·Outer diameter: 10mm Inner diameter: 9.4mm Length: 465mm

[0360] Using this test unit, Applicants have determined that the thermal resistance of gravity return heat pipes varies unexpectedly with the operating temperature of the fluid, typically represented by the evaporating temperature of the heat pipe. Based on this evidence, shown in Figure 5A, the thermal resistance dramatically and unexpectedly improves (decreases) at evaporating temperatures above 40°C, to particularly low levels of 0.5°C or less per watt at evaporating temperatures above about 50°C, preferably between about 50°C and about 120°C.

[0361] The unit was also operated at a range of heat inputs to the evaporator section using R-134a as the working fluid to develop a performance baseline for varying heat inputs from low to high. At each heat input value, the evaporating temperature of the heat pipe during operation was measured, and the difference between the ambient temperature and the evaporating temperature was determined; for convenience, this difference is referred to herein as the evaporator temperature difference. Generally, a lower evaporator temperature difference for a given heat input indicates better heat transfer performance. The unit was then operated under the same conditions, except with cis-1233zd as the working fluid. The results of this work are shown in Figure 5BA herein.

[0362] As shown in Figure 5B, the results indicate that cis-1233zd as the working fluid in a gravity-return heat pipe provides approximately the same or lower levels of heat transfer capacity as R-134a at evaporator temperature differences between 5°C and approximately 60°C, while the heat transfer capacity is unexpectedly higher than when the working fluid is R-134a when the evaporator temperature difference exceeds approximately 60°C. Thus, Applicants have found that at temperature differences of approximately 60°C, the ratio of the heat capacity of cis-1233zd to R-134a in a gravity-return heat pipe is greater than or equal to 1, while below this temperature difference, the capacity is less than 1. For example, for a heat sink with an ambient temperature of approximately 25°C, it was unexpectedly discovered that cis-1233zd working fluid in a gravity-return heat pipe can dissipate more heat than R134a under the same temperature difference when the evaporator temperature exceeds approximately 88°C. Stated another way, applicants have found that gravity return heat pipes containing cis-1233zd as the working fluid exhibit a lower evaporator temperature difference than R-134a for a given heat transfer capacity at these evaporator conditions.

[0363] Example 6 - Capillary heat pipe performance with Cis1233zd An experimental heat transfer unit in the form of a capillary heat pipe was constructed. The test unit included a heat pipe with an evaporator section encased in a copper block attached to an electric heater insulated with foam to obtain accurate measurements of heat flowing through the heat pipe. The condensing section of the heat pipe was fitted with cross-shaped aluminum fins to provide additional heat transfer surface for transferring heat to ambient air at approximately 25°C. The section of the heat pipe between the evaporator and condenser sections was also insulated with insulating foam. The tests and results reported herein were conducted in accordance with standard GB / T 14812-2008. The heat pipe was substantially straight and hollow, with the following dimensions and containing sintered capillary components as shown: ·Outer diameter: 10mm Inner diameter: 9.4mm Sintered inner diameter: 8.4mm Effective sintering radius: 0.1 to 0.15 μm Length: 465mm

[0364] The unit was operated at a range of heat inputs to the evaporator section using R-134a as the working fluid to develop a performance baseline for heat inputs varying from low to high. At each heat input value, the evaporating temperature of the heat pipe during operation was measured and the difference between the ambient temperature and the evaporating temperature was determined; for convenience, this difference is referred to herein as the evaporator temperature difference. Generally, for a given heat input, A lower input evaporator temperature difference indicates better heat transfer performance. Next, the unit was operated under the same conditions, except with cis-1233zd as the working fluid. The results of this work are shown in Figures 6A and 6B.

[0365] The results, as shown in Figures 6A and 6B, show that the evaporator temperature difference and heat capacity of a capillary heat pipe using cis-1233zd unexpectedly closely matches that of R134a, particularly for evaporator temperatures of about 35°C to about 90°C, and even more preferably about 35°C to about 60°C, when the ambient heat sink is about 25°C. This unexpectedly leads to the ability to utilize cis-1233zd as a drop-in replacement for R-134a in capillary heat pipe applications.

[0366] Numbered embodiments: Numbered Embodiment 1 Use of a composition comprising at least about 60% by weight of cis 1-chloro-3,3,3-trifluoropropene as a working fluid in a heat pipe.

[0367] Numbered Embodiment 2 The use of numbered embodiment 1, wherein the working fluid comprises at least about 70% by weight of cis 1-chloro-3,3,3-trifluoropropene.

[0368] Numbered Embodiment 3 The use of numbered embodiment 1 or 2 of numbered embodiment 2, wherein the working fluid comprises at least about 80 wt. % cis 1-chloro-3,3,3-trifluoropropene.

[0369] Numbered Embodiment 4 The use of any one of numbered embodiments 1-3, wherein the working fluid comprises at least about 90% by weight of cis 1-chloro-3,3,3-trifluoropropene.

[0370] Numbered Embodiment 5 The use of any one of numbered embodiments 1-4, wherein the working fluid comprises at least about 95% by weight of cis 1-chloro-3,3,3-trifluoropropene.

[0371] Numbered Embodiment 6 The use of any one of numbered embodiments 1-5, wherein the working fluid comprises at least about 97% by weight of cis 1-chloro-3,3,3-trifluoropropene.

[0372] Numbered Embodiment 7 The use of any one of numbered embodiments 1-6, wherein the working fluid comprises at least about 99.5 wt. % cis 1-chloro-3,3,3-trifluoropropene.

[0373] Numbered Embodiment 8 The use of any one of numbered embodiments 1-7, wherein the working fluid consists essentially of cis 1-chloro-3,3,3-trifluoropropene.

[0374] Numbered Embodiment 9 The use of any one of numbered embodiments 1-8, wherein the working fluid consists of cis 1-chloro-3,3,3-trifluoropropene.

[0375] Numbered Embodiment 10. The use of any one of numbered embodiments 1-9, wherein the working fluid has a global warming potential (GWP) of about 1000 or less.

[0376] Numbered Embodiment 11 The use of any one of numbered embodiments 1-10, wherein the working fluid has a global warming potential (GWP) of about 750 or less.

[0377] Numbered Embodiment 12. The use of any one of numbered embodiments 1 to 11, wherein the working fluid has a global warming potential (GWP) of about 500 or less.

[0378] Numbered Embodiment 13. The use of any one of numbered embodiments 1 to 12, wherein the working fluid has a global warming potential (GWP) of about 150 or less.

[0379] Numbered Embodiment 14 The use of any one of numbered embodiments 1 to 13, wherein the working fluid has an ozone depletion potential (ODP) of about 0.05 or less.

[0380] Numbered Embodiment 15. The use of any one of numbered embodiments 1 to 14, wherein the working fluid has an ozone depletion potential (ODP) of about 0.02 or less.

[0381] Numbered Embodiment 16. The use of any one of numbered embodiments 1 to 15, wherein the working fluid has a near-zero ozone depletion potential (ODP).

[0382] Numbered Embodiment 17. The use of any one of numbered embodiments 1 to 16, wherein the heat pipe is selected from a gravity return heat pipe, a capillary return heat pipe, a centripetal return heat pipe (or a rotary heat pipe), an electrokinetic return heat pipe (electrohydrodynamic heat pipe and electroosmotic heat pipe), a magnetic return heat pipe, an oscillating heat pipe, or an osmotic heat pipe.

[0383] Numbered Embodiment 18. The use of any one of numbered embodiments 1 to 17, wherein the heat pipe is selected from a gravity return heat pipe, a capillary return heat pipe, a centripetal return heat pipe (or a rotary heat pipe), or a magnetic return heat pipe.

[0384] Numbered Embodiment 19. The use of any one of numbered embodiments 1 to 17, wherein the heat pipe is a gravity return heat pipe.

[0385] Numbered Embodiment 20. The use of any one of numbered embodiments 1 to 17, wherein the heat pipe is a capillary return heat pipe.

[0386] Numbered Embodiment 21 The use of any one of numbered embodiments 1 to 20, wherein the heat pipe is provided for cooling an electrical or electronic component.

[0387] Numbered Embodiment 22 The use of numbered embodiment 21, wherein the electrical or electronic component is an electrical device selected from an insulated gate bipolar transistor (IGBT), a projector, or a game console computer.

[0388] Numbered Embodiment 23 The use of numbered embodiment 21, wherein the electrical or electronic component is a battery, a motor, or a power control unit (PCU) of an electric vehicle.

[0389] Numbered Embodiment 24 The use of numbered embodiment 21, wherein the electrical or electronic component is a central processing unit (CPU), a graphics processing unit (GPU), memory, a blade, or a rack in a data center.

[0390] Numbered Embodiment 25. The use of numbered embodiment 21, wherein the electrical or electronic component is a light emitting diode (LED) light, a quantum dot light emitting diode (QLED) TV, or an organic light emitting diode (OLED).

[0391] Numbered embodiment 26: The electrical or electronic components are used in radar, radars, and other spacecraft. The use of numbered embodiment 21, wherein the device is a user, a satellite, or a space station.

[0392] Numbered Embodiment 27. The use of numbered embodiment 21, wherein the electrical or electronic component is a radio frequency (RF) chip, a WiFi system, base station cooling, a mobile phone, or a switch in a communications device.

[0393] Numbered Embodiment 28. The use of any one of numbered embodiments 1 to 20, wherein a heat pipe is provided for recovering heat from an electrical or electronic component.

[0394] Numbered Embodiment 29. The use of numbered embodiment 28, wherein the heat pipe is provided for recovering heat from a data center.

[0395] Numbered Embodiment 30. The use of any one of numbered embodiments 1 to 20, wherein the heat pipe is provided for use in a method of refrigeration.

[0396] Numbered Embodiment 31. The use of a heat pipe according to numbered embodiment 30, wherein the method is to defrost a component, to make ice, or to improve air temperature uniformity.

[0397] Numbered Embodiment 32. The use of any one of numbered embodiments 1 to 31, wherein the heat pipe has an operating temperature in the range of about -20°C to about 200°C.

[0398] Numbered Embodiment 33. The use of any one of numbered embodiments 1 to 32, wherein the heat pipe has an operating temperature in the range of about 0°C to about 140°C.

[0399] Numbered Embodiment 34. The use of any one of numbered embodiments 1 to 33, wherein the heat pipe has an operating temperature in the range of about 20°C to about 140°C.

[0400] Numbered Embodiment 35. The use of any one of numbered embodiments 1 to 34, wherein the heat pipe has an operating temperature in the range of about 40°C to about 80°C.

[0401] Numbered Embodiment 36. The use of any one of numbered embodiments 1 to 35, wherein the heat pipe is provided for cooling an insulated gate bipolar transistor (IGBT), a projector, a motor, a power control unit (PCU), a light emitting diode (LED) light, a quantum dot light emitting diode (QLED), or for cooling a radio frequency (RF) chip, a WiFi system, a base station, cooling a communication device including a mobile phone or a switch, or for thermal management of a spacecraft such as a radar, a satellite, or a space station.

[0402] Numbered Embodiment 37 A heat pipe, wherein the heat pipe comprises the working fluid of any one of numbered embodiments 1-16.

[0403] Numbered Embodiment 38. The heat pipe of numbered embodiment 37, selected from a gravity return heat pipe, a capillary return heat pipe, a centripetal return heat pipe (or a rotary heat pipe), an electrokinetic return heat pipe (electrohydrodynamic heat pipe and electroosmotic heat pipe), a magnetic return heat pipe, an oscillating heat pipe, or an osmotic heat pipe.

[0404] Numbered Embodiment 39. The heat pipe of numbered embodiment 37, wherein the heat pipe is selected from a gravity return heat pipe, a capillary return heat pipe, a centripetal return heat pipe (or rotary heat pipe), or a magnetic return heat pipe.

[0405] Numbered Embodiment 40. The heat pipe of any one of numbered embodiments 37-39, wherein the heat pipe is a gravity return heat pipe.

[0406] Numbered Embodiment 41 The heat pipe of any one of numbered embodiments 37-39, wherein the heat pipe is a capillary return heat pipe.

[0407] Numbered Embodiment 42 The heat pipe of any one of numbered embodiments 37-42, wherein the heat pipe has an operating temperature in the range of about -20°C to about 200°C.

[0408] Numbered Embodiment 43 The heat pipe of any one of numbered embodiments 37-43, wherein the heat pipe has an operating temperature in the range of about 0°C to about 140°C.

[0409] Numbered Embodiment 44. The heat pipe of any one of numbered embodiments 37-43, wherein the heat pipe has an operating temperature in the range of about 20°C to about 140°C.

[0410] Numbered Embodiment 45. The heat pipe of any one of numbered embodiments 37-44, wherein the heat pipe has an operating temperature in the range of about 40°C to about 140°C.

[0411] Numbered Embodiment 46. A method of cooling an electrical or electronic component using the heat pipe of any one of numbered embodiments 37-45.

[0412] Numbered Embodiment 47. The method of numbered embodiment 46, wherein the electrical or electronic component is an electrical device selected from an insulated gate bipolar transistor (IGBT), a projector, or a game console computer.

[0413] Numbered Embodiment 48. The method of numbered embodiment 46, wherein the electrical or electronic component is a battery, a motor, or a power control unit (PCU) of an electric vehicle.

[0414] Numbered Embodiment 49. The method of numbered embodiment 46, wherein the electrical or electronic component is a central processing unit (CPU), a graphics processing unit (GPU), a memory, a blade, or a rack in a data center.

[0415] Numbered Embodiment 50. The method of numbered embodiment 46, wherein the electrical or electronic component is a light emitting diode (LED) light, a quantum dot light emitting diode (QLED) TV, or an organic light emitting diode (OLED).

[0416] Numbered Embodiment 51 The method of numbered embodiment 46, wherein the electrical or electronic component is a radar, a laser in a spacecraft, a satellite, or a space station.

[0417] Numbered Embodiment 52. The method of numbered embodiment 46, wherein the electrical or electronic component is a radio frequency (RF) chip, a WiFi system, base station cooling, a mobile phone, or a switch in a communications device.

[0418] Numbered Embodiment 53. A method of recovering heat from an electrical or electronic component using the heat pipe of any one of numbered embodiments 37-45.

[0419] Numbered embodiment 54. The method of numbered embodiment 53, wherein the method for recovering heat relates in particular to heat recovery in a data center between hot fresh air and cold internal air.

[0420] Numbered Embodiment 55 A heat pump according to any one of numbered embodiments 37 to 45. Freezing method using ip.

[0421] Numbered Embodiment 56. The method of numbered embodiment 55, wherein the method is defrosting a component, making ice, or improving air temperature uniformity.

[0422] Numbered Embodiment 57 A method of preparing a heat pipe, the method comprising filling the heat pipe with the composition of any one of numbered embodiments 1-16.

[0423] Numbered Embodiment 58 includes a method of transferring heat, comprising: (a) providing a heat pipe including an evaporating section containing a liquid working fluid comprising at least about 60% cis 1-chloro-3,3,3-trifluoropropene and a condensing section containing a working fluid vapor comprising greater than 60% cis 1-chloro-3,3,3-trifluoropropene; (b) placing the evaporating section in thermal communication with a body, fluid, surface, etc. to be cooled; and (c) placing the condensing section in thermal communication with a body, fluid, surface, etc. to be heated.

[0424] Numbered Embodiment 59. The method of numbered embodiment 58, wherein the liquid working fluid and the vapor working fluid each comprise at least about 70% by weight of cis 1-chloro-3,3,3-trifluoropropene.

[0425] Numbered Embodiment 60. The method of numbered embodiment 59, wherein the liquid working fluid and the vapor working fluid each comprise at least about 80% by weight of cis 1-chloro-3,3,3-trifluoropropene.

[0426] Numbered Embodiment 61. The method of numbered embodiment 60, wherein the liquid working fluid and the vapor working fluid each comprise at least about 90% by weight of cis 1-chloro-3,3,3-trifluoropropene.

[0427] Numbered Embodiment 62. The method of numbered embodiment 61, wherein the liquid working fluid and the vapor working fluid each comprise at least about 95% by weight of cis 1-chloro-3,3,3-trifluoropropene.

[0428] Numbered Embodiment 63. The method of numbered embodiment 62, wherein the liquid working fluid and the vapor working fluid each comprise at least about 97% by weight of cis 1-chloro-3,3,3-trifluoropropene.

[0429] Numbered Embodiment 64. The method of numbered embodiment 63, wherein the liquid working fluid and the vapor working fluid each comprise at least about 99.5% by weight of cis 1-chloro-3,3,3-trifluoropropene.

[0430] Numbered Embodiment 65. The method of numbered embodiment 64, wherein the liquid working fluid and the vapor working fluid each consist essentially of cis 1-chloro-3,3,3-trifluoropropene.

[0431] Numbered Embodiment 66. The method of numbered embodiment 65, wherein the liquid working fluid and the vapor working fluid each comprise cis 1-chloro-3,3,3-trifluoropropene.

[0432] Numbered Embodiment 67. Any of numbered embodiments 58-66, wherein the heat pipe is selected from a gravity return heat pipe, a capillary return heat pipe, a centripetal return heat pipe (or a rotary heat pipe), an electrokinetic return heat pipe (electrohydrodynamic heat pipe and electroosmotic heat pipe), a magnetic return heat pipe, an oscillating heat pipe, or an osmotic heat pipe. The method according to any one of claims 1 to 4.

[0433] Numbered Embodiment 68. The method of numbered embodiment 67, wherein the heat pipe is selected from a gravity return heat pipe, a capillary return heat pipe, a centripetal return heat pipe (or rotary heat pipe), or a magnetic return heat pipe.

[0434] Numbered Embodiment 69. The method of any one of numbered embodiments 67 or 68, wherein the heat pipe is a gravity return heat pipe.

[0435] Numbered Embodiment 70. The method of any one of numbered embodiments 67 or 68, wherein the heat pipe is a capillary return heat pipe.

[0436] Numbered Embodiment 71. The method of any one of numbered embodiments 67-70, wherein the heat pipe has an operating temperature in the range of about -20°C to about 200°C.

[0437] Numbered Embodiment 72. The method of any one of numbered embodiments 67-71, wherein the heat pipe has an operating temperature in the range of about 0°C to about 140°C.

[0438] Numbered Embodiment 73. The method of any one of numbered embodiments 67 to 72, wherein the heat pipe has an operating temperature in the range of about 20°C to about 140°C.

[0439] Numbered Embodiment 74. The method of any one of numbered embodiments 67-73, wherein the heat pipe has an operating temperature in the range of about 40°C to about 140°C.

[0440] Numbered Embodiment 75 The method of any one of numbered embodiments 58-74, wherein the power limit of the heat pipe operating at about 50°C does not degrade by more than 40% relative percent over an operating temperature range of about 20°C to about 100°C, preferably by 30% relative percent or less over an operating temperature range of about 20°C to about 100°C, more preferably by 25% relative percent or less over an operating temperature range of about 20°C to about 100°C, more preferably by 20% relative percent or less over an operating temperature range of about 20°C to about 100°C, more preferably by 15% relative percent or less over an operating temperature range of about 20°C to about 100°C, and more preferably by 10% relative percent or less over an operating temperature range of about 20°C to about 100°C.

[0441] Numbered Embodiment 76. An electronic device comprising: a component operating at a temperature greater than ambient temperature, the component comprising: (a) an electronic component that generates heat during operation, causing the temperature of the component to be greater than ambient temperature; and (b) a heat pipe comprising: an evaporator section containing a liquid working fluid comprising greater than 60% by weight of cis 1-chloro-3,3,3-trifluoropropene; and a condenser section containing a vapor working fluid comprising greater than 60% by weight of cis 1-chloro-3,3,3-trifluoropropene; wherein the evaporator section is thermally connected to the electronic component; and the condenser section is thermally connected to a heat sink, the heat sink being at a temperature of about 20°C to about 100°C, more preferably about 50°C to about 100°C.

[0442] Numbered Embodiment 77 The electronic device of numbered embodiment 76, wherein the liquid working fluid and the vapor working fluid are as defined in numbered embodiments 59-65.

[0443] Numbered Embodiment 78: The electronic device of numbered embodiments 76-77, wherein the heat pipe has an operating temperature range of about 20°C to about 100°C.

[0444] Numbered embodiment 79. The heat pipe of any one of numbered embodiments 67 to 74. 79. The electronic device of any one of numbered embodiments 76 to 78, wherein:

[0445] Numbered Embodiment 80 The electronic device of numbered embodiments 76-79, wherein the electrical or electronic component is as defined in any one of numbered embodiments 48-52.

[0446] Numbered Embodiment 81 The electronic device of numbered embodiments 76-80, wherein the electronic device is as defined in numbered embodiment 47.

[0447] Numbered Embodiment 82: An electronic device as described in numbered embodiments 76-80, wherein the power limit of the heat pipe operating at about 50°C does not degrade by more than 40% relative percent over an operating temperature range of about 20°C to about 100°C, preferably by 30% relative percent or less over an operating temperature range of about 20°C to about 100°C, more preferably by 25% relative percent or less over an operating temperature range of about 20°C to about 100°C, more preferably by 20% relative percent or less over an operating temperature range of about 20°C to about 100°C, more preferably by 15% relative percent or less over an operating temperature range of about 20°C to about 100°C, and more preferably by 10% relative percent or less over an operating temperature range of about 20°C to about 100°C.

Claims

1. The use of a working fluid consisting of cis-1-chloro-3,3,3-trifluoropropene in a heat pipe as a substitute for 1,1,1,2-tetrafluoroethane (R-134a), The heat pipe includes an evaporation section for containing the working fluid and a condensation section for containing the working fluid, The evaporation section is in thermal communication with the body or fluid to be cooled, and the condensation section is in thermal communication with the heat sink. The operating temperature of the heat pipe is 50°C to 100°C, and the temperature of the heat sink is 15°C to 80°C. The aforementioned use, wherein the power limit of the heat pipe operating at 50°C does not decrease by more than 40% over the operating temperature range of 50°C to 100°C.

2. The use according to claim 1, wherein the heat pipe is selected from gravity return heat pipes, capillary return heat pipes, centripetal return heat pipes (or rotary heat pipes), electrodynamic return heat pipes, magnetic return heat pipes, vibrating heat pipes, or osmotic heat pipes.

3. The use according to any one of claims 1 to 2, wherein the heat pipe is a gravity return heat pipe or a capillary return heat pipe.

4. The use according to claim 1, wherein the operating temperature of the heat pipe is 50°C to 100°C, and the temperature of the heat sink is 15°C to 40°C.

5. The use according to any one of claims 1 to 4, wherein the power limit of the heat pipe operating at 50°C does not decrease by more than 25% over an operating temperature range of 50°C to 100°C.

6. The use according to any one of claims 1 to 4, wherein the power limit of the heat pipe operating at 50°C does not decrease by more than 10% over the operating temperature range of 50°C to 100°C.

7. A heat pipe containing the working fluid according to any one of claims 1 to 6.

8. A gravity return heat pipe comprising the working fluid according to any one of claims 1 to 6.

9. A capillary return heat pipe comprising the working fluid according to any one of claims 1 to 6.

10. A method for cooling electrical or electronic components using a heat pipe according to any one of claims 7 to 9.

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