Printed wiring board with built-in electronic component

Abstract

To prevent a decrease in an insulation between pads adjacent to each other due to migration or the like along an interface between a resin insulating layer of a build-up layer and a protective film of a built-in electronic component.SOLUTION: An electronic component housed in a concave part of a substrate is sealed and contained in the concave part by a build-up layer laminated on the substrate. The build-up layer has a resin insulating layer, a conductor layer formed on the resin insulating layer, and a plurality of via hole conductors penetrating the resin insulating layer and exposed to a lower surface thereof. The electronic component has a plurality of pads on a surface facing the resin insulating layer, and the plurality of pads are each connected to the plurality of via hole conductors exposed to the lower surface of the resin insulating layer. Each of the plurality of via hole conductors is an electronic component embedded printed wiring board electrically connected to another circuit portion of the printed wiring board via a conductor layer. The electronic component has an insulating protective film covering a surface facing the resin insulating layer, and the protective film has the concave part between pads adjacent to each other in a portion other than an opening for exposing each of the plurality of pads of the electronic component.SELECTED DRAWING: Figure 1A

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