Substrate conveyance device, substrate conveyance system, and substrate conveyance method

JP2025186849APending Publication Date: 2025-12-24YASKAWA DENKI KK
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Patent Information

Application Number
JP2024095255
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-06-12
Publication Date
2025-12-24

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Abstract

To improve substrate conveyance efficiency by enabling reduction in installation area.SOLUTION: A substrate conveyance device 28 includes a fixed element 11 comprising a plurality of coil units 17, a first movable element 35 that comprises first magnet units 41A, 41B and floats and moves over the fixed element 11, a second movable element 37 that comprises second magnet units 43A, 43B and floats and moves over the fixed element 11, a bearing 39 for guiding the first movable element 35 and the second movable element 37 so as to be relatively operational, and a substrate support unit 21A that is connected to the first movable element 35 and the second movable element 37 to support a substrate W.SELECTED DRAWING: Figure 6
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Citation Information

Patent Citations

  • Semiconductor processing equipment

    JP2018504784A