Method for determining an order for creating multiple wire loops in relation to a workpiece - Patent Application 20070123633

Abstract

A method for determining an order for creating a plurality of wire loops is provided. The method includes (a) providing workpiece data for a workpiece. The workpiece data includes (i) position data for bonding locations on the workpiece and (ii) wire loop data for a plurality of wire loops providing interconnections between the bonding locations. The method also includes (b) analyzing the workpiece data. The analyzing includes considering overlap conditions between the plurality of wire loops, considering wire loop heights between the plurality of wire loops, considering lateral bending conditions between the plurality of wire loops, and considering wire loop positions between the plurality of wire loops. The method also includes (c) providing an order for creating the plurality of wire loops in relation to the workpiece based at least in part on a result of step (b).

Description

[Technical field]

[0001] (CROSS-REFERENCE TO RELATED APPLICATIONS.) This application claims the benefit of U.S. Provisional Application No. 63 / 310,200, filed February 15, 2022, the contents of which are incorporated herein by reference.

[0002] The present invention relates to the creation of wire loops, and more particularly to a method for determining an order for creating multiple wire loops in relation to a workpiece. [Background technology]

[0003] A wire bonding machine is used to form a wire loop between the respective locations to be electrically interconnected. Exemplary wire bonding techniques include ball bonding and wedge bonding. The steps in a typical ball bonding application include bonding a free air ball to a first bonding location of a workpiece (e.g., a die pad of a semiconductor die), extending a length of wire continuous with the bonded free air ball to a second bonding location of the workpiece (e.g., a lead of a lead frame), and bonding the wire to the second bonding location, thereby forming a wire loop between the first and second bonding locations. Various types of bonding energy can be used in forming the bond between (a) the end of the wire loop and (b) the bond site (e.g., a die pad, a lead, etc.), including, for example, ultrasonic energy, thermo-acoustic energy, and thermo-compressive energy.

[0004] There have been many developments relating to optimizing wire loops and / or wire bonding processes, with representative developments being described in U.S. Patent No. 10,325,878 ("Method for generating a wire loop profile for a wire loop and for verifying proper clearance between adjacent wire loops"), U.S. Patent No. 9,496,240 ("System and method for optimizing loop parameters and loop trajectory in forming a wire loop"), U.S. Patent No. 8,302,840 ("Closed-loop wire bonding method and bonding force calibration"), and U.S. Patent Application Publication No. 2012 / 0074206 ("Method for forming a wire loop and a wire bond of a conductive bump"). Summary of the Invention [Problem to be solved by the invention]

[0005] It would be desirable to provide an improved method of forming multiple wire loops in relation to a workpiece, including providing an order for efficiently forming multiple wire loops. [Means for solving the problem]

[0006] According to an exemplary embodiment of the present invention, a method for determining an order for creating a plurality of wire loops in association with a workpiece is provided. The method includes (a) providing workpiece data for the workpiece. The workpiece data includes (i) position data for bonding locations on the workpiece, and (ii) wire loop data for a plurality of wire loops providing interconnections between the bonding locations on the workpiece. The method further includes (b) analyzing the workpiece data. The analyzing includes the sub-steps of (b1) considering an overlap condition between the plurality of wire loops, (b2) considering a wire loop height between the plurality of wire loops, (b3) considering a lateral bending condition between the plurality of wire loops, and (b4) considering a wire loop position between the plurality of wire loops. The method further includes (c) providing an order for creating a plurality of wire loops in association with the workpiece based at least in part on the result of step (b). As will be appreciated by those skilled in the art, the "one" of the plurality of wire loops described in each of sub-steps (b1)-(b4) is not necessarily the same.

[0007] According to another exemplary embodiment of the present invention, a method for determining an order for creating a plurality of wire loops in relation to a workpiece is provided. The method includes: (a) providing workpiece data for the workpiece. The workpiece data includes: (i) position data for bonding locations on the workpiece; and (ii) wire loop data for a plurality of wire loops providing interconnections between the bonding locations on the workpiece. The method further includes: (b) analyzing each of the plurality of wire loops using the workpiece data. The analyzing includes: (b1) determining an overlap condition for each of the plurality of wire loops with respect to the other plurality of wire loops; (b2) determining a height for each of the plurality of wire loops relative to the other plurality of wire loops; (b3) determining a lateral bend condition for each of the plurality of wire loops relative to the other plurality of wire loops; and (b4) determining a position of each wire loop relative to the other plurality of wire loops. The method further includes: (c) providing an order for creating the plurality of wire loops in relation to the workpiece based at least in part on a result of step (b). [Brief description of the drawings]

[0008] The invention is best understood from the following detailed description when read in conjunction with the accompanying drawings, in which it is emphasized that, according to common practice, the various features of the drawings are not to scale. Conversely, dimensions of the various features have been arbitrarily expanded or reduced for clarity. The drawings include the following figures: [Figure 1A] FIG. 1A is a block diagram side view of a wire bonding machine useful for performing methods according to various exemplary embodiments of the present invention during the formation of multiple wire loops. [Figure IB] FIG. 1B is an overhead block diagram of a workpiece including multiple wire loops useful for illustrating methods according to various exemplary embodiments of the present invention. [Diagram 2]FIG. 2 is a flow diagram illustrating a method for determining an order for creating multiple wire loops in relation to a workpiece in accordance with an exemplary embodiment of the present invention. [Diagram 3] FIG. 3 is a flow diagram illustrating another method for determining an order for creating multiple wire loops in relation to a workpiece, according to another exemplary embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] In connection with wire bonding on a workpiece (e.g., a semiconductor package), wire loop clearances can be checked and wire loop shapes can be optimized using techniques described, for example, in U.S. Pat. Nos. 10,325,878 and 9,496,240. After the specific parameters for forming the wire loops have been determined, the wire loops can be assigned a desired wire bond order (e.g., the order in which multiple wire loops in a semiconductor package are formed). Conventional approaches to assigning the order in which wire loops are formed tend to involve manual processes and are highly dependent on the experience of the user (e.g., process engineer, technician, etc.). These manual processes tend to be very laborious and time consuming.

[0010] Aspects of the present invention provide a solution in which the order of forming wire loops is automatically assigned (e.g., by analyzing predefined criteria in conjunction with workpiece data), thereby improving productivity. More importantly, the ambiguity regarding several possible orders can be reduced to provide a more effective solution. A feature of the method is that it uses (a) the 2D and / or 3D shapes of the various wire loops and (b) their spatial orientation relative to one another as inputs to determine the correct wire bond order (output). A directed graph data structure (or multiple data structures) can be used, where each wire loop is represented by a vertex in a graph, and the directed edges indicate the bonding order. Multiple comparison functions are then applied to incorporate various wire bond order rules to determine the wire bond order.

[0011] Certain "rules" are considered in connection with determining the appropriate order for forming the multiple wire loops (e.g., by software of one or more algorithms in connection with an automated process). These "rules" are not absolute, but rather are considerations. Examples of these rules include: (a) one or more "ground" wires are typically bonded first (e.g., for electrostatic discharge reasons); (b) wire loops with lower loop heights are typically formed before wire loops with higher loop heights; (c) wire loops with shorter lengths are typically formed before wire loops with longer lengths; (d) if the wire angle affects the pitch of the wire loops, the bonded wires may "corner in" and cause interference and must be considered accordingly; and (e) wire loops bonded to outer pad layers of a semiconductor die are typically formed before wire loops bonded to inner pad layers (and if there is a dependency on a subsequent inner layer, the wire loops that are bonded to inner pad layers may be bonded to inner pad layers). Dependencies are typically ordered by the current layer), (f) for adjacent wire loops bonded to the same bond location, the wire loop without lateral bends is typically formed first, followed by the wire loop with lateral bends, (g) for adjacent wire loops bonded to different bond locations, the wire loop with lateral bends is typically bonded first, followed by the wire loop without lateral bends, and (h) taking into account the first and second bond locations of the wire loops, e.g., adjusting the second bond location may be appropriate (e.g., if the location change does not adversely affect the package or wire bonding process). One or more computers (e.g., and associated algorithms) may be used to determine (e.g., as part of an automated process) an order for forming / creating the multiple wire loops as described herein. For example, FIG. 1A shows a computer 118 that is part of the wire bonding machine 100 and another computer 128 that is not part of the wire bonding machine 100. Either or both of the computers 118, 128 may be used in connection with analyzing workpiece data and providing an order for creating the multiple wire loops based at least in part on the analysis of the workpiece data.

[0012] Workpiece data is provided and analyzed taking into account the order in which wire loops are formed. Such workpiece data includes (i) position data for bonding locations on the workpiece, and (ii) wire loop data for a plurality of wire loops providing interconnections between bonding locations on the workpiece. In connection with the analysis of the workpiece data, certain considerations tend to be more important than others. For example, in certain embodiments of the present invention, the analysis of the workpiece data includes (i) considering overlap conditions for the plurality of wire loops, (ii) considering wire loop heights for the plurality of wire loops, (iii) considering lateral bending conditions for the plurality of wire loops, and (iv) considering wire loop positions for the plurality of wire loops.

[0013] With respect to overlap conditions between multiple wire loops, overlapping (or intersecting) wires refer to wires that cross in two-dimensional (2D) space (for example, one wire passes above or below another wire when viewed from above). Wires that do not cross in 2D space may not depend on any wire order assignment. Wires that cross in 2D space require wire order assignment.

[0014] For wire loop heights of multiple wire loops, the wire loop height typically refers to the maximum height over the entire length of the wire loop. For a set of wires that intersect in 2D space, the wire loop heights tend to determine the order (i.e., sequence) in which the wire loops are formed. Furthermore, wire loops with lower loop heights tend to be formed before wire loops with higher loop heights.

[0015] Regarding lateral bend conditions between multiple wire loops: A lateral bend refers to an intentional twist in a wire loop that diverts the wire from the direct path connecting the first and second bonding locations. Lateral bends are typically applied to improve clearance with adjacent wires. The effect on the formation sequence of the wire loops tends to depend on the direction in which the lateral bend is applied.

[0016] Regarding the location of one wire loop of multiple wire loops: the XY coordinates of the start point (e.g., first bond) and end point (e.g., second bond) of the wire loop determine the wire location. The relative position of the wires helps derive an efficient order for forming the multiple wire loops, for example, in terms of speed and throughput.

[0017] In certain embodiments of the invention, the results of the first study (e.g., the first check) are used as input for further studies. In a particular example, the loop height of a particular wire loop is used in connection with a wire loop overlap study.

[0018] 1A, a wire bonding machine 100 and a computer 128 (external to the wire bonding machine 100) are shown. The wire bonding machine 100 includes a bond head assembly 120, a support structure 116, and a computer 118. The computer 128 is located separate from the wire bonding machine 100. The bond head assembly 120 is shown carrying a wire bonding tool 122. A wire 106 is shown passing through the wire bonding tool 122 and terminating in a free air ball (FAB) 124 in preparation for a wire bonding operation. The support structure 116 of the wire bonding machine 100 is shown supporting a workpiece 112. In the illustrated example, the workpiece 112 includes a substrate 102 (e.g., a lead frame) and a die 110 (e.g., a semiconductor die). Wire loops 106a and 106b are shown providing an electrical interconnection between the die 110 and the substrate 102. Wire loop 106a and wire loop 106b are shown with different loop heights (i.e., wire loop 106a is "shorter" in height than wire loop 106b). In such an example, wire loop 106a will likely form before wire loop 106b.

[0019] 1B, a plan view of a workpiece 112 (similar to FIG. 1A, including a die 110 and a substrate 102) is shown. The die 110 is shown to have a plurality of bond sites 108 (e.g., die pads), including an inner bond site 108a (i.e., a bond site located relatively close to the center of the die 110) and an outer bond site 108b (i.e., a bond site located relatively close to an edge of the die 110). The substrate 102 is shown to have a plurality of bond sites 104 (e.g., leads of a lead frame). In FIG. 1B, a plurality of wire loops are formed on the workpiece 112.

[0020] Considering wire loops 106a and 106b (top left portion of FIG. 1B), wire loop 106a is shown formed to provide an electrical interconnection between a bond site 108 (i.e., outer bond site 108b) and bond site 104, and wire loop 106b is shown formed (after wire loop 106a) to provide an electrical interconnection between another bond site 108 (i.e., outer bond site 108b) and another bond site 104. Wire loops 106a and 106b are considered to be "overlapping" or "crossing" wire loops. Wire loops 106a and 106b are also of different heights (see diagram in FIG. 1A). Due to the loop height information of wire loops 106a and 106b (e.g., because the loop height of wire loop 106a is lower than that of wire loop 106b) and the overlap condition between wire loops 106a and 106b, wire loop 106a needs to be formed before wire loop 106b.

[0021] Considering further, wire loop 106c and wire loop 106d are shown formed between respective bond sites 108 and corresponding bond sites 104 (see the lower right portion of FIG. 1B). Wire loop 106d is shown having a bend 114, and more specifically, a "lateral bend" (e.g., bent substantially in the XY plane). If there is a lateral bend between wire loops 106c and 106d, then wire loop 106d will likely have formed before wire loop 106c, since wire loops 106c and 106d are bonded to different bonding locations (i.e., different bond sites 104, such as leads of a lead frame).

[0022] In yet another consideration, wire loops 106e, 106f, and 106g are shown formed between respective bond sites 108 and corresponding bond sites 104 (see the lower left portion of FIG. 1B). Wire loops 106e, 106f, and 106g are shown in different positions. To improve the time efficiency of creating wire loops 106e, 106f, and 106g, wire loops 106e, 106f, and 106g are formed in either a left-to-right (e.g., wire loop 106e, then wire loop 106f, then 106g) or right-to-left (e.g., wire loop 106g, then wire loop 106f, then wire loop 106e) direction.

[0023] In yet another consideration, wire loop 106i is shown formed from inner bond site 108a to corresponding bond site 104 (see the top right portion of FIG. 1B). Wire loop 106h is shown formed from outer bond site 108b to corresponding bond site 104. Wire loops 106i and 106h are considered to be "overlapping" or "crossing." Because wire loop 106h is bonded to the outer pad layer (including outer bond site 108b), it is considered more likely that wire loop 106h will be formed before wire loop 106i, which is bonded to the inner pad layer (including inner bond site 108a).

[0024] These considerations discussed in connection with FIGS. 1A-1B are examples of the types of considerations that may be made to determine an appropriate sequence for forming multiple wire loops in relation to the workpiece 112. Of course, this is a simple example. In other words, the workpiece 112 may have many wire loops formed therein, not shown, in the various conditions described (e.g., overlapping wire loops, etc.). Workpieces containing many wire loops may utilize the methods described herein. Thus, finding an efficient and desirable sequence for forming multiple wire loops in relation to the workpiece may require prioritizing certain "rules" over others.

[0025] 2 and 3 are flow diagrams illustrating a method for determining (e.g., automatically using one or more computers) an order for creating multiple wire loops in relation to a workpiece. As will be appreciated by those skilled in the art, certain steps included in the flow diagrams may be omitted or added, and the order of steps (or "substeps") may be altered from the order shown, all within the scope of the present invention.

[0026] With specific reference to FIG. 2, in process 200, workpiece data for a workpiece is provided. The workpiece data includes (i) position data for bonding locations on the workpiece, and (ii) wire loop data for a plurality of wire loops providing interconnections between the bonding locations on the workpiece. For example, the wire loop data may include at least one of two-dimensional and three-dimensional shapes of the plurality of wire loops, and orientations of the plurality of wire loops relative to one another. Process 200 also includes assembling the workpiece data into a data structure accessible to a computer (e.g., see computer 118 and / or computer 128 shown in FIG. 1A).

[0027] In step 202, the workpiece data is analyzed. The analysis in step 202 includes substeps of step 202(a), step 202(b), step 202(c), and step 202(d). In step 202(a), the overlap condition between the plurality of wire loops is considered. In step 202(b), the wire loop height of the plurality of wire loops is considered. In step 202(c), the lateral bending condition of the plurality of wire loops is considered. In step 202(d), the wire loop position between the plurality of wire loops is considered. Step 202 can be performed using a computer (e.g., computer 118, 128 shown in FIG. 1A). Such a computer can be on the wire bonding machine (e.g., computer 118) or separate from the wire bonding machine (e.g., computer 128). Step 202 can be performed using an algorithm executed on the computer.

[0028] In step 202, the workpiece data may be analyzed by prioritizing each of the sub-steps step 202(a), step 202(b), step 202(c), and step 202(d), such prioritization being, for example, prioritizing one consideration (and associated rules, etc.) over another in absolute terms, weighted terms, etc.

[0029] In a particular example, the results of step 202(a) take precedence over the results of steps 202(b), 202(c), and 202(d). Similarly, the results of step 202(b) take precedence over the results of steps 202(c) and 202(d). Similarly, the results of step 202(c) take precedence over the results of step 202(d).

[0030] Additionally, step 202 may include additional steps to account for time efficiencies associated with creating multiple wire loops.

[0031] In step 204, an order for creating the wire loops in relation to the workpiece is provided based at least in part on the results of step 202. Step 204 includes determining an order for creating the wire loops such that a ground wire included in the wire loops is created before the creation of other wire loops. Further, the order may be determined such that the wire loops can be created without interfering with adjacent ones of the wire loops. Step 204 may be performed using a computer (e.g., computers 118, 128 shown in FIG. 1A). Such a computer may be on the wire bonding machine (e.g., computer 118) or separate from the wire bonding machine (e.g., computer 128). Step 204 may be performed using an algorithm executed on the computer.

[0032] As will be appreciated by those skilled in the art, the analysis of the workpiece data in step 202 may involve different and / or additional considerations than those discussed above.

[0033] With specific reference to FIG. 3 , in step 300, workpiece data for a workpiece is provided. The workpiece data includes (i) position data for bonding locations on the workpiece, and (ii) wire loop data for a plurality of wire loops providing interconnections between the bonding locations on the workpiece. For example, the wire loop data may include at least one of two-dimensional and three-dimensional shapes of the plurality of wire loops, and orientations of the plurality of wire loops relative to one another. Step 300 may also include assembling the workpiece data in a data structure accessible to a computer (e.g., see computer 118 and / or computer 128 shown in FIG. 1B ).

[0034] In step 302, each of the plurality of wire loops is analyzed using the workpiece data. The analysis in step 302 includes substeps of step 302(a), step 302(b), step 302(c), and step 302(d). In step 302(a), each of the plurality of wire loops is checked for overlap with the others of the plurality of wire loops. In step 302(b), each of the plurality of wire loops is checked for height relative to the others of the plurality of wire loops. In step 302(c), each of the plurality of wire loops is checked for lateral bending relative to the others of the plurality of wire loops. In step 302(d), the position of each wire loop is checked relative to the others of the plurality of wire loops. Step 302 can be performed using a computer (e.g., computer 118, 128 shown in FIG. 1A). Such a computer may be on the wire bonding machine (e.g., computer 118) or may be on a computer separate from the wire bonding machine (e.g., computer 128). Step 302 may be performed using an algorithm executed on a computer.

[0035] In step 302, the workpiece data may be analyzed by prioritizing each of the substeps step 302(a), step 302(b), step 302(c), and step 302(d), such prioritization being, for example, prioritizing one check (and associated rules, etc.) over another check in absolute terms, weighted terms, etc.

[0036] In certain examples, the results of step 302(a) may take precedence over the results of steps 302(b), 302(c), and 302(d). Similarly, the results of step 302(b) may take precedence over the results of steps 302(c) and 302(d). Similarly, the results of step 302(c) may take precedence over the results of step 302(d).

[0037] Additionally, step 302 may include additional steps to account for time efficiencies associated with creating multiple wire loops.

[0038] In step 304, an order for creating the wire loops in relation to the workpiece is provided based at least in part on the results of step 302. Step 304 may include determining an order for creating the wire loops such that a ground wire included in one of the wire loops is created before the creation of the other wire loops. Additionally, the order may be determined such that the wire loops can be created without interfering with adjacent ones of the wire loops. Step 304 may be performed using a computer (e.g., computers 118, 128 shown in FIG. 1A). Such a computer may be on the wire bonding machine (e.g., computer 118) or separate from the wire bonding machine (e.g., computer 128). Step 304 may be performed using an algorithm executed on the computer.

[0039] As will be appreciated by those skilled in the art, the analysis of the workpiece data in step 302 may include different and / or additional considerations than those discussed above.

[0040] In connection with determining the order in which to form the multiple wire loops, the order in which the wire bonds are formed on each of the multiple wire loops may also be considered (e.g., forming a first bond on the wire loop in one location followed by a second bond on the wire loop in another location). As will be appreciated by those skilled in the art, each wire loop may include multiple bond portions along the length of the wire loop, and in some cases, may include a single bond portion (see, e.g., U.S. Pat. No. 9,502,371, "Method of Forming a Wire Interconnect Structure").

[0041] Although the invention has been illustrated and described herein with reference to specific embodiments, it is not intended that the invention be limited to the details shown, but rather various changes in the details may be made within the scope and range of equivalents of the claims and without departing from the invention.

Claims

1. 1. A method for determining an order for creating a plurality of wire loops in relation to a workpiece, comprising: (a) providing workpiece data for the workpiece, the workpiece data including (i) position data for bonding locations on the workpiece, and (ii) wire loop data for the plurality of wire loops providing interconnections between each of the bonding locations on the workpiece; (b) analyzing the workpiece data, the analyzing step including the substeps of (b1) considering overlap conditions between each of the plurality of wire loops; (b2) considering wire loop height between each of the plurality of wire loops; (b3) considering lateral bending conditions between each of the plurality of wire loops; and (b4) considering wire loop position between each of the plurality of wire loops; (c) providing the order for creating the plurality of wire loops in relation to the workpiece based at least in part on the results of step (b); A method having the following.

2. 10. The method of claim 1, wherein steps (b) and (c) are performed using a computer.

3. 3. The method of claim 2, wherein the computer is on a wire bonding machine.

4. 3. The method of claim 2, wherein the computer is separate from the wire bonding machine.

5. 10. The method of claim 1, wherein steps (b) and (c) are performed using an algorithm implemented on a computer.

6. 2. The method of claim 1, wherein the wire loop data includes at least one of a two-dimensional shape and a three-dimensional shape of each of the plurality of wire loops and an orientation of the plurality of wire loops relative to one another.

7. 2. The method of claim 1, wherein step (a) includes assembling the workpiece data in a computer-accessible data structure.

8. 2. The method of claim 1, wherein step (c) includes determining an order for creating the plurality of wire loops such that a ground wire included in the plurality of wire loops is created before the creation of other wire loops in the plurality of wire loops.

9. 2. The method of claim 1, wherein step (b) includes analyzing the workpiece data by prioritizing each of substeps (b1) through (b4) relative to one another.

10. 10. The method of claim 9, wherein the result of sub-step (b1) takes precedence over the results of sub-steps (b2) to (b4).

11. 11. The method of claim 10, wherein the result of sub-step (b2) takes precedence over the results of sub-steps (b3)-(b4).

12. 12. The method of claim 11, wherein the result of sub-step (b3) takes precedence over the result of sub-step (b4).

13. 2. The method of claim 1, wherein step (c) includes providing said ordering such that said plurality of wire loops are created without interference with adjacent ones of said plurality of wire loops.

14. 2. The method of claim 1, wherein the analyzing step further comprises the substep (b5) of considering time efficiencies associated with creating the plurality of wire loops.

15. 1. A method for determining an order for creating a plurality of wire loops in relation to a workpiece, comprising: (a) providing workpiece data for the workpiece, the workpiece data including (i) position data for bonding locations on the workpiece, and (ii) wire loop data for the plurality of wire loops providing interconnections between bonding locations on the workpiece; (b) analyzing each of the plurality of wire loops using the workpiece data, the analyzing step including the substeps of: (b1) verifying an overlap state of each of the plurality of wire loops relative to the others of the plurality of wire loops; (b2) verifying a height of each of the plurality of wire loops relative to the others of the plurality of wire loops; (b3) verifying a lateral bend state of each of the plurality of wire loops relative to the others of the plurality of wire loops; and (b4) verifying a position of each of the plurality of wire loops relative to the others of the plurality of wire loops. (c) providing the order for creating the plurality of wire loops in relation to the workpiece based at least in part on the results of step (b); A method having the following.

16. 16. The method of claim 15, wherein steps (b) and (c) are performed using a computer.

17. 17. The method of claim 16, wherein the computer is on a wire bonding machine.

18. 17. The method of claim 16, wherein the computer is separate from the wire bonding machine.

19. 16. The method of claim 15, wherein steps (b) and (c) are performed using an algorithm implemented on a computer.

20. 16. The method of claim 15, wherein the wire loop data includes at least one of a two-dimensional shape and a three-dimensional shape of each of the plurality of wire loops and an orientation of each of the plurality of wire loops relative to one another.

21. 16. The method of claim 15, wherein step (a) includes assembling the workpiece data in a computer-accessible data structure.

22. 16. The method of claim 15, wherein step (c) includes determining an order for creating the plurality of wire loops such that a ground wire included in the plurality of wire loops is created before the creation of other wire loops in the plurality of wire loops.

23. 16. The method of claim 15, wherein step (b) includes analyzing the workpiece data by prioritizing each of substeps (b1)-(b4) relative to one another.

24. 24. The method of claim 23, wherein the result of sub-step (b1) takes precedence over the results of sub-steps (b2) to (b4).

25. 25. The method of claim 24, wherein the result of sub-step (b2) takes precedence over the results of sub-steps (b3)-(b4).

26. 26. The method of claim 25, wherein the result of sub-step (b3) takes precedence over the result of sub-step (b4).

27. 16. The method of claim 15, wherein step (c) includes providing the ordering such that the plurality of wire loops are created without interference with adjacent ones of the plurality of wire loops.

28. 16. The method of claim 15, wherein the analyzing step further comprises the substep (b5) of considering time efficiencies associated with creating the plurality of wire loops.

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