Photosensitive resin and photoresist composition containing the same

JP2025506765AActive Publication Date: 2025-03-13TAKOMA TECH
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Patent Information

Application Number
JP2024549570
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Priority Date
2022-12-07
Filing Date
2022-12-08
Publication Date
2025-03-13
Estimated Expiration
2042-12-08
Patent Text Reader

Abstract

The present invention relates to a photosensitive resin that has high solubility in a developer, good etching resistance, and low line edge roughness even when exposed to a short wavelength light source of less than 248 nm or less than 193 nm. The present invention also relates to a photoresist composition containing the photosensitive resin.
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Citation Information

Patent Citations

  • Positive type photoresist composition

    JP2001100424A

  • Thermosetting resin composition, fiber composite resin composition and molded product formed by curing the same

    JP2009299015A

  • Curable resin composition and application thereof

    JP2015067618A

  • Polymer and photosensitive resin composition

    JP2015183024A

  • Photosensitive compositions based on polycyclic polymers

    US20040039153A1