Semiconductor processing apparatus, semiconductor processing system and method for positioning semiconductor edge

Abstract

The present invention provides a semiconductor processing apparatus including a lower cavity having a first support area for supporting a wafer, an upper cavity having a second support area, a temperature control module mounted close to the upper cavity and / or the lower cavity, and a first passage formed in an edge area of ​​the first support area or the second support area. When the upper cavity and the lower cavity are combined, a wafer is placed between the first support area and the second support area. The temperature control module adjusts its own temperature to adjust the temperature of the upper cavity and / or the lower cavity. A first space is formed by the first passage, and one or more chemical fluids flow in the first space to corrode the edge area of ​​the wafer. The upper cavity and / or the lower cavity includes a positioning structure, and the positioning structure abuts against the outer periphery of the edge of the wafer to overlap the central axis of the wafer and the central axis of the second support area. The present invention adjusts the positioning structure to position the wafer by adjusting the temperature of the temperature control module.

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