Auto-aligned master area multiplication for continuous embossing

Abstract

The present invention relates to embossing a pattern using a resin formulation to generate a stamp that continues the embossed pattern. As the pattern repeats, the stamp can be peeled off the embossing over an integer number of patterns and returned to the embossing at a different location. This realization allows a novel approach to seamlessly replicate any pattern on a flat area or into a seamless continuous cylinder. The stitching and mastering manufacturing process and technology of the present invention represents a solution to an industry problem. Stitching allows for verticalization of all critical manufacturing steps and eliminates the need to rely on a third party for mastering.

Description

[Technical field]

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS This application claims priority to U.S. Application No. 18 / 123,190, filed March 17, 2023, which claims the benefit of U.S. Provisional Application No. 63 / 321,629, filed March 18, 2022, the disclosure of which is incorporated herein by reference.

[0002] The present invention relates to a system and method for stitching and mastering production of embossed structures. [Background technology]

[0003] When using tiny 3D optical features to create devices such as retroreflectors, holograms, and tiny Fresnel lenses, the techniques cannot be used to scale over large areas. These techniques create spaces between the films, which is not good for creating things like windows. For this reason, techniques are needed that can create tiny features over a wide range. Techniques already exist to reduce the distance between the seams, but there is still a distance. One of these techniques is to bond small masters, electroform copies of enlarged versions, and then bond these together. This ultimately creates a cylinder, and the flash created by the seam is polished. Another solution uses a step-and-repeat process to imprint, lithograph, and micromachine over an area, then move and repeat the process. Depending on the accuracy of the movement, defects and distances between the seams can still occur. There is a need to develop techniques that can create embossed patterns over large distances without seams between the patterns. Summary of the Invention [Means for solving the problem]

[0004] The present invention relates to the embossing of a pattern using a resin formulation to produce a stamp that continues the embossed pattern. Because the pattern is repeated, the stamp can be peeled off the embossing over an integer number of patterns and returned to the embossing at a different location. This realization allows a novel approach to seamlessly replicate a pattern onto a flat area or onto a seamless continuous cylinder.

[0005] The self-alignment process of an embossed pattern on a flat surface is as follows. The process begins with imprinting or embossing the pattern using a stamp and liquid resin on a flat substrate. The resin is dispersed on the substrate. A plastic film is then stamped into the resin to produce a formed pattern. The stamped resin is then cured by UV curing, which is a photochemical process in which high intensity UV light is used to instantly cure or dry an ink, coating, or adhesive. The UV formulation is liquid monomers and oligomers mixed with a small amount of photoinitiator, which is then exposed to UV energy. The stamp is then peeled off from the embossment and the stamp is set aside. One edge of the embossment is then cleaned to remove any edge defects or excess resin so that only the pattern remains. The substrate is then ready for alignment. The stamp is then displaced so that about 1 / 4 inch of the pattern overlaps the embossed pattern. Once the stamp is well aligned, the stamp is pressed into the embossment in a small area. The engagement causes the pattern to self-align on the nanoscale, and the area of ​​engagement can expand from its initial point, eventually covering the entire overlapped area. The lamination roller then clamps the engaged area of ​​the pattern during a step to keep the pattern engaged. The stamp can then be lifted off the substrate up to the clamped area, and another area of ​​liquid resin can be applied to the substrate. Once correctly applied, the resin is wicked into the clamped area up to the first embossed pattern. The stamp is then lowered into the resin and laminated to the substrate, pushing out any excess resin. Ultraviolet light hardens the resin again, and the stamp is removed. This process can be repeated, so that the pattern is seamlessly replicated. Once the desired area is created on the substrate, a new larger stamp can be made by covering the entire embossed area with stamp resin and polymer film. Once a long seamless stamp is created, the process can be repeated at right angles to create a larger area.For example, a stamp may start out 5 inches by 6 inches and produce a stamp that is 5 inches by 17 inches long. Then, working in the other direction, the stamp may double in width to 17 inches by 27.5 inches. This is a polymer master on a flat rigid substrate. Nickel can then be electroformed onto this master to produce a durable shim for production embossing.

[0006] The self-alignment process of the embossed pattern on a cylindrical surface is similar to the planar process and is as follows. In this case, the stamp pattern and the embossed pattern are aligned and engaged along the two overlapping areas. The diameter of such structures can be simply discrete values ​​that are graduated by the same amount as the original pattern repeats. The gaps in the embossment are then filled with liquid resin and supported by another roll of film. As with the planar process, the resin will fill the stamp and embossed interface. The resin is then cured and the support mandrel, inner support film, and sections of the stamp can be removed. An outer support structure can be added to maintain the cylindrical or other shape. This leaves a seamless continuous pattern inside the film cylinder. The inner surface of the polymer master can then be coated utilizing an electroless plating process, silver plating being one option. A nickel sleeve can be electroformed onto the resin pattern by passing a nickel anode through the center of the cylinder. The resin and film can then be removed leaving the nickel sleeve ready for product embossing.

[0007] Other features and aspects of the invention will become apparent from the following detailed description, taken in conjunction with the accompanying drawings, which illustrate, by way of example, the features in accordance with embodiments of the invention. This summary is not intended to limit the scope of the invention, which is defined solely by the appended claims.

[0008] Various embodiments are illustrated by way of example and not limitation in the accompanying drawings, in which:-- Figure 1 is a block diagram of a multi-layered, ... [Brief description of the drawings]

[0009] [Figure 1] FIG. 2 is a diagram of the first step of the self-aligning embossing technique against a flat surface. [Diagram 2] FIG. 13 is a diagram of a second step of the self-aligning embossing technique against a flat surface. [Diagram 3] FIG. 13 is a diagram of the third step of the self-aligning embossing technique against a flat surface. [Figure 4] FIG. 11 is a diagram of a fourth step of the self-aligning embossing technique against a flat surface. [Diagram 5] FIG. 5 illustrates the fifth step of the self-aligning embossing technique against a flat surface. [Figure 6] FIG. 11 is a diagram of the sixth step of the self-aligning embossing technique against a flat surface. [Figure 7] FIG. 7 is a diagram of the seventh step of the self-aligning embossing technique against a flat surface. [Figure 8] FIG. 1 is a diagram of the first step of a self-aligning embossing technique for a cylindrical surface. [Figure 9] FIG. 13 is a diagram of a second step of the self-aligning embossing technique for a cylindrical surface. [Figure 10] FIG. 13 is a diagram of the third step of the self-aligning embossing technique for a cylindrical surface. [Figure 11] FIG. 11 is a diagram of a fourth step of the self-aligning embossing technique for a cylindrical surface. [Figure 12] 1 is an image of the microdesign during the embossing step of manufacturing. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] FIG. 1 is a diagram of the first step of the self-aligning embossing technique on a flat surface. The first step begins with imprinting or embossing on a flat surface using a stamp and liquid resin. A stamp pattern 100 made of a plastic film is stamped down onto the resin with the formed pattern (102). The stamp is lowered onto a layer 104 of resin dispersed on a substrate 106. The stamp is then laminated to the resin (108). The stamped resin is then cured (108) using UV curing, which is a photochemical process in which high intensity UV light is used to instantly cure or dry inks, coatings, or adhesives. The UV formulation is liquid monomers and oligomers mixed with a small amount of photoinitiator, which is then exposed to UV energy. The embossed pattern 112 is formed as the UV light cures (110) the resin 110.

[0011] 2 is a diagram of the second step of the self-aligning embossing technique against a flat surface. The stamp 102 is peeled upwards from the embossed pattern 112, and the stamp 102 is set aside. Next, one edge of the embossed pattern 112 is cleaned by cutting the edge of the embossed pattern (202) so that any excess resin or defects are removed. Only the pattern remains, and the substrate 106 is then ready for alignment (204).

[0012] FIG. 3 is a diagram of the third step of the self-aligning embossing technique against a flat surface. The stamp 102 is then displaced so that approximately ¼ inch of the embossed pattern 112 overlaps. The stamp 102 is aligned and engaged with the embossment (300). Once the stamp 102 is aligned, it can be pressed into the embossment in a small area (302). The engagement causes the pattern to self-align on the nanoscale, after which the engagement area can be allowed to expand from its initial point, eventually covering the entire overlapped area. A lamination roller is then clamped (304) in the engagement area of ​​the pattern to keep the pattern engaged during the next step.

[0013] 4 is a diagram of the fourth step of the self-aligning embossing technique against a flat surface. The stamp 102 is lifted (400) off the substrate 106 up to the clamped area so that another area of ​​liquid resin can be applied (402) to the substrate 106. Once correctly applied, the resin is wicked into the clamped area up to the first embossed pattern 402.

[0014] Figure 5 is a diagram of the fifth step of the self-aligning embossing technique against a flat surface. The stamp 102 is then lowered into the resin, forcing out any excess resin (500), and laminated to the substrate 106. The engaged areas are clamped with a laminator to maintain engagement (502). UV light hardens the resin (504) and the stamp is removed again. The process is then repeated to seamlessly replicate the pattern.

[0015] 6 is a diagram of the sixth step of the self-aligning embossing technique against a flat surface. Once the desired area has been formed on the substrate, a new larger stamp can be made by covering the entire embossed area with a stamp and polymer film 600. The master 602 is filled with stamp resin (604). The film 600 is laminated (606) against the master 602. The film 600 is then cured (608) against the master 602. The formed stamp 102 is then peeled off (610) and is ready for use.

[0016] FIG. 7 is a diagram of the seventh step of the self-aligning embossing technique against a flat surface. Once a seamless long stamp 700 is made, the process can be repeated at right angles to make a wider area 702. In this example, the process starts with a 5 inch by 6 inch section to make a 5 inch by 17 inch long stamp 700. From there, the 5 inch by 17 inch long stamp 700 can be doubled in width to make a wider area 702, for example 17 inches by 27.5 inches. This is a polymer master on a flat rigid substrate.

[0017] Figure 8 is a diagram of the first step of the self-aligning embossing technique for a cylindrical surface. This is a similar process to the planar technique. The stamp polarity 800 and emboss polarity 802 are aligned and engaged along two overlapping regions, such as an unpatterned support film 804, on a support mandrel 804. The diameter of such structures can only be discrete values ​​that are graduated by the same amount as the original pattern repeats.

[0018] 9 is a diagram of the second step of the self-aligning embossing technique for a cylindrical surface. The embossment gap is filled with liquid resin (900) and encased in a support film (902). Similar to the planar example, the resin will fill the mating stamp and emboss interface.

[0019] 10 is a diagram of the third step of the self-aligning embossing technique for a cylindrical surface. The resin is cured using UV light (1000), and the support mandrel 806, inner support film, and sections of the stamp can be removed (1002). An outer support structure 1004 can be added to maintain the cylindrical or other shape. This leaves a seamless, continuous pattern inside the film cylinder.

[0020] Figure 11 is a diagram of the fourth step of the self-aligning embossing technique for a cylindrical surface. The inner surface of the polymer master can be coated using an electroless plating process, with silver plating being one option. A nickel sleeve 1104 can be electroformed into the resin pattern by passing a nickel anode 1102 through the center of the cylinder. The resin and film can be removed leaving the nickel sleeve 1106 ready for product embossing.

[0021] Figure 12 is an image of the microdesign during the embossing step of manufacturing. The stitching and mastering process and technology of the present invention solves an industry problem. Stitching allows for verticalization of all critical manufacturing steps, eliminating the need to rely on a third party for mastering.

[0022] Although various embodiments of the disclosed technology have been described above, it should be understood that they are presented by way of example only and not limitation. Similarly, various figures may depict an example architecture or other configuration of the disclosed technology, but this is done to aid in understanding the features and functionality that may be included in the disclosed technology. The disclosed technology is not limited to the example architecture or configuration depicted, and the desired functionality may be implemented using various alternative architectures and configurations. In fact, it will be apparent to one of ordinary skill in the art how alternative functional, logical or physical divisions and configurations may be implemented to implement the desired features of the technology disclosed herein. Also, different component module names other than those depicted herein may be applied to the various divisions. Furthermore, with respect to flow diagrams, operational descriptions, and method claims, the order of steps presented herein does not mandate that the various embodiments be implemented to perform the described functionality in the same order, unless the context dictates otherwise.

[0023] While the disclosed technology has been described above in terms of various exemplary embodiments and implementations, it should be understood that various features, aspects, and functionality described in one or more of the individual embodiments are not limited in their applicability to the particular embodiment for which they are described, but instead may be applied to one or more other embodiments of the disclosed technology, either alone or in various combinations, regardless of whether such an embodiment is described and whether such features are presented as part of a described embodiment. Thus, the breadth and scope of the technology disclosed herein should not be limited by any of the exemplary embodiments described above.

[0024] Terms and phrases used herein, and variations thereof, unless otherwise indicated, should be construed as open ended rather than limiting. As examples above, the term "including" should be construed as meaning "including, without limitation" and the like; the term "examples" is used to provide illustrative examples of the elements under discussion, not an exhaustive or limiting list; the term "a" or "an" should be read as meaning "at least one," "one or more," and the like; adjectives such as "conventional," "traditional," "usual," "standard," "known," and terms of similar meaning should not be construed as limiting the elements described to those elements available during a given period or at a given time, but instead should be construed as encompassing conventional, traditional, ordinary, or standard technology that may be available or known at any time now or in the future. Similarly, when the specification refers to technology that would be apparent or known to one of ordinary skill in the art, such technology encompasses technology that would be apparent or known to one of ordinary skill in the art at any time now or in the future.

Claims

1. A process for embossing a film, comprising: heating the resin formulation to produce a stamp that continues the repeating embossed pattern; peeling the stamp from the embossed pattern over an integer number of patterns and returning the stamp to the embossed pattern at a different location to allow for seamless replication of the pattern onto a patterned area; The process includes:

2. The process of claim 1 , wherein the region is a cylinder.

3. The process of claim 1 , wherein the region is a planar surface.

4. 2. The process of claim 1, wherein the embossing process is self-aligning and begins with embossing a pattern by using a stamp and liquid resin on a flat substrate to spread the resin on the substrate, and then stamping the plastic film into the resin to produce the formed pattern.

5. The process of claim 4 , wherein ultraviolet light hardens the resin and the stamp is peeled from the embossing and set aside.

6. 6. The process of claim 5, wherein one edge of the embossment is then cleaned to remove any edge defects or excess resin so that only the pattern remains.

7. The process of claim 1 , wherein a cylindrical surface forms the surface of the embossment.

8. heating the resin formulation to produce a stamp that continues the repeating embossed pattern; peeling the stamp from the embossed pattern over an integer number of patterns and placing the stamp back onto the embossed pattern in a different location to allow for seamless replication of the pattern onto the patterned area; The embossed film is formed by this.

9. The embossed film of claim 8 , wherein the region is a cylinder.

10. The embossed film of claim 8 , wherein the region is a flat surface.

11. The embossing film of claim 8, wherein the embossing process is self-aligning and begins with embossing a pattern by using a stamp and liquid resin on a flat substrate to spread the resin on the substrate, and then stamping the plastic film into the resin to produce the formed pattern.

12. The embossed film of claim 11 , wherein UV light cures the resin and the stamp is peeled from the embosser and set aside.

13. The embossed film of claim 12, wherein one edge of the embossment is then cleaned to remove any edge defects or excess resin so that only the pattern remains.

14. The embossed film of claim 8 , wherein a cylindrical surface forms the surface of the embossment.

15. heating the resin formulation to produce a stamp that continues the repeating embossed pattern; peeling the stamp from the embossed pattern over an integer number of patterns and placing the stamp back onto the embossed pattern in a different location to allow for seamless replication of the pattern onto the patterned area; It is formed by the region is a plane; The embossing process is self-aligning and begins with the embossing of a formed pattern using a stamp and liquid resin on a flat substrate, the resin is then dispersed on the substrate, and a plastic film is then stamped into the resin to produce the molded pattern, embossing the film.

16. The embossed film of claim 15, wherein the stamp is well aligned and pressed into the embossment in a small area, and corresponding engagement causes self-alignment of the pattern at the nanoscale, and the engagement area expands from the initial point and progresses throughout the overlapped area.

17. The embossed film of claim 16, wherein a clamp engages an area of ​​the pattern with a laminating roller to keep the pattern engaged during the forming step, and the stamp is lifted from the substrate to the clamp and adjacent to allow another area of ​​liquid resin to be applied to the substrate.

18. 20. The embossed film of claim 17, wherein the resin will wick to the clamp and areas proximal to the clamp to the first embossed pattern and the stamp forms a seamless replicated pattern.

Images