2High-quality signal transmission high-frequency connection structure based on floating structure

JP2025510701AActive Publication Date: 2025-04-15RESERCH ON ELECTRICAL APPLIANCES OF SHANGHAI ASTRONAUTICS CO LTD
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Patent Information

Application Number
JP2024556008
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Priority Date
2022-03-31
Filing Date
2022-12-29
Publication Date
2025-04-15
Estimated Expiration
2042-12-29

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Abstract

The present disclosure discloses a high-quality signal transmission high-frequency connection structure based on a two-floating structure, the high-quality signal transmission high-frequency connection structure based on the two-floating structure includes a PCB board and a high-frequency signal transmission assembly, the pad for transmitting a high-frequency signal to the PCB board includes a high-frequency signal transmission area and a ground area, the ground area is formed outside the high-frequency signal transmission area and has a gap between the high-frequency signal transmission area and the ground area, the high-frequency signal transmission assembly contacts the pad of the PCB board, the high-frequency signal transmission assembly includes an outer conductor assembly and an inner conductor assembly, the outer conductor assembly contacts the ground area, the inner conductor assembly contacts the high-frequency signal transmission area, and the parts of the outer conductor assembly and the inner conductor assembly that contact the PCB board can be floated, so that the outer conductor assembly and the inner conductor assembly can contact the pad simultaneously. The present disclosure improves the conditions for high-frequency signal transmission, eliminates the air gap in the high-frequency transmission line, avoids signal distortion and energy loss, and enables the transmission speed of high-frequency signals to reach 20 Gbps or more.
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Citation Information

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