Systems and methods for monitoring spatial light modulator (SLM) flare - Patents.com

Abstract

The problem of the presence of excessive flare in maskless photolithography systems is addressed by a system and method that utilizes an aerial imaging system to monitor flare associated with the maskless photolithography system.

Description

[Technical field]

[0001] cross reference This application claims priority to U.S. Provisional Patent Application No. 63 / 337,682, entitled "SYSTEM AND METHODS FOR MONITORING SPATIAL LIGHT MODULATOR (SLM) FLARE," filed May 3, 2022, which is hereby incorporated by reference in its entirety for all purposes. [Background technology]

[0002] Certain maskless photolithography systems and methods utilize one or more light sources, a spatial light modulator (SLM), and projection optics to project spatially patterned light onto photoresist on a wafer. The spatial pattern imparted by the SLM determines the locations at which the photoresist is exposed. To expose all of the photoresist on the wafer, the wafer is moved relative to the SLM and projection optics (e.g., using an actuator system that moves a stage on which the wafer sits). As the wafer is moved, the spatial pattern imparted by the SLM is updated to expose the photoresist at the desired locations on the wafer. However, the use of an SLM in maskless photolithography can introduce extra flare into the maskless photolithography system optics. Thus, systems and methods are presented herein for monitoring flare (SLM flare, as an example) in a maskless photolithography system.

[0003] Various embodiments of the invention are disclosed in the following detailed description and the accompanying drawings. [Brief description of the drawings]

[0004] [Figure 1A] FIG. 1 shows a schematic diagram illustrating an exemplary system for monitoring SLM flare in a maskless photolithography system when the system is operating in a first position. [Figure 1B]FIG. 1 shows a schematic diagram illustrating an exemplary system for monitoring SLM flare in a maskless photolithography system when the system is operating in a second position. [Figure 2A] 1 shows a flowchart illustrating a first exemplary method for monitoring SLM flare in a maskless photolithography system. [Figure 2B] 13 shows a flowchart illustrating a second exemplary method for monitoring SLM flare in a maskless photolithography system. [Diagram 3] FIG. 1 is a block diagram of a computer system used in some embodiments to perform portions of the methods for monitoring SLM flare in a maskless photolithography system described herein. [Figure 4A] 1 shows an example of a checkerboard SLM pattern or reference modulation pattern as described herein. [Figure 4B] 4B shows an example of a simulated illuminance profile obtained after passing light through the checkerboard pattern of FIG. 4A. [Figure 4C] 4C shows an example of a simulated central intensity of the irradiance profile of FIG. 4B. [Figure 4D] 4D shows an example of simulated contrast for the illumination profile of FIG. 4C. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0005] The present invention can be realized in many ways, including as a process, an apparatus, a system, a composition of matter, a computer program product embodied on a computer-readable storage medium, and / or a processor, such as a processor configured to execute instructions stored in and / or provided by a memory coupled to the processor. These implementations, or any other form the present invention may take, may be referred to herein as techniques. In general, the order of steps of a disclosed process may be modified within the scope of the present invention. Unless otherwise specified, components such as a processor or memory described as configured to perform a task may be implemented as general components temporarily configured to perform the task at a given time, or as specific components manufactured to perform the task. As used herein, the term "processor" refers to one or more devices, circuits, and / or processing cores configured to process data, such as computer program instructions.

[0006] A detailed description of one or more embodiments of the present invention is provided below along with the accompanying drawings illustrating the principles of the present invention. Although the present invention will be described in connection with such embodiments, the present invention is not limited to any embodiment. The scope of the present invention is limited only by the claims, and the present invention encompasses numerous alternatives, modifications, and equivalents. Numerous specific details are set forth in the following description in order to provide a thorough understanding of the present invention. These details are provided for the purpose of example, and the present invention may be practiced according to the claims without some or all of these specific details. For the sake of clarity, technical material known in the art related to the present invention has not been described in detail so as not to unnecessarily obscure the present invention.

[0007] As used herein, the term "or" is intended to convey both a disjunctive and a conjunctive sense. For example, the phrase "A or B" should be interpreted as including element A only, element B only, and the combination of elements A and B.

[0008] As used herein, the term "flare" refers to unwanted reflected or scattered light that reaches the wafer during a photolithography process. Flare can be caused by light traveling in a direction different than predicted by ray tracing. Flare can generally reduce exposure quality in photolithography by providing exposure to nominally dark areas on the wafer, thereby reducing contrast. Flare can be quantified as the percentage of the total light energy reaching the wafer that results from unwanted reflections or scattering within the photolithography system or within components of the photolithography system.

[0009] Certain maskless photolithography systems and methods utilize one or more light sources, a spatial light modulator (SLM), and projection optics to project spatially patterned light onto photoresist on a wafer. The spatial pattern imparted by the SLM determines the locations where the photoresist is exposed. To expose all of the photoresist on the wafer, the wafer is moved relative to the SLM and projection optics (e.g., using an actuator system that moves a stage on which the wafer sits). As the wafer is moved, the spatial pattern imparted by the SLM is updated to expose the photoresist at the desired locations on the wafer. However, the use of an SLM in maskless photolithography can introduce extra flare into the maskless photolithography system optics. For example, an SLM can operate in a piston mode by raising or lowering a micromirror. This raising and lowering process may impart a 0 degree phase or a 180 degree phase to each pixel of the SLM. However, small errors in the raising and lowering process can result in phase errors that manifest as flare. Small gaps between the micromirrors, holes in the centers of the micromirrors, and imperfections in the coating of the micromirrors can also contribute to flare. Furthermore, the flare associated with an SLM may change over time as its components age.

[0010] The problem of the presence of excessive flare in maskless photolithography systems is therefore addressed by a system and method that utilizes an aerial imaging system to monitor flare associated with the maskless photolithography system. The system and method generally utilize a stage configured to support an SLM and a reference plate featuring a reference modulation pattern. The stage is movable between two positions to allow either the SLM or the reference plate to receive source light from a light source. When the stage is positioned to allow the SLM to receive the source light, the SLM imparts an SLM modulation pattern to the source light and projects the spatially modulated light to a projection lens. The projection lens projects a first image corresponding to the spatially modulated light. The first image is received by the aerial imaging system. When the stage is positioned to allow the reference plate to receive the source light, the reference plate imparts a reference modulation pattern to the source light and projects the reference modulated light to a projection lens. The projection lens projects a second image corresponding to the reference modulated light. The second image is received by the aerial imaging system. The spatially modulated light includes a first flare pattern including a contribution from the SLM, and the reference modulated light includes a second flare pattern including a contribution from the reference plate. Assuming the reference plate is substantially free of defects, the flare associated with the SLM can be determined by subtracting the second flare pattern from the first flare pattern. The resulting flare can be used to modify one or more parameters associated with the SLM, such as the exposure time or exposure intensity of the spatially modulated light on the photoresist.

[0011] Provided herein is a system for monitoring spatial light modulator (SLM) flare in a maskless photolithography system, the system including a stage configured to support an SLM and a reference plate, the stage being movable between a first position where the SLM receives source light, imparts an SLM pattern to the source light, and projects spatially modulated light based on the SLM pattern, the spatially modulated light comprising a first flare pattern associated with the SLM, and a second position where the reference plate receives the source light, imparts a reference modulation pattern to the source light, and projects reference modulated light based on the reference modulation pattern, the reference modulated light comprising a second flare pattern associated with the reference plate, and a stage configured to support an SLM and a reference plate, the stage being movable between a first position where the SLM receives source light, imparts a reference modulation pattern to the source light, and projects reference modulated light based on the reference modulation pattern, the reference modulated light comprising a second flare pattern associated with the reference plate, and a stage configured to receive the spatially modulated light and project the spatially modulated light when the stage is in the first position. The system includes a projection lens configured to project a first image corresponding to the dimming and to receive a reference modulated light and project a second image corresponding to the reference modulated light when the stage is in a second position; an aerial imaging system configured to receive the first image and output a first signal corresponding thereto when the stage is in the first position and to receive the second image and output a second signal corresponding thereto when the stage is in the second position; and a controller operably coupled to the stage and the aerial imaging system, the controller configured to: (a) move the stage to the first position; (b) receive the first signal; (c) move the stage to the second position; (d) receive the second signal; and (e) determine a third flare pattern associated with the SLM error based on a difference between the first signal and the second signal. In some embodiments, the system further includes a light source configured to project a source light. In some embodiments, the controller is further operably coupled to the SLM, and the controller is further configured to modify one or more parameters associated with the SLM in response to the third flare pattern. In some embodiments, the one or more parameters include one or more elements selected from the group consisting of an exposure time of the spatially modulated light on the photoresist, an exposure intensity of the spatially modulated light on the photoresist, and a phase of one or more pixels associated with the SLM.In some embodiments, the reference modulation pattern comprises a static modulation pattern. In some embodiments, the aerial imaging system comprises at least one deep ultraviolet (DUV) camera. In some embodiments, the SLM pattern or the reference modulation pattern is selected from the group consisting of a checkerboard pattern, a flat line pattern, a parallelogram pattern, a diamond pattern, and a pattern including at least one alignment mark. In some embodiments, the source light comprises an OBKK light or a BBSK light. In some embodiments, the controller comprises a processor and a memory coupled to the processor, the memory configured to provide instructions to the processor that, when executed, cause the processor to perform (a)-(e). In some embodiments, the controller comprises a processor configured to perform (a)-(e) and a memory coupled to the processor and configured to provide instructions to the processor to perform (a)-(e).

[0012] Further provided herein is a method for monitoring spatial light modulator (SLM) flare in a maskless photolithography system, the method comprising the steps of: (a) projecting a source light onto an SLM, thereby imparting an SLM pattern to the source light and projecting spatially modulated light based on the SLM pattern, the spatially modulated light including a first flare pattern associated with the SLM; (b) using a projection lens to receive the spatially modulated light and project a first image corresponding to the spatially modulated light; and (c) using an aerial imaging system to receive the first image and output a first signal corresponding thereto. (d) projecting the source light onto a reference plate, thereby imparting a reference modulation pattern to the source light, and projecting the reference modulated light based on the reference modulation pattern, the reference modulated light including a second flare pattern associated with the reference plate; (f) using an aerial imaging system to receive the reference modulated light and project a second image corresponding to the reference modulated light; and (g) determining a third flare pattern associated with the SLM error based on a difference between the first signal and the second signal. In some embodiments, the method further includes using a light source to project the source light. In some embodiments, the method further includes modifying one or more parameters associated with the SLM in response to the third flare pattern. In some embodiments, the one or more parameters include one or more elements selected from the group consisting of an exposure time of the spatially modulated light on the photoresist, an exposure intensity of the spatially modulated light on the photoresist, and a phase of one or more pixels associated with the SLM. In some embodiments, the reference modulation pattern includes a static modulation pattern. In some embodiments, the aerial imaging system comprises at least one deep ultraviolet (DUV) camera. In some embodiments, the SLM pattern or the reference modulation pattern is selected from the group consisting of a checkerboard pattern, a flat line pattern, a parallelogram pattern, a diamond pattern, and a pattern including at least one alignment mark.

[0013] Further provided in the specification is an exposure apparatus comprising: an illumination optical system configured to illuminate an SLM having a plurality of spatial light modulator (SLM) elements whose reflective surfaces are arranged on a placement surface; a projection optical system configured to project light from the SLM onto a workpiece; a reference member having a reference modulation pattern; a position change device configured to change the positional relationship between the SLM, the reference member, and the projection optical system to either a first positional relationship in which light from the illumination optical system is incident on the projection optical system via the SLM, or a second positional relationship in which light from the illumination optical system is incident on the projection optical system via the reference member; and a detection device configured to detect light from the SLM or the reference member via the projection optical system.

[0014] In some embodiments, the exposure apparatus comprises a calculation device configured to calculate a state of the SLM based on a first output from the detection device in the first positional relationship and a second output from the detection device in the second positional relationship. In some embodiments, the state of the SLM comprises flare from the SLM. In some embodiments, the detection device is configured to detect an aerial image of the SLM and a reference pattern of the reference member formed by the projection optics. In some embodiments, the detection device is configured to detect an aerial image of the SLM in the first positional relationship and an aerial image of the reference modulation pattern in the second positional relationship. In some embodiments, the exposure apparatus further comprises a controller configured to control a pattern of the plurality of SLM elements and a position changing device. In some embodiments, the controller is configured to set the pattern of the plurality of SLM elements to the same pattern as the reference modulation pattern. In some embodiments, the reference modulation pattern comprises at least one of a checkerboard pattern, a flat line pattern, a parallelogram pattern, a diamond pattern, and a pattern including at least one alignment mark.

[0015] Further provided herein is an exposure method including the steps of illuminating a spatial light modulator (SLM) having a plurality of SLMs with reflective surfaces arranged on a placement surface, using a projection optical system to project light from the SLM onto a workpiece, setting a positional relationship between the SLM and the projection optical system to a first positional relationship in which the light from the SLM is incident on the projection optical system, outputting a first output by detecting the light from the SLM via the projection optical system in the first positional relationship, setting a positional relationship between a reference member having a reference modulation pattern and the projection optical system to a second positional relationship in which the light from the reference member is incident on the projection optical system, and outputting a second output by detecting the light from the SLM via the projection optical system in the second positional relationship. In some embodiments, the exposure method further includes obtaining a state of the SLM based on the first and second outputs.

[0016] Further provided herein is a method for manufacturing a device, the method for manufacturing a device comprising the steps of forming a resist on a surface of a substrate and exposing an exposure pattern using an exposure method.

[0017] FIG. 1A shows a schematic diagram illustrating an exemplary system 100 for monitoring SLM flare in a maskless photolithography system when the system 100 is operating in a first position. In some embodiments, the system 100 is referred to herein as an exposure apparatus. In the illustrated example, the system 100 comprises illumination optics 110. In some embodiments, the illumination optics 110 comprises a light source. In some embodiments, the illumination optics 110 is configured to project a source light 112. In some embodiments, the illumination optics 110 comprises at least one light emitting diode (LED). In some embodiments, the illumination optics 110 comprises at least one laser source. In some embodiments, the laser source comprises at least one continuous wave laser source. In some embodiments, the laser source comprises at least one pulsed laser. In some embodiments, the laser source comprises at least one gas laser, typically an argon fluoride (ArF) excimer laser or a krypton fluoride (KrF) excimer laser. In some embodiments, the laser source comprises at least one metal vapor laser. In some embodiments, the laser source comprises at least one solid-state laser. In some embodiments, the laser source comprises at least one semiconductor laser or diode laser. Although shown in FIG. 1A as including illumination optics 110, in some embodiments, system 100 does not include illumination optics 110.

[0018] In the illustrated example, the system 100 includes a repositioning device 120. In some embodiments, the repositioning device 120 includes a stage. In some embodiments, the repositioning device 120 is configured to support the SLM 130 and the reference member 140. In some embodiments, when the repositioning device 120 is in a first position, the SLM 130 receives the source light 112, imparts an SLM pattern 132 thereto, and projects spatially modulated light 134 based on the SLM pattern 132. In some embodiments, the SLM pattern 132 includes a checkerboard pattern, a flat line pattern, a parallelogram pattern, a diamond pattern, or a pattern including at least one alignment mark. In some embodiments, the spatially modulated light 134 includes a first flare pattern associated with the SLM 130. In the illustrated example, the SLM 130 includes a reflective SLM. However, in some embodiments, the SLM 130 includes a transmissive SLM. In some embodiments, the SLM includes a plurality of SLM elements having a reflective surface arranged on a placement surface. In some embodiments, the illumination optics 110 is configured to illuminate the SLM.

[0019] In the illustrated example, SLM 130 provides SLM pattern 132 with a display resolution of 8×6 for simplicity. However, SLM pattern 132 may have any display resolution. In some embodiments, SLM 130 has a pixel pitch of at least about 0.1 micrometers (μm) or more. In some embodiments, SLM 130 has a pixel pitch of at most about 10 μm or less. In some embodiments, SLM 130 has a pixel pitch of about 0.1 μm to about 10 μm. Additionally, the inset shows SLM pattern 132 rotated 90 degrees for illustrative purposes.

[0020] In the depicted example, system 100 includes projection optics 150. In some embodiments, projection optics 150 includes a projection lens. In some embodiments, when repositioning apparatus 120 is in a first position, projection optics 150 is configured to receive spatially modulated light 134 and project a first image 152 that corresponds to spatially modulated light 134. In some embodiments, projection optics is configured to project light from the SLM onto a workpiece (not shown in FIG. 1A ).

[0021] In the illustrated example, the system 100 includes a detection device 160. In some embodiments, the detection device 160 includes an aerial imaging system. In some embodiments, when the repositioning device 120 is in the first position, the detection device 160 is configured to receive the first image 152 and output a first signal 162 corresponding to the first image 152. In some embodiments, the first image 152 includes an aerial image of the SLM 130. In some embodiments, the detection device 160 includes at least one ultraviolet (UV) camera or at least one deep UV (DUV) camera. In some embodiments, the detection device 160 is substantially similar to or identical to any of the systems disclosed in U.S. Pat. Nos. 8,809,616, 7,573,052, and 7,791,718, each of which is incorporated by reference in its entirety for all purposes.

[0022] In the illustrated example, the system 100 includes a controller 170. In some embodiments, the controller 170 is operably coupled to the position change device 120 and the detection device 160. In some embodiments, the controller 170 is configured to receive the first signal 162 when the position change device 120 is in the first position.

[0023] Thus, when in the first position, detection arrangement 160 is configured to detect light from SLM 130 via projection optics 150 .

[0024] FIG. 1B shows a schematic diagram illustrating an exemplary system 100 for monitoring SLM flare in a maskless photolithography system when the system 100 is operating in a second position.

[0025] As shown in FIG. 1A, the system 100 generally comprises illumination optics 110 configured to project source light 112, a positioning apparatus 120 configured to support an SLM 130 and a reference member 140, projection optics 150, a detection apparatus 160, and a controller 170.

[0026] In the illustrated example, when the position-changing device 120 is in the second position, the reference member 140 receives the source light 112, imparts a reference modulation pattern 142, and projects a reference modulated light 144 based on the reference modulation pattern 142. In some embodiments, the reference member 140 comprises a reference plate. In some embodiments, the reference modulation pattern 142 comprises a checkerboard pattern, a flat line pattern, a parallelogram pattern, a diamond pattern, or a pattern including at least one alignment mark. In some embodiments, the reference modulated light 144 comprises a second flare pattern associated with the reference member 140. In some embodiments, the reference modulation pattern 142 comprises a static modulation pattern. In some embodiments, the reference member 140 comprises a series of transmissive regions and a series of absorbing regions. In some embodiments, the transmissive regions and absorbing regions emulate the behavior of an ideal SLM.

[0027] In the illustrated example, the reference member 140 provides a reference modulation pattern 142 having a display resolution of 8×6 for simplicity. However, the reference modulation pattern 142 may have any display resolution. For example, in some embodiments, the reference modulation pattern 142 has the same display resolution as the display resolution of the SLM pattern 132. For example, in some embodiments, the display resolution of the reference modulation pattern is greater than or less than the display resolution of the SLM pattern 132. Additionally, the inset shows the reference modulation pattern 154 rotated 90 degrees for illustrative purposes.

[0028] In the illustrated example, when the repositioning apparatus 120 is in the first position, the projection optics 150 is configured to receive the reference modulated light 144 and project a second image 154 that corresponds to the reference modulated light 144 .

[0029] In the illustrated example, when the repositioning device 120 is in the second position, the detection device 160 is configured to receive the second image 154 and output a second signal 164 corresponding to the second image 154. In some embodiments, the first image 152 includes an aerial image of the reference member 140.

[0030] 1A, the system 100 includes a controller 170. In some embodiments, the controller 170 is operably coupled to the position change device 120 and the detection device 160. In some embodiments, in the illustrated example, the controller 170 is configured to receive a second signal 164 when the position change device 120 is in the second position.

[0031] In some embodiments, the controller 170 is configured to sequentially control the repositioning device 120 and the detection device 160. Thus, in some embodiments, the controller 170 is configured to perform the following sequence of operations: (a) moving the repositioning device 120 to a first position, (b) receiving a first signal 162 from the detection device 160, (c) moving the repositioning device 120 to a second position, (d) receiving a second signal 164 from the detection device 160, and (e) determining a third flare pattern associated with the SLM error based on a difference between the first signal 162 and the second signal 164. In some embodiments, the sequence of operations is repeated one or more times during operation of the maskless photolithography system.

[0032] In some embodiments, the controller 170 is operably coupled to the SLM 130. In some embodiments, the controller 170 is configured to modify one or more parameters associated with the SLM 130 in response to the third flare pattern. For example, in some embodiments, the controller 170 is configured to modify an exposure time of the spatially modulated light 134 on a photoresist (not shown in FIG. 1A or FIG. 1B), an exposure intensity of the spatially modulated light 134 on the photoresist, or a phase of one or more pixels associated with the SLM 134. In some embodiments, the controller 170 is configured to control the pattern of the SLM 130 and the plurality of SLM elements of the repositioning device 120. In some embodiments, the controller 170 is configured to set the pattern of the plurality of SLM elements to the same pattern as the reference modulation pattern 142. In some embodiments, the controller 170 comprises a computer system 300, or any component thereof, described herein with respect to FIG. 3.

[0033] Thus, the detector 160 is configured to detect light from the reference member 140 via the projection optics 150 when in the second position.

[0034] In combination, as shown in Figures 1A and 1B, in some embodiments, the position change device 120 is configured to change the positional relationship between the SLM 130, the reference member 140, and the projection optical system 150 to either a first positional relationship in which light from the illumination optical system 110 enters the projection optical system 150 via the SLM 130, or a second positional relationship in which light from the illumination optical system 110 enters the projection optical system 150 via the reference member 140.

[0035] In some embodiments, the system 100 further comprises a computing device (not shown in FIG. 1A or FIG. 1B ). In some embodiments, the computing device comprises a computer system 300 described herein with respect to FIG. 3 , or any components thereof. In some embodiments, the computing device is configured to calculate a state of the SLM 130 based on a first output (e.g., first signal 162) from the detection device 160 in the first positional relationship and a second output (e.g., second signal 164) from the detection device 160 in the second positional relationship. In some embodiments, the computing device is configured to calculate a state of the SLM 130 based on a difference between the first signal 162 and the second signal 164, as described herein. In some embodiments, the state of the SLM 130 includes a flare from the SLM 130.

[0036] FIG. 2A shows a flow chart illustrating a first exemplary method 200A for monitoring SLM flare in a maskless photolithography system. In the illustrated example, source light is projected onto an SLM at 210A. In some embodiments, projecting the source light onto the SLM imparts an SLM pattern to the source light and projects spatially modulated light based on the SLM pattern. In some embodiments, the spatially modulated light includes a first flare pattern associated with the SLM. In some embodiments, the SLM includes any SLM described herein with respect to FIG. 1A or FIG. 1B. In some embodiments, the SLM pattern includes any SLM pattern described herein with respect to FIG. 1A or FIG. 1B. In some embodiments, the spatially modulated light includes any spatially modulated light described herein with respect to FIG. 1A or FIG. 1B. In some embodiments, the first flare pattern includes any first flare pattern described herein with respect to FIG. 1A or FIG. 1B.

[0037] At 220A, a projection lens is used to receive the spatially modulated light. In some embodiments, the projection lens is used to project a first image corresponding to the spatially modulated light. In some embodiments, the projection lens comprises any projection lens described herein with respect to FIG. 1A or FIG. 1B. In some embodiments, the first image includes any first image described herein with respect to FIG. 1A or FIG. 1B.

[0038] At 230A, an aerial imaging system is used to receive a first image and output a first signal corresponding to the first image. In some embodiments, the aerial imaging system comprises any aerial imaging system described herein with respect to Figure 1A or Figure 1B. In some embodiments, the first signal includes any first signal described herein with respect to Figure 1A or Figure 1B.

[0039] At 240A, the source light is projected onto a reference plate. In some embodiments, projecting the source light onto the reference plate imparts a reference modulation pattern to the source light and projects a reference modulated light based on the reference modulation pattern. In some embodiments, the reference modulated light includes a second flare pattern associated with the reference plate. In some embodiments, the reference plate comprises any reference plate described herein with respect to FIG. 1A or FIG. 1B. In some embodiments, the reference modulation pattern includes any reference modulation pattern described herein with respect to FIG. 1A or FIG. 1B. In some embodiments, the reference modulated light includes any reference modulated light described herein with respect to FIG. 1A or FIG. 1B. In some embodiments, the second flare pattern includes any second flare pattern described herein with respect to FIG. 1A or FIG. 1B.

[0040] At 250A, a projection lens is used to receive the reference modulated light. In some embodiments, the projection lens is used to project a second image corresponding to the reference modulated light. In some embodiments, the second image includes any second image described herein with respect to FIG. 1A or FIG. 1B.

[0041] At 260A, an aerial imaging system is used to receive a second image and output a second signal corresponding to the second image. In some embodiments, the second signal includes any second signal described herein with respect to FIG. 1A or FIG. 1B.

[0042] At 270A, a third flare pattern associated with the SLM error is determined based on the difference between the first signal and the second signal. In some embodiments, the third flare pattern includes any third flare pattern described herein with respect to FIG. 1A or FIG. 1B.

[0043] In some embodiments, the method 200A further includes modifying one or more parameters associated with the SLM in response to the third flare pattern, in some embodiments, the one or more parameters include an exposure time of the spatially modulated light on the photoresist, an exposure intensity of the spatially modulated light on the photoresist, or a phase of one or more pixels associated with the SLM.

[0044] In some embodiments, method 200A, or any one or more of operations 210A, 220A, 230A, 240A, 250A, and 260A, and 270A, are performed using system 100 described herein with respect to FIG. 1A or FIG. 1B, or computer system 300 described herein with respect to FIG. 3.

[0045] 2B shows a flow chart illustrating a second exemplary method 200B for monitoring SLM flare in a maskless photolithography system. In the illustrated example, the SLM is illuminated at 210B. In some embodiments, the SLM includes any SLM described herein with respect to FIG. 1A or FIG. 1B.

[0046] At 220B, projection optics are used to project light from the SLM to the workpiece. In some embodiments, the projection optics comprises any projection optics described herein with respect to Figure 1A or Figure 1B.

[0047] At 230B, the positional relationship between the SLM and the projection optics is set to a first positional relationship in which light from the SLM is incident on the projection optics, in some embodiments the positional relationship is set using a repositioning apparatus as described herein with respect to Figure 1A or 1B.

[0048] At 240B, light is detected from the SLM via the projection optics in a first relationship to provide a first output, in some embodiments the light is detected using a detection apparatus as described herein with respect to Figure 1A or Figure 1B.

[0049] At 250B, the positional relationship between the reference member and the projection optical system is set to a second positional relationship in which light from the reference member is incident on the projection optical system. In some embodiments, the reference member comprises any reference member described herein with respect to Figure 1A or 1B. In some embodiments, the positional relationship is set using a repositioning device described herein with respect to Figure 1A or 1B.

[0050] At 260B, light is detected from the reference member via the projection optics in a second relationship to provide a second output, in some embodiments, the light is detected using a detection apparatus described herein with respect to FIG.

[0051] In some embodiments, the method 200B further includes obtaining a state of the SLM based on the first and second outputs.

[0052] In some embodiments, a method for manufacturing a device includes forming a resist (eg, photoresist) on a surface of a substrate and exposing the resist to an exposure pattern using method 200B.

[0053] In some embodiments, system 100, method 200A, or method 200B are used to measure SLM flare at different locations across all or part of the surface of the SLM to obtain flare measurements as a function of position on the SLM. In some embodiments, an aerial imaging system as described herein measures SLM flare at different locations on the SLM using a scanning imaging protocol.

[0054] In some embodiments, system 100, method 200A, or method 200B are used to measure the uniformity of the illumination provided by a light source, or a light source and a projection lens. In some embodiments, the uniformity of the illumination can be measured by setting all pixels of the SLM to a uniform phase or height. In some embodiments, the measured uniformity of the illumination can enable the SLM to compensate for non-uniformities in the illumination.

[0055] In some embodiments, system 100, method 200A, or method 200B is used to provide a calibration profile of the SLM. In some embodiments, a white light interferometer (e.g., a Mirau interferometer, a Michelson interferometer, a Linnik interferometer, etc.) is used to measure height or phase errors of pixels of the SLM. In some embodiments, the measured height or phase errors may enable the SLM to compensate for such non-idealities. In some embodiments, the white light interferometer comprises any of the interferometers disclosed in U.S. Patent Nos. 11,099,007, 10,267,625, and 10,302,419, each of which is incorporated herein by reference in its entirety for all purposes.

[0056] In some embodiments, system 100, method 200A, or method 200B is used to calibrate the relative position between a white light interferometer and an SLM defect detection system. In some embodiments, a reference modulation pattern or an SLM modulation pattern including alignment marks is used to calibrate the relative position. In some embodiments, the SLM defect detection system comprises any inspection device disclosed in Japanese Patent No. 6969163, which is incorporated herein by reference in its entirety for all purposes.

[0057] In some embodiments, system 100, method 200A, or method 200B are used to calibrate the illumination uniformity of an SLM defect detection system. In some embodiments, the illumination uniformity is calibrated using SLM pattern 132 that displays a flat pattern (i.e., the pattern when all mirrors of SLM 130 are in the same state).

[0058] In some embodiments, the system 100 can be used to calibrate the height measurements of an SLM defect detection system. In some embodiments, the height measurements are calibrated using an SLM pattern 132 that displays a checkerboard pattern.

[0059] In some embodiments, system 100, method 200A, or method 200B is used to provide blind alignment of an illumination pattern. In some embodiments, the blind alignment uses a parallelogram illumination pattern and a test pattern that includes a parallelogram pattern. In some embodiments, the blind alignment uses a test pattern that includes a checkerboard pattern.

[0060] In some embodiments, system 100, method 200A, or method 200B are used to provide measurements of the optical power or intensity of the projected light described herein. In some embodiments, the measurements of optical power or intensity are measured using a test pattern that includes a solid pattern. In some embodiments, the measurements of optical power or intensity are used to monitor any changes in the SLM, such as degradation of the intrinsic reflectivity of the SLM (e.g., due to changes in the SLM surface or coating). In some embodiments, the changes in the SLM are detected by comparing the measurements of optical power or intensity through the SLM to measurements through the test pattern.

[0061] FIG. 3 is a block diagram of a computer system 300 used in some embodiments to perform a portion of the method for monitoring SLM flare in a maskless photolithography system described herein (e.g., operation 270A of method 200A described herein with respect to FIG. 2A). In some embodiments, the computer system can be utilized as a component of the system for monitoring SLM flare in a maskless photolithography system described herein (e.g., controller 170 of system 100 described herein with respect to FIG. 1A or FIG. 1B, etc.). FIG. 3 illustrates one embodiment of a general-purpose computer system. Other computer system architectures and configurations can be used to perform the processing of the present invention. The computer system 300, which is made up of various subsystems described below, includes at least one microprocessor subsystem 301. In some embodiments, the microprocessor subsystem comprises at least one central processing unit (CPU) or a graphics processing unit (GPU). The microprocessor subsystem can be realized by a single chip processor or multiple processors. In some embodiments, the microprocessor subsystem is a general-purpose digital processor that controls the operation of the computer system 300. Using instructions retrieved from memory 304, the microprocessor subsystem controls the receipt and manipulation of input data, and the output and display of data on output devices.

[0062] The microprocessor subsystem 301 is bidirectionally coupled to memory 304, which may include a first primary storage area, typically a random access memory (RAM), and a second primary storage area, typically a read-only memory (ROM). As is well known in the art, the primary storage may be used as a general storage area and scratch pad memory, and may also be used to store input data and processing data. It may also store programming instructions and data in the form of data objects and text objects, in addition to other data and instructions for processes operating on the microprocessor subsystem. As is also well known in the art, the primary storage typically includes basic operating instructions, program code, data and objects used by the microprocessor subsystem to perform its functions. The primary storage 304 may include any suitable computer-readable storage medium, as described below, depending, for example, on whether data access needs to be bidirectional or unidirectional. The microprocessor subsystem 301 may also directly and very quickly retrieve and store frequently needed data in a cache memory (not shown).

[0063] The removable mass storage device 305 provides additional data storage capacity for the computer system 300 and is coupled to the microprocessor subsystem 301 either bidirectionally (read / write) or unidirectionally (read only). The storage device 305 may also include computer readable media such as magnetic tape, flash memory, signals embodied on carrier waves, PC-CARDS, portable mass storage devices, holographic storage devices, and other storage devices. The fixed mass storage device 309 may also provide additional data storage capacity. The most common example of a mass storage device 309 is a hard disk drive. The mass storage devices 305 and 309 generally store additional programming instructions, data, etc. that are not normally actively used by the processing subsystem. It will be understood that the information held in the mass storage devices 305 and 309 may be incorporated in standard fashion as part of the primary storage device 304 (e.g., RAM) as virtual memory, if desired.

[0064] In addition to providing the processing subsystem 301 with access to the storage subsystem, the bus 306 may also be used to provide access to other subsystems and devices. In the described embodiment, these may include a display monitor 308, a network interface 307, a keyboard 302, and a pointing device 303, as well as auxiliary input / output device interfaces, a sound card, speakers, and other subsystems as required. The pointing device 303 may be a mouse, stylus, trackball, or tablet, and is useful for interacting with a graphical user interface.

[0065] The network interface 307 allows the processing subsystem 301 to be coupled to another computer, computer network, or telecommunications network using a network connection as shown. It is contemplated that through the network interface 307, the processing subsystem 301 may receive information, e.g., data objects or program instructions, from another network, or output information to another network in the course of performing the method steps described above. Information, often represented as a series of instructions executed on the processing subsystem, may be received from and output to another network, e.g., in the form of a computer data signal embodied in a carrier wave. An interface card or similar device and appropriate software implemented by the processing subsystem 301 may be used to connect the computer system 300 to an external network and transfer data according to standard protocols. That is, the method embodiments of the present invention may be performed solely on the processing subsystem 301, or may be performed over a network, such as the Internet, an intranet network, or a local area network, with a remote processing subsystem sharing a portion of the processing. Additional mass storage devices (not shown) may also be connected to the processing subsystem 301 through the network interface 307.

[0066] Auxiliary I / O device interfaces (not shown) may be used with computer system 300. The auxiliary I / O device interfaces may include generic and customized interfaces that allow processing subsystem 301 to send, and more typically receive, data to and from other devices such as microphones, touch-sensitive displays, transducer card readers, tape readers, voice or handwriting recognition devices, biometric readers, cameras, portable mass storage devices, and other computers.

[0067] Moreover, embodiments of the present invention further relate to computer storage products having computer readable media containing program code for performing various computer implemented operations. A computer readable medium is any data storage device capable of storing data which can thereafter be read by a computer system. The media and program code may be those specially designed and constructed for the purposes of the present invention, or may be of a type well known to those skilled in the art of computer software technology. Examples of computer readable media include, but are not limited to, all of the above media, i.e. magnetic media such as hard disks, floppy disks, and magnetic tapes, optical media such as CD-ROM disks, magneto-optical media such as floptical disks, specially configured hardware devices such as application specific integrated circuits (ASICs), programmable logic devices (PLDs), ROM and RAM devices, etc. The computer readable media may also be distributed as a data signal embodied in a carrier wave over a network of coupled computer systems such that the computer readable code is stored and executed in a distributed manner. Examples of program code include both machine code, as produced, for example, by a compiler, or files containing higher level code that may be executed using an interpreter. The computer system shown in FIG. 3 is but one example of a computer system suitable for use with the present invention. Other computer systems suitable for use with the present invention may include additional or fewer subsystems. Moreover, bus 306 illustrates any interconnection scheme that serves to link the subsystems. Other computer architectures having different configurations of subsystems may also be utilized. EXAMPLES

[0068] Example 1: Checkerboard pattern FIG. 4A shows an example of a checkerboard SLM pattern or reference modulation pattern described herein. In the illustrated example, the checkerboard pattern utilized a series of dark squares and a series of light squares. Each of the dark and light squares comprised an area of ​​36 nanometers (nm) by 36 nm and was separated from the other squares by a gap of 4 nm. The dark and light squares were arranged in a checkerboard pattern covering an area of ​​3 μm by 3 μm. The test pattern was placed on a 6 μm by 6 μm substrate.

[0069] FIG. 4B shows an example of a simulated irradiance profile obtained after passing light through the checkerboard pattern of FIG. 4A. FIG. 4C shows an example of a simulated central intensity of the irradiance profile of FIG. 4B. FIG. 4D shows an example of a simulated contrast of the irradiance profile of FIG. 4C. As shown in FIG. 4B-FIG. 4D, the reference plate alone produces a sharp irradiance profile with minimal losses. The reference plate combined with an error-free SLM produces a less sharp irradiance profile with increased losses. The reference plate with an SLM with phase errors due to the micromirror position error of 8 nm produces an even blurrier irradiance profile with even higher losses.

[0070] Enumeration of embodiments Embodiment 1. A system for monitoring spatial light modulator (SLM) flare in a maskless photolithography system, comprising: The system comprises: a stage configured to support the SLM and a reference plate, a first position in which the SLM receives a source light, imparts an SLM pattern to the source light, and projects spatially modulated light based on the SLM pattern, the spatially modulated light comprising a first flare pattern associated with the SLM; a second position where the reference plate receives the source light, imparts a reference modulation pattern to the source light, and projects a reference modulated light based on the reference modulation pattern, the reference modulated light including a second flare pattern associated with the reference plate; receiving the spatially modulated light when the stage is in a first position and projecting a first image corresponding to the spatially modulated light; a projection lens configured to receive the reference modulated light and project a second image corresponding to the reference modulated light when the stage is in the second position; and receiving a first image and outputting a corresponding first signal when the stage is in a first position; an aerial imaging system configured to receive a second image and output a corresponding second signal when the stage is in the second position; a controller operably coupled to the stage and the aerial imaging system, (a) moving the stage to a first position; (b) receiving a first signal; (c) moving the stage to a second position; (d) receiving a second signal; (e) a controller configured to determine a third flare pattern associated with the SLM error based on a difference between the first signal and the second signal; A system comprising:

[0071] Embodiment 2. The system of embodiment 1, further comprising a light source configured to project source light.

[0072] Embodiment 3. The system of embodiment 1 or 2, wherein the controller is further operably coupled to the SLM, the controller further configured to alter one or more parameters associated with the SLM in response to a third flare pattern.

[0073] Embodiment 4. The system of embodiment 3, wherein the one or more parameters include one or more elements selected from the group consisting of an exposure time of the spatially modulated light on the photoresist, an exposure intensity of the spatially modulated light on the photoresist, and a phase of one or more pixels associated with the SLM.

[0074] Embodiment 5. A system according to any one of embodiments 1 to 4, wherein the reference modulation pattern comprises a static modulation pattern.

[0075] Embodiment 6. A system described in any one of embodiments 1 to 5, wherein the aerial imaging system comprises at least one deep ultraviolet (DUV) camera.

[0076] Embodiment 7. A system described in any one of embodiments 1 to 6, wherein the SLM pattern or reference modulation pattern is selected from the group consisting of a checkerboard pattern, a flat line pattern, a parallelogram pattern, a diamond pattern, and a pattern including at least one alignment mark.

[0077] Embodiment 8. A system described in any one of embodiments 1 to 7, wherein the source light includes OBKK light or BBSK light.

[0078] Embodiment 9. The controller A processor; a memory coupled to the processor, the memory being configured to provide the processor with instructions that, when executed, cause the processor to perform (a)-(e); 9. The system of any one of embodiments 1 to 8, comprising:

[0079] Embodiment 10. The controller A processor configured to execute (a)-(e); a memory coupled to the processor and configured to provide the processor with instructions to perform (a)-(e); 9. The system of any one of embodiments 1 to 8, comprising:

[0080] Embodiment 11. A method for monitoring spatial light modulator (SLM) flare in a maskless photolithography system, comprising: The method comprises: (a) projecting source light onto an SLM, thereby imparting an SLM pattern to the source light, and projecting spatially modulated light based on the SLM pattern, the spatially modulated light comprising a first flare pattern associated with the SLM; (b) using a projection lens to receive the spatially modulated light and project a first image corresponding to the spatially modulated light; (c) using an aerial imaging system to receive a first image and output a first signal corresponding thereto; (d) projecting the source light onto a reference plate, thereby imparting a reference modulation pattern to the source light, and projecting the reference modulated light based on the reference modulation pattern, the reference modulated light including a second flare pattern associated with the reference plate; (e) using a projection lens to receive the reference modulated light and project a second image corresponding to the reference modulated light; (f) using the airborne imaging system to receive a second image and output a corresponding second signal; (g) determining a third flare pattern associated with the SLM error based on a difference between the first signal and the second signal; A method comprising:

[0081] Embodiment 12. The method of embodiment 11, further comprising the step of using a light source to project the source light.

[0082] Embodiment 13. The method of embodiment 11 or 12, further comprising modifying one or more parameters associated with the SLM in response to the third flare pattern.

[0083] Embodiment 14. The method of embodiment 13, wherein the one or more parameters include one or more elements selected from the group consisting of an exposure time of the spatially modulated light on the photoresist, an exposure intensity of the spatially modulated light on the photoresist, and a phase of one or more pixels associated with the SLM.

[0084] Embodiment 15. The method of any one of embodiments 11 to 14, wherein the reference modulation pattern includes a static modulation pattern.

[0085] Embodiment 16. The method of any one of embodiments 11 to 15, wherein the aerial imaging system comprises at least one deep ultraviolet (DUV) camera.

[0086] Embodiment 17. A method according to any one of embodiments 11 to 16, wherein the SLM pattern or the reference modulation pattern is selected from the group consisting of a checkerboard pattern, a flat line pattern, a parallelogram pattern, a diamond pattern, and a pattern including at least one alignment mark.

[0087] Embodiment 18. An illumination optical system configured to illuminate a spatial light modulator (SLM) having a plurality of SLM elements arranged on a placement surface, the SLM having a reflective surface; a projection optics configured to project light from the SLM onto a workpiece; a reference member having a reference modulation pattern; a position changing device configured to change the positional relationship between the SLM, the reference member, and the projection optical system to either a first positional relationship in which light from the illumination optical system is incident on the projection optical system via the SLM, or a second positional relationship in which light from the illumination optical system is incident on the projection optical system via the reference member; a detection device configured to detect light from the SLM or the reference member via the projection optics; An exposure apparatus comprising:

[0088] Embodiment 19. An exposure apparatus as described in embodiment 18, further comprising a calculation device configured to calculate a state of the SLM based on a first output from a detection device in a first positional relationship and a second output from a detection device in a second positional relationship.

[0089] Embodiment 20. An exposure apparatus as described in embodiment 19, wherein the state of the SLM includes flare from the SLM.

[0090] Embodiment 21. An exposure apparatus according to any one of embodiments 18 to 20, wherein the detection device is configured to detect an aerial image of the SLM and a reference modulation pattern of the reference member formed by the projection optical system.

[0091] Embodiment 22. An exposure apparatus as described in embodiment 21, wherein the detection device is configured to detect an aerial image of the SLM in a first positional relationship and to detect an aerial image of the reference modulation pattern in a second positional relationship.

[0092] Embodiment 23. An exposure apparatus according to any one of embodiments 18 to 22, further comprising a controller configured to control the pattern and position changing device of the plurality of SLM elements.

[0093] Embodiment 24. An exposure apparatus as described in embodiment 23, wherein the controller is configured to set the pattern of the multiple SLM elements to the same pattern as the reference modulation pattern.

[0094] Embodiment 25. An exposure apparatus according to any one of embodiments 18 to 24, wherein the reference modulation pattern includes at least one of a checkerboard pattern, a flat line pattern, a parallelogram pattern, a diamond pattern, and a pattern including at least one alignment mark.

[0095] Embodiment 26. Illuminating a spatial light modulator (SLM) having a plurality of SLMs with reflective surfaces arranged on a placement surface; using projection optics to project light from the SLM onto a workpiece; setting a positional relationship between the SLM and the projection optical system to a first positional relationship in which light from the SLM is incident on the projection optical system; outputting a first output by detecting light from the SLM via a projection optical system in a first positional relationship; setting a positional relationship between a reference member having a reference modulation pattern and the projection optical system to a second positional relationship in which light from the reference member is incident on the projection optical system; outputting a second output by detecting light from the SLM via the projection optics in a second positional relationship; An exposure method comprising:

[0096] Embodiment 27. An exposure method as described in embodiment 26, further comprising a step of acquiring a state of the SLM based on the first and second outputs.

[0097] Embodiment 28. A step of forming a resist on a surface of a substrate; Exposing an exposure pattern using the exposure method according to embodiment 26 or 27; A method for manufacturing a device comprising:

[0098] In addition, to the extent permitted by the domestic laws of the designated state (or elected state) to which this international application applies, the above disclosures of all publications (including international publication pamphlets) and U.S. patents related to the exposure apparatus cited in each of the above embodiments and variations are incorporated by reference into this specification.

Claims

1. 1. A system for monitoring spatial light modulator (SLM) flare in a maskless photolithography system, comprising: The system comprises: a stage configured to support the SLM and a reference plate, a first position in which the SLM receives a source light, imparts an SLM pattern to the source light, and projects spatially modulated light based on the SLM pattern, the spatially modulated light including a first flare pattern associated with the SLM; a second position where the reference plate receives the source light, imparts a reference modulation pattern to the source light, and projects reference modulated light based on the reference modulation pattern, the reference modulated light including a second flare pattern associated with the reference plate; receiving the spatially modulated light when the stage is in the first position and projecting a first image corresponding to the spatially modulated light; a projection lens configured to receive the reference modulated light and project a second image corresponding to the reference modulated light when the stage is in the second position; and receiving the first image and outputting a first signal corresponding thereto when the stage is in the first position; an aerial imaging system configured to receive the second image and output a corresponding second signal when the stage is in the second position; a controller operably coupled to the stage and the aerial imaging system, (a) moving the stage to the first position; (b) receiving the first signal; (c) moving the stage to the second position; (d) receiving the second signal; (e) the controller configured to determine a third flare pattern associated with an SLM error based on a difference between the first signal and the second signal. system.

2. and further comprising a light source configured to project the source light. The system of claim 1 .

3. the controller is further operably coupled to the SLM, the controller being further configured to alter one or more parameters associated with the SLM in response to the third flare pattern.

3. A system according to claim 1 or 2.

4. the one or more parameters include one or more elements selected from the group consisting of an exposure time of the spatially modulated light on a photoresist, an exposure intensity of the spatially modulated light on a photoresist, and a phase of one or more pixels associated with the SLM; The system of claim 3.

5. the reference modulation pattern comprises a static modulation pattern; A system according to any one of claims 1 to 4.

6. the aerial imaging system comprises at least one deep ultraviolet (DUV) camera; A system according to any one of claims 1 to 5.

7. The SLM pattern or the reference modulation pattern is selected from the group consisting of a checkerboard pattern, a flat line pattern, a parallelogram pattern, a diamond pattern, and a pattern including at least one alignment mark. A system according to any one of claims 1 to 6.

8. The light source light includes OBKK light or BBSK light. A system according to any one of claims 1 to 7.

9. The controller: A processor; a memory coupled to the processor, the memory configured to provide instructions to the processor that, when executed, cause the processor to perform (a)-(e); Equipped with A system according to any one of claims 1 to 8.

10. The controller: A processor configured to perform (a)-(e); a memory coupled to the processor and configured to provide instructions to the processor to perform (a) through (e); Equipped with A system according to any one of claims 1 to 8.

11. 1. A method for monitoring spatial light modulator (SLM) flare in a maskless photolithography system, comprising: The method comprises: (a) projecting source light onto an SLM, thereby imparting an SLM pattern to the source light, and projecting spatially modulated light based on the SLM pattern, the spatially modulated light including a first flare pattern associated with the SLM; (b) using a projection lens to receive the spatially modulated light and project a first image corresponding to the spatially modulated light; (c) using an aerial imaging system to receive the first image and output a first signal corresponding thereto; (d) projecting the source light onto a reference plate, thereby imparting a reference modulation pattern to the source light, and projecting a reference modulated light based on the reference modulation pattern, the reference modulated light including a second flare pattern associated with the reference plate; (e) using the projection lens to receive the reference modulated light and project a second image corresponding to the reference modulated light; (f) using the aerial imaging system to receive the second image and output a second signal corresponding thereto; (g) determining a third flare pattern associated with an SLM error based on a difference between the first signal and the second signal; A method comprising:

12. using a light source to project the source light; The method of claim 11.

13. and modifying one or more parameters associated with the SLM in response to the third flare pattern.

13. The method according to claim 11 or 12.

14. the one or more parameters include one or more elements selected from the group consisting of an exposure time of the spatially modulated light on a photoresist, an exposure intensity of the spatially modulated light on a photoresist, and a phase of one or more pixels associated with the SLM; The method of claim 13.

15. the reference modulation pattern comprises a static modulation pattern; 15. The method according to any one of claims 11 to 14.

16. the aerial imaging system comprises at least one deep ultraviolet (DUV) camera; 16. The method according to any one of claims 11 to 15.

17. The SLM pattern or the reference modulation pattern is selected from the group consisting of a checkerboard pattern, a flat line pattern, a parallelogram pattern, a diamond pattern, and a pattern including at least one alignment mark.

17. The method according to any one of claims 11 to 16.

18. an illumination optical system configured to illuminate a spatial light modulator (SLM) having a plurality of SLM elements arranged on a placement surface with reflective surfaces; a projection optical system configured to project light from the SLM onto a workpiece; a reference member having a reference modulation pattern; a position changing device configured to change a positional relationship between the SLM, the reference member, and the projection optical system to either a first positional relationship in which light from the illumination optical system is incident on the projection optical system via the SLM, or a second positional relationship in which light from the illumination optical system is incident on the projection optical system via the reference member; a detection device configured to detect light from the SLM or the reference member via the projection optical system; Equipped with Exposure equipment.

19. a computing device configured to compute a state of the SLM based on a first output from the detector in the first positional relationship and a second output from the detector in the second positional relationship. The exposure apparatus according to claim 18.

20. the condition of the SLM includes flare from the SLM.

20. The exposure apparatus according to claim 19.

21. the detection device is configured to detect an aerial image of the SLM and the reference pattern of the reference member formed by the projection optical system; 21. The exposure apparatus according to any one of claims 18 to 20.

22. the detection device is configured to detect the aerial image of the SLM in the first relationship and to detect the aerial image of the reference modulation pattern in the second relationship. The exposure apparatus according to claim 21.

23. a controller configured to control the pattern of the plurality of SLM elements and the position changing device; 23. The exposure apparatus according to any one of claims 18 to 22.

24. the controller is configured to set the pattern of the plurality of SLM elements to a pattern that is the same as the reference modulation pattern. The exposure apparatus according to claim 23.

25. the reference modulation pattern includes at least one of a checkerboard pattern, a flat line pattern, a parallelogram pattern, a diamond pattern, and a pattern including at least one alignment mark; 25. The exposure apparatus according to any one of claims 18 to 24.

26. illuminating a spatial light modulator (SLM) having a plurality of SLMs with reflective surfaces disposed on a placement surface; using projection optics to project light from the SLM onto a workpiece; setting a positional relationship between the SLM and the projection optical system to a first positional relationship in which light from the SLM is incident on the projection optical system; outputting a first output by detecting light from the SLM via the projection optical system in the first positional relationship; setting a positional relationship between a reference member having a reference modulation pattern and the projection optical system to a second positional relationship in which light from the reference member is incident on the projection optical system; outputting a second output by detecting light from the SLM via the projection optical system in the second positional relationship; Including, Exposure method.

27. obtaining a state of the SLM based on the first and second outputs. The exposure method according to claim 26.

28. forming a resist on a surface of a substrate; exposing an exposure pattern using the exposure method according to claim 26 or 27; Including, How the device is manufactured.

Images