Shower unit, semiconductor device, and method of processing a wafer

JP2025519242AActive Publication Date: 2025-06-24JIANGSU MICROVIA NANO EQUIP TECH CO LTD
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Patent Information

Application Number
JP2024571188
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Priority Date
2022-09-09
Filing Date
2023-08-02
Publication Date
2025-06-24
Estimated Expiration
2043-08-02

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Abstract

The present invention provides a shower unit, a semiconductor device, and a method for processing a wafer. In an annular region of the shower plate, a plurality of independent shower regions are formed, and the flow rate and concentration of reactants flowing in as required can be adjusted respectively. These shower regions are annularly distributed and can be arranged in an edge region of a central gas inlet. By adjusting the flow rate and concentration of reactants flowing into different shower regions respectively as required, the consistency of wafer surface process parameters is adjusted, and the purpose of enhancing the uniformity of the deposition thickness between the wafer edge region and the central region is achieved, and an annular shower head plate is provided.
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Citation Information

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