Heat dissipation architecture and electronics for optoelectronic modules

Abstract

The present application relates to the technical field of optoelectronic modules and discloses an electronic chip, a plurality of optical engines distributed along the periphery of the electronic chip, and a cold plate, wherein the cold plate includes a main cold plate for dissipating heat from the electronic chip, a sub-cold plate for dissipating heat from at least one of the plurality of optical engines, and a heat pipe assembly corresponding to the sub-cold plate, wherein the heat pipe assembly includes at least one heat pipe, the at least one heat pipe having an evaporating end connected to the sub-cold plate and a condensing end connected to the main cold plate, wherein a flow path is provided on the main cold plate for dissipating heat from the heat pipe assembly, and the sub-cold plate has a maintenance station, and when the sub-cold plate is in the maintenance station, there is an operation space between the sub-cold plate and the corresponding optical engine for maintaining the corresponding optical engine.

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