Robotic device operation within a rectangular mainframe

JP2025527643APending Publication Date: 2025-08-22APPLIED MATERIALS INC
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Patent Information

Application Number
JP2025511381
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Priority Date
2023-08-16
Filing Date
2023-08-25
Publication Date
2025-08-22

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Abstract

A robotic apparatus is provided having a variable end effector pitch suitable for accommodating various pitches, such as between two adjacent processing chambers or two adjacent load lock chambers. The robotic apparatus can operate in a dual substrate handling mode, a single substrate handling mode, or a combination thereof. The robotic apparatus can also be an off-axis robot. Various robotic apparatuses, electronic device processing systems including such robotic apparatuses, and methods of using the same, according to various embodiments, are described.
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Citation Information

Patent Citations

  • Substrate transport apparatus

    JP2020053692A

  • Semiconductor processing system

    US20210358781A1

  • Substrate transport apparatus with multiple arms on a common axis of rotation

    US6485250B2