Method, apparatus, and components for fabricating embedded optics for photonic components

Abstract

Method, device, and component for fabricating embedded optics for photonic components. The present invention relates to a method for fabricating embedded optics in photonic components, including fabricating embedded optics using thermoplastic materials, a method for producing these optics, a thermostatic system for fabricating them, an open thermostatic containment structure or cavity, a freestanding thermoplastic material supply unit, a temperature and atmospheric gas control unit, and a cooling unit. The present invention also relates to a system for fabricating embedded optics in a continuous thermal process.

Description

Technical field to which the invention belongs

[0001] The present invention relates to a method for manufacturing embedded optics using thermoplastic materials, a method for producing the optics, a thermostatic system for manufacturing the same, an open thermostatic containment structure or cavity, an autonomous thermoplastic material supply unit, a preferably airtight temperature and atmosphere control unit, and a cooling unit. The present invention also relates to a system for manufacturing embedded optics using a continuous thermal process.

[0002] More specifically, the present invention relates to a method for manufacturing an embedded optics for a photonic component, the photonic component having an optics suitable for emitting or capturing electromagnetic radiation of a predetermined frequency and made of a thermoplastic material having a melting temperature Tm, the thermoplastic material being suitable for transmitting the electromagnetic radiation, and the photonic component being present on a physical carrier. The present invention also relates to a containment structure, an autonomous thermoplastic material supply unit, and an apparatus for manufacturing an embedded optics for a photonic component, the photonic component having an optics suitable for emitting or capturing electromagnetic radiation of a predetermined frequency and made of a thermoplastic material having a melting temperature Tm, the thermoplastic material being suitable for transmitting the electromagnetic radiation, and the photonic component being present on a physical carrier. Prior art

[0003] The concept of wafer level optics as defined by EV Group, https: / / www.evgroup.com / technologies / wafer-level-optics / , allows for the design and manufacture of miniaturized wafer-level optics using advanced technologies similar to semiconductors, resulting in a miniaturized optics final product. There are a wide variety of manufacturing technologies that allow for the development of these optics, most of which are based on lithography and lens molding.

[0004] Wafer-Level Packaging (WLP), https: / / ams.com / advanced-packaging, also exists. As defined by AMS-OSRAM AG, it is a process in which photonic components are connected to integrated circuits (ICs) before the wafer and the ICs are cut into cubes. In WLP, the upper and lower layers of packaging and the weld bumps are attached to the integrated circuits once they are on the wafer. This process differs from conventional processes in that the wafer is cut into individual circuits (dices) before the components to be packaged are attached.

[0005] Wafer Level Chip Size Packaging (WL-CSP) is the smallest packaging currently available on the market and is produced by companies called OSATs (Outsourced Semiconductor Assembly and Test).

[0006] In addition to these wafer-level concepts, there are also optical packaging concepts with various definitions and different types, as defined by Tolga Tekin et al. in their review of "Packaging for Optoelectronic, Photonic, and MEMS Components," Tolga Tekin, July 2011, "Packaging for Optoelectronic, Photonic, and MEMS Components," IEEE Journal of Selected Topics in Quantum Electronics 17(3):704-719, DOI:10.1109 / JSTQE.2011.2113171. These range from an external element, such as a box or envelope, used as protection for the optical components of the system to an "enclosure" around a set of optical / electronic / mechanical components whose function is to protect them as well.

[0007] While there are packages that are used only to hold, connect, or protect some of the photonic components, it can also be seen that similar packaging also has optics built in to give the emitter optical functionality, such as overmolded dies on lead frames, as can be found in Tolga Tekin et al.

[0008] The concept of embedded optics can be defined in several ways. Embedded lenses, or lens groups embedded in the packaging of a component, can be assumed to be fabricated directly on the element and given their optical function. Embedded optics can be manufactured by injection molding, CNC machining, 3D printing, and, as seen above, by lithography.

[0009] Among these manufacturing processes currently using materials that need to be heated and melted, the injection process stands out. In this manufacturing process, the pressure gradient at which the material reaches the closed cavity usually causes problems with the filling level of the closed cavity, as the material does not reach the optimal temperature to fluidly fill the entire cavity, leaving unfilled areas that are difficult to reach. Furthermore, the material is heated and melted, and then pumped into the closed cavity at a certain pressure to fill it and then, by cooling, to allow it to adopt the designed shape. In this process, the material is subjected to a thermal gradient from its supply until it fills the closed cavity, as described in the patents referenced below.

[0010] Patent WO2008100146A2 relates to a method for encapsulating an electronic component placed on a carrier under pressure, comprising the process steps of: A) placing the electronic component in a mold cavity; B) heating an encapsulating material; C) placing the encapsulating material in the mold cavity; D) filling the mold cavity; and E) cooling the encapsulating material in the mold cavity. The present invention also relates to an apparatus capable of carrying out such a method.

[0011] Patent WO2005120799A1 relates to a method for encapsulating an electronic component disposed on a carrier, comprising the process steps of A) heating an encapsulant, B) disposing the encapsulant in a mold cavity, C) filling the mold cavity, and D) cooling the encapsulant in the mold cavity. Temperature regulation of the encapsulant is thereby achieved by creating different temperature zones between separate sections of the path covered by the encapsulant, which are at least partially thermally separated from each other by at least one temperature barrier. This invention also relates to an apparatus for encapsulating an electronic component disposed on a carrier.

[0012] Patent WO2010008287A1 relates to a method for encapsulating an electronic component arranged on a carrier, comprising the steps of moving several mold parts towards each other using a sealing force, whereby the electronic component is enclosed by the mold cavity, applying pressure to a liquid encapsulant, filling the mold cavity with the encapsulant, hardening the encapsulant, measuring the pressure on the encapsulant, and wherein the sealing force of the mold parts and the applied pressure are interdependent.

[0013] US Patent 20200147865A1 relates to a dispenser attachment for a microscope objective in an apparatus for drawing three-dimensional structures by laser lithography in a lithography fluid, which can be solidified by irradiation with laser light.

[0014] On the other hand, additive manufacturing, also known as 3D printing, is also prominent, in which a material is heated and given a desired shape in the manufacturing process, and this material is in direct contact with air when it is fed, and as a result, the material is subjected to a very high temperature gradient from the time it is fed by the feeding system, which leads to roughness and low precision in the manufactured components, and the manufactured components require post-processing to minimize such defects. The following cited patents illustrate this temperature gradient that is experienced from the time it is fed:

[0015] Patent WO201301728A2 relates to a method and an apparatus for producing a three-dimensional object made of a material that can be solidified and that is initially liquid or can be liquefied, where the three-dimensional object is formed in the material that is dispensed and solidifies simultaneously with the dispensing of the material that will be solidified.

[0016] US Patent 2014019757A1 relates to an apparatus and method useful for generating three-dimensional objects from solidifiable material by sequential ejection of droplets onto an object carrier for the object to be generated.

[0017] US Patent 9539765 relates to a method for ejecting a volume flow consisting of continuous droplets to generate a three-dimensional object of a solidifiable material present in a flow phase, in which pressure is applied to eject the material in droplets out of a cyclable outlet opening to generate the three-dimensional object within a build chamber.

[0018] US Patent US989604B2 relates to an apparatus for generating three-dimensional objects from a hardenable material, comprising a build space for building the object, a temperature control unit for controlling the temperature of the build space, and a preparation unit for preparing the hardenable material so that the material is in a fluid phase. A pressure generation unit applies pressure to the liquid phase in the preparation unit to eject the hardenable material in droplets through an outlet. The temperature-controlled build space is surrounded by a build space frame, which accommodates at least the ejection unit, the preparation unit, and an object support for object generation.

[0019] Typically, a photonic component (e.g., an LED) is placed on a carrier (usually a printed circuit board (PCB)) so that the electrical connection between the photonic component and the carrier is performed via a connector that forms an arc. In methods using plastic injection technology, it is not uncommon for this arc to break. DISCLOSURE OF THE INVENTION

[0020] The object of the present invention is to overcome these drawbacks, which is achieved by a method for manufacturing embedded optics for a photonic component of the type set out above, characterized in that it uses an isothermal cavity suitable for filling with a thermoplastic material, the isothermal cavity being open, and a support structure suitable for supporting a physical carrier above the cavity so that the photonic component is present in the cavity, the isothermal cavity being partially open when the physical carrier is supported by the support structure, the method comprising the following steps: [a] melting a thermoplastic material; [b] disposing the physical carrier having the photonic component on the support structure such that the photonic component resides within the isothermal cavity and the isothermal cavity is partially released; [c] filling the isothermal cavity with the hot-melt thermoplastic material in a filling unit, wherein the isothermal cavity is maintained at a temperature Tc greater than a temperature Tm by a temperature control system during the step of filling the isothermal cavity; [d] Once the isothermal cavity is filled, cooling the isothermal cavity below temperature Tm; [e] The photonic component coated with thermoplastic material is ejected from the isothermal cavity by an ejector.

[0021] Generally, methods using 3D printing technology do not use any type of cavity. Next, methods for injecting polymeric materials use a cavity that is sealed. It is important to understand what it means for a cavity to be sealed. The cavity is sealed in the sense that the molten thermoplastic material cannot escape from the cavity. However, the cavity is not airtight because it has holes that allow air to escape; that is, the cavity is "not sealed to air, but sealed to the thermoplastic material." In this specification and in the claims, the expressions "sealed cavity" and "open cavity" have been used in this sense, i.e., whether the cavity is sealed or open to the molten thermoplastic material.

[0022] In fact, it has been observed that the contact arcs that electrically couple the photonic component to the physical carrier are structurally very fragile and prone to fracture when subjected to mechanical stress. The method according to the invention allows the creation of an optical system in which the connector is substantially free from any mechanical stress and has a surface (the inner surface of the isothermal cavity) that is conducive to creating an optically functional surface. Because the cavity is open and at a temperature Tc above its melting temperature Tm, the polymer material remains as low in fluidity and viscosity as necessary throughout the cavity filling process, ensuring a very "smooth" filling of the cavity. This prevents negative stresses on the connector.

[0023] Preferably, the pressure within the cavity is ambient pressure.

[0024] Preferably, the electromagnetic radiation is visible and / or infrared radiation.

[0025] Preferably, the filling unit is a temperature and atmospheric gas control unit, and preferably said gas is an oxygen-free gas. Advantageously, the gas is at a temperature Tg higher than the temperature of said isothermal cavity.

[0026] Preferably, step [d] is carried out in a cooling unit.

[0027] Preferably, step [a] of melting the thermoplastic material is advantageously carried out in an autonomous material supply unit having a temperature control system.

[0028] Preferably, step [c] of filling the isothermal cavity with the molten thermoplastic material is carried out by gravity.

[0029] Preferably, the filling unit has an entrance area and an exit area to allow entry and exit of the containment structure, respectively.

[0030] Preferably, the physical carrier has at least one hole, and in step [c] of filling the isothermal cavity, the molten thermoplastic material exits the isothermal cavity through the hole and forms a head on the physical carrier adapted to hold the optical system.

[0031] Preferably, the thermoplastic material is a cycloolefin polymer and the temperature Tc therein is comprised between 100°C and 420°C, preferably between 220°C and 260°C.

[0032] Preferably, the thermoplastic material is polycarbonate and the temperature Tc therein is comprised between 100°C and 420°C, preferably between 260°C and 310°C.

[0033] Preferably, the thermoplastic material is polymethyl methacrylate and the temperature Tc therein is comprised between 100°C and 420°C, preferably between 100°C and 180°C.

[0034] The subject of the present invention is a containment structure characterized by: [a] a thermostatic cavity suitable for being filled with a molten thermoplastic material, the thermostatic cavity being open; [b] a support structure suitable for supporting a physical carrier having a photonic component on the thermostatic cavity such that the photonic component is present in the thermostatic cavity, the thermostatic cavity being partially open when the physical carrier is supported by the support structure; and [c] a temperature control system suitable for maintaining the thermostatic cavity at a temperature Tc higher than the melting temperature Tm of the thermoplastic material.

[0035] Preferably, the containment structure comprises an ejector adapted to eject the photonic component coated with thermoplastic material from the isothermal cavity.

[0036] Preferably, the containment structure includes a plurality of isothermal cavities.

[0037] The present invention is also directed to an autonomous thermoplastic material supply unit characterized by having a temperature control system suitable for melting a thermoplastic material and maintaining it at a temperature Tc higher than a temperature Tm, and by supplying the molten thermoplastic material by gravity.

[0038] Another object of the present invention is an apparatus for manufacturing embedded optics for photonic components of the type set forth above, characterized in that the storage structure comprises a storage structure and a filling unit, the storage structure comprising, in turn, [a] a thermostatic cavity suitable for being filled with molten thermoplastic material, the thermostatic cavity being open; [b] a support structure suitable for supporting a physical carrier carrying a photonic component on the thermostatic cavity so that the photonic component is present in the thermostatic cavity, the thermostatic cavity being partially open when the physical carrier is supported by the support structure; and [c] a temperature control system suitable for maintaining the thermostatic cavity at a temperature Tc higher than the melting temperature Tm of the thermoplastic material.

[0039] This storage device may have various preferred solutions.

[0040] Preferably, the containment structure comprises an ejector suitable for ejecting the thermoplastic material coated photonic component from the isothermal cavity.

[0041] Preferably, the containment structure comprises a plurality of isothermal cavities.

[0042] Preferably, the method further comprises an autonomous thermoplastic material supply unit having a temperature control unit suitable for melting the thermoplastic material, maintaining it at a temperature Tc higher than the temperature Tm, and supplying the molten thermoplastic material by gravity, which in turn comprises a suitable temperature control system therefor.

[0043] Preferably, the autonomous thermoplastic material supply unit comprises a reservoir suitable for containing an oxygen-free gas.

[0044] Preferably, the filling unit is a temperature and atmospheric gas control unit, and advantageously the gas is an oxygen-free gas.

[0045] Preferably, the temperature and atmosphere gas control unit comprises a temperature control system suitable for maintaining the gas at a temperature Tg higher than the temperature of the isothermal cavity.

[0046] Preferably, the filling unit has an entrance area and an exit area suitable for allowing the storage structure to enter and exit.

[0047] Preferably, the enclosure comprises a cooling unit.

[0048] Preferably, the outlet region is connected to the inlet of the cooling unit.

[0049] Preferably, a heating plate allowing the temperature of said cavity to be adjusted.

[0050] Generally, the device according to the invention is suitable for carrying out the method according to the invention.

[0051] Other preferred embodiments of the present invention are as follows.

[0052] 1. at least one temperature and atmospheric gas control unit, preferably with gas-tightness, Open high temperature containment structures or cavities, Autonomous thermoplastic material supply unit, and cooling units, A continuous thermal process having Preferably, the gas-tight temperature and atmospheric gas control unit comprises a temperature control system and at least one open isothermal containment structure or cavity, an autonomous thermoplastic material supply unit and an inlet area and an outlet area for the open isothermal containment structure or cavity; The open isothermal containment structure or cavity has at least one temperature control system; A method for manufacturing embedded optics for photonic components based on the use of thermoplastic materials, comprising an autonomous thermoplastic material supply unit capable of handling solidifiable materials in a liquid or liquefiable state to supply the material and having a temperature control system to produce these optics in a continuous thermal process.

[0053] 2. Inlet system for thermoplastic materials, Support and / or fixing structures for at least positioning the physical carrier in which the optoelectronic components that are part of the photonic component are housed, Temperature control system, An ejector that can eject the final photonic component from the open, thermostatic containment structure or cavity. the presence or absence of a transfer system, preferably airtight, from the temperature and atmosphere control unit to the cooling unit; ·Optical system, 10. An open isothermal containment structure or cavity according to paragraph 1, characterized by containing at least

[0054] 3. 3. An open isothermal containment structure or cavity according to paragraph 2, characterized in that it houses at least some cavities in the form of an array that will form an embedded optical system.

[0055] 4. 10. An autonomous thermoplastic material supply unit according to paragraph 1, characterized by filling the open thermostatic containment structure or cavity with the liquid thermoplastic material by the effect of gravity.

[0056] 5. 10. A preferably airtight temperature and atmosphere gas control unit according to paragraph 1, characterized by using an oxygen-free gas to prevent inflammation.

[0057] 6. 10. A preferably airtight temperature and atmosphere gas control unit according to paragraph 1, characterized by allowing the liquid thermoplastic material to be dispensed without being subjected to a temperature gradient.

[0058] 7. 10. A preferably airtight temperature and atmospheric gas control unit according to paragraph 1, characterized in that its temperature is higher than the temperature of the open isothermal containment structure or cavity.

[0059] 8. 10. A cooling unit according to paragraph 1, characterized in that it is at least capable of containing an open high temperature containment structure or cavity that is filled with a thermoplastic material.

[0060] 9. 10. A cooling unit according to paragraph 1, characterized by carrying out a process of cooling a material by exposing it to a thermal gradient with an open isothermal containment structure or cavity.

[0061] 10. 10. A cooling unit according to paragraph 1, characterized in that its temperature is lower than that of the temperature and atmospheric gas control unit, which is preferably airtight. [Brief explanation of the drawings]

[0062] To complement the description given and to facilitate a better understanding of the characteristics of the present invention, drawings are attached as part of said description, the following being represented in an illustrative and non-limiting manner: [Figure 1] 1 is a schematic diagram of a system for manufacturing embedded optics having an open isothermal cavity for a single optic, an autonomous thermoplastic material supply unit, a movement system, and a preferably airtight temperature and atmospheric gas control unit according to the present invention.

[0063] [Figure 2]Schematic diagram of a photonic component consisting of a physical carrier on which an emitter with control electronics, connectors, and communication channels is located so that thermoplastic material flows through the component.

[0064] [Figure 3] 1 is a schematic diagram of a system for manufacturing an embedded optic with an isothermal cavity for a single optic that is filled with a thermoplastic material.

[0065] [Figure 4] 1 is a schematic diagram of an isothermal cavity for a single optical system filled with a thermoplastic material in a quench unit.

[0066] [Figure 5] 1 is a schematic diagram of a photonic component having a single optical system manufactured in accordance with the present invention.

[0067] [Figure 6] Schematic of a photonic component formed with an array of emitters.

[0068] [Figure 7] 1 is a schematic diagram of a system for fabricating embedded optics with a constant temperature cavity for optical arrays according to the present invention.

[0069] [Figure 8] 1 is a schematic diagram of a system for fabricating embedded optics for optical arrays while embedding photonic components, according to the present invention.

[0070] [Figure 9] 1 is a schematic diagram of a system for fabricating embedded optics for optical arrays while filling cavities with thermoplastic.

[0071] [Figure 10]1 shows a schematic diagram of a system for fabricating embedded optics for optical arrays while filling cavities with thermoplastic in a cooling unit according to the present invention.

[0072] [Figure 11] 1 is a schematic diagram of an embedded photonic component with an array of optics fabricated in accordance with the present invention.

[0073] [Figure 12] FIG. 1 is a schematic diagram of one embodiment of the present invention of a system for fabricating embedded optics having an isothermal cavity for a single previously fabricated optic, an autonomous material supply unit, a movement system, and an atmospheric gas control unit, preferably airtight.

[0074] [Figure 13] FIG. 1 is a schematic diagram of a previously fabricated optical system.

[0075] [Figure 14] 1 is a schematic diagram of a system for fabricating an embedded optical system with a previously fabricated optical system in an isothermal cavity according to the present invention;

[0076] [Figure 15] 1 is a schematic diagram of a system for fabricating an embedded optical system with a previously fabricated optical system in an isothermal cavity that is filled with a thermoplastic material.

[0077] [Figure 16] 1 is a schematic diagram of a system for fabricating an embedded optical system, with the previously fabricated optical system in an isothermal cavity that is filled with a thermoplastic material in a cooling unit.

[0078] [Figure 17] 1 is a schematic diagram of a photonic component fabricated in accordance with the present invention and embedded with previously fabricated optics.

[0079] [Figure 18] 1 is a schematic diagram of another optical manufacturing system for manufacturing embedded optical systems with a temperature control and monitoring system, a heating plate, and a supply system for an autonomous thermoplastic material supply unit. Detailed Description of the Preferred Embodiments of the Invention

[0080] The present invention discloses a method for fabricating embedded optics for photonic components, where photonic components are understood to mean any system consisting of a physical carrier, emitter or detector, on which electronic and electrical components are mounted and connected to each other, and the optics required to provide this component with an optical function. Embedded optics is not limited to single optics, as the fabrication of arrays of optics is also contemplated, as well as the embedding of pre-fabricated optics as individual optics or in the form of an array.

[0081] A method for fabricating embedded optics for photonic components employs a thermoplastic material to produce these optics, a temperature-controlled system for fabricating the same, an open temperature-controlled containment structure or cavity, an autonomous thermoplastic material supply unit, a preferably airtight temperature and atmosphere gas control unit, and a cooling unit.

[0082] The system for manufacturing embedded optics for photonic components according to the present invention has the most important advantage that the material does not experience any temperature gradient between melting and filling the cavity, and has a continuous thermal process from the time the material is heated and melted to the time the material is dispensed and filled into the open isothermal cavity, so that the fluid state of the material is maintained in the most optimal way. This open isothermal cavity is preferably placed in a temperature and atmosphere gas control unit, preferably airtight, so that the temperature of the open isothermal cavity and the temperature of the environment can be maintained in a controlled manner. Unlike current processes, in the process according to the present invention, the open isothermal cavity is placed in a cooling unit, and the material, together with the open isothermal cavity, is subject to a temperature gradient due to cooling when it is not being dispensed.

[0083] Another advantage of the system for manufacturing embedded optics for photonic components is that the supply of material is carried out by a material supply unit, whereby the material can be dropped into the system for filling the open isothermal cavity by gravity, without the need for external pressure. The condition of the electrical, electronic and optical components that are part of the photonic component is thereby protected, considering that the introduction of material into the open isothermal cavity ensures that the pressure does not damage these components.

[0084] Furthermore, in the process for manufacturing embedded optics for photonic components according to the present invention, the cooling process is carried out in a cooling unit that the open isothermal cavity with the material to be cooled is reached by a movement system so that the open isothermal containment structure with the material is directly exposed to the thermal gradient, rather than the material, to obtain the embedded optics for the photonic component in question. This quenching unit can be located directly below, above, beside, or sufficiently far away from the atmospheric gas control unit, but is not limited to these locations.

[0085] In view of the above figures, there can be seen a preferred embodiment of the present invention, with the parts and elements, by the numbering adopted, shown and described in detail below.

[0086] Thus, in one embodiment of the present invention, a system for manufacturing an embedded optical system comprises an open isothermal containment structure or cavity (1) having a negative (2) of the embedded optical system to be manufactured and provided with a temperature control system, an inlet system (3) for thermoplastic material, a support and / or fixing structure (4) for positioning the physical carrier in which the optoelectronic component forming part of the photonic component is housed, and, if present, an autonomous thermoplastic material supply unit (5). The containment structure may or may not be arranged on a movement system (6) that allows translation of the containment structure in the X, Y, and Z directions. In turn, the isothermal containment structure (1) as the inlet system (3) for the material and the autonomous thermoplastic material supply unit (5) are preferably hermetically arranged within an atmosphere gas control unit (7) that ensures that the atmosphere into which the material is supplied is at a specific and controlled temperature. This atmosphere gas control unit (7) has openings that allow entry and exit of the isothermal containment structure, and it is preferably hermetically sealed at all times.

[0087] The containment structure is maintained at a temperature suitable for the thermoplastic material used to create the embedded optics so that it can fill the cavities without undergoing changes in its flow properties or modifying their chemical properties.

[0088] In the particular case of the present invention, the optoelectronic component of the photonic component comprises a physical carrier on which the emitter is placed, which has control electronics (8), connecting cables (9) and communication channels (10) for the flow of thermoplastic material through the component (10).

[0089] The method for manufacturing embedded optics for a photonic component in the specific case of the present invention starts with placing the optoelectronic components of the photonic component on a supporting and / or fixing structure (4) of a high-temperature containment structure (1) which is arranged, preferably gas-tightly, in an atmospheric gas control unit (7).

[0090] By means of an autonomous thermoplastic material dispensing unit (5), the cavity (2) is filled with thermoplastic material by means of an inlet system (3) for the thermoplastic material, and the cavity of the embedded optics (11) is filled up.

[0091] The next step in the manufacturing method of embedded optics for photonic components comprises cooling / solidifying the thermoplastic material in the cavity (2). For this purpose, the thermostatic containment structure (1) is displaced from the atmospheric gas control unit (7) by the outlet and the display element to the cooling unit (12), which solidifies the thermoplastic in the cavity and obtains a manufactured photonic component with embedded optics.

[0092] In the particular case of the present invention, the photonic component comprises an array of optoelectronic components (15) arranged on a physical carrier (14).

[0093] In this particular case of the invention, the isothermal containment structure (1) supplied with the temperature control system is formed by several cavities (2) forming the embedded optics, which may or may not be placed on a movement system (6) making it possible to displace the cavities in the X, Y and Z directions. The high temperature containment structure (1), as well as the inlet system (3) for the material and the autonomous thermoplastic material supply unit (5), are preferably placed in an atmosphere gas control unit (7) that makes it possible to bring the atmosphere into which the material is supplied to a specific and controlled temperature. This atmosphere control unit (7) has openings that allow the high temperature containment structure to enter or exit, and is preferably kept sealed at all times in an airtight manner.

[0094] The method for manufacturing embedded optics for a photonic component in the specific case of the present invention starts with placing the optoelectronic components of the photonic component in a supporting and / or fixing structure (4) of a high-temperature containment structure (1), which are then placed, preferably gas-tight, in an atmospheric gas control unit (7).

[0095] By means of an autonomous thermoplastic material supply unit (5), the cavity is filled with thermoplastic material by means of an inlet system (3) for the thermoplastic material, and the cavity of the embedded optics (11) is then filled up.

[0096] The next step in the method for fabricating embedded optics for photonic components in the specific case of the present invention comprises cooling / solidifying the thermoplastic material in the high temperature containment structure, which is moved from the atmosphere control unit to a cooling unit (12) which, depending on the outlet and movement arrangement, can be located directly below, above, beside or remote from the atmosphere gas control unit, solidifying the thermoplastic material in the cavity and obtaining a photonic component with embedded optics.

[0097] Once the thermoplastic material solidifies, the final embedded photonic component (17) is ejected by an ejector provided in a high temperature containment structure.

[0098] In the specific case of the present invention, the photonic component comprises a single optoelectronic component or an array of optoelectronic components, which may or may not have an emitter with electronic control circuitry, a connecting cable, and a communication channel through the component where the thermoplastic material is disposed on a physical carrier.

[0099] In this particular case of the invention, the high temperature containment structure in which the temperature control system is provided has one or more cavities (2) for placing the optical system (20) previously manufactured by any manufacturing method, such as, but not limited to, CNC machining, 3D printing, injection, which may or may not be placed on a translation system (6) that allows the cavity to be moved in the X, Y, and Z directions.

[0100] The high temperature containment structure as an inlet system for the material and the autonomous thermoplastic material supply unit are, in turn, preferably hermetically disposed within an atmosphere control unit that allows the atmosphere for the material to be at a specific and controlled temperature, the atmosphere control unit having openings that allow the isothermal containment structure to enter and exit, and that preferably remains sealed at all times in a hermetically sealed manner.

[0101] In the specific case of the present invention, the method for manufacturing embedded optical elements for photonic components begins with placing the optoelectronic components for the photonic component in a support and / or fixing structure (4) and for the previously manufactured optical system in a constant temperature containment structure (1), which are preferably hermetically sealed and placed in an atmospheric gas control unit.

[0102] The cavity for having thermoplastic material is filled by an inlet system for thermoplastic material (3) by means of an autonomous thermoplastic material supply unit (5), and the cavity (11) is then filled up and embeds the previously manufactured optical system.

[0103] The next step in the method for fabricating embedded optics for a photonic component comprises cooling / solidifying the thermoplastic material in the cavity (2), for which the isothermal containment structure is moved from the atmospheric gas control unit to a cooling unit (12), which can be located directly below, directly above, directly beside, or sufficiently far away from the atmospheric gas control unit, by means of an outlet and a moving element, to solidify the thermoplastic in the cavity and obtain a photonic component with embedded optics.

[0104] Once the thermoplastic material has solidified, the final embedded photonic component (17) is ejected by an ejector (13) provided in a thermostatic containment structure.

[0105] In the specific case of the present invention shown in Figure 18, a system for manufacturing embedded optics for photonic components comprises a temperature control and monitoring system (22) that allows a complete temperature mapping by infrared light of both the cavity and the thermoplastic material itself that is deposited in the cavity, a heating plate (23) that allows the temperature of the cavity to be adjusted according to the needs of the thermoplastic material used, and a free-standing thermoplastic material supply unit (5) that can be moved in the X, Y and Z directions by a movement system (24) in order to adjust the position of the material inlet according to the cavity used.

Claims

1. A method for manufacturing the optical system for a photonic component, characterized by using a thermoplastic cavity suitable for filling with a thermoplastic material, wherein the thermoplastic cavity is open, and a support structure suitable for supporting a physical carrier on the cavity such that a photonic component is present within the cavity, wherein the thermoplastic cavity is partially open when the physical carrier is supported by the support structure, wherein the photonic component is suitable for emitting or capturing electromagnetic radiation of a predetermined frequency, the optical system is made of a thermoplastic material having a melting point temperature Tm, the thermoplastic material is suitable for emitting the electromagnetic radiation, and the photonic component is present on a physical carrier. The above method involves the following steps: [a] The thermoplastic material is melted, [b] The physical carrier having the photonic component is placed on the support structure such that the photonic component is located within the constant temperature cavity and the constant temperature cavity is partially open. [c] In the filling unit, the constant temperature cavity is filled with the molten thermoplastic material, and the constant temperature cavity is maintained at a temperature Tc greater than the temperature Tm by a temperature control system during the step of filling the constant temperature cavity. [d] Once the constant temperature cavity is filled, the constant temperature cavity is cooled to a temperature lower than the temperature Tm. [e] The photonic component coated with the thermoplastic material is ejected from the constant temperature cavity by an ejector. A method for manufacturing an embedded optical system for a photonic component having [a certain characteristic].

2. The filling unit is a temperature and atmosphere gas control unit, and the gas is preferably an oxygen-free gas. The method according to claim 1, characterized by the above.

3. The gas has a temperature Tg higher than the temperature of the constant temperature cavity. The method according to claim 2, characterized by the above.

4. Step [d] is performed in the cooling unit. A method according to any one of claims 1 to 3, characterized by the above.

5. The step [a] of melting the thermoplastic material is preferably carried out in an autonomous thermoplastic material supply unit having a temperature control system. A method according to any one of claims 1 to 4, characterized by the above.

6. The step [c] of filling the constant temperature cavity with the molten plastic material is preferably carried out by gravity. A method according to any one of claims 1 to 5, characterized by the above.

7. The filling unit has an inlet area and an outlet area that allow entry and exit, respectively. A method according to any one of claims 1 to 6, characterized by the above.

8. The physical carrier has at least one pore, and in step [c] of filling the constant temperature cavity, the molten thermoplastic material exits through the pore into the constant temperature cavity and forms a head suitable for holding the optical system on the physical carrier. A method according to any one of claims 1 to 7, characterized by the above.

9. The thermoplastic material is a cyclic olefin polymer, and the temperature Tc is between 100°C and 420°C, preferably between 220°C and 260°C. A method according to any one of claims 1 to 8, characterized by the above.

10. The thermoplastic material is polycarbonate, and the temperature Tc is between 100°C and 420°C, preferably between 260°C and 310°C. A method according to any one of claims 1 to 8, characterized by the above.

11. The thermoplastic material is polymethyl methacrylate, and the temperature Tc is between 100°C and 420°C, preferably between 100°C and 180°C. A method according to any one of claims 1 to 8, characterized by the above.

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