Apparatus including multiple heads and method of using the apparatus

Abstract

The apparatus may include a support structure and a docking station, the apparatus configured to move the docking station relative to the support structure. The apparatus may further include a head from a plurality of heads. The apparatus may also include a first coupler configured to couple the head to the support structure and decouple the head from the support structure, and a second coupler configured to couple the head to the docking station and decouple the head from the docking station. A method of using the apparatus may include coupling the head to the docking station and decoupling the first head from the support structure. The method may further include moving the docking station along the support structure. The method may further include coupling the head to the support structure and decoupling the head from the docking station.

Description

[Technical Field]

[0001] The present disclosure relates to an apparatus including multiple heads and a method of using the apparatus. [Background technology]

[0002] Advanced packaging techniques require high throughput and precise chip placement. Hybrid bonding can be particularly challenging when misalignment tolerances are tight. Single-chip transfer techniques can achieve high accuracy but have low throughput. Multi-chip transfer techniques can achieve high throughput but precise chip placement can be difficult. High throughput placement is required while still meeting chip placement specifications. Summary of the Invention

[0003] In one aspect, an apparatus can include a support structure; a docking station, where the apparatus is configured to move the docking station relative to the support structure; a head among a plurality of heads, where the head has a chip holding area; a first coupler configured to couple the head to the support structure and decouple the head from the support structure; and a second coupler configured to couple the head to the docking station and decouple the head from the docking station.

[0004] In one embodiment, the head further includes a body and a tip chuck, the head configured to allow movement of the tip chuck relative to the support structure.

[0005] In another embodiment, the second coupler is configured to prevent the docking station from contacting the chip holding area.

[0006] In a further embodiment, the chip holding area occupies a central portion of a surface facing away from the support structure, and the head has a first bonding zone disposed between a first peripheral surface of the head and the chip holding area.

[0007] In certain embodiments, the first bonding zone is along a first major surface of the head, and the head has a second bonding zone along a second major surface of the head, the second major surface being opposite the first major surface.

[0008] In another particular embodiment, the chip holding area is recessed within the head.

[0009] In other embodiments, the first coupler, the second coupler, or each of the first coupler and the second coupler includes a zone-based vacuum chuck that is part of or coupled to the support structure.

[0010] In yet another embodiment, the apparatus is configured such that the head can be moved toward and away from the support structure.

[0011] In yet another embodiment, the apparatus further includes a controller configured to send a signal to move the body of the head from a first position on the support structure to a second position on the support structure.

[0012] In a further embodiment, the apparatus further includes a positioning stage coupled to the docking station and configured to move the docking station relative to the support structure.

[0013] In certain embodiments, the apparatus further includes a destination chuck coupled to the positioning stage.

[0014] In a more specific embodiment, the apparatus further includes a base spaced apart from the support structure, the positioning stage coupled to the base, and a source substrate coupled to the support structure, the support structure including a bridge.

[0015] In a more specific embodiment, the plurality of heads are a plurality of bonding heads, and the apparatus further includes a pickup head stage coupled to the base, and a plurality of pickup heads coupled to the pickup head stage.

[0016] In another aspect, a method can include coupling a first head to a docking station by actuating a first coupler associated with the docking station, wherein a plurality of heads includes the first head, the first head having a chip holding area; decoupling the first head from the support structure by decoupling a second coupler associated with the support structure; moving the docking station from a first position along the support structure to a second position along the support structure; coupling the first head to the support structure by actuating a third coupler; and decoupling the first head from the docking station by decoupling the first coupler.

[0017] In one embodiment, the method further includes coupling a second head to the docking station by actuating a fourth coupler associated with the docking station, the plurality of heads including the second head, the second head having a tip holding area, and decoupling the second head from the support structure by decoupling a fifth coupler associated with the support structure. The method can further include moving the docking station from a third position along the support structure to a fourth position along the support structure, coupling the second head to the support structure by actuating a sixth coupler, and decoupling the second head from the docking station by decoupling the fourth coupler.

[0018] In certain embodiments, the plurality of heads have a first pitch before moving the docking station from the first position to the second position and before moving the docking station from the third position to the fourth position, and the plurality of heads have a second pitch after moving the docking station from the first position to the second position and after moving the docking station from the third position to the fourth position, the second pitch being different from the first pitch.

[0019] In a more specific embodiment, the method further includes mounting a destination substrate on a destination chuck coupled to the positioning stage, the destination substrate having a plurality of destination bonding sites at a destination pitch, the destination pitch being closer to the second pitch than the first pitch.

[0020] In another embodiment, the step of moving the docking station is performed between a pair of transfer operations, the plurality of heads includes a second head, the second head having a chip holding area, the second head being coupled to the support structure and not moved between the pair of transfer operations.

[0021] In yet another embodiment, the first head has a first side adjacent to the support structure and a second side adjacent to the docking station, and the chip holding area is along the second side. The step of coupling the first head to the docking station includes coupling a portion of the first head along the second side such that (1) a portion of the first head contacts the docking station but the chip holding area does not contact the docking station, or (2) a portion of the first head contacts a component coupled to the docking station but the chip holding area does not contact the component coupled to the docking station.

[0022] In yet another embodiment, the plurality of heads is a plurality of bonding heads.

[0023] In a further embodiment, the method further includes the steps of: picking up a set of chips from a source substrate with a plurality of pickup heads, the plurality of pickup heads being at a source matching pitch when picking up the set of chips; adjusting the plurality of pickup heads holding the set of chips to a bonding head matching pitch; and transferring the set of chips from the plurality of pickup heads to the plurality of bonding heads, the plurality of bonding heads including a first head, the transferring step being performed after moving the first head using the docking station. The method further includes the steps of measuring an alignment error of the chips held by the plurality of bonding heads, adjusting a position of at least one of the chips held by a bonding head of the plurality of bonding heads relative to a destination substrate on a destination chuck based on the alignment error, and bonding the set of chips to the destination substrate with the plurality of bonding heads. [Brief explanation of the drawings]

[0024] Embodiments are illustrated by way of example and not limitation in the accompanying figures.

[0025] [Figure 1] FIG. 1 includes a conceptual diagram of an apparatus that can be used to transfer chips from a source substrate to a destination substrate.

[0026] [Figure 2] FIG. 2 includes a side view of a bond head according to one embodiment.

[0027] [Figure 3] FIG. 3 includes a cross-sectional view of a portion of a bridge and bonding head using a vacuum-based coupler to couple the bridge and bonding head.

[0028] [Figure 4] FIG. 4 includes a cross-sectional view of a portion of a bridge and bonding head that uses an electromagnetic coupler to couple the bridge and bonding head.

[0029] [Figure 5] FIG. 5 includes a cross-sectional view of a portion of a bridge and a bond head using a mechanical coupler to couple the bridge and the bond head.

[0030] [Figure 6] FIG. 6 contains a process flow diagram for a method for positioning multiple bonding heads during a chip transfer operation.

[0031] [Figure 7] FIG. 7 includes a cross-sectional view of a portion of the apparatus of FIG. 1 prior to movement of the bonding head.

[0032] [Figure 8] FIG. 8 includes a cross-sectional view of a portion of the apparatus of FIG. 7 after the docking station has been moved into position with the bonding head.

[0033] [Figure 9]FIG. 9 includes a cross-sectional view of a portion of the apparatus of FIG. 8 after the docking side coupler has been actuated to couple the bonding head and docking station.

[0034] [Figure 10] FIG. 10 includes a cross-sectional view of a portion of the apparatus of FIG. 9 after the bridge-side coupler has been deactivated to separate the bond head and bridge from one another.

[0035] [Figure 11] FIG. 11 includes a cross-sectional view of a portion of the apparatus of FIG. 10 after the bond head has been moved to a desired position.

[0036] [Figure 12] FIG. 12 includes a cross-sectional view of a portion of the apparatus of FIG. 11 after the bridge-side coupler has been actuated to couple the bonding head and bridge.

[0037] [Figure 13] FIG. 13 includes a cross-sectional view of a portion of the apparatus of FIG. 12 after the docking side coupler has been deactivated to disconnect the bond head and docking station from each other.

[0038] [Figure 14] FIG. 14 includes a cross-sectional view of a portion of the apparatus of FIG. 13 after the docking station has been moved to the location of another bonding head.

[0039] [Figure 15] FIG. 15 includes a cross-sectional view of a portion of the apparatus of FIG. 14 after the docking side coupler has been actuated to couple another bonding head to the docking station.

[0040] [Figure 16] FIG. 16 includes a cross-sectional view of a portion of the apparatus of FIG. 15 after the bridge-side coupler has been deactivated to disconnect the other bond head and the bridge from each other.

[0041] [Figure 17] FIG. 17 includes a cross-sectional view of a portion of the apparatus of FIG. 16 after the other bond head has been moved to a desired position.

[0042] [Figure 18] FIG. 18 includes a cross-sectional view of a portion of the apparatus of FIG. 17 after the bridge-side coupler has been actuated to couple another bonding head to the bridge.

[0043] [Figure 19] FIG. 19 includes a cross-sectional view of a portion of the apparatus of FIG. 18 after the docking side coupler has been deactivated to disconnect the other bond head and the docking station from each other.

[0044] [Figure 20] FIG. 20 includes a cross-sectional view of a portion of the apparatus of FIG. 19 after the docking station has been moved away from the other bond heads.

[0045] Those skilled in the art will appreciate that elements in the figures are illustrated for simplicity and clarity and have not necessarily been drawn to scale. For example, the dimensions of some of the elements in the figures may be exaggerated relative to other elements to help understand embodiments of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0046] The following description in combination with the drawings is provided to aid in understanding the teachings disclosed herein. The following discussion focuses on particular embodiments and implementations of the teachings. This focus is provided to help explain the teachings and should not be construed as a limitation on the scope or applicability of the teachings.

[0047] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one skilled in the art to which this invention belongs. The materials, methods, and examples are illustrative only and are not intended to be limiting. To the extent not described herein, many details regarding specific materials and processing acts are conventional and can be found in textbooks and other sources in the art.

[0048] The apparatus can include a docking station that allows the bonding head to be moved, the docking station allowing for very accurate and precise positioning of the bonding head. The apparatus can include a bridge and a docking station, the apparatus configured to move the docking station relative to the bridge. The apparatus can further include one head of a plurality of heads, the head having a chip holding area. The apparatus can further include a bridge-side coupler configured to couple the head to the bridge and decouple the head from the bridge, and a docking-side coupler configured to couple the head to the docking station and decouple the head from the docking station. In one embodiment, the docking station can be coupled to a destination stage that allows for accurate and precise positioning of the docking station relative to a corresponding position along the bridge. Thus, existing equipment can be modified for the docking station, allowing the position of the bonding head to be changed to suit different destination substrate designs.

[0049] Bonding head pitch changes for an array of bonding heads are performed less frequently compared to pick-up head pitch changes for an array of pick-up heads. The fewer pitch changes for an array of bonding heads, the more emphasis can be placed on stability rather than dynamic / high-speed performance, as is the case with an array of pick-up heads. The apparatus and methods of using the apparatus are better understood using the following description in conjunction with the corresponding figures. While much of the description refers to relocating a bonding head, the concepts described herein can also be used to relocate a pick-up head.

[0050] FIG. 1 includes a conceptual diagram of an apparatus 100 that can be used to transfer multiple chips 132 coupled to a source chuck 122 to a destination substrate 158 coupled to a destination chuck 148. The apparatus 100 includes a bridge 120, a base 140, and a controller 160 coupled to the bridge 120, the base 140, or one or more components coupled to the bridge 120 or the base 140. Each of the bridge 120 and the base 140 can be a support structure. The bridge 120 can be coupled to the source chuck 122 and an array of bonding heads 124. The base 140 can be coupled to a pickup head stage 142 and a destination stage 146. The apparatus 100 of FIG. 1 can include registration, alignment, and metrology hardware, firmware, software, or a combination thereof; however, to simplify understanding of the apparatus, such registration, alignment, and metrology hardware, firmware, software, or a combination thereof is not shown in FIG. 1.

[0051] 1 and other figures, bridge 120, base 140, and components physically coupled to bridge 120 or base 140 may be configured along an X direction, a Y direction, a Z direction, or a combination thereof. With respect to a cross-sectional or side view, the X direction is between the left and right sides of the drawing, the Z direction is between the top and bottom of the drawing, and the Y direction is into and out of the drawing sheet. Unless otherwise noted, rotation occurs along the XY plane defined by the X and Y directions.

[0052] The components within the apparatus 100 will generally be described in the order in which a set of chips from the plurality of chips 132 is transferred from the source chuck 122 to the destination substrate 158. Due to similarities in operation, the pickup head stage 142 and the destination stage 146 will be described in the same place later in this specification.

[0053] The terms "transfer operation" and "transfer cycle" are referred to to aid in understanding the embodiments described herein. A transfer operation begins with picking up a set of chips in the plurality of chips 132 from the source chuck 122 and ends with the final set of chips being transferred to the destination substrate 158. A transfer cycle begins with picking up a particular set of chips from the source chuck 122 and continues until the same particular set of chips is transferred to the destination substrate 158. A transfer operation may include one or more transfer cycles.

[0054] The source chuck 122 may be a vacuum chuck, a pin-type chuck, a groove-type chuck, an electrostatic chuck, an electromagnetic chuck, etc. The source chuck 122 may be coupled to the bridge 120 by being attached directly to the bridge, or may be coupled to the bridge via a stage (not shown). The source chuck 122 has a source-holding surface facing the base 140 or a component coupled to the base 140.

[0055] The plurality of chips 132 may be attached to a source substrate (not shown separately) coupled to a source chuck 122 coupled to the bridge 120. The source substrate may hold the plurality of chips 132, with all or only a portion of the plurality of chips being transferred to a destination substrate. The source substrate may be an initial substrate or an intermediate substrate. The source substrate may be adhesive tape, which may be in the form of a tape frame or tape reel, a container having a grid defining a matrix of regions capable of holding the plurality of chips 132, or the like.

[0056] The chips in the plurality of chips 132 may include microprocessors, microcontrollers, graphics processing units, digital signal processors, memory chips (e.g., level 2 or level 3 cache, flash memory, etc.), power transistor chips, power circuit chips, etc. The chips have a device side that has most or all of the chip's electrical circuit elements and a back side opposite the device side. In the embodiment shown in FIG. 1 , the back side of a chip in the plurality of chips 132 is disposed between the source chuck 122 and the device side of the chip. In other embodiments, the device side of a chip in the plurality of chips 132 is disposed between the source chuck 122 and the back side of the chip. The side of the chip facing the base 140, or components coupled to the base, is activated for hybrid bonding to the destination substrate 158. In one embodiment, the device side of the chip may include a plurality of chip bonding sites that are bonded by the apparatus 100 to corresponding destination substrate bonding sites to form electrical connections between the chip bonding sites and the destination substrate bonding sites. The chip has a backside opposite the device side, which may also include backside bonding sites that may serve as future destination substrate bonding sites for later use.

[0057] The pickup head stage 142 and the destination stage 146 are positioning stages coupled to the base 140 and can provide translational movement along the base 140 in the X, Y, or Z directions, or rotational movement about one or more axes, such as rotation about the Z axis and rotation along a plane along the X and Y directions. The pickup head stage 142 and the destination stage 146 can move together or independently of each other. The pickup head stage 142 and the destination stage 146 can be the same type or different types of stages.

[0058] An array of pickup heads 144 is coupled to the pickup head stage 142 and has a pickup face facing the bridge 120 or a component coupled to the bridge 120. In one embodiment, the pickup heads may be held by a chip chuck, which may be a vacuum chuck, a pin-type chuck, a groove-type chuck, an electrostatic chuck, or an electromagnetic chuck.

[0059] The array of pickup heads 144 can be configured as a vector (rows or columns of pickup heads) or as a matrix (at least two rows and at least two columns of pickup heads). For a matrix, the number of bonding heads in the array of pickup heads 144 can vary between rows, columns, or between rows and columns. Some array configurations can be 3x1, 6x1, 2x2, 2x3, 2x4, 4x2, 10x10, or other rectangular shapes, with one number corresponding to the number of pickup heads along a row or column and a second number corresponding to the number of pickup heads along the other row or column. In theory, all chips from an entire source wafer can be transferred at once. In such a configuration, the array of pickup heads 144 has fewer pickup heads along rows closer to the top and bottom of the array compared to the row or pair of rows closest to the center of the array, and the array of pickup heads 144 has fewer pickup heads along columns closer to the left and right sides of the array compared to the column or pair of columns closest to the center of the array. After reading this specification, one skilled in the art will be able to determine an array configuration for array of pickup heads 144 that meets the needs or desires of a particular application.

[0060] The pickup head array 144 may be configured to have an adjustable pitch that can be reversibly changed between a source-matching pitch and a bonding head-matching pitch. The pickup head array 144 or the pickup head stage 142 may include motors, electrical components, etc., that can be actuated to move the pickup head to achieve the desired pitch. The apparatus 100 may be configured to allow at least one pitch change per transfer cycle. On average, the pitch of the pickup head array 144 can change twice during a transfer cycle. As used herein, pitch is the sum of the width or length of a feature and the space between the feature and its immediate neighbors. A feature may be a chip on a source substrate, a pickup head in the pickup head array 144, a bonding head in the bonding head array 124, or a destination bonding site on a destination substrate 158. The pitch along the X direction may be the same or different from the pitch in the Y direction.

[0061] In one embodiment, the pickup head array 144 may be at a source matching pitch when picking up a set of chips from the source chuck 122 and at a bonding head matching pitch when transferring the chips to the bonding head array 124. After the chips are transferred to the bonding head array 124, the pitch of the pickup head array 144 may be returned to the source matching pitch before picking up the next set of chips for the next transfer cycle.

[0062] An array 124 of bonding heads is coupled to the bridge 120. Each of the bonding heads in the array 124 of bonding heads has a bridge-side major surface and a docking-side major surface opposite the bridge-side major surface. As shown in the embodiment of FIG. 1 , the bonding heads are coupled to the bridge 120 along the bridge-side major surface. The docking-side major surface is spaced apart from the docking station 150. During an operation to reconfigure the bonding heads to a different bonding head pitch, the docking-side major surface is coupled to the docking station 150.

[0063] Similar to the pickup head array 144, the bonding head array 124 can be configured as a vector (rows or columns of bonding heads 124) or a matrix (at least two rows and at least two columns of bonding heads 124). For a matrix, the number of bonding heads in the bonding head array 124 can vary between rows, columns, or between rows and columns. Some array configurations can be 3x1, 6x1, 2x2, 2x3, 2x4, 4x2, 10x10, or another rectangular shape, with one number corresponding to the number of bonding heads along a row or column and a second number corresponding to the number of bonding heads along the other of the rows or columns. Theoretically, chips from an entire wafer can be transferred all at once. In such a configuration, the array of bonding heads 124 has fewer bonding heads along rows closer to the top and bottom of the array compared to the row or pair of rows closest to the center of the array, and the array of bonding heads 124 has fewer bonding heads along columns closer to the left and right sides of the array compared to the column or pair of columns closest to the center of the array. After reading this specification, one skilled in the art will be able to determine an array configuration for the array of bonding heads 124 that meets the needs or desires of a particular application. In one embodiment, the array of bonding heads 124 has the same number of rows and columns as the array of pick-up heads 144.

[0064] Each of the bonding heads in the array of bonding heads 124 may include a chip chuck and a body disposed between the chip chuck and the bridge 120. The bonding heads are configured so that the chip chuck has a limited range of movement relative to its corresponding body to provide better positioning when the chip is transferred from the array of bonding heads 124 to the destination substrate 158 when coupled to the destination chuck 148.

[0065] Better chip positioning can be achieved by measuring the alignment error as the position of each chip on each bonding head relative to the chip's ideal position on the bonding head. The controller 160 or a local controller can use the alignment error to determine the amount of chip positioning to more closely align the chip with the corresponding destination bonding site on the destination substrate 158. The chips are held by chip chucks on the bonding heads. The controller 160 or a local controller can send signals to adjust the position of each chip by moving the chip chuck of the bonding head using the limited range of movement of the chip chuck relative to the corresponding body. Thus, in one embodiment, the chip chuck can be moved to adjust the position of the chip relative to the destination substrate 158 held by the destination chuck 148. If the chips are within the misalignment tolerance, it may not be necessary to position all of the chips.

[0066] The amount by which the position of the chip chuck is adjusted is less than the amount by which the bonding head is moved using docking station 150. In one embodiment, the amount by which the position is adjusted is at least an order of magnitude less than the amount by which the bonding head is moved using docking station 150. Systems for measuring alignment errors are well known in the art and may include one or more of a camera, an interferometer, fiducial marks, etc., used to measure alignment errors of the chips on array 124 of bonding heads. Each bonding head may include a positioning stage, well known in the art, that may be used to adjust the position of each chip on each bonding head relative to a destination substrate on a destination chuck based on the measured alignment errors.

[0067] FIG. 2 includes a side view of an exemplary bonding head 244 that may be present in the plurality of bonding heads 124, according to one embodiment. The bonding head 244 includes a body 2442 and a chip chuck 2444. When the bonding head 244 is coupled to the bridge 120, the body 2442 is positioned between the bridge 120 and the chip chuck 2444. The bonding head 244 has a chip holding area 2446 that faces the base 140 or a component coupled to the base 140, as shown in FIG. 1. Thus, the bonding head 244 of FIG. 2 is flipped upside down compared to the bonding head shown in FIG. 1. The chip contacts the chip chuck 2444 within the chip holding area 2446, which is located within a recess 2447. If the chip is too thin to extend outside the recess 2447, a backing plate can be attached to the chip. The backing plate contacts the chip chuck 2444, and the surface of the chip extends outside the recess 2447. Portion 2448 of chip chuck 2444 defines the perimeter of chip holding area 2446. Portion 2448 is a bonding zone that allows physical contact to docking station 150 or a component (not shown) that is coupled to docking station 150. Thus, bonding head 244 can be moved using docking station 150 without contacting surfaces within chip holding area 2446.

[0068] The bonding head 244 in FIG. 2 is a non-limiting embodiment, and other designs are possible. In other designs, the recess 2447 may not be present, and the chip holding area 2446 may be flush with the portion 2448 of the chip chuck 2444. The docking station 150 may be designed to contact the chip chuck 2444 outside of the chip holding area 2446. In the same or other embodiments, a component may be used between the docking station 150 and the chip chuck 2444. For example, the component may resemble a gasket or may comprise an elastomeric material (e.g., silicone, polybutylene, or rubber) with an opening corresponding to the chip holding area 2446. After reading this specification, one skilled in the art will be able to determine the design of the bonding heads and docking stations 150 in the array of bonding heads 124 so as to allow the bonding heads to move while reducing the risk of contact between the chip holding area 2446 and the docking station 150 or a component coupled to the docking station 150. The sensors may sense when the bonding head is at or near the docking station 150 and bridge 120. The sensors may be connected to the docking station 150, the bridge 120, the bonding head, or a combination thereof.

[0069] Referring to FIG. 1 , the destination chuck 148 may be coupled to a destination stage 146 that is coupled to the bridge 120. In one embodiment, the destination chuck 148 is attached to the destination stage 146. The destination chuck 148 can hold a destination substrate 158 having destination bonding sites. The destination chuck 148 can be a vacuum chuck, a pin-type chuck, a groove-type chuck, an electrostatic chuck, an electromagnetic chuck, etc. The destination chuck 148 can be heated, cooled, or both heated and cooled. The destination chuck 148 can include a heater. In the same or a different embodiment, a fluid (not shown) can flow through the destination chuck 148 to increase or decrease the temperature of the destination chuck 148.

[0070] The destination substrate 158 is coupled to the destination chuck 148 and has a destination bonding site (not shown separately) to which a chip from the plurality of chips 132 is bonded. The destination substrate 158 can be an intermediate substrate or a final product substrate. The destination substrate 158 can include any of the substrates described with respect to the source substrate, including a semiconductor wafer, a package substrate, a printed wiring board, a circuit board, an interposer, etc. A microelectronic device can be part of the destination substrate 158, such as a semiconductor wafer. The package substrate, printed wiring board, circuit board, or interposer may or may not have a chip mounted thereon. Portions of all sides of the destination substrate 158 can be activated for hybrid bonding. Care must be taken to avoid or at least reduce the possibility of contact with the activated surfaces.

[0071] Apparatus 100 may be operated using controller 160 in communication with bridge 120, any components coupled to bridge 120, base 140, any components coupled to base 140, or any combination thereof. Controller 160 may be operated using a computer-readable program optionally stored in memory 162. Controller 160 may include a processor (e.g., a central processing unit of a microprocessor or microcontroller), a field programmable gate array (FPGA), an application-specific integrated circuit (ASIC), etc. Controller 160 may be within apparatus 100. In other implementations (not shown), controller 160 may be at least part of a computer external to apparatus 100, such computer being bidirectionally coupled to apparatus 100. Memory 162 may include a non-transitory computer-readable medium containing instructions for performing actions associated with or between transfer operations. In other embodiments, bridge 120 , a component coupled to bridge 120 , base 140 , or a component coupled to base 140 may include a local controller that provides some of the functionality provided by controller 160 .

[0072] The docking station 150 can be coupled to or decoupled from the bonding heads in the array of bonding heads 124. The docking station 150 is coupled to a destination stage 146, which allows the docking station 150 to be translated in the X direction, the Y direction, or both. The apparatus 100 can be configured to allow the heads to move away from or toward the bridge before the docking station 150 is translated in the X direction, the Y direction, or both. Compared to the array of pick-up heads 144, the docking station 150 and destination stage 146 allow for more accurate and precise positioning of the bonding heads. While the time required to change the arrangement of the array of bonding heads 124 is longer than changing the pitch of the array of pick-up heads 144, changing the arrangement of the array of bonding heads 124 can be performed less frequently. For example, the arrangement of the array of bonding heads 124 can be changed between transfer operations (e.g., between a pair of destination substrates) rather than during the transfer operation.

[0073] Couplers may be used to couple the array of bonding heads 124 to the bridge 120 and docking station 150. The couplers may be vacuum-based, electromagnetic, mechanical, etc. The couplers may be partially or completely within the bridge 120, the docking station 150, a bonding head in the array of bonding heads 124, or a combination thereof. The same or different couplers may be used at different locations along the bridge.

[0074] 1 and 3 for an exemplary vacuum-based coupler, the bridge 120 can include a vacuum channel 320 that aids in coupling the bonding head 324 to the bridge 120. Only a portion of the body of the bonding head 324 is shown in FIG. 3 . The vacuum channel can be coupled by a vacuum actuator controlled by the controller 160 or a local controller within the bridge 120. The vacuum actuator can be a valve, regulator, or the like. The vacuum source can be within the apparatus 100 or external to the apparatus 100. A suction from the vacuum holds the bonding head in place. Thus, coupling can occur by activating the vacuum actuator, and detachment can occur by deactivating the vacuum actuator corresponding to the vacuum zone. A vacuum-based coupler for the docking station 150 can be configured and operate substantially as described with respect to the vacuum-based coupler for the bridge 120. In an alternative embodiment, the bonding head 324 can have a vacuum channel, and the vacuum can be supplied from a vacuum source within the bonding head or from a source forming one or more of the docking station 150, the base 140, the bridge 120, or the like.

[0075] In the case of an electromechanical coupler, the circuitry is within the bridge 120 or the bonding head, and the electromagnetic material within the bonding head or bridge 120 may be activated when the circuitry is turned on and deactivated when the circuitry is turned off. In FIG. 4 , the bridge 120 may include the circuitry 420, and the bonding head 424 may include the electromagnetic material 4242 and the body 4244. Only a portion of the body 4244 is shown in FIG. 4 . In other embodiments, the electromagnetic material 4242 may be within the bridge 120, and the circuitry 420 may be within the bonding head 424. The magnetic force from the electromagnetic material 4242 is sufficient to hold the bonding head in place. Thus, coupling occurs by activating the circuitry 420, and decoupling may occur by deactivating the circuitry controlled by the controller 160 or a local controller. The electromagnetic-based coupler for the docking station 150 may be configured and operate substantially as described with respect to the electromagnetic-based coupler for the bridge 120.

[0076] For mechanical couplers, hooks, clips, a pair of protrusions, or the like may be used to hold the bonding head in place. In FIG. 5 , bonding head 524 had a shoulder 522 that may allow a clip 526 to hold bonding head 524 in place relative to bridge 120. Only a portion of the body of bonding head 524 is shown in FIG. 5 . Mechanical couplers may be manually set or activated by electrical circuitry within bridge 120 or the bonding head. For electrical circuits, coupling occurs by activating the circuitry and decoupling occurs by deactivating the circuitry, and such activation / deactivation may be controlled by controller 160 or a local controller. Mechanical couplers for docking station 150 may be configured and operate substantially as described with respect to the mechanical couplers for bridge 120.

[0077] Before describing the method, a description of the bonding convention illustrated with respect to the bonding heads will be provided. Figure 7 includes an array 124 of bonding heads with bonding zones on opposite ends of bonding heads 1242, 1244, and 1246. Shaded bonding zones are used to indicate that the coupler is activated (bonded), and clear (unshaded) bonding zones are used to indicate that the coupler is inactivated (unbonded). In Figure 7, the bridge side coupler is active and the docking side coupler is deactivated. The same convention is used in the other figures.

[0078] Attention is now directed to a method of using the apparatus 100 when moving a bonding head within the array of bonding heads 124. FIG. 6 includes a process flow diagram of the method described with respect to FIGS. 7-20. Some portions of the apparatus 100 shown in FIG. 1 are not shown in FIGS. 7-20 to facilitate understanding of the method. FIGS. 7-20 do not show the destination substrate 158 (of FIG. 1) on the destination chuck 148. During the method, the destination chuck 148 may have an exposed top surface, or the destination substrate 158 or a dummy substrate (e.g., a bare silicon wafer, a glass plate, etc.) may be overlaid on the destination chuck 148 to protect the destination chuck 148 during the method described below.

[0079] Before beginning the description of the method corresponding to Figure 6, several operations may have already been performed or may have been performed. The positioning of the bonding head array 124 corresponds to the destination bonding sites of the previous destination substrate, and the previous destination substrate has a chip bonded to the destination bonding sites. Thus, the transfer operation is completed. Before the next transfer operation begins for the next destination substrate, the bonding head array 124 is adjusted to the location and destination pitch of the destination bonding sites of the next destination substrate. The method corresponding to Figure 6 is performed between immediately successive transfer operations.

[0080] The method may include moving a docking station to the bonding head to be moved in block 622 of FIG. 6 . FIG. 7 includes a cross-sectional view of a portion of an apparatus, the portion including bridge 120, bonding head array 124 including bonding heads 1242, 1244, and 1246, base 140, destination stage 146, destination chuck 148, and docking station 150. Bonding head array 124 may include more or fewer bonding heads compared to the embodiment shown in FIG. 1 . Bridge-side bonding regions of bonding heads 1242, 1244, and 1246 are shaded because bonding heads 1242, 1244, and 1246 are coupled to bridge 120. Referring to FIGS. 7 and 8 , controller 160 or a local controller can send a signal to move destination stage 146 so that docking station 150 is below bonding head 1242.

[0081] The method may further include coupling the bonding head to the docking station in block 632 of FIG. 6. Referring to FIG. 9, the docking station 150 is extended to contact the bonding head 1242. Alternatively, the bridge 120, the base 140, or the destination stage 146 can be moved so that the docking station 150 contacts the bonding head 1242. Data from the sensors can provide information to the controller 160 or a local controller that the docking station 150 and the bonding head 1242 are adjacent or close to each other. The controller 160 or the local controller can send a signal to actuate a docking-side coupler of the bonding head 1242 to couple the bonding head 1242 to the docking station 150.

[0082] The method may include decoupling the bond head from the bridge in block 634 of Figure 6. The controller 160 or a local controller may send a signal to deactivate a bridge-side coupler of the bond head 1242, decoupling the bond head 1242 from the bridge 120 in Figure 10.

[0083] The method may further include moving the docking station from the first position to the second position at block 642 of Figure 6. With reference to Figures 10 and 11, the controller 160 or the local controller may send a signal to move the destination stage 146 so that the bonding head 1242 is below a desired position along the bridge 120. The bonding head 1242 may be moved away from the bridge 120 before the destination stage 146 moves along the XY plane, and the bonding head 1242 may be moved closer to the bridge 120 after the destination stage 146 moves along the XY plane. In Figure 11, the desired position of the bonding head 1242 is near the right side of the bridge 120.

[0084] The method may further include coupling the bonding head to the bridge at block 652 of Figure 6. Referring to Figure 12, data from the sensors may provide information to the controller 160 or a local controller that the docking station 150 and the bonding head 1242 are adjacent or close to each other. The controller 160 or local controller may send a signal to activate a bridge-side coupler of the bonding head 1242, coupling the bonding head 1242 to the bridge 120.

[0085] The method may include decoupling the bonding head from the docking station in block 654 of Figure 6. The controller 160 or the local controller may send a signal to deactivate the docking side coupler of the bonding head 1242, decoupling the bonding head 1242 from the docking station 150 in Figure 13. The docking station 150 may be moved away from the bonding head 1242. At this point in the process, the bonding head 1242 is in the desired position corresponding to the destination bonding site of the next destination substrate.

[0086] At decision diamond 662 of Figure 6, a determination is made as to whether further movement of the bonding head is required. If further movement of the bonding head is not required ("NO" branch), the method ends. If another bonding head is required to be moved ("YES" branch), the operations corresponding to blocks 622, 632, 634, 642, 652, and 654 are repeated for the other bonding head. In the embodiment shown in Figure 13, bonding head 1244 needs to be moved to a desired position corresponding to another destination bonding site on a next destination substrate.

[0087] The method may include moving the docking station to the bonding head to be moved in block 622 of Figure 6. With reference to Figures 13 and 14, the controller 160 or a local controller may send a signal to move the destination stage 146 so that the docking station 150 is below the bonding head 1244.

[0088] The method may further include coupling the bonding head to the docking station at block 632 of Figure 6. Referring to Figure 15, the docking station 150 is extended to contact the bonding head 1244. Alternatively, the bridge 120, the base 140, or the destination stage 146 can be moved so that the docking station 150 contacts the bonding head 1244. The controller 160 or the local controller can send a signal to actuate a docking-side coupler of the bonding head 1244 to couple the bonding head 1244 to the docking station 150.

[0089] The method may include decoupling the bond head from the bridge in block 634 of Figure 6. The controller 160 or a local controller may send a signal to deactivate a bridge-side coupler of the bond head 1244, decoupling the bond head 1244 from the bridge 120 in Figure 16.

[0090] The method may further include moving the docking station from the first position to the second position at block 642 of Figure 6. With reference to Figures 16 and 17, controller 160 or the local controller may send a signal to move destination stage 146 so that bonding head 1244 is below a desired position along bridge 120. Bonding head 1244 may be moved away from bridge 120 before destination stage 146 moves along the XY plane, and bonding head 1244 may be moved closer to bridge 120 after destination stage 146 moves along the XY plane. In Figure 17, the desired position of bonding head 1244 is midway between bonding heads 1242 and 1246.

[0091] The method may further include coupling the bonding head to the bridge at block 652 of Figure 6. Referring to Figure 18, data from the sensors may provide information to the controller 160 or a local controller that the docking station 150 and the bonding head 1242 are adjacent or close to each other. The controller 160 or local controller may send a signal to activate a bridge-side coupler of the bonding head 1244, coupling the bonding head 1244 to the bridge 120.

[0092] The method may include decoupling the bonding head from the docking station in block 654 of Figure 6. The controller 160 or the local controller may send a signal to deactivate the docking side coupler of the bonding head 1244, decoupling the bonding head 1244 from the docking station 150 in Figure 19. The docking station 150 may be moved away from the bonding head 1244 in Figure 20. At this point in the process, the bonding head 1244 is in the desired position corresponding to the destination bonding site of the next destination substrate.

[0093] At decision diamond 662 of Figure 6, a determination is made as to whether further movement of the bonding head is required. If further movement of the bonding head is not required ("NO" branch), the method ends. If further movement of the bonding head is required ("YES" branch), the operations corresponding to blocks 622, 632, 634, 642, 652, and 654 are repeated for the other bonding head. Since further movement of the bonding head is not required, the method may end. In the embodiment shown in Figure 20, bonding head 1246 was not moved during the method corresponding to Figure 6. That is, not all bonding heads need to be moved between immediately successive pairs of transfer operations.

[0094] The above method can be used to move one head at a time. In other embodiments, a set of heads can be moved simultaneously. For example, bonding head 1242 or 1244 can be a column of bonding heads in the Y direction, and all bonding heads along the same column can be moved simultaneously. In other examples, sets of heads can be along different rows or columns. After reading this specification, one skilled in the art will be able to determine the number and positions of bonding heads to move simultaneously.

[0095] 6 is completed, the next destination substrate may be coupled to the destination chuck 148, if it has not already been done. If a dummy substrate was placed on the destination chuck 148, it may be removed after the method is completed and before the next destination substrate is coupled to the destination chuck 148. If the previous destination substrate and the next destination substrate have the same design (e.g., the same part number), the array of bonding heads 124 may not need to be repositioned between the transfer operation for the previous destination substrate and the next transfer operation for the next destination substrate. Because the previous and next substrates may not be located in the same exact position on the destination chuck 148, a slight realignment of the next destination substrate 158 relative to the bonding heads may be performed.

[0096] Comparing Figures 7 and 20, the bonding head pitch for the array 124 of bonding heads is different. The bonding head pitch for the array 124 of bonding heads in Figure 7 is smaller than the bonding head pitch for the array 124 of bonding heads in Figure 20. In the same or a different embodiment, the bonding head pitch in the X direction may be changed while the bonding head pitch in the Y direction may remain the same, or vice versa. In a further embodiment, as shown in Figures 7 and 20, the bonding head pitch may be reduced rather than increased.

[0097] The embodiments described herein allow for accurate and precise positioning of the bonding head. A docking station can be used during movement and positioning of the bonding head. The docking station can be coupled to a destination stage that allows for accurate and precise positioning of the docking station relative to a corresponding location along the bridge. Thus, existing equipment can be modified with a docking station to allow for changing the bonding head to suit different destination substrate designs.

[0098] Bonding head pitch changes for an array of bonding heads are performed less frequently compared to pick-up head pitch changes for an array of pick-up heads. Fewer pitch changes for an array of bonding heads can emphasize stability rather than dynamic / high speed performance, which is emphasized when changing pick-up head pitch for an array of pick-up heads.

[0099] It should be noted that not all of the activities described above in the general description or examples are required, some of the specific activities may not be required, and one or more additional activities may be performed in addition to those described. Furthermore, the order in which the activities are listed is not necessarily the order in which they are performed.

[0100] Benefits, other advantages, and solutions to problems have been described above with respect to particular embodiments. However, the benefits, advantages, solutions to problems, and any features that may give rise to or make more pronounced any benefit, advantage, or solution should not be construed as critical, necessary, or essential features of any or all of the claims.

[0101] The specification and examples of the implementations described herein are intended to provide a general understanding of the structure of various implementations. The specification and examples are not intended to serve as an exhaustive and comprehensive description of all of the elements and features of apparatus and systems that use the structures or methods described herein. Separate implementations may also be provided in combination in a single implementation, and conversely, various features that are described for brevity in the context of a single implementation may also be provided separately or in any subcombination. Furthermore, references to values ​​described in ranges include each and every value within that range. Many other implementations may become apparent to those skilled in the art only after reading this specification. Other implementations may be used and derived from the present disclosure, such that structural substitutions, logical substitutions, or other changes may be made without departing from the scope of the present disclosure. Accordingly, the present disclosure should be considered illustrative and not limiting.

Claims

1. 1. An apparatus comprising: a support structure; a docking station, wherein the apparatus is configured to move the docking station relative to the support structure; and a head among the plurality of heads, the head having a tip holding area; a first coupler configured to couple the head to the support structure and to decouple the head from the support structure; a second coupler configured to couple the head to the docking station and to decouple the head from the docking station; An apparatus comprising:

2. the head further comprises a body and a tip chuck; The apparatus of claim 1 , wherein the head is configured to allow movement of the tip chuck relative to the support structure.

3. The apparatus of claim 1 , further comprising a controller configured to send a signal to move the body of the head from a first position on the support structure to a second position on the support structure.

4. The apparatus of claim 1 , wherein the second coupler is configured to prevent the docking station from contacting the chip holding area.

5. the chip holding area occupies a central portion of a surface facing away from the support structure; The apparatus of claim 1 , wherein the head has a first bonding zone disposed between a first peripheral surface of the head and the tip holding area.

6. 6. The apparatus of claim 5, wherein the first bonding zone is along a first major surface of the head, and the head has a second bonding zone along a second major surface of the head, the second major surface being opposite the first major surface.

7. The apparatus of claim 5 , wherein the tip holding area is recessed within the head.

8. 10. The apparatus of claim 1, wherein the first coupler, the second coupler, or each of the first coupler and the second coupler comprises a zone-based vacuum chuck that is part of or coupled to the support structure.

9. The apparatus of claim 1 , wherein the apparatus is configured to move the head toward and away from the support structure.

10. The apparatus of claim 1 , further comprising a positioning stage coupled to the docking station and configured to move the docking station relative to the support structure.

11. The apparatus of claim 10 further comprising a destination chuck coupled to the positioning stage.

12. a base spaced from the support structure, the positioning stage coupled to the base; and a source substrate coupled to the support structure, the support structure including a bridge; The apparatus of claim 11 further comprising:

13. the plurality of heads are a plurality of bonding heads, and the apparatus comprises: a pickup head stage coupled to the base; a plurality of pickup heads coupled to the pickup head stage; The apparatus of claim 12 further comprising:

14. coupling a first head to a docking station by actuating a first coupler associated with the docking station, the plurality of heads including the first head, the first head having a chip holding area; decoupling the first head from a support structure by deactivating a second coupler associated with the support structure; moving the docking station from a first position along the support structure to a second position along the support structure; coupling the first head to the support structure by actuating a third coupler; decoupling the first head from the docking station by deactivating the first coupler; A method comprising:

15. coupling a second head to the docking station by actuating a fourth coupler associated with the docking station, the plurality of heads including the second head, the second head having a chip holding area; decoupling the second head from the support structure by deactivating a fifth coupler associated with the support structure; moving the docking station from a third position along the support structure to a fourth position along the support structure; coupling the second head to the support structure by actuating a sixth coupler; decoupling the second head from the docking station by deactivating the fourth coupler; The method of claim 14 further comprising:

16. the plurality of heads have a first pitch before moving the docking station from the first position to the second position and before moving the docking station from the third position to the fourth position; the plurality of heads have a second pitch after moving the docking station from the first position to the second position and after moving the docking station from the third position to the fourth position, the second pitch being different from the first pitch; 16. The method of claim 15.

17. further comprising loading a destination substrate onto a destination chuck coupled to the positioning stage; 17. The method of claim 16, wherein the destination substrate has a plurality of destination bonding sites at a destination pitch, the destination pitch being closer to the second pitch than the first pitch.

18. The step of moving the docking station is performed between a pair of transfer motions; the plurality of heads includes a second head, the second head having a chip holding area; The method of claim 14 , wherein the second head is coupled to the support structure and is not moved between the pair of transfer movements.

19. the first head has a first side adjacent to the support structure and a second side adjacent to the docking station; the chip holding area is along the second side surface, The step of coupling the first head to the docking station includes: (1) contacting the docking station and the chip holding area not contacting the docking station; or (2) contacting a component coupled to the docking station, and the chip holding area not contacting the component coupled to the docking station; 15. The method of claim 14.

20. The method of claim 14 , wherein the plurality of heads is a plurality of bonding heads.

21. picking up a set of chips from a source substrate with a plurality of pickup heads, the plurality of pickup heads being at a source matching pitch when picking up the set of chips; adjusting the plurality of pickup heads holding the set of chips to a bonding head matching pitch; transferring the set of chips from the plurality of pick-up heads to the plurality of bonding heads, the plurality of bonding heads including a first head, the transferring step being performed after moving the first head using the docking station; measuring alignment errors of the chips held by the plurality of bonding heads; adjusting a position of at least one of the chips held by a bonding head of the plurality of bonding heads relative to a destination substrate on a destination chuck based on the alignment error; bonding the set of chips to the destination substrate with the plurality of bonding heads; 21. The method of claim 20, further comprising:

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