Polycyclic olefin polymers containing olefinic functional groups for forming low-loss films with improved thermal properties - Patent Application 20070122999
Polymers formed from polycyclic olefin monomers with olefinic functional groups address the limitations of existing insulating materials by providing low dielectric and thermal properties, ensuring stability and integrity in printed circuit boards and automotive components.
Patent Information
- Application Number
- JP2025514117
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2022-09-07
- Filing Date
- 2023-09-07
- Publication Date
- 2025-09-19
AI Technical Summary
Existing insulating materials for printed circuit boards and automotive components face challenges in achieving low dielectric constants, low dielectric dissipation factors, high glass transition temperatures, and low coefficients of thermal expansion, which are essential for preventing delamination and maintaining structural integrity under harsh conditions.
Polymers comprising two or more polycyclic olefin monomers, at least one with an olefinic functional group, are used to form insulating materials with improved dielectric and thermal properties, including films, composites, and prepregs, through vinyl addition polymerization, allowing for crosslinking and high-temperature stability.
The polymers exhibit low dielectric constants (2.2 to 3.0 at 10 GHz), low dielectric dissipation factors (0.001 to 0.002 at 10 GHz), and coefficients of thermal expansion (50 ppm/K), enabling high glass transition temperatures (150°C to 280°C) and stable performance in extreme conditions.