Polishing compositions and methods of use thereof

JP2025540092APending Publication Date: 2025-12-11FUJIFILM ELECTRONIC MATERIALS U S A INC
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Patent Information

Application Number
JP2025531385
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Priority Date
2022-11-29
Filing Date
2023-11-21
Publication Date
2025-12-11

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Abstract

This disclosure relates to a polishing composition comprising an abrasive, at least two pH adjusters, a barrier film removal rate enhancer, a low-k removal rate inhibitor, and an azole-containing corrosion inhibitor. This disclosure also features a method for polishing a substrate comprising copper and silicon oxide using the polishing composition.
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