Bonded structure with security die

Abstract

A bonded structure is disclosed. The bonded structure may include a semiconductor device with active circuitry and a security die electrically connected to and directly bonded to a surface of the semiconductor device along a bonding interface without adhesive. The security die may include a security core. The security core may include encryption logic and memory. The security core may be configured to decrypt data to be transmitted to the active circuitry and to encrypt signals from the active circuitry.

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