Reaction chamber and wafer etching equipment

Abstract

The present disclosure relates to the semiconductor technology field and provides a reaction chamber (100) and a wafer etching apparatus. The reaction chamber (100) includes a cavity (1), a wafer transfer opening (10), a first inner liner (11), and a first heater (112). A wafer stage (4) is installed inside the cavity (1). The wafer transfer opening (10) communicates with the interior of the cavity (1). The first inner liner (11) is installed between the inner wall of the cavity (1) and the outer wall of the wafer stage (4). The first heater (112) is installed in the inner wall of the cavity (1) and corresponds to the position of the first inner liner (11), and is configured to heat the first inner liner (11).

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