Method for predicting temperature rise of sliding contact member
An analytical method predicts temperature rise on contact strips by using a heat distribution coefficient and apparent thermal conductivity, addressing the limitations of experimental methods by considering the contact surface state, enhancing prediction accuracy.
JP2026001394APending Publication Date: 2026-01-07RAILWAY TECHNICAL RESEARCH INSTITUTE
Patent Information
- Application Number
- JP2024098680
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-06-19
- Publication Date
- 2026-01-07
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Figure 2026001394000001_ABST
Abstract
To provide a method for analytically predicting the temperature rise of a contact strip due to frictional heat when the sliding surface of the contact strip is slid and moved along a trolley wire in consideration of the state of a contact surface.SOLUTION: The method includes a temperature rise calculation step of calculating a temperature rise of the contact strip by multiplying frictional heat on a surface of the contact strip, which is expressed by integrating a frictional force with a sliding movement speed, by a heat distribution rate to the contact strip, wherein the temperature rise calculation step includes an input step of giving the heat distribution rate, and the apparent thermal conductivity of the contact strip is calculated by determining apparent thermal conductivities of the trolley wire and the contact strip and correcting the heat distribution rate to the apparent thermal conductivity so as to give the heat distribution rate from the specific heat and the density of the contact strip.SELECTED DRAWING: Figure 1
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Citation Information
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