Heat medium temperature control device using thermoelectric element
Patent Information
- Application Number
- JP2024134617
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-06-19
- Filing Date
- 2024-08-09
- Publication Date
- 2026-01-07
- Estimated Expiration
- Not applicable · inactive patent
Smart Images

Figure 2026001669000001_ABST
Abstract
Description
[Technical Field]
[0001] The present invention relates to a heat medium temperature control device using a thermoelectric element for controlling the temperature and circulation of a heat medium. In particular, the present invention relates to a heat medium temperature control device using a thermoelectric element that is detachably connected to a temperature control device to be temperature controlled and controls the state of the temperature control device according to the user's desired conditions by adjusting the temperature of the circulating heat medium. [Background technology]
[0002] In general, a hot water mat includes a mat with a flow path for hot water to flow, a boiler for producing hot water, and a circulation line connecting the boiler and the mat, and heats a room by circulating the heated water. However, since the hot water mat is structured to provide only hot water, it has a problem that it is difficult to use in hot summer or when a user desires cool air in addition to winter.
[0003] To solve this problem, a hot and cold water temperature control device has been recently disclosed that selectively supplies hot and cold water to a mat, thereby providing not only heating but also cooling functions for the mat. As disclosed in Korean Patent Publication No. 10-2401138, a thermoelectric element having a heat generating surface and a heat absorbing surface is used in the hot and cold water temperature control device to selectively supply hot and cold water.
[0004] Recently, research and development has been actively conducted to improve the thermal efficiency of hot and cold water temperature control devices using thermoelectric elements. For example, when using a thermoelectric element to control the temperature of circulating water, research and development has been actively conducted on structures that can increase the heat transfer efficiency between the thermoelectric element and the heat medium and / or that can effectively dissipate the heat generated by the thermoelectric element. Summary of the Invention [Problem to be solved by the invention]
[0005] The present invention is intended to solve the above-mentioned problems, and aims to provide a heat medium temperature control device that improves heat dissipation efficiency by providing an auxiliary heat dissipation section to assist the heat dissipation function of the main heat dissipation section.
[0006] Another object of the present invention is to provide a heat medium temperature control device that improves heat exchange efficiency by including a heat medium block structure that can effectively guide heat exchange between the circulating heat medium and the thermoelectric element.
[0007] The technical problems that the present invention aims to solve are not limited to the technical problems mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art to which the present invention pertains from the detailed description of the invention below. [Means for solving the problem]
[0008] The present invention relates to a heat medium temperature control device connected to a temperature control device provided with a tube through which a heat medium circulates, for controlling the temperature of the heat medium. The heat medium temperature control device may include a main tank unit, a heat exchange unit, a heat medium circulation unit, and an auxiliary heat dissipation unit. The main tank unit can accommodate the circulating heat medium and supply the heat medium to the temperature control device. The heat exchange unit may include a thermoelectric element, a heat medium block disposed on one side of the thermoelectric element and provided with a first flow path for transferring the heat medium recovered from the temperature control device to the main tank unit, and a main heat dissipation unit disposed on the other side of the thermoelectric element. The heat medium circulation unit may include an inlet line connecting the heat medium block to the temperature control device and an outlet line connecting the main tank unit to the temperature control device. The auxiliary heat dissipation unit may be connected to the main heat dissipation unit. The main heat dissipation unit may include a main heat dissipation block and a heat dissipation flow path pipe inserted through a thickness of the main heat dissipation block and including a second flow path of the auxiliary heat medium, the second flow path having a heat dissipation inlet and a heat dissipation outlet formed at one end and the other end, respectively. The auxiliary heat dissipation unit may include an auxiliary thermoelectric element, an auxiliary heat medium block disposed on one side of the auxiliary thermoelectric element and including a third flow path of the auxiliary heat medium, the auxiliary block inlet and the auxiliary block outlet formed at one end and the other end, respectively, and an auxiliary heat medium circulator having an auxiliary inlet line connecting the heat dissipation outlet and the auxiliary block inlet and an auxiliary outlet line connecting the heat dissipation inlet and the auxiliary block outlet.
[0009] One surface of the auxiliary thermoelectric element may be fixed and driven as a cooling surface that performs a cooling function.
[0010] The auxiliary heat dissipation unit may further include an auxiliary circulation pump for guiding the circulation of the auxiliary heat medium.
[0011] The main heat dissipation block may be provided as a plurality of main heat dissipation blocks, and the heat dissipation flow path pipe may extend to pass through the plurality of main heat dissipation blocks a plurality of times in succession.
[0012] The heat medium temperature control device according to an embodiment of the present invention may further include a sensing unit that senses the temperature of the heat medium at a predetermined position at a predetermined interval or in real time, and a control unit that selectively drives the auxiliary heat dissipation unit according to predetermined conditions based on information acquired from the sensing unit.
[0013] The preset condition may be a condition in which the auxiliary thermoelectric element is driven in a temperature change step in which the temperature is changed from a first temperature to a second temperature, which is a target set temperature, and the second temperature is maintained, or the auxiliary thermoelectric element is not driven in a temperature maintenance step in which a temperature range preset corresponding to the second temperature is maintained.
[0014] The auxiliary heat dissipation unit may further include an auxiliary heat dissipation block disposed on the other side of the auxiliary thermoelectric element, and an auxiliary heat dissipation fan configured to discharge the air that has been subjected to heat exchange to the outside.
[0015] The heat medium block may include a first body having one surface in contact with the thermoelectric element and another surface on which a partition wall forming the first flow path is formed, and a second body covering the first body and fixed to the first body, and at least one of the partition walls may include a protrusion protruding downward.
[0016] The protrusions may be formed at a predetermined angle inclined in accordance with the flow direction of the heat medium.
[0017] The heat medium temperature control device according to an embodiment of the present invention may further include connectors connected to the inlet line and the outlet line. The connector may include an outlet flow path and a return flow path separated by a barrier, a first mesh case disposed in the outlet flow path and having a plurality of open holes, a second mesh case disposed in the return flow path and having a plurality of open holes, and functional balls housed in the first mesh case and the second mesh case. The outlet flow path may be connected to the outlet line. The return flow path may be connected to the inlet line. [Effects of the Invention]
[0018] The present invention has the advantage that the heat dissipation efficiency can be significantly improved by providing an auxiliary heat dissipation section to assist the heat dissipation function of the main heat dissipation section, and that the auxiliary heat dissipation section can be driven independently and / or selectively from the main heat dissipation section according to preset conditions, thereby improving the heat dissipation efficiency while reducing power consumption.
[0019] The present invention also has the advantage of improving heat exchange efficiency by including a heat medium block structure that provides a flow path for effectively guiding heat exchange between the circulating heat medium and the thermoelectric elements.
[0020] The effects that can be obtained in the present invention are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art to which the present invention pertains from the following description. [Brief explanation of the drawings]
[0021] [Figure 1] 1 is a perspective view showing a heat medium temperature control device using a thermoelectric element according to an embodiment of the present invention. [Figure 2] 1 is a conceptual diagram illustrating the configuration and operating state of a heat medium temperature control device using a thermoelectric element according to an embodiment of the present invention. [Figure 3]1 is a perspective view schematically showing the inside of a heat medium temperature control device using a thermoelectric element according to an embodiment of the present invention. [Figure 4] FIG. 2 is an exploded perspective view showing the structure of a heat medium block and a main tank according to the embodiment of the present invention. [Figure 5] 5A and 5B are diagrams illustrating the shape of a partition wall according to an embodiment of the present invention. [Figure 6] and [Figure 7] 10A and 10B are diagrams comparing the temperature distribution and the fluid trajectory distribution of a fluid when protrusions are formed on a partition wall and when they are not formed on a partition wall. [Figure 8] and [Figure 9] 3A and 3B are diagrams illustrating the structure of a heat dissipation portion according to an embodiment of the present invention. [Figure 10] 1A and 1B are diagrams illustrating the structure of a connector according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION
[0022] In the following description of the embodiments disclosed herein, if it is determined that a detailed description of related publicly known technologies may obscure the gist of the embodiments disclosed herein, the detailed description will be omitted. In addition, the attached drawings are provided to facilitate understanding of the embodiments disclosed herein, and the technical ideas disclosed herein should not be limited by the attached drawings, and should be understood to include all modifications, equivalents, and alternatives within the spirit and technical scope of the present invention.
[0023] Terms including ordinal numbers such as first, second, etc. may be used to describe various components, but the components are not limited by the terms. The terms are used only to distinguish one component from another.
[0024] When a component is said to be "coupled" or "connected" to another component, it should be understood that it may be directly coupled or connected to the other component, but that there may be other components in between. In contrast, when a component is said to be "directly coupled" or "directly connected" to another component, it should be understood that there are no other components in between.
[0025] The singular expression includes the plural expression unless the context clearly indicates otherwise.
[0026] In this application, the use of terms such as "comprise" or "have" is intended to specify the presence of any features, numbers, steps, operations, components, parts, or combinations thereof set forth in the specification, but is to be understood as not precluding the possible presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.
[0027] In describing embodiments of the present invention, terms indicating directions such as up / down, front / back, left / right, etc. are intended to provide a relative reference for describing embodiments of the present invention, and are not intended to specify a certain direction or position as an absolute reference, and may change relatively depending on the position of the object of interest, the position of the observer, the view direction, etc.
[0028] Fig. 1 is a perspective view showing a heat medium temperature control device using a thermoelectric element according to an embodiment of the present invention. Fig. 2 is a conceptual diagram showing the configuration and operating state of a heat medium temperature control device using a thermoelectric element according to an embodiment of the present invention. Fig. 3 is a perspective view showing the interior of a heat medium temperature control device using a thermoelectric element according to an embodiment of the present invention. Fig. 4 is an exploded perspective view showing the structure of a heat medium block and a main tank according to an embodiment of the present invention.
[0029] As shown in FIGS. 1 to 4, a heat medium temperature control device 100 using a thermoelectric element according to an embodiment of the present invention (hereinafter referred to as a heat medium temperature control device) is detachably connected to a temperature control device 10 to be temperature-controlled, and can be a device that controls the temperature and humidity of the temperature control device 10 and / or the surrounding environment according to the user's desired conditions by adjusting the temperature of the circulating heat medium. The temperature control device 10 can be, but is not limited to, a cooling / heating mat having a flow path pipe 11 through which the heat medium flows. The heat medium is preferably, but is not limited to, water.
[0030] The heat medium temperature control device 100 according to the embodiment of the present invention may include a housing 101 that determines the outer shape of the device. The housing 101 may have a hexahedral shape as shown in the drawing, but is not limited thereto and may have various outer shapes that can accommodate components described below. To ensure ease of assembly, the housing 101 may include a first housing and a second housing that can be assembled and separated as desired by the user.
[0031] A user input unit 102 may be formed on one surface, preferably the top surface, of the housing 101. The user input unit 102 may generate key input data that a user inputs to control the operation of the heat medium temperature control device 100. To this end, the user input unit 102 may be configured with at least one or a combination of a keypad, a dome switch, a touchpad, and a touch screen in which a touchpad and a display panel are combined. A connector 103 for connecting the heat medium temperature control device 100 and the temperature control device 10 may be detachably coupled to one surface, preferably one side surface, of the housing 101.
[0032] A heat medium temperature control device 100 according to an embodiment of the present invention may include a main tank unit 110, a heat exchange unit 120, a heat medium circulating unit 160, a circulation pump 170, and a control unit 180. The main tank unit 110, the heat exchange unit 120, the heat medium circulating unit 160, the circulation pump 170, and the control unit 180 may be accommodated inside a housing 101. The main tank unit 110, the heat exchange unit 120, and the heat medium circulating unit 160 may be interconnected with a flow path 11 of the temperature control device 10 to form a flow path for the heat medium.
[0033] The main tank 110 may contain a heat medium flowing in from the outside and a heat medium to be circulated. The main tank 110 may have an inlet that is open to the outside, and the inlet may be openable and closable via at least one lid 111. Preferably, the inlet may be exposed to the outside of the housing 101, and the lid 111 may be detachably fastened to the inlet outside the housing 101. The main tank 110 may have an outlet 112 provided at a lower portion thereof.
[0034] The heat exchange unit 120 may be configured to conduct heat exchange with a heat medium under the control of the control unit 180 in response to a user operation and / or a preset condition. The heat exchange unit 120 may include a thermoelectric element 130, a heat medium block 140, and a heat dissipation unit 150.
[0035] The thermoelectric element 130 utilizes the Peltier effect, which creates a temperature difference through a potential difference by utilizing the effect that occurs when bipolar semiconductors (e.g., N-type and P-type semiconductors) are combined. When a voltage is applied to the thermoelectric element 130, a temperature difference occurs on both sides of the element, and one of the two sides generates heat and the other side cools by absorbing heat. The heating and absorbing sides of the thermoelectric element 130 change depending on the direction of the current, and the amount of heat generated and absorbed can be adjusted depending on the amount of current.
[0036] The heat medium block 140 may be located on one surface of the thermoelectric element 130. Preferably, one surface of the heat medium block 140 may be located so as to contact one surface of the thermoelectric element 130. The heat medium block 140 may be located between the thermoelectric element 130 and the main tank unit 110. Preferably, the other surface of the heat medium block 140 may be located so as to contact the main tank unit 110.
[0037] The heat medium block 140 may accommodate a circulating heat medium therein. That is, the heat medium block 140 may include a flow path through which the circulating heat medium can be heat exchanged by the thermoelectric elements 130 while flowing from the temperature control device 10 and then being discharged to the main tank unit 110. To this end, the heat medium block 140 may include a block inlet 142, a plurality of partition walls 143, and a block outlet 149. The block inlet 142 may be a portion through which the heat medium recovered from the temperature control device 10 flows into the heat medium block 140. The plurality of partition walls 143 may form a flow path for the heat medium that has flowed in through the block inlet 142. The block outlet 149 may be a portion that is connected to the main tank unit 110 so that the heat medium flowing through the flow path formed by the partition walls 143 is discharged to the main tank unit 110.
[0038] One end of the flow path defined by the partition 143 may be connected to the block inlet 142, and the other end may be connected to the block outlet 149. The block inlet 142 may be open downward toward the bottom of the housing 101, and the block outlet 149 may be open toward the inside of the main tank 110. As a result, a heat medium flow path may be formed within the heat medium block 140, which is a combination of the block inlet 142, the partition 143, and the block outlet 149.
[0039] The partition walls 143 can guide the flow path of the heat medium. The partition walls 143 can extend in the left-right direction (or side direction) within the heat medium block 140 and be spaced apart from each other in the up-down direction. The partition walls 143 can be arranged in a zigzag pattern to guide the heat medium to flow in a zigzag pattern. This can mean that the heat medium flow path can be secured to be sufficiently long in a limited space. As a result, the heat medium can flow along the flow path within the heat medium block 140 and be guided to exchange heat sufficiently with the thermoelectric elements 130, thereby significantly improving heat exchange efficiency.
[0040] The thermal medium block 140 may include a first body 141 and a second body 147 that are assembled together. The outer shape of the thermal medium block 140 may be determined by combining the first body 141 and the second body 147. One surface of the first body 141 may be positioned to contact the thermoelectric element 130. A partition wall 143 may be formed on the other surface of the first body 141. The first body 141 and the partition wall 143 may be formed of the same material, which may be a material with high thermal conductivity, such as a metal material. As a result, the first body 141 and the partition wall 143, which have relatively high thermal conductivity, are in direct contact with the thermoelectric element 130, thereby significantly improving the efficiency of heat exchange with the thermal medium flowing along the flow path defined by the partition wall 143.
[0041] The second body 147 may be fixed to the first body 141 while covering the partition wall 143. By combining the first body 141 and the second body 147, a flow path through the partition wall 143 may be determined in a predetermined direction. One surface of the second body 147 may contact the main tank portion 110. One surface of the main tank portion 110 may be fixed to one surface of the second body 147 in an open state. The second body 147 may be formed of the same material as the first body 141. Alternatively, the second body 147 may be formed of the same material as the main tank portion 110, for example, a plastic material. In this case, the second body 147 and the main tank portion 110 may be formed integrally.
[0042] The heat dissipation unit 150 may include a heat sink 151 and a heat dissipation fan 155 that perform a heat dissipation function. The heat sink 151 may be located on the other side of the thermoelectric element 130. The heat sink 151 may include heat dissipation fins formed on one side adjacent to the thermoelectric element 130 and the other side opposite the other side. The heat dissipation fan 155 may be located on the other side of the heat sink 151 and may be driven to discharge air that has exchanged heat to the outside. The heat dissipation fan 155 may be fixed to the other side of the heat sink 151. If necessary, the heat dissipation fan 155 may be driven to draw outside air into the interior. If necessary, a plurality of heat sinks 151 and a plurality of heat dissipation fans 155 may be provided.
[0043] The heat medium circulating unit 160 may include a flow path pipe through which the heat medium flows. The heat medium circulating unit 160 may connect some components within the heat medium temperature control device 100, and may connect some components within the heat medium temperature control device 100 to the temperature adjustment device 10. The heat medium circulating unit 160 may include at least a discharge line 161 and an inlet line 165.
[0044] The discharge line 161 may connect the main tank unit 110 and the temperature control device 10. The discharge line 161 may be referred to as a flow path pipe through which the heat medium discharged from the discharge port 112 of the main tank unit 110 flows to the temperature control device 10. The inlet line 165 may connect the heat medium block 140 and the temperature control device 10. The inlet line 165 may be referred to as a flow path pipe through which the heat medium recovered from the temperature control device 10 flows to the block inlet port 142 of the heat medium block 140. The inlet line 165 and the discharge line 161 may form a flow path for the heat medium circulating between the heat medium temperature control device 100 and the temperature control device 10. The flow path may be formed as follows, and the heat medium may circulate along the flow path according to a user setting, predetermined conditions, etc.
[0045] <Flow path of circulating heat transfer medium> Heat medium block 140 of heat exchange unit 120 → main tank unit 110 → discharge line 161 → temperature adjustment device 10 → inlet line 165 → heat medium block 140 of heat exchange unit 120
[0046] The circulation pump 170 may circulate the heat medium through the flow path. The circulation pump 170 may be located below the main tank 110 and may be connected to the discharge line 161, but is not limited thereto.
[0047] The control unit 180 can execute one or more instructions. The control unit 180 can control the heat medium temperature control device 100 according to preset conditions, including a cold water mode and a hot water mode. The preset conditions can include information corresponding to a user's device operation information and sensing information of the surrounding environment. The preset conditions can be received via the user input unit 102. Alternatively, the heat medium temperature control device 100 can further include a communication unit capable of communicating with a user terminal, and the preset conditions can be received by the user terminal. The preset conditions can be stored in advance in a memory.
[0048] For example, the control unit 180 may apply power to the thermoelectric element 130 and drive the circulation pump 170 in response to a power-on (ON) signal. The control unit 180 may control the thermoelectric element 130 in response to a cold water mode (or a temperature setting corresponding to the cold water mode) signal. That is, the control unit 180 may control the direction of current through the thermoelectric element 130 to a predetermined direction so that one side of the thermoelectric element 130 facing the thermal medium block 140 performs a cooling function. The control unit 180 may control the thermoelectric element 130 in response to a hot water mode (or a temperature setting corresponding to the hot water mode) signal. That is, the control unit 180 may control the direction of current through the thermoelectric element 130 to a predetermined opposite direction so that one side of the thermoelectric element 130 facing the thermal medium block 140 performs a heating function. The control unit 180 may acquire sensing information from a temperature sensor that senses the temperature of the outlet water and control the amount of current in the thermoelectric element so that the heat medium corresponding to the temperature set by the user can be discharged.
[0049] The controller 180 may be implemented as a non-volatile computer-readable medium containing executable program instructions. Examples of computer-readable medium include, but are not limited to, ROM, RAM, compact disc (CD)-ROMs, magnetic tape, floppy disks, flash drives, smart cards, and optical data storage devices.
[0050] The control unit 180 may be implemented using at least one of application specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field programmable gate arrays (FPGAs), processors, microprocessors, and other electrical units for performing functions.
[0051] The heat medium temperature control device 100 may further include a power supply unit for supplying power to at least some components of the device. The power supply unit may receive power from an external source or may include an energy storage device such as a battery.
[0052] Fig. 5 is a diagram illustrating the shape of the partition wall according to an embodiment of the present invention. Figs. 6 and 7 are diagrams comparing the temperature distribution and fluid trajectory distribution of a fluid when protrusions are formed on the partition wall and when they are not.
[0053] As shown in FIG. 5, the thermal medium block 140 may include partition walls 143. As described above, the partition walls 143 may be arranged vertically at predetermined intervals in a zigzag pattern to form a single flow path. For example, as shown in the figure, one of adjacent partition walls 143 may be shifted left to form a right hole 143a that is open to the right, and the other may be shifted right to form a left hole 143b that is open to the left. Due to this arrangement of the partition walls 143, the thermal medium block 140 may have a structure in which the right holes 143a and the left holes 143b are alternately formed in at least a portion of the region from bottom to top.
[0054] In this structure, at least one of the partition walls 143 may further include a protrusion 135 that protrudes downward (or in the opposite direction to the heat transfer medium inflow direction). The partition wall 143 may include a plurality of protrusions 135, and the plurality of protrusions 135 may be arranged at predetermined intervals. The number and spacing of the protrusions 135 formed on each partition wall 143 may be the same, but is not limited to this.
[0055] 6 and 7, a preferred embodiment of the present invention includes protrusions 135, which increase the surface area of the heat conductor that the circulating heat transfer medium contacts. This improves the thermal conductivity from the thermoelectric element 130 and significantly improves the temperature uniformity depending on the position of the heat transfer medium. Furthermore, the inclusion of a resistance structure such as the protrusions 135 can reduce eddy currents in the flowing heat transfer medium.
[0056] As another example, the protrusions 135b formed on the partition walls 143 may be inclined at a predetermined angle along the flow direction of the heat medium. For example, at a position where the flow direction of the heat medium is to the right (e.g., a protrusion formed on a partition wall shifted to the left in FIG. 5(b)), the protrusions that come into contact with the heat medium may be inclined at a predetermined angle toward the right. At a position where the flow direction of the heat medium is to the left (e.g., a protrusion formed on a partition wall shifted to the right in FIG. 5(b)), the protrusions that come into contact with the heat medium may be inclined at a predetermined angle toward the left. This has the advantages of ensuring a predetermined thermal conductivity from the thermoelectric elements 130 without impeding the flow of the heat medium and significantly reducing vortex phenomena.
[0057] 8 and 9 are diagrams for explaining the structure of a heat dissipation portion according to an embodiment of the present invention.
[0058] As shown in FIGS. 8 and 9, the heat dissipation unit 150 according to the embodiment of the present invention may include a main heat dissipation unit 150 and an auxiliary heat dissipation unit 200. As shown in FIG.
[0059] The main heat dissipation unit 150 may include one or more main heat dissipation blocks 151, a main heat dissipation fan 155, and a heat dissipation channel pipe 156. It is preferable that a plurality of main heat dissipation blocks 151 are provided, and the following description will be given of an example in which a plurality of main heat dissipation blocks 151 are provided. Although the drawings illustrate an example in which three main heat dissipation blocks 151a, 151b, and 151c are provided, the present invention is not limited to this. The plurality of main heat dissipation blocks 151a, 151b, and 151c may be arranged in a line in one direction. One surface of each of the main heat dissipation blocks 151a, 151b, and 151c may be in contact with at least a portion of the thermoelectric element 140. The other surface of each of the main heat dissipation blocks 151a, 151b, and 151c may include a plurality of heat dissipation fins spaced apart from each other by a predetermined distance.
[0060] A plurality of thermoelectric elements 130 may be provided, and at least one of the plurality of thermoelectric elements 130a, 130b, and 130c may be fixed to one surface of the main heat dissipation blocks 151a, 151b, and 151c. As another example, the thermoelectric element 130 may be configured as a single element and positioned so that at least a portion of the thermoelectric element 130 is in contact with one surface of the plurality of main heat dissipation blocks 151a, 151b, and 151c. In this case, the arrangement direction of the main heat dissipation blocks 151a, 151b, and 151c may correspond to the length direction of the thermoelectric element 140.
[0061] A main heat dissipation fan 155 may be disposed on the other surface of each of the main heat dissipation blocks 151a, 151b, and 151c. A plurality of main heat dissipation fans 155 may be provided, and at least one of the plurality of main heat dissipation fans 155 may be fixed to and disposed on the other surface of each of the main heat dissipation blocks 151a, 151b, and 151c.
[0062] The heat dissipation channel pipe 156 may form one flow path. The heat dissipation channel pipe 156 may extend through the main heat dissipation blocks 151a, 151b, and 151c. One end and the other end of the heat dissipation channel pipe 156 are open to the outside of the main heat dissipation blocks 151a, 151b, and 151c and may be referred to as a heat dissipation outlet 157 and a heat dissipation inlet 158, respectively. The heat dissipation channel pipe 156 may be made of copper, aluminum, stainless steel, or the like, which have excellent heat exchange efficiency.
[0063] For example, each of the main heat dissipation blocks 151a, 151b, and 151c may have a plurality of through holes 152 penetrating the thickness thereof. Each of the through holes 152 may be formed to penetrate the main heat dissipation blocks 151a, 151b, and 151c along the arrangement direction. Adjacent through holes 152 may be spaced apart at a predetermined interval along the width direction of the main heat dissipation blocks 151a, 151b, and 151c. Each of the through holes 152 formed in one of the adjacent main heat dissipation blocks 151a, 151b, and 151c corresponds to each of the through holes 152 formed in the other one, and the corresponding through holes 152 may be lined up in one direction and communicate with each other.
[0064] The heat dissipation channel pipes 156 may be inserted and fixed into the through holes 152. The heat dissipation channel pipes 156 may be inserted into the through holes 152 of the main heat dissipation blocks 151a, 151b, and 151c so as to continuously penetrate the main heat dissipation blocks 151a, 151b, and 151c. The heat dissipation channel pipes 156 may extend in a zigzag pattern so as to penetrate the main heat dissipation blocks 151a, 151b, and 151c multiple times.
[0065] The auxiliary heat dissipation unit 200 may include an auxiliary heat medium block 201 , an auxiliary thermoelectric element 203 , an auxiliary heat medium circulator 205 , an auxiliary heat dissipation block 207 , and an auxiliary heat dissipation fan 208 .
[0066] The auxiliary heat medium block 201 may be located on one surface of the auxiliary thermoelectric element 203. Preferably, one surface of the auxiliary heat medium block 201 may be located so as to be in contact with one surface of the auxiliary thermoelectric element 203. One surface of the auxiliary thermoelectric element 203 may be fixed and driven as a cooling surface that performs a cooling function.
[0067] The auxiliary heat medium block 201 may accommodate a circulating auxiliary heat medium therein. The auxiliary heat medium may be water or the same material as the heat medium circulating through the temperature control device 10, but is not limited thereto. The auxiliary heat medium block 201 may include a flow path through which the circulating auxiliary heat medium can exchange heat with the auxiliary thermoelectric element 203 as it flows in through the heat dissipation outlet 157 of the heat dissipation flow path pipe 156 and flows out toward the heat dissipation inlet 158 of the heat dissipation flow path pipe 156. To this end, the auxiliary heat medium block 201 may include an auxiliary block inlet 202a, an auxiliary partition wall, and an auxiliary block outlet 202b. The auxiliary block inlet 202a may be a portion through which the auxiliary heat medium recovered from the heat dissipation outlet 157 flows in. A plurality of auxiliary partition walls may form a flow path for the auxiliary heat medium flowing in through the auxiliary block inlet 202a. The auxiliary partition wall may guide the flow path of the auxiliary heat medium. The auxiliary partition wall may have substantially the same structure as the partition wall 143 of the heat medium block 140, but is not limited thereto. The auxiliary block outlet 202b may be a portion where the auxiliary heat medium flowing through the flow path formed by the auxiliary partition wall is discharged to the heat dissipation inlet 158. One end of the flow path formed by the auxiliary partition wall may be connected to the auxiliary block inlet 202a, and the other end may be connected to the auxiliary block outlet 202b.
[0068] The auxiliary heat medium circulating unit 205 may include a flow path pipe through which the auxiliary heat medium flows. The auxiliary heat medium circulating unit 205 may connect the main heat dissipation unit 150 and the auxiliary heat dissipation unit 200. For example, the auxiliary heat medium circulating unit 205 may include an auxiliary inlet line 205a connecting the heat dissipation outlet 157 of the heat dissipation flow path pipe 156 to the auxiliary block inlet 202a, and an auxiliary outlet line 205b connecting the heat dissipation inlet 158 of the heat dissipation flow path pipe 156 to the auxiliary block outlet 202b.
[0069] <Flow path of circulating auxiliary heat transfer medium> Heat dissipation flow pipe 156 → heat dissipation outlet 157 of heat dissipation flow pipe 156 → auxiliary inlet line 205a → auxiliary block inlet 202a → auxiliary heat medium block 201 → auxiliary block outlet 202b → auxiliary outlet line 205b → heat dissipation inlet 158 of heat dissipation flow pipe 156 → heat dissipation flow pipe 156
[0070] The circulating auxiliary heat medium may be cooled through heat exchange with the auxiliary thermoelectric elements 203 in the auxiliary heat medium block 201 and then flow into the heat dissipation channel pipe 156. The cooled auxiliary heat medium may effectively cool the generated heat through heat exchange with the main heat dissipation unit 150. The auxiliary heat medium that has exchanged heat while flowing through the heat dissipation channel pipe 156 may flow back into the auxiliary heat medium block 201 and be cooled.
[0071] The auxiliary heat dissipation unit 200 may further include an auxiliary circulation pump for circulating the auxiliary heat medium. The auxiliary circulation pump may be connected to the auxiliary inlet line 205a or the auxiliary outlet line 205b, but is not limited thereto.
[0072] The auxiliary heat dissipation block 207 may be located on the other side of the auxiliary thermoelectric element 203. The auxiliary heat dissipation block 207 may include auxiliary heat dissipation fins formed on one side adjacent to the auxiliary thermoelectric element 203 and the other side opposite the one side. The auxiliary heat dissipation fan 208 may be located on the other side of the auxiliary heat dissipation block 207 and may be driven to exhaust the air that has exchanged heat to the outside. The auxiliary heat dissipation fan 208 may be fixed on the other side of the auxiliary heat dissipation block 207.
[0073] The auxiliary heat dissipation unit 200 assists the heat dissipation function of the main heat dissipation unit 150 and can be driven under the control of the control unit 180. The auxiliary heat dissipation unit 200 can be driven independently of the main heat dissipation unit 150 under preset conditions. The auxiliary heat dissipation unit 200 can be selectively driven under preset conditions. The embodiment according to the present invention has the advantage of being able to reduce power consumption because the auxiliary heat dissipation unit 200 can be selectively driven as needed via the control unit 180.
[0074] For example, the control unit 180 can monitor the temperature at a predetermined position within the heat medium temperature control device 100 at a predetermined interval or in real time, and can selectively control the thermoelectric element 130, the main heat dissipation unit 150, and the auxiliary heat dissipation unit 200 based on the monitoring information.
[0075] More specifically, the control unit 180 can sense at least one of the temperature of the heat medium discharged from the heat medium temperature control device 100, the temperature of the heat medium circulating inside the main tank unit 110, and the temperature of the heat medium circulating inside the heat medium block 140 via a temperature sensor.
[0076] By driving the thermoelectric element 130, a first temperature of the heat medium at a first time point at a predetermined position may be different from a second temperature of the heat medium at a second time point. For example, the first temperature may refer to the temperature at the time when the device is turned on, and the second temperature may refer to the temperature of the heat medium corresponding to a user's target temperature setting.
[0077] The control unit 180 may drive the thermoelectric element 130 to change the temperature of the heat medium from a first temperature to a second temperature (temperature change step) based on sensing information from the temperature sensor, and may drive the thermoelectric element 130 to maintain the second temperature after the second temperature is reached (temperature maintenance step). The temperature maintenance step may be a step of maintaining the second temperature, which is a target set temperature, and / or a step of maintaining a preset temperature range corresponding to the second temperature. For example, the preset temperature range may be set within ±2°C of the second temperature, but is not limited thereto.
[0078] In the temperature changing step, the amount of heat generated may increase as the amount of current flowing through the thermoelectric element 130 becomes relatively large, so the control unit 180 can drive the auxiliary heat dissipation unit 200 while driving the heat dissipation unit 150. In the temperature maintaining step, the amount of heat generated may decrease as the amount of current flowing through the thermoelectric element 130 becomes relatively small, so the control unit 180 can reduce power consumption by not driving the auxiliary heat dissipation unit 200.
[0079] In addition, in the temperature maintaining step, the control unit 180 can reduce power consumption by selectively driving only some of the thermoelectric elements 140a, 140b, and 140c. In addition, in the temperature maintaining step, the control unit 180 can reduce power consumption by selectively driving only some of the main heat dissipation fans 155.
[0080] FIG. 10 is a diagram illustrating the structure of a connector according to an embodiment of the present invention.
[0081] 10, a connector 103 according to an embodiment of the present invention may be a component that connects the heat medium temperature control device 100 and the temperature adjustment device 10. The connector 103 may include a barrier that separates the water outflow path 1033 and the water return path 1034. The barrier may prevent the heat medium flowing through the water outflow path 1033 and the heat medium flowing through the water return path 1034 from mixing with each other.
[0082] The connector 103 may include a first cover 1031 and a second cover 1032 that are assembleable and separably coupled. The assembly method of the first cover 1031 and the second cover 1032 may be a screw coupling method, but is not limited thereto, and may be selected from various methods such as a snap-fit method and a magnetic coupling method.
[0083] The first cover 1031 can be provided with a first water outlet 1031a and a first water return port 1031b. The second cover 1032 can be provided with a second water outlet 1032a and a second water return port 1032b. The first water outlet 1031a can open one end of the water outflow path 1033, and the second water outlet 1032a can open the other end of the water outflow path 1033. The first water return port 1031b can open one end of the water return path 1034, and the second water return port 1032b can open the other end of the water return path 1034. The control unit 180 can control the opening and closing of the first water outlet 1031a, the second water outlet 1032a, the first water return outlet 1031b, and the second water return outlet 1032b in response to a preset signal including a user operation in order to circulate the heat medium.
[0084] The first water outlet 1031a is connected to the discharge line 161, and can be a portion through which the heat medium discharged from the main tank unit 110 via the circulation pump 170 flows into the water outlet flow path 1033. The second water outlet 1032a can be a portion through which the heat medium that has flowed into the water outlet flow path 1033 is discharged to the temperature adjustment device 10. The first water return port 1031b is connected to the inlet line 165, and can be a portion through which the heat medium that has flowed into the water return flow path 1034 is transferred to the heat medium block 140 via the inlet line 165. The second water return port 1032b can be a portion through which the heat medium recovered from the temperature adjustment device 10 flows into the water return flow path 1034. Although not shown, the second water outlet 1032a and the temperature control device 10, and the second water return port 1032b and the temperature control device 10 can be connected via flexible first and second flow pipes, respectively, to improve ease of use.
[0085] The connector 103 may include a first mesh case (1035a) and a second mesh case (1036a) having a plurality of open holes and disposed within the assembled first cover 141 and second cover 1032. The first mesh case 1035a is disposed in the water outlet flow path 1033 and can accommodate a plurality of functional balls 1037. If necessary, one end of the first mesh case 1035a may be open, and a first mesh cover 1035b may be provided to open and close the open end of the first mesh case 1035a. The second mesh case 1036a is disposed in the water return flow path 1034 and can accommodate a plurality of functional balls 1037. If necessary, one end of the second mesh case 1036a may be open, and a second mesh cover 1036b may be provided to open and close the open end of the second mesh case 1036a.
[0086] The functional balls 1037 can prevent and remove deposits such as water stains that impair the functionality of the device, such as reducing heat exchange efficiency. The functional balls 1037 can be made of a ceramic material (e.g., alumina, silica, etc.). The functional balls 1037 can move freely within the first mesh case 1035a and the second mesh case 1036a due to the flow rate of the heat transfer medium that flows in through the open holes, and can perform their intended function while being continuously in contact with the heat transfer medium.
[0087] Although the embodiments have been described above using limited drawings, those skilled in the art may apply various technical modifications and variations based on the above. For example, suitable results may be achieved even if the described techniques are performed in a different order than described, and / or the components of the described systems, structures, devices, circuits, etc. are combined or combined in a different manner than described, or are substituted or replaced by other components or equivalents. [Explanation of symbols]
[0088] 10 Temperature control equipment 100 Heat medium temperature control device 110 Main tank section 120 Heat exchange section 130 Thermoelectric element 140 Heat Transfer Medium Block 150 Heat dissipation section, main heat dissipation section 151 Heat sink, main heat sink block 156 Heat radiation flow pipe 160 Heat medium circulation section 170 Circulation Pump 180 Control Unit 200 Auxiliary heat dissipation section 201 Auxiliary heat transfer medium block 203 Auxiliary thermoelectric element 205 Auxiliary heat medium circulation section 207 Auxiliary heat dissipation block
Claims
1. 1. A heat medium temperature control device using a thermoelectric element, which is connected to a temperature adjustment device provided with a tube through which a heat medium circulates, and controls the temperature of the heat medium, a main tank portion that accommodates the circulating heat medium and supplies the heat medium to the temperature adjustment device; a heat exchange unit including a thermoelectric element, a heat medium block disposed on one surface of the thermoelectric element and having a first flow path for transferring the heat medium recovered from the temperature adjustment device to the main tank unit, and a main heat dissipation unit disposed on the other surface of the thermoelectric element; a heat medium circulating unit including an inlet line connecting the heat medium block and the temperature adjusting device, and an outlet line connecting the main tank unit and the temperature adjusting device; an auxiliary heat dissipation part connected to the main heat dissipation part, The main heat dissipation section is a main heat dissipation block; and a heat dissipation flow path pipe inserted through the thickness of the main heat dissipation block and including a second flow path for an auxiliary heat medium, the second flow path having a heat dissipation inlet and a heat dissipation outlet formed at one end and the other end, respectively; The auxiliary heat dissipation portion is a heat transfer medium temperature control device using a thermoelectric element, comprising: an auxiliary thermoelectric element; an auxiliary heat transfer medium block disposed on one surface of the auxiliary thermoelectric element and including a third flow path for the auxiliary heat transfer medium, the auxiliary heat transfer medium block having an auxiliary block inlet and an auxiliary block outlet formed at one end and the other end, respectively; and an auxiliary heat transfer medium circulating unit having an auxiliary inlet line connecting the heat dissipation outlet and the auxiliary block inlet, and an auxiliary outlet line connecting the heat dissipation inlet and the auxiliary block outlet.
2. One surface of the auxiliary thermoelectric element is 2. A heat transfer medium temperature control device using a thermoelectric element according to claim 1, which is fixed and driven on a cooling surface that performs a cooling effect.
3. The auxiliary heat dissipation portion is The heat medium temperature control device using a thermoelectric element according to claim 1 , further comprising an auxiliary circulation pump for guiding the circulation of the auxiliary heat medium.
4. The main heat dissipation block is provided with a plurality of main heat dissipation blocks, 2. The heat medium temperature control device using a thermoelectric element according to claim 1, wherein the heat dissipation flow path pipe extends so as to pass through the plurality of main heat dissipation blocks consecutively a plurality of times.
5. a sensing unit that senses the temperature of the heat medium at a predetermined position at a predetermined interval or in real time; a control unit that selectively drives the auxiliary heat dissipation unit in accordance with a preset condition based on information acquired from the sensing unit; The heat medium temperature control device using a thermoelectric element according to claim 1, further comprising:
6. The preset conditions are:
6. The heat transfer medium temperature control device using a thermoelectric element according to claim 5, wherein the auxiliary thermoelectric element is driven in a temperature change step in which the first temperature is changed to a second temperature that is a target set temperature, and the auxiliary thermoelectric element is not driven in a temperature maintenance step in which the second temperature is maintained or a temperature range that is preset corresponding to the second temperature is maintained.
7. The auxiliary heat dissipation portion is The heat medium temperature control device using a thermoelectric element according to claim 5 , further comprising: an auxiliary heat dissipation block disposed on the other surface of the auxiliary thermoelectric element; and an auxiliary heat dissipation fan for discharging the air that has been heat exchanged to the outside.
8. The heat medium block is a first body having one surface in contact with the thermoelectric element and another surface on which a partition wall forming the first flow path is formed; a second body that covers the first body and is fixed to the first body; At least one of the partition walls is The heat transfer medium temperature control device using a thermoelectric element according to claim 1, further comprising a protrusion protruding downward.
9. The protrusion is 9. A heat medium temperature control device using a thermoelectric element according to claim 8, wherein the thermoelectric element is formed at a predetermined angle inclined in accordance with the flow direction of the heat medium.
10. further comprising connectors connected to the inlet line and the outlet line; The connector comprises: an outflow channel and a return channel separated by a barrier; a first mesh case disposed in the water outflow channel and having a plurality of open holes; and a second mesh case disposed in the water return flow path and having a plurality of open holes; a functional ball housed in the first mesh case and the second mesh case; The water outlet flow path is connected to the discharge line, The heat medium temperature control device using a thermoelectric element according to claim 1 , wherein the return flow path is connected to the inlet line.
Citation Information
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