Semiconductor device

JP2026014720APending Publication Date: 2026-01-29RENESAS ELECTRONICS CORP
1 Cites 0 Cited by

Patent Information

Application Number
JP2024116122
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-07-19
Publication Date
2026-01-29

Smart Images

  • Figure 2026014720000001_ABST
    Figure 2026014720000001_ABST
Patent Text Reader

Abstract

To provide a semiconductor device capable of reducing an electric resistance value of a gate electrode while reducing an area ratio of the gate electrode.SOLUTION: A semiconductor device (DEV1, DEV2) includes a semiconductor substrate (SUB) having an upper surface (F1), a first source layer (SL1) formed in the semiconductor substrate and disposed on the upper surface, a first drain layer (DL1) formed in the semiconductor substrate and disposed on the upper surface so as to be separated from the first source layer in a first direction (DR1), a first drain insulating film (DRIF1) formed on the upper surface and located between the first source layer and the first drain layer in the first direction, a first gate insulating film (GI1) formed on the upper surface and located between the first drain film and the first source layer in the first direction, and a first gate electrode (GE1) formed on the first gate insulating film and the first drain insulating film.SELECTED DRAWING: Figure 1
Need to check novelty before this filing date? Find Prior Art

Citation Information

Patent Citations

  • Semiconductor device

    JP2023069620A