Semiconductor device
JP2026014720APending Publication Date: 2026-01-29RENESAS ELECTRONICS CORP
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Patent Information
- Application Number
- JP2024116122
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-07-19
- Publication Date
- 2026-01-29
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Figure 2026014720000001_ABST
Abstract
To provide a semiconductor device capable of reducing an electric resistance value of a gate electrode while reducing an area ratio of the gate electrode.SOLUTION: A semiconductor device (DEV1, DEV2) includes a semiconductor substrate (SUB) having an upper surface (F1), a first source layer (SL1) formed in the semiconductor substrate and disposed on the upper surface, a first drain layer (DL1) formed in the semiconductor substrate and disposed on the upper surface so as to be separated from the first source layer in a first direction (DR1), a first drain insulating film (DRIF1) formed on the upper surface and located between the first source layer and the first drain layer in the first direction, a first gate insulating film (GI1) formed on the upper surface and located between the first drain film and the first source layer in the first direction, and a first gate electrode (GE1) formed on the first gate insulating film and the first drain insulating film.SELECTED DRAWING: Figure 1
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Semiconductor device
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