Method for connecting power semiconductor module and gate drive substrate, and assembly

Abstract

To secure a surface mounting area of a gate drive substrate without enlarging the gate drive substrate, and to easily connect a power semiconductor module and the gate drive substrate without using a through-hole.SOLUTION: A connection method of connecting a plurality of press-fit pins 11 and 12 protruding from a power semiconductor module main body 20 of a power semiconductor module 1 to a gate drive substrate 2 includes a soldering step of soldering a plurality of connection sleeves 31 and 32 to a plurality of interconnection patterns 21 and 22 formed on a surface of the gate drive substrate 2 on the power semiconductor module 1 side, and a connection step of press-fitting tip portions 11A and 12A of the plurality of press-fit pins 11 and 12 into through-holes 31A and 32A of the plurality of connection sleeves 31 and 32, respectively. Each of the plurality of connecting sleeves 31, 32 is formed of a conductive material.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a method for connecting a power semiconductor module and a gate drive substrate and an assembly thereof. [Background technology]

[0002] Patent Document 1 describes that a plurality of control signal pins (press-fit pins) extending from a semiconductor module (power semiconductor module) are inserted into through holes in a control board (gate drive board), and the control signal pins (press-fit pins) are joined to the through holes with solder. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2019-198173 Summary of the Invention [Problem to be solved by the invention]

[0004] However, when press-fit pins are soldered to through-holes as in the technology described in Patent Document 1, the tips of the press-fit pins protrude to the opposite side of the power semiconductor module, across the gate drive board. Therefore, with the technology described in Patent Document 1, it is not possible to surface-mount electronic components in the area of ​​the gate drive board opposite the power semiconductor module where the through-holes (press-fit pins) are located. In other words, with the technology described in Patent Document 1, it is not possible to ensure a sufficient surface mounting area for electronic components, and in order to ensure a sufficient surface mounting area for electronic components, the gate drive board must be enlarged.

[0005] Furthermore, the technology described in Patent Document 1 requires the complicated task of soldering a plurality of press-fit pins to a plurality of through-holes in order to connect the power semiconductor module and the gate drive board.

[0006] Furthermore, with the technology described in Patent Document 1, once the press-fit pins are soldered to the through-holes, it becomes impossible to separate (remove) the power semiconductor module from the gate drive board.

[0007] In view of the above, an object of the present invention is to provide a method for connecting a power semiconductor module to a gate drive board, and an assembly thereof, which can ensure a surface mounting area of ​​the gate drive board without increasing the size of the gate drive board, and can easily connect the power semiconductor module to the gate drive board without using through-holes. [Means for solving the problem]

[0008] One aspect of the present invention is a method for connecting a power semiconductor module to a gate drive board, the method including: a soldering step for soldering a plurality of connection sleeves to a plurality of wiring patterns formed on a surface of the gate drive board facing the power semiconductor module; and a connecting step for press-fitting each of the tip portions of the plurality of press-fit pins into each of the through holes of the plurality of connection sleeves, wherein each of the plurality of connection sleeves is formed from a conductive material.

[0009] One aspect of the present invention is an assembly formed by connecting a plurality of press-fit pins protruding from a power semiconductor module body of a power semiconductor module to a gate drive board, the assembly including a plurality of connection sleeves that connect tip portions of the plurality of press-fit pins to the gate drive board, each of the plurality of connection sleeves being formed from a conductive material, each of the plurality of connection sleeves having a base portion connected to a respective one of a plurality of wiring patterns formed on a surface of the gate drive board facing the power semiconductor module, a contact portion that comes into contact with each of the tip portions of the plurality of press-fit pins, and a guide portion that guides each of the tip portions of the plurality of press-fit pins to the contact portion when the tip portions of the plurality of press-fit pins are press-fitted into through holes of the plurality of connection sleeves.

[0010] In one embodiment of the assembly of the present invention, the base portions of the plurality of connection sleeves are fixed by soldering to a plurality of wiring patterns formed on the surface of the gate drive board facing the power semiconductor module, and the widthwise size of the base portions perpendicular to the longitudinal direction in which the plurality of press-fit pins extend may be larger than the widthwise size of the contact portions.

[0011] In the assembly according to one aspect of the present invention, the guide portion may be funnel-shaped.

[0012] In one aspect of the assembly of the present invention, tip portions of the plurality of press-fit pins may be press-fitted into through holes of the plurality of connection sleeves so as to be removable from the plurality of connection sleeves. [Effects of the Invention]

[0013] According to the present invention, it is possible to ensure a surface mounting area for the gate drive board without increasing the size of the gate drive board, and it is possible to easily connect the power semiconductor module and the gate drive board without using through holes. [Brief explanation of the drawings]

[0014] [Figure 1] FIG. 2 is a schematic diagram showing an example of an assembly AS of the first embodiment. [Figure 2] 2 is a schematic component diagram of the connecting sleeve 31 (32, . . . , 3N) shown in FIG. 1. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0015] Hereinafter, embodiments of a method for connecting a power semiconductor module and a gate drive substrate and an assembly according to the present invention will be described with reference to the drawings.

[0016] First Embodiment FIG. 1 is a diagram schematically illustrating an example of an assembly AS according to the first embodiment. Specifically, FIG. 1(A) schematically illustrates a state before a power semiconductor module 1 and a gate drive substrate 2 constituting the assembly AS are connected, and FIG. 1(B) schematically illustrates a state after the power semiconductor module 1 and the gate drive substrate 2 are connected via connection sleeves 31, 32, ..., 3N (N is an integer equal to or greater than 3). FIG. 2 is a schematic component diagram of the connection sleeves 31 (32, ..., 3N) shown in FIG. 1. Specifically, FIG. 2(A) is a schematic plan view of the connection sleeves 31 (32, ..., 3N), FIG. 2(B) is a schematic front view of the connection sleeves 31 (32, ..., 3N), FIG. 2(C) is a schematic bottom view of the connection sleeves 31 (32, ..., 3N), and FIG. 2(D) is a schematic cross-sectional view along line AA in FIG. 2(A).

[0017] 1 and 2, the assembly AS is formed by connecting a plurality of press-fit pins 11, 12, ..., 1N protruding from a power semiconductor module body 10 of the power semiconductor module 1 to a gate drive substrate 2. In detail, the assembly AS includes the power semiconductor module 1, the gate drive substrate 2, and a plurality of connection sleeves 31, 32, ..., 3N.

[0018] The power semiconductor module 1 includes a power semiconductor module main body 10 and press-fit pins 11, 12, ..., 1N, the number of which is the same as the number of connection sleeves 31, 32, ..., 3N. The press-fit pins 11, 12, ..., 1N are formed of a conductive material, are connected to gates (not shown) of a plurality of switching elements (not shown) housed in the power semiconductor module main body 10, and protrude outside the power semiconductor module main body 10.

[0019] The press-fit pin 11 has a tip portion 11A and a non-tip portion 11B. When the power semiconductor module 1 and the gate drive board 2 are connected as shown in FIG. 1B, the tip portion 11A is received in the through hole 31A of the connection sleeve 31 and comes into contact with the inner circumferential surface of the contact portion 312 of the connection sleeve 31. When the power semiconductor module 1 and the gate drive board 2 are connected as shown in FIG. 1B, the non-tip portion 11B is located outside the through hole 31A of the connection sleeve 31.

[0020] The press-fit pin 12 has a tip portion 12A and a non-tip portion 12B. When the power semiconductor module 1 and the gate drive board 2 are connected as shown in FIG. 1B, the tip portion 12A is received in the through hole 32A of the connection sleeve 32 and comes into contact with the inner circumferential surface of the contact portion 322 of the connection sleeve 32. When the power semiconductor module 1 and the gate drive board 2 are connected as shown in FIG. 1B, the non-tip portion 12B is located outside the through hole 32A of the connection sleeve 32.

[0021] The press-fit pin 1N has a tip portion 1NA and a non-tip portion 1NB. The tip portion 1NA is received in the through hole 3NA of the connection sleeve 3N and comes into contact with the inner circumferential surface of the contact portion 3N2 of the connection sleeve 3N when the power semiconductor module 1 and the gate drive substrate 2 are connected as shown in FIG. 1(B). The non-tip portion 1NB is located outside the through hole 3NA of the connection sleeve 3N when the power semiconductor module 1 and the gate drive substrate 2 are connected as shown in FIG. 1(B).

[0022] In the example shown in Figures 1 and 2, the multiple press-fit pins 11, 12, ..., 1N have the same shape, but in other examples, the shapes of the multiple press-fit pins 11, 12, ..., 1N may be different from each other, or the shape of any one of the press-fit pins 11, 12, ..., 1N may be different from the shape of the remaining press-fit pins.

[0023] In the example shown in FIGS. 1 and 2 , a gate drive circuit (not shown) that controls the driving of multiple switching elements housed in the power semiconductor module main body 10 is formed on a gate drive substrate 2. In detail, the gate drive substrate 2 has a substrate 20, wiring patterns 21, 22, ..., 2N that constitute the gate drive circuit, an electronic component wiring pattern 2A, and an electronic component 2B. The wiring patterns 21, 22, ..., 2N are formed on the lower surface (the side facing the power semiconductor module 1) of the substrate 20. A connection sleeve 31 is soldered to the wiring pattern 21. A connection sleeve 32 is soldered to the wiring pattern 22, and a connection sleeve 3N is soldered to the wiring pattern 2N. The electronic component wiring pattern 2A is formed on the upper surface (the side opposite the power semiconductor module 1) of the substrate 20. The electronic component 2B is surface-mounted on the electronic component wiring pattern 2A. In detail, the electronic component 2B is surface-mounted on the electronic component wiring pattern 2A as shown in FIG. 1(A) before the power semiconductor module 1 and the gate drive substrate 2 are connected as shown in FIG. 1(B).

[0024] In the example shown in Figures 1 and 2, the electronic component 2B is surface-mounted on the upper surface of the substrate 20 (the side opposite the power semiconductor module 1) and is not surface-mounted on the lower surface of the substrate 20 (the side facing the power semiconductor module 1), but in other examples, multiple electronic components 2B may be surface-mounted on both the upper surface of the substrate 20 (the side opposite the power semiconductor module 1) and the lower surface of the substrate 20 (the side facing the power semiconductor module 1).

[0025] In the example shown in FIGS. 1 and 2, the connection sleeve 31 is made of a conductive material, and connects the tip portion 11A of the press-fit pin 11 and the wiring pattern 21 of the gate drive board 2.

[0026] 1 and 2, the connection sleeve 31 is formed by gold-plating or tin-plating a conductive metal member such as copper. In other examples, the conductive connection sleeve 31 may be formed by a method different from that shown in FIGS. 1 and 2.

[0027] 1 and 2, the connection sleeve 31 has a base portion 311, a contact portion 312, and a guide portion 313. The connection sleeve 31 has a through hole 31A that penetrates the base portion 311, the contact portion 312, and the guide portion 313. The base portion 311 is a portion that is connected to the wiring pattern 21 formed on the lower surface (the side of the power semiconductor module 1) of the gate drive substrate 2 (substrate 20). Before the power semiconductor module 1 and the gate drive substrate 2 are connected as shown in FIG. 1(B), the base portion 311 is fixed to the wiring pattern 21 by soldering as shown in FIG. 1(A).

[0028] The contact portion 312 is generally cylindrical and is the portion that comes into contact with the tip portion 11A of the press-fit pin 11. More specifically, when the power semiconductor module 1 and the gate drive board 2 are connected as shown in FIG. 1B, the inner circumferential surface of the contact portion 312 comes into contact with the tip portion 11A of the press-fit pin 11. More specifically, when the power semiconductor module 1 and the gate drive board 2 are connected as shown in FIG. 1B, the tip portion 11A of the press-fit pin 11 is press-fit into the contact portion 312 of the connection sleeve 31. In other words, the outer circumferential surface of the tip portion 11A of the press-fit pin 11 and the inner circumferential surface of the contact portion 312 of the connection sleeve 31 form an interference fit, ensuring electrical connection between the press-fit pin 11 and the connection sleeve 31.

[0029] 1 and 2, as shown in Fig. 2, the size W311 of the base portion 311 in the width direction (left and right direction in Fig. 2) (the direction perpendicular to the longitudinal direction in which the press-fit pin 11 extends) is larger than the size W312 of the contact portion 312 in the width direction. Therefore, the posture of the connection sleeve 31 can be more stable during solder reflow for connecting the connection sleeve 31 and the wiring pattern 21 than when the size W311 of the base portion 311 in the width direction is small. In other examples (for example, when the size W312 of the contact portion 312 in the width direction is relatively large), the size W311 of the base portion 311 in the width direction and the size W312 of the contact portion 312 in the width direction may be equal.

[0030] In the example shown in FIGS. 1 and 2, when the tip portion 11A of the press-fit pin 11 is press-fitted into the through-hole 31A of the connection sleeve 31 as shown in FIGS. 1A and 1B, the guide portion 313 guides the tip portion 11A of the press-fit pin 11 to the contact portion 312. More specifically, the guide portion 313 is funnel-shaped. Therefore, when the tip portion 11A of the press-fit pin 11 is press-fitted into the through-hole 31A of the connection sleeve 31 as shown in FIGS. 1A and 1B, even if the positions of the press-fit pin 11 and the connection sleeve 31 are misaligned in the left-right direction or the front-to-rear direction in FIG. 1, the tip portion 11A of the press-fit pin 11 can be guided to the contact portion 312. In other words, the misalignment between the positions of the press-fit pin 11 and the connection sleeve 31 can be absorbed.

[0031] In the example shown in Figures 1 and 2 (an example in which press-fit pins 11, 12, ..., 1N have the same shape), the shapes of connection sleeves 31, 32, ..., 3N are the same, but in other examples (an example in which press-fit pins 11, 12, ..., 1N have different shapes from each other, or the shape of one of press-fit pins 11, 12, ..., 1N is different from the shape of the remaining press-fit pins), the shapes of connection sleeves 31, 32, ..., 3N do not have to be the same.

[0032] 1 and 2 and other examples, the connection sleeve 32 has a base portion 321, a contact portion 322, and a guide portion 323, and the connection sleeve 3N has a base portion 3N1, a contact portion 3N2, and a guide portion 3N3. The connection sleeve 32 has a through hole 32A that penetrates the base portion 321, the contact portion 322, and the guide portion 323, and the connection sleeve 3N has a through hole 3NA that penetrates the base portion 3N1, the contact portion 3N2, and the guide portion 3N3. The base portion 321 is a portion connected to the wiring pattern 22 formed on the lower surface (the power semiconductor module 1 side) of the gate drive substrate 2 (substrate 20), and the base portion 3N1 is a portion connected to the wiring pattern 2N formed on the lower surface (the power semiconductor module 1 side) of the gate drive substrate 2 (substrate 20). 1(B), before the power semiconductor module 1 and the gate drive substrate 2 are connected, the base portion 321 is fixed to the wiring pattern 22 by soldering, and the base portion 3N1 is fixed to the wiring pattern 2N by soldering. In other words, before the power semiconductor module 1 and the gate drive substrate 2 are connected, the gate drive circuit is completed as shown in FIG.

[0033] 1 and 2 and other examples, the contact portion 322 is generally cylindrical and is the portion that comes into contact with the tip portion 12A of the press-fit pin 12. More specifically, when the power semiconductor module 1 and the gate drive board 2 are connected as shown in FIG. 1(B), the inner circumferential surface of the contact portion 322 comes into contact with the tip portion 12A of the press-fit pin 12. More specifically, when the power semiconductor module 1 and the gate drive board 2 are connected as shown in FIG. 1(B), the tip portion 12A of the press-fit pin 12 is press-fit into the contact portion 322 of the connection sleeve 32. In other words, the outer circumferential surface of the tip portion 12A of the press-fit pin 12 and the inner circumferential surface of the contact portion 322 of the connection sleeve 32 form an interference fit, ensuring electrical connection between the press-fit pin 12 and the connection sleeve 32.

[0034] 1 and 2 and other examples, the contact portion 3N2 is generally cylindrical and is the portion that comes into contact with the tip portion 1NA of the press-fit pin 1N. More specifically, when the power semiconductor module 1 and the gate drive board 2 are connected as shown in FIG. 1(B), the inner circumferential surface of the contact portion 3N2 comes into contact with the tip portion 1NA of the press-fit pin 1N. More specifically, when the power semiconductor module 1 and the gate drive board 2 are connected as shown in FIG. 1(B), the tip portion 1NA of the press-fit pin 1N is press-fit into the contact portion 3N2 of the connection sleeve 3N. In other words, the outer circumferential surface of the tip portion 1NA of the press-fit pin 1N and the inner circumferential surface of the contact portion 3N2 of the connection sleeve 3N form an interference fit, ensuring electrical connection between the press-fit pin 1N and the connection sleeve 3N.

[0035] 1 and 2, as shown in Fig. 2, the widthwise size W321 (left-right direction in Fig. 2) of the base portion 321 is larger than the widthwise size W322 of the contact portion 322, and the widthwise size W3N1 (left-right direction in Fig. 2) of the base portion 3N1 is larger than the widthwise size W3N2 of the contact portion 3N2. In other examples (e.g., examples in which the widthwise sizes W322 and W3N2 of the contact portions 322 and 3N2 are relatively large), the widthwise size W321 of the base portion 321 may be equal to the widthwise size W322 of the contact portion 322, or the widthwise size W3N1 of the base portion 3N1 may be equal to the widthwise size W3N2 of the contact portion 3N2.

[0036] 1 and 2 and other examples (examples in which the press-fit pins 11, 12, ..., 1N have different shapes from one another or the shape of one of the press-fit pins 11, 12, ..., 1N is different from the shape of the remaining press-fit pins), when the tip portions 11A, 12A, ..., 1NA of the press-fit pins 11, 12, ..., 1N are press-fit into the through holes 31A, 32A, ..., 3NA of the connection sleeves 31, 32, ..., 3N as shown in Figures 1(A) and 1(B), the guide portion 323 guides the tip portion 12A of the press-fit pin 12 to the contact portion 322, and the guide portion 3N3 guides the tip portion 1NA of the press-fit pin 1N to the contact portion 3N2. Specifically, the guide portions 323, ..., 3N3 are funnel-shaped.

[0037] 1 and 2, when a plurality of press-fit pins 11, 12, ..., 1N protruding from the power semiconductor module main body 10 of the power semiconductor module 1 are connected to the gate drive substrate 2, first, as shown in Fig. 1(A), connection sleeves 31, 32, ..., 3N are soldered to wiring patterns 21, 22, ..., 2N formed on the lower surface (the side of the power semiconductor module 1) of the base material 20 of the gate drive substrate 2. Next, as shown in Fig. 1(B), tip portions 11A, 12A, ..., 1NA of the press-fit pins 11, 12, ..., 1N are press-fitted into through holes 31A, 32A, ..., 3NA of the connection sleeves 31, 32, ..., 3N.

[0038] In detail, in the example shown in Figures 1 and 2, the tip portions 11A, 12A, ..., 1NA of the press-fit pins 11, 12, ..., 1N are press-fitted into the through holes 31A, 32A, ..., 3NA of the connection sleeves 31, 32, ..., 3N so as to be removable from the connection sleeves 31, 32, ..., 3N.

[0039] In the example shown in Figures 1 and 2, after the tip portions 11A, 12A, ..., 1NA of the press-fit pins 11, 12, ..., 1N are press-fitted into the through holes 31A, 32A, ..., 3NA of the connection sleeves 31, 32, ..., 3N as shown in Figure 1(B), no process is performed to fix the gate drive substrate 2 to the power semiconductor module 1 by, for example, screwing. However, in another example, after the tip portions 11A, 12A, ..., 1NA of the press-fit pins 11, 12, ..., 1N are press-fitted into the through holes 31A, 32A, ..., 3NA of the connection sleeves 31, 32, ..., 3N as shown in Figure 1(B), the gate drive substrate 2 may be fixed to the power semiconductor module 1 by using a technique similar to the technique described in paragraph 0017 of Japanese Patent No. 6884241 (for example, screwing).

[0040] Second Embodiment The assembly AS of the second embodiment is configured similarly to the assembly AS of the first embodiment shown in FIG. 1, except for the points that will be described later.

[0041] 1 (one example of the assembly AS of the first embodiment), the multiple press-fit pins 11, 12, ..., 1N protruding from the power semiconductor module main body 10 of the power semiconductor module 1 are arranged in the left-right direction of FIG. 1, and there are no press-fit pins arranged in the front-to-rear direction of FIG. 1. In one example of the assembly AS of the second embodiment, not only the multiple press-fit pins 11, 12, ..., 1N arranged in the left-to-right direction of FIG. 1 protrude from the power semiconductor module main body 10, but also multiple press-fit pins (not shown) arranged in the front-to-rear direction of FIG. 1 may protrude from the power semiconductor module main body 10. In this example, the assembly AS of the second embodiment includes multiple connection sleeves (not shown) that mate with the multiple press-fit pins (not shown) arranged in the front-to-rear direction of FIG. 1 when the power semiconductor module 1 and the gate drive substrate 2 are connected. [Explanation of symbols]

[0042] AS... assembly, 1... power semiconductor module, 10... power semiconductor module main body, 11... press-fit pin, 11A... tip portion, 11B... non-tip portion, 12... press-fit pin, 12A... tip portion, 12B... non-tip portion, 1N... press-fit pin, 1NA... tip portion, 1NB... non-tip portion, 2... gate drive board, 20... substrate, 21... wiring pattern, 22... wiring pattern, 2N... wiring pattern, 2A... wiring pattern for electronic component, 2B... electronic component, 31... connection sleeve, 311... base portion, 312... contact portion, 313... guide portion, 31A... through hole, 32... connection sleeve, 321... base portion, 322... contact portion, 323... guide portion, 32A... through hole, 3N... connection sleeve, 3N1... base portion, 3N2... contact portion, 3N3... guide portion, 3NA... through hole

Claims

1. A method for connecting a power semiconductor module to a gate drive board, the method comprising: connecting a plurality of press-fit pins protruding from a power semiconductor module body of the power semiconductor module to a gate drive board; a soldering step of soldering a plurality of connection sleeves to a plurality of wiring patterns formed on a surface of the gate drive substrate on the side of the power semiconductor module; a connecting step of press-fitting each of the tip portions of the plurality of press-fit pins into each of the through holes of the plurality of connection sleeves, each of the plurality of connection sleeves is formed of a conductive material; A method for connecting a power semiconductor module to a gate drive board.

2. An assembly configured by connecting a plurality of press-fit pins protruding from a power semiconductor module body of a power semiconductor module to a gate drive substrate, a plurality of connection sleeves that connect tip portions of the plurality of press-fit pins to the gate drive board; each of the plurality of connection sleeves is formed of a conductive material; Each of the plurality of connection sleeves is a base portion connected to each of a plurality of wiring patterns formed on a surface of the gate drive substrate on the side of the power semiconductor module; a contact portion that comes into contact with each of the tip portions of the plurality of press-fit pins; a guide portion that guides each of the tip portions of the press-fit pins to the contact portion when the tip portions of the press-fit pins are press-fitted into the through holes of the connection sleeves. assembly.

3. base portions of the plurality of connection sleeves are fixed by soldering to a plurality of wiring patterns formed on a surface of the gate drive substrate on the side of the power semiconductor module; The size of the base portion in a width direction perpendicular to the longitudinal direction in which the plurality of press-fit pins extend is a size larger than the width direction of the contact portion; 3. The assembly of claim 2.

4. The guide portion is funnel-shaped.

4. The assembly of claim 3.

5. Tip portions of the press-fit pins are press-fitted into through holes of the connection sleeves so as to be removable from the connection sleeves.

5. The assembly of claim 4.

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