Substrate processing apparatus and substrate processing method

Abstract

To provide a substrate processing apparatus and a substrate processing method capable of reducing processing unevenness in a surface of a substrate.SOLUTION: The substrate processing apparatus 100 processes a substrate W. The substrate processing apparatus 100 includes a processing tank 110, a substrate holding unit 120, an etching liquid supply unit 130, a bubble supply unit 140, and a control unit 161. The etching liquid supplier 130 has at least an upper discharge hole 131a and a lower discharge hole 132a. In the substrate processing apparatus 100, the controller 161 controls the processing for the substrate W. The controller 161 controls the etching liquid supplier 130 to adjust the discharge amount of the etching liquid LQ so that the discharge amount of the etching liquid LQ discharged from the upper discharge hole 131a is larger than the discharge amount of the etching liquid LQ discharged from the lower discharge hole 132a in a part of the period during which the substrate W is etched.SELECTED DRAWING: Figure 1

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