Ring cutting apparatus

JP2026019587APending Publication Date: 2026-02-05DENSO CORP
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Patent Information

Application Number
JP2024121265
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-07-26
Publication Date
2026-02-05

AI Technical Summary

Technical Problem

Existing ring cutting devices face issues with deforming or catching stacked cut workpieces, particularly when cutting deformable materials like O-rings.

Method used

A ring cutting device comprising an outer holding member, inner holding member, cutting plate, actuator, and load member, which together facilitate the controlled cutting of ring members by restricting deformation and ensuring stable extraction.

Benefits of technology

The device effectively cuts out ring members without deformation or catching, allowing for continuous and stable operation, even with soft materials, and accommodates various diameters through modular components.

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Abstract

To provide a ring cutting device capable of appropriately cutting a ring member.SOLUTION: The ring cutting device 1 cuts an O-ring 70, and includes a holder 11, a magazine 12, a cutting plate 53, a cutting cylinder 45, and a weight 15. The holder 11 is provided on the outer peripheral side of the O-rings 70 in the stacked state. The magazine 12 is inserted into the inner peripheral side of the stacked O-rings 70. The cutting plate 53 is provided so as to be slidable on the lower side in the vertical direction of the holder 11 and the magazine 12, and cuts a predetermined number of O-rings 70 to the outside of the holder 11. The cutting cylinder 45 drives the cutting plate 53. The weight 15 is placed on the upper side in the vertical direction of the stacked ring members.SELECTED DRAWING: Figure 4
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Citation Information

Patent Citations

  • Ring cutting-out device

    JP2006326770A