Terminal box

Abstract

To provide a terminal box capable of suppressing a bypass diode from receiving thermal stress with a simple configuration.SOLUTION: The junction box 10 includes a pair of plate-shaped conductive terminals 12 to which a pair of bus bars 4 for supplying electric power generated by solar cells are connected, respectively, and which have a front-side 12a irradiated with sunlight and a back-side 12b not irradiated with sunlight, a bypass diode 16 for electrically connecting the pair of conductive terminals 12, and a case 18 for accommodating the pair of conductive terminals 12 and the bypass diode 16 therein. The bypass diode 16 is disposed on the 12b side of the back surface. When the front 12a is viewed from a direction perpendicular to the front 12a of the pair of conductive terminals 12, at least a part of the diode body 16a of the bypass diode 16 overlaps with at least one of the pair of conductive terminals 12.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present disclosure relates to a terminal box. [Background technology]

[0002] A solar cell module used for solar power generation comprises a solar cell panel and a terminal box. The solar cell panel generates electricity through photoelectric conversion of a plurality of solar cells (e.g., perovskite solar cells) arranged inside the solar cell panel. The generated electricity is output from the solar cell panel via a pair of bus bars made of conductive plates or rods. Each of the pair of bus bars is electrically connected to a pair of conductive terminals arranged inside the terminal box. The terminal box is provided to relay the pair of bus bars drawn inside and output the electricity to one end of a cable. The other end of the cable is connected to the terminal box of another solar cell module.

[0003] When the solar cells are thin perovskite solar cells, a terminal box is generally placed on the surface of the solar panel. A bypass diode is placed between a pair of conductive terminals of the terminal box, which enables the output of only the power generated by the remaining solar cells by bypassing the malfunctioning solar cells when some of the solar cells are malfunctioning.

[0004] Patent Document 1 discloses a terminal box (a photovoltaic junction box in Patent Document 1). Arranged within the terminal box are four conductive terminals and three bypass diodes (diodes in Patent Document 1) that span adjacent conductive terminals. All three bypass diodes are arranged above the conductive terminals within the terminal box, and the terminal box is mounted on a solar panel.

[0005] Patent Document 2 discloses a terminal box. Inside the terminal box, a pair of conductive terminals (relay terminals in Patent Document 2) and a bypass diode, which is formed by joining a pair of thin metal plates above and below a bare chip, are arranged. The pair of thin metal plates of the bypass diode are connected to the conductive terminals by soldering. Because the bypass diode has this configuration, heat generated in the bare chip is quickly dissipated from the pair of thin metal plates and the conductive terminals. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Patent Application Publication No. 2017-046574 [Patent Document 2] Japanese Patent Application Laid-Open No. 2001-168368 Summary of the Invention [Problem to be solved by the invention]

[0007] Diodes generally have low heat resistance. If the bypass diodes installed in the terminal box fail due to thermal stress, the solar cell module will not be able to operate normally. Therefore, it is necessary to prevent the bypass diodes from being subjected to thermal stress caused by rising ambient temperatures and current flow.

[0008] The terminal box disclosed in Patent Document 1 is mounted on top of the solar cell panel, and the bypass diodes are located inside the terminal box above the conductive terminals. As a result, the bypass diodes are not shaded by the solar cell panel or the conductive terminals, and the ambient temperature is likely to rise. In such an environment, the thermal resistance of the bypass diodes increases, causing a large temperature rise in the bypass diodes when current is applied, which can cause the bypass diodes to be subjected to thermal stress and potentially fail.

[0009] In the terminal box disclosed in Patent Document 2, the bypass diode has a configuration in which a pair of thin metal plates are bonded to a bare chip, and heat generated when current is passed through the bare chip can be dissipated from the thin metal plates and conductive terminals. However, when the pair of thin metal plates are bonded to the bare chip, heat is applied to the bare chip, which may cause the bare chip to rise in temperature and be subjected to thermal stress. Furthermore, using a bypass diode configured by bonding a thin metal plate to a bare chip rather than one with lead terminals increases the manufacturing process of the terminal box, which may increase costs. For these reasons, there is room for improvement in terminal boxes with built-in bypass diodes.

[0010] Therefore, there is a need for a terminal box that has a simple configuration and is capable of suppressing thermal stress on the bypass diodes. [Means for solving the problem]

[0011] One embodiment of a terminal box according to the present disclosure includes a pair of plate-shaped conductive terminals to which a pair of bus bars that supply power generated by a solar cell are connected, the conductive terminals having a front surface that is irradiated with sunlight and a back surface that is not irradiated with sunlight; a bypass diode that electrically connects the pair of conductive terminals; and a case that houses the pair of conductive terminals and the bypass diode, wherein the bypass diode is arranged on the back surface side, and when the surface of the pair of conductive terminals is viewed in a direction perpendicular to the surfaces of the pair of conductive terminals, at least a portion of the diode body of the bypass diode overlaps with at least one of the pair of conductive terminals.

[0012] According to this embodiment, at least a portion of the diode body of the bypass diode is disposed on the back surface side opposite to the front surface of at least one of the pair of conductive terminals that is irradiated with sunlight, and when viewed from a direction perpendicular to the surfaces of the pair of conductive terminals, at least a portion of the diode body of the bypass diode overlaps with at least one of the pair of conductive terminals. In other words, the diode body is shielded from light by the conductive terminal.

[0013] As a result, the rise in ambient temperature on the back side of the conductive terminal on which the diode body is disposed due to sunlight irradiation is smaller than the rise in ambient temperature on the front side. As a result, the increase in thermal resistance of the diode body is suppressed compared to when sunlight is directly irradiated on the diode body, so the temperature rise of the diode body when current is passed through the bypass diode is smaller, and the possibility of the bypass diode being subjected to thermal stress and causing a breakdown, etc. is suppressed. In this way, a terminal box that can suppress thermal stress on the bypass diode with a simple configuration in which the conductive terminals shield the diode body from light has been obtained. [Brief explanation of the drawings]

[0014] [Figure 1] 1 is a schematic diagram illustrating a configuration of a solar cell module including a terminal box according to a first embodiment. [Figure 2] FIG. [Figure 3] FIG. 2 is a plan view of the inside of the terminal box. [Figure 4] FIG. 10 is a plan view of the inside of a terminal box according to a modified example of the first embodiment. [Figure 5] FIG. 10 is a plan view of the inside of a terminal box according to a modified example of the first embodiment. [Figure 6] FIG. 10 is a plan view of the inside of a terminal box according to a modified example of the first embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0015] Hereinafter, embodiments of a terminal box according to the present disclosure will be described in detail with reference to the drawings. Note that the embodiments described below are examples for explaining the terminal box, and the terminal box is not limited to these embodiments. Therefore, the terminal box according to the present disclosure can be embodied in various forms without departing from the spirit and scope of the present disclosure.

[0016] [First embodiment] [Configuration of solar cell module] As shown in FIG. 1, the solar cell module 1 is configured to include a solar cell panel 2 having a plurality (three in this embodiment) of solar cells 2a (an example of a solar cell), a pair of bus bars 4, and a terminal box 10 according to the first embodiment.

[0017] In this embodiment, the solar cell 2a is, for example, a perovskite solar cell. The solar cell panel 2 connects multiple solar cell cells 2a in series / parallel to generate desired power. The configurations of the solar cell 2a and the solar cell panel 2 are publicly known, so detailed description will be omitted.

[0018] Each of the pair of bus bars 4 is made of a metal with high electrical conductivity, such as a copper alloy, and outputs the power generated by the solar cell panel 2 to the outside and inputs the power to the terminal box 10. The bus bars 4 are drawn from the inside of the solar cell panel 2 to the outside of the solar cell panel 2, extend along the outer edge of the solar cell panel 2, and are fitted into the terminal box 10. One end of the bus bar 4 is electrically connected to the solar cell 2a of the solar cell panel 2, and the other end is electrically connected to a conductive terminal 12 arranged in the terminal box 10 (see FIG. 2 ). The terminal box 10 is provided to relay the pair of bus bars 4 drawn inside and output power to a cable (not shown). The other end of the cable is connected to the terminal box 10 of another solar cell module 1.

[0019] As described above, the solar cell 2a of this embodiment is a perovskite solar cell. Perovskite solar cells are thin. Therefore, in this embodiment, in order to take advantage of this characteristic and configure the solar cell module 1 thin, the terminal box 10 is disposed close to the outer edge of the solar cell panel 2. In other words, the terminal box 10 is not entirely covered by the solar cell panel 2 but is exposed. This allows the entire terminal box 10 to be directly irradiated with sunlight.

[0020] [Terminal box configuration] As shown in Figures 2 and 3, the terminal box 10 according to the first embodiment is configured to include a pair of conductive terminals 12, a bypass diode 16, and a case 18 and a cover 19 that accommodate these.

[0021] The conductive terminal 12 is a rectangular plate made of a metal with high electrical and thermal conductivity, such as a copper alloy. The conductive terminal 12 has a busbar connection portion 13 to which the busbar 4 is electrically connected, a diode connection portion 15 to which a bypass diode 16 is electrically connected, and a heat conductive portion 14 disposed between the busbar connection portion 13 and the diode connection portion 15. The busbar connection portion 13, the heat conductive portion 14, and the diode connection portion 15 are disposed in this order along the long side of the conductive terminal 12.

[0022] The pair of conductive terminals 12 are housed in a case 18 and supported inside the case 18 by a known method (not shown). The pair of conductive terminals 12 are supported with their diode connection portions 15 close to each other and spaced apart from the bottom surface 18a of the case 18. In this state, the back surface 12b, which is one plate surface of the conductive terminals 12, faces the bottom surface 18a of the case 18. The front surface 12a, which is the other plate surface of the conductive terminal 12, is the surface that is irradiated with sunlight (indicated by the dashed arrow in FIG. 2).

[0023] A first insertion hole 13a, which is a through-hole through which the bus bar 4 can be inserted, is formed in the bus bar connection portion 13 of the conductive terminal 12. The bus bar 4 drawn out from the solar cell panel 2 is inserted into a second insertion hole 18b, which is a through-hole formed in the case 18, and the first insertion hole 13a, and is bent 90 degrees, and is electrically connected to the bus bar connection portion 13 on the surface 12a of the conductive terminal 12 by a method such as soldering.

[0024] The bypass diode 16 has a diode body 16a made of a P-type semiconductor and an N-type semiconductor, and a pair of lead wires 16b connected to the P-type and N-type semiconductors of the diode body 16a, respectively. When the front surface 12a of the conductive terminal 12 is viewed in a direction perpendicular to the front surface 12a (hereinafter, viewing from this direction will also be referred to as a "plan view"), the bypass diode 16 is positioned so that the entire diode body 16a completely overlaps one of the pair of conductive terminals 12 and is in a position that is not visible (see FIG. 3). In other words, in a plan view, the entire diode body 16a is completely covered by the conductive terminal 12 and is hidden by the back surface 12b of the conductive terminal 12. Each of the pair of lead wires 16b of the bypass diode 16 is electrically connected to a diode connection portion 15 on the back surface 12b of each of the pair of conductive terminals 12 by a method such as soldering.

[0025] The heat conductive portion 14, which is disposed between the busbar connection portion 13 and the diode connection portion 15 of the conductive terminal 12, has a through hole 14a formed therein, penetrating from the front surface 12a to the back surface 12b. The through hole 14a is formed in the heat conductive portion 14. The first cross-sectional area S1 (see the cross-sectional view taken along the arrow AA in FIG. 3 ) is the cross-sectional area of ​​the conductive terminal 12 when the heat conductive portion 14 is cut along the short side of the conductive terminal 12, which is perpendicular to the direction in which the busbar connection portion 13, the heat conductive portion 14, and the diode connection portion 15 are arranged, so as to include the through hole 14a. The first cross-sectional area S1 is smaller than the second cross-sectional area S2 (see the cross-sectional view taken along the arrow BB in FIG. 3 ) when the conductive terminal 12 is cut along the short side of the conductive terminal 12 at a portion of the busbar connection portion 13 that does not include the first insertion hole 13a, for example, at a portion where the busbar 4 is soldered. The second cross-sectional area S2 is, in other words, the product of the length of the short side of the conductive terminal 12 and the plate thickness of the conductive terminal 12.

[0026] [Thermal stress on bypass diodes] As described above, by forming through holes 14a in heat conduction portion 14, the area (first cross-sectional area S1) of the heat transfer path through which heat applied to busbar connection portion 13 is conducted to diode connection portion 15 becomes smaller than the area of ​​the heat transfer path when through holes 14a are not formed. Therefore, heat applied to busbar connection portion 13 is less likely to be conducted to diode connection portion 15, and heat applied to diode connection portion 15 is less likely to be conducted to busbar connection portion 13. In other words, since applied heat is less likely to escape to other locations in busbar connection portion 13 and diode connection portion 15, it can be said that the heat capacity of these connections is reduced.

[0027] As a result, only a small amount of heat is required to melt the solder when the bypass diode 16 is electrically connected by soldering or other methods to the diode connection portion 15 on the back surface 12b of the conductive terminal 12. This makes it possible to suppress the thermal stress that the diode body 16a receives when the bypass diode 16 is soldered.

[0028] Similarly, when electrically connecting the busbar 4 to the busbar connection portion 13 on the surface 12a of the conductive terminal 12 by soldering or other methods, only a small amount of heat is required to melt the solder. As a result, even if the bypass diode 16 is connected to the conductive terminal 12 before the busbar 4, the amount of heat conducted from the busbar connection portion 13 to the diode connection portion 15 is reduced, and the thermal stress that the diode body 16a of the bypass diode 16 receives from the heat of soldering the busbar 4 can be suppressed.

[0029] In this way, the heat capacity of the busbar connection portion 13 and the diode connection portion 15 is reduced, and heat conduction from one to the other is suppressed, so the connection point of the busbar 4 (the point where heat is applied) and the connection point of the bypass diode 16 can be located close to each other, and the length of the long side of the conductive terminal 12 can be shortened to make it smaller, which also reduces the volume of the terminal box 10.

[0030] Furthermore, in this embodiment, the entire diode body 16a of the bypass diode 16 is disposed on the back surface 12b side opposite to the front surface 12a of the conductive terminals 12 that is irradiated with sunlight, and when the front surface 12a of the pair of conductive terminals 12 is viewed in a direction perpendicular to the front surface 12a, at least a part (in this embodiment, the entirety) of the diode body 16a of the bypass diode 16 overlaps with at least one of the pair of conductive terminals 12. In other words, the diode body 16a is shaded from light by the conductive terminals 12 (see FIG. 2).

[0031] As a result, the rise in ambient temperature on the back surface 12b side of the conductive terminal 12 on which the diode body 16a is arranged due to irradiation with sunlight is smaller than the rise in ambient temperature on the front surface 12a side. As a result, the increase in thermal resistance of the diode body 16a is suppressed compared to when sunlight is directly irradiated on the diode body 16a, so the temperature rise in the diode body 16a when current is applied to the bypass diode 16 is smaller, and the possibility of the bypass diode 16 being subjected to thermal stress and causing a breakdown or the like is suppressed.

[0032] [Modification of the first embodiment] Next, terminal boxes 10 according to modifications of the first embodiment will be described with reference to Figs. 4 to 6. In these modifications, the arrangement of the bypass diodes 16 and the shape of the heat conduction section 14 differ from those of the first embodiment. Other than that, the configuration is the same as that of the first embodiment. Therefore, in the description of these modifications, the same reference numerals are used for parts having the same configuration as that of the first embodiment, and detailed description of the same configuration will be omitted.

[0033] 4, the terminal box 10 may be configured so that the bypass diode 16 is arranged such that a portion of the diode body 16a is exposed between the pair of conductive terminals 12 in a plan view. Even with this configuration, the other portions (unexposed portions) of the diode body 16a are shielded from light by each of the pair of conductive terminals 12, so an increase in the thermal resistance of the diode body 16a is suppressed compared to when the entire diode body 16a is directly irradiated with sunlight. As a result, the temperature rise of the diode body 16a when current is applied to the bypass diode 16 is reduced, and the possibility of the bypass diode 16 being subjected to thermal stress and causing a breakdown or the like is suppressed.

[0034] As shown in FIG. 5 , instead of the through-holes 14a, the heat-conducting portion 14 may have notches 14b so that the central portion along the short side of the conductive terminal 12 remains. Even with this configuration, the area (first cross-sectional area S1) of the heat transfer path through which heat applied to the busbar connection portion 13 is transferred to the diode connection portion 15 is smaller than the area of ​​the heat transfer path without the through-holes 14a. This reduces the heat capacity of the busbar connection portion 13 and the diode connection portion 15, thereby suppressing thermal stress on the diode body 16a of the bypass diode 16. Furthermore, because heat transfer from one side of the busbar connection portion 13 to the other side of the diode connection portion 15 is suppressed, the connection point of the busbar 4 (the point where heat is applied) and the connection point of the bypass diode 16 can be located closer to each other, thereby shortening the length of the long side of the conductive terminal 12 and thereby reducing its size. This also reduces the volume of the terminal box 10.

[0035] 6, instead of the through-hole 14a, a notch 14b may be provided in the heat conductive portion 14 so that one end portion along the short side direction of the conductive terminal 12 remains. Even with this configuration, the same effect as the modification shown in FIG. 5 can be achieved.

[0036] Other Embodiments (1) In the above embodiment and its modified examples, the shape of the heat conductive portion 14 of the conductive terminal 12 is the through hole 14a or the notch 14b, but this is not limited thereto. Any shape may be adopted as long as the first cross-sectional area S1 is smaller than the second cross-sectional area S2. For example, the thickness of the heat conductive portion 14 may be thinner than the thicknesses of the bus bar connection portion 13 and the diode connection portion 15.

[0037] (2) In the above embodiment and its modified examples, the heat conductive portions 14 of the pair of conductive terminals 12 have the same shape, but different shapes may be combined to form the terminal box 10. Furthermore, the through hole 14a and the notch 14b may be formed in one conductive terminal 12.

[0038] (3) In the above embodiment and its modified examples, the diode connection portion 15 is longer than the heat conduction portion 14 in the longitudinal direction of the conductive terminal 12. However, the length of the through hole 14a or the notch 14b along the longitudinal direction may be increased to the extent that the electrical connection of the bypass diode 16 to the conductive terminal 12 is not impaired. As a result, the heat conduction portion 14 may be longer than the diode connection portion 15. Increasing the length of the heat conduction portion 14 makes it more difficult for heat generated during soldering of the bus bar 4 to be conducted to the diode body 16a of the bypass diode 16. Furthermore, the heat capacity of the diode connection portion 15 is further reduced, thereby reducing the amount of heat required during soldering of the bypass diode 16. As a result, the thermal stress on the diode body 16a can be further reduced.

[0039] (4) In the above embodiment and its modified examples, the bus bar 4 and the bypass diode 16 are electrically connected by soldering. However, they may be configured to be electrically connected by other methods such as welding.

[0040] Hereinafter, the terminal box 10 described in the above embodiment and its modified example will be considered to have the following configuration.

[0041] <1> One aspect of the terminal box (10) includes a pair of plate-shaped conductive terminals (12) to which a pair of bus bars (4) that supply power generated by the solar cells (2a) are connected, the conductive terminals having a front surface (12a) that is irradiated with sunlight and a back surface (12b) that is not irradiated with sunlight, a bypass diode (16) that electrically connects the pair of conductive terminals (12), and a case (18) that houses the pair of conductive terminals (12) and the bypass diode (16), wherein the bypass diode (16) is arranged on the back surface (12b) side, and when the front surface (12a) of the pair of conductive terminals (12) is viewed in a direction perpendicular to the front surface (12a) of the pair of conductive terminals (12), at least a portion of the diode body (16a) of the bypass diode (16) overlaps with at least one of the pair of conductive terminals (12).

[0042] According to this aspect, at least a portion of the diode body 16a of the bypass diode 16 is disposed on the back surface 12b side opposite to the front surface 12a of at least one of the pair of conductive terminals 12 that is irradiated with sunlight, and when the front surface 12a of the pair of conductive terminals 12 is viewed in a direction perpendicular to the front surface 12a of the pair of conductive terminals 12, at least a portion of the diode body 16a of the bypass diode 16 overlaps with at least one of the pair of conductive terminals 12. In other words, the diode body 16a is shielded from light by the conductive terminal 12.

[0043] As a result, the increase in the ambient temperature on the back surface 12b of the conductive terminal 12 on which the diode body 16a is disposed due to sunlight irradiation is smaller than the increase in the ambient temperature on the front surface 12a. As a result, the increase in thermal resistance of the diode body 16a is suppressed compared to when sunlight is directly irradiated on the diode body 16a, so the temperature increase in the diode body 16a when current is applied to the bypass diode 16 is smaller, and the possibility of the bypass diode 16 being subjected to thermal stress and causing a breakdown or the like is suppressed.

[0044] <2> the above <1> In the terminal box (10) described above, it is preferable that the entire diode body (16a) overlaps one of the pair of conductive terminals (12).

[0045] According to this embodiment, the entire diode body 16a overlaps one of the pair of conductive terminals 12, and therefore the diode body 16a is completely shielded from light by the conductive terminal 12. As a result, an increase in the thermal resistance of the diode body 16a is further suppressed, and therefore the temperature rise of the diode body 16a when current is applied to the bypass diode 16 is further reduced, further reducing the possibility of the bypass diode 16 being subjected to thermal stress and causing a breakdown or the like.

[0046] <3> the above <1> or <2> In the terminal box (10) described above, each of the pair of conductive terminals (12) has a busbar connection portion (13) to which a busbar (4) is electrically connected, a diode connection portion (15) to which a bypass diode (16) is electrically connected, and a heat conduction portion (14) arranged between the busbar connection portion (13) and the diode connection portion (15), and it is preferable that a first cross-sectional area (S1) of the conductive terminal (12) when the heat conduction portion (14) is cut in a direction perpendicular to the arrangement direction of the busbar connection portion (13), the heat conduction portion (14), and the diode connection portion (15) is smaller than a second cross-sectional area (S2) of the conductive terminal (12) when the busbar connection portion (13) is cut in the perpendicular direction.

[0047] According to this aspect, by providing the heat conduction portion 14 in the conductive terminal 12, the first cross-sectional area S1 of the heat transfer path through which heat applied to the busbar connection portion 13 is conducted to the diode connection portion 15 is smaller than the second cross-sectional area S2 of the conductive terminal 12 at the busbar connection portion 13. As a result, the heat applied to the busbar connection portion 13 is less likely to be conducted to the diode connection portion 15, and the heat applied to the diode connection portion 15 is less likely to be conducted to the busbar connection portion 13. In other words, the applied heat is less likely to escape to other locations in the busbar connection portion 13 and the diode connection portion 15, which reduces the heat capacity of these connections.

[0048] As a result, when the bypass diode 16 is electrically connected to the diode connection portion 15 on the back surface 12b of the conductive terminal 12 by soldering or other methods, only a small amount of heat is required to melt the solder, thereby further reducing the thermal stress that the diode body 16a receives when soldering the bypass diode 16.

[0049] Similarly, when electrically connecting the busbar 4 to the busbar connection portion 13 on the surface 12a of the conductive terminal 12 by soldering or other methods, only a small amount of heat is required to melt the solder. As a result, even if the bypass diode 16 is connected to the conductive terminal 12 before the busbar 4, the amount of heat conducted from the busbar connection portion 13 to the diode connection portion 15 is reduced, further reducing the thermal stress that the diode body 16a of the bypass diode 16 receives from the heat of soldering the busbar 4.

[0050] <4> the above <3> In the terminal box (10) described above, the heat-conducting portion (14) of the conductive terminal (12) preferably has a through-hole (14a).

[0051] According to this embodiment, the heat conduction portion (14) can be formed by the simple method of forming the through hole (14a) in the conductive terminal (12), thereby further suppressing the thermal stress that the diode body (16a) of the bypass diode (16) receives. [Industrial Applicability]

[0052] The present disclosure is applicable to terminal boxes. [Explanation of symbols]

[0053] 2a: solar cell (solar cell), 4: bus bar, 12: conductive terminal, 12a: front surface, 12b: back surface, 13: bus bar connection part, 14: heat conduction part, 14a: through hole, 15: diode connection part, 16: bypass diode, 18: case, S1: first cross-sectional area, S2: second cross-sectional area

Claims

1. a pair of plate-shaped conductive terminals to which a pair of bus bars for supplying power generated by the solar cell are connected, the conductive terminals having a front surface that is irradiated with sunlight and a back surface that is not irradiated with sunlight; a bypass diode electrically connecting the pair of conductive terminals; a case that houses the pair of conductive terminals and the bypass diode therein, the bypass diode is disposed on the back surface side; When the surface of the terminal box is viewed in a direction perpendicular to the surfaces of the pair of conductive terminals, at least a portion of a diode body of the bypass diode overlaps with at least one of the pair of conductive terminals.

2. 2. The terminal box according to claim 1, wherein the entire diode body overlaps one of the pair of conductive terminals.

3. each of the pair of conductive terminals has a bus bar connection portion to which the bus bar is electrically connected, a diode connection portion to which the bypass diode is electrically connected, and a heat conduction portion disposed between the bus bar connection portion and the diode connection portion; 3. The terminal box according to claim 1, wherein a first cross-sectional area of ​​the conductive terminal when the heat conduction portion is cut in a direction perpendicular to an arrangement direction of the bus bar connection portion, the heat conduction portion, and the diode connection portion is smaller than a second cross-sectional area of ​​the conductive terminal when the bus bar connection portion is cut in the perpendicular direction.

4. The terminal box according to claim 3 , wherein the heat conducting portion of the conductive terminal has a through hole.

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